JP2006080226A - Cold plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cold plate performing required cooling of a self-heat generating electronic component located at an arbitrary position on the plate body 11 of the cold plate 10 without causing malfunction or damage of the electronic component. <P>SOLUTION: The cold plate 10 comprises plate bodies 11 and 12 in which a refrigerant channel 14 is formed, and heat-exchanging fins 11a and 12a provided in the refrigerant channel 14 and fixed thermo-conductively with the plate bodies 11 and 12 wherein the heat-exchanging fins 11a and 12a form a cascade channel such that the refrigerant flow resistance is distributed unequally from the refrigerant inlet 15 of the refrigerant channel 14 toward the refrigerant outlet 16 side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cold plate that absorbs heat generated from a semiconductor element or the like on a substrate as a heat sink of a semiconductor module or the like on which an electronic device such as a computer is mounted, and controls a stabilized operation of the semiconductor element or the semiconductor module.

  Conventionally, this type of cold plate circulates the refrigerant almost uniformly from the refrigerant inlet header portion to the plurality of refrigerant passages between the outlet header portions in the refrigerant passage, and generates heat generated from the semiconductor elements on the cold plate. , There is something that was made to absorb almost evenly.

  As such a cold plate, there is one disclosed in Japanese Patent Laid-Open No. 2001-24126 (see [Patent Document 1]).

  As shown in FIGS. 8 and 9, this cold plate is provided with a refrigerant flow path through which a refrigerant such as water flows. The cold plate 1 is provided with a refrigerant flow path 3 in a main body plate 2, a refrigerant inlet 5 is provided in a header portion 4 on one side of the refrigerant flow path 3, and a header portion on the other side of the refrigerant flow path 3. 6 are provided with refrigerant outlets 7 respectively. As shown in FIG. 8, the refrigerant flow path 3 is provided with a plurality of partition plates 9 that divide the refrigerant flow path 3 into a plurality of refrigerant flow dividing paths 8 between the header portions 4 and 6. On the main body plate 2, as shown by the imaginary lines in FIG.

The cold plate 1 configured as described above is disposed in the main body plate 2.
The refrigerant flowing in from the refrigerant inlet 5 sequentially flows in the direction of the arrows in FIGS. 8 and 9 and is discharged from the refrigerant outlet 7 side. The circulating refrigerant absorbs the heat generated from the semiconductor modules a and b through the main body plate 2 through the main body plate 2 and is discharged to the outside through the refrigerant flow path 3. Therefore, the semiconductor modules a and b are cooled to a required temperature via the main body plate 2 and do not suffer from malfunction or damage due to high heat.
JP 2001-24126 A

  According to the configuration of the cold plate 1, the refrigerant flowing from the refrigerant inlet 5 to the refrigerant outlet 7 side of the main body plate 2 is evenly circulated in the refrigerant flow path 3 to the plurality of refrigerant flow dividing paths 8. The plurality of semiconductor modules a or b installed at substantially the same distance as the refrigerant inlet 5 on the main body plate 2 can be cooled substantially uniformly.

  On the other hand, as shown in FIG. 8 and FIG. 9, the semiconductor module a installed on the side closer to the refrigerant inlet 5 and the semiconductor module b installed on the far position are equally endothermic by heat conduction with the body plate 2 side ( Not cooled). That is, as the temperature of the refrigerant rises from the refrigerant inlet 5 to the refrigerant outlet 7 side of the refrigerant flow path 3, the surface temperature of the main body plate 2 gradually increases.

  As a result, both of the semiconductor modules a and b installed on the main body plate 2 of the cold plate 1 cannot be cooled almost uniformly.

  In this case, when a plurality of semiconductor modules a and b having almost no difference in self-heating characteristics and heat-resistant temperature are used, at least one of the semiconductor modules a and b does not have an endothermic action by the body plate 2. It may become sufficient and abnormal temperature may rise.

  In this case, with this abnormal temperature rise, for example, the semiconductor module a may malfunction or be damaged. Further, for example, when the semiconductor module a is provided so as to be sufficiently cooled, more heat absorption (cooling) than necessary is performed on the semiconductor module b side.

  Accordingly, the cold plate 1 requires more cooling capacity than necessary, and cannot be used rationally as a heat sink.

In addition, when a plurality of semiconductor components having temperature characteristics are arranged and cooled, a temperature difference occurs between them and the performance of the apparatus may be deteriorated.

  The present invention has been made in view of the above circumstances, and even if an electronic component accompanying self-heating such as a semiconductor module is installed at an arbitrary position on the main body plate 2 of the cold plate 1, the electronic It is an object of the present invention to provide a cold plate in which required cooling is performed on a component, and the electronic component does not deteriorate in performance, malfunction, or be damaged.

  In order to achieve the above object, according to the present invention, there is provided a plate body in which a coolant channel is formed, and a heat exchange fin provided in the coolant channel in a heat conductive manner with the plate body, The heat exchange fin provides a cold plate characterized in that a cascade flow path is formed so that the refrigerant flow path resistance in the longitudinal direction of the refrigerant flow path is unevenly distributed.

  In order to achieve the above object, according to the present invention, a set of two plate bodies each having a coolant channel formed on one side thereof and the coolant channel sides of the set of two sheets of plate bodies are joined together. A heat exchange fin attached to the hollow refrigerant flow path formed, and the heat exchange fin is a cascade flow path so that the refrigerant flow path resistance in the longitudinal direction of the refrigerant flow path is unevenly distributed. A cold plate is provided.

  In order to achieve the above object, according to the present invention, there is provided a plate body provided with a hollow refrigerant flow path, and a heat exchange fin that is thermally conductively attached to the plate main body in the refrigerant flow path. The heat exchange fin provides a cold plate characterized in that a cascade flow path is formed so that the refrigerant flow path resistance in the longitudinal direction of the refrigerant flow path is unevenly distributed.

  In order to achieve the above object, according to the present invention, a plate main body in which a refrigerant flow path is formed and a fin core formed by making press molds at unequal pitches in the refrigerant flow path are configured. An offset fin is provided, and the offset fin provides a cold plate characterized in that a cascade flow path is formed so that the offset pitch in the longitudinal direction of the refrigerant flow path is an unequal pitch.

  According to the present invention, an electronic component is thermally conductively disposed at a required position on the electronic component installation surface of the main body plate, thereby preventing an abnormal temperature increase due to self-heating of the electronic component. Therefore, it is possible to provide a cold plate suitable for heat dissipation (cooling) of an electronic component that does not cause malfunction due to an abnormal temperature rise of the electronic component.

  Further, it is possible to provide a cold plate that can uniformly cool a plurality of components that need to be uniformly cooled in terms of temperature characteristics.

  An embodiment of a cold plate according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a schematic view showing an embodiment of a cold plate 10 of the present invention.

  The cold plate 10 is provided so that electronic parts such as a computer circuit board can be installed and an abnormal temperature rise due to self-heating from the electronic parts can be prevented.

  The cold plate 10 is an electronic component. For example, when the semiconductor modules c to e rise in an abnormal temperature due to self-heating, the cold plate 10 absorbs heat generated by the self-heating so that the semiconductor modules c to e operate normally and stably. Is provided. The heat generated by the semiconductor modules c to e is subjected to plate heat exchange of the cold plate 10. As a result, the semiconductor modules c to e are provided so as to be maintained at a temperature that does not cause the abnormal temperature.

  As shown in FIG. 1, the cold plate 10 is configured as a set of two plate bodies, for example, one plate (hereinafter referred to as “A-side plate”) 11 and the other plate (hereinafter referred to as “B-side plate”). ) 12.

  As shown in FIG. 2, the B-side plate 12, which is one plate body, is integrally formed with the B-side plate 12 with heat exchange fins 12 b formed so that the refrigerant circulates in a meandering manner.

  Also on the A-side plate 11 side, the heat exchange fins 11a are formed integrally with the A-side plate 11 as in the B-side plate 12 side.

  As shown in FIG. 3, the cold plate 10 is assembled by mutually bonding the heat exchange fins 11 a and 12 a of the A-side plate 11 and the B-side plate 12.

  Further, as shown in FIGS. 1 to 3, the A-side plate 11 and the B-side plate 12 of the cold plate 10 have a rectangular parallelepiped shape, and are integrally made of a material having good thermal conductivity, for example, aluminum (alloy). Produced. Further, the heat exchange fins 11a and 12a of the A-side plate 11 and B-side plate 12 are provided so that the offset pitches are unevenly distributed along the longitudinal direction thereof as shown in FIG. It is done.

  The cold plate 10 is formed as a single plate by combining the heat exchange fins 11a and 12a of the A side plate 11 and the B side plate 12 facing each other. As a result, a fin space formed by joining the heat exchange fins 11 a and 12 a is used as the refrigerant flow path 14.

  A liquid refrigerant before heat absorption (hereinafter referred to as an unabsorbed liquid refrigerant) f1 is circulated through the refrigerant flow path 14 from the refrigerant inlet 15 side of the refrigerant flow path 14 and the semiconductor module is interposed via the A-surface plate 11. Liquid refrigerant (hereinafter referred to as endothermic liquid refrigerant) f2 that has absorbed heat from the c to e sides is discharged to the outside. The endothermic liquid refrigerant f2 can be recirculated back to the non-endothermic liquid refrigerant f1.

  Further, in order to increase the heat exchange efficiency with the non-endothermic refrigerant f1 flowing through the refrigerant flow path 14 provided with the heat exchange fins 11a and 12a of the A surface plate 11 and the B surface plate 12 of the cold plate 10, The exchange fins 11a and 12a are formed in a cascade as shown in FIG.

  The configuration of the heat exchange fins 11a and 12a formed in the cascade shape has a maze shape or a jig jig shape, for example, as shown in FIG. According to this configuration, the unabsorbed liquid refrigerant f <b> 1 flowing along the refrigerant flow path 14 is affected by an increase in flow resistance due to the cascade shape in the refrigerant flow path 14. The cascade-like refrigerant flow path 14 increases the heat exchange action in the increased portion by increasing the flow resistance of the non-endothermic liquid refrigerant f1.

  The structure of each heat exchange fin 11a and 12a of the A surface plate 11 and the B surface plate 12 is demonstrated still in detail with reference to FIGS.

  The heat exchange fins 11a and 12a can have the same shape.

  Therefore, one heat exchange fin 11a and 12a will be described.

  The heat exchange fins 12a are located at the partition fin portion 20 provided on the side closest to the refrigerant inlet portion 15, the wide fin group 21 positioned at the front stage, the intermediate width fin group 22 positioned at the middle stage, and the rear stage. The narrow fin group 23 and the wide fin portion 24 are configured in a continuous multistage. The cross-sectional shape of each fin portion in each of the fin groups 21, 22, 23 and the wide fin group 24 is a shape in which the fins are arranged in parallel in the width (d) direction and the height (h) direction as shown in FIG. There is no.

  For example, the intermediate width fin group 22 has a plurality of intermediate width fins 22a arranged in parallel in the width (d) direction of the refrigerant flow path 14 and in parallel in the height (h) direction. In addition, the fin groups 21 to 23 and the wide fins 24 formed in multiple stages in the longitudinal direction of the refrigerant flow path 14 are, for example, the intermediate width fin group 22 portion in the connecting portion, as shown in FIG. The fin pitch is shifted by half a pitch.

  As described above, the heat exchange fins 12a are formed in multiple stages with fine fin pitches as they reach the fin groups 21, 22, 23 and the wide fin portion 24, so that the flow resistance of the endothermic liquid refrigerant f2 gradually increases. .

  Each of the fin groups 21, 22, 23 and the wide fin portion 24 has a plurality of fins 21a, 22a, 23a and a wide fin portion 24 arranged in parallel. It may be formed.

  The wide fin group 21 has a plurality of wide fins 21a arranged in parallel in the width direction, and the flow resistance when the non-endothermic liquid refrigerant f1 passes through the wide fin group 21 is at a relatively small level. Therefore, the level of the heat absorption amount (heat exchange amount) of the non-endothermic liquid refrigerant f1 passing through the wide fin group 21 is set to be low.

  Further, the intermediate width fin group 22 has a plurality of intermediate width fins 22a arranged in parallel in the width direction, and is arranged so as to be shifted by a half pitch from each wide fin row of the wide fin group 21 on the front stage side. As a result, the flow resistance when passing through the intermediate width fin group 22 side while gradually becoming the endothermic liquid refrigerant f2 from the non-endothermic liquid refrigerant f1 is set to a relatively middle level. Therefore, the level of the heat absorption amount (heat exchange amount) of the non-endothermic liquid refrigerant f1 passing through the intermediate width fin group 22 is set to the middle level.

  Further, the narrow fin group 23 has a plurality of narrow fins 23a arranged in parallel in the width direction, and is arranged so as to be shifted by a half pitch from each row of intermediate width fins 22 of the intermediate width fin group 22 on the front stage side. As a result, the flow resistance when the non-endothermic liquid refrigerant f1 passes through the narrow fin group 23 side is at a relatively large level. Therefore, the level of the heat absorption amount (heat exchange amount) of the non-endothermic liquid refrigerant f1 passing through the narrow fin group 23 is set to a large level.

  At this stage, the non-endothermic liquid refrigerant f1 is in the state of the endothermic liquid refrigerant f2 as the heat absorption proceeds. In this way, the non-endothermic liquid refrigerant f1 flowing through the refrigerant flow path 14 formed by the heat exchange fins 12a effectively absorbs heat from an electronic component having a relatively large heat dissipation amount, for example, the semiconductor module d shown in FIG. can do.

  On the other hand, the A-side plate 11 constituting the cold plate 10 has an outer side surface (a side surface opposite to the heat exchange fin 11a) as a module arrangement surface 11b, and a plurality of semiconductor modules c to e at required positions on the module arrangement surface 11b. Are arranged in a thermally conductive manner.

  Due to the combination of the A-side plate 11 and the B-side plate 12, the cascade-like refrigerant flow path 14 has a refrigerant inlet 15 at one end and a refrigerant outlet at the multi-end as shown in FIGS. 16 is formed, and the unheated liquid refrigerant f1 in the required temperature state supplied in the direction of the arrow from a refrigerant supply device (not shown) is supplied from the refrigerant inlet 15 side, whereby the refrigerant flow path 14 is circulated. Then, heat is exchanged with the both plates 11 and 12 side to become an endothermic liquid refrigerant f2 in an endothermic state and is discharged from the refrigerant outlet 16 side to the outside.

  Next, the semiconductor modules c to e arranged using the module arrangement surface 11a of the A surface plate 11 will be described.

  The semiconductor modules c to e are arranged at different positions as indicated by imaginary lines in FIG.

  The semiconductor module c is arranged, for example, at the front stage side of the refrigerant flow path 14, that is, at a position away from the position of the wide fin group 21. This is because it is necessary to obtain a strong cooling action because the semiconductor module c has the required heat resistance even if it self-heats so much.

  Further, in the case of the semiconductor module d, for example, it is disposed at the rear stage side of the refrigerant flow path 14, that is, at a position that is slightly shifted from the center across the narrow fin group 23 and the wide fin portion 24.

  This is because the semiconductor module e has a certain exothermic property and requires some cooling.

  Next, the operation of the cold plate 10 will be described with reference to FIGS.

  When the non-endothermic liquid refrigerant f1 is supplied from the refrigerant supply unit (not shown) to the refrigerant inlet 15 of the refrigerant flow path 14 of the cold plate 10, the supplied non-endothermic liquid refrigerant f1 is, as shown in FIG. The heat generated by the self-heating of the semiconductor modules c to e is absorbed through the refrigerant flow path 14 of the plate 10 to become the endothermic liquid refrigerant f2 and is discharged from the refrigerant outlet 18 side to the outside.

  The non-endothermic liquid refrigerant f <b> 1 flows into the plurality of wide fins 21 a of the wide fin group 21. Since the inflowing non-endothermic liquid refrigerant f1 has a wide fin pitch in the longitudinal direction of each wide fin 21a, the wide fin group 21 side does not receive much flow resistance, that is, the heat absorption efficiency remains low. Pass through.

  Next, the non-endothermic liquid refrigerant f1 that has passed through the wide fin group 21 flows into the intermediate-width fin group 22 while absorbing heat. Then, as shown in FIG. 4, the non-endothermic liquid refrigerant f1 flows into the rear stage side while gradually absorbing heat in the refrigerant flow path 14 (see arrow) formed by being divided into a plurality of parts by a plurality of intermediate width fins 22a. To do.

  In the stage of passing through the intermediate width fin group 22, the non-endothermic liquid refrigerant f1 is subjected to a relatively intermediate level of flow resistance because the fin pitch in the longitudinal direction of the plurality of intermediate width fins 22a is at an intermediate level. The intermediate width fin group 22 is passed with the endothermic efficiency at a medium level. During this passage, the non-endothermic liquid refrigerant f1 absorbs the heat generated by the semiconductor module d and flows into the narrow fin group 23 side.

  At this time, it flows into the terminal side of the narrow fin group 23 while absorbing heat generated by self-heating of the semiconductor module d near the narrow fin group 23 and the semiconductor module e slightly shifted.

  When flowing up to this stage, the non-endothermic liquid refrigerant f1 is subjected to a relatively large level of flow resistance because the fin pitch in the longitudinal direction of the plurality of small fins 23a is small, that is, the heat absorption efficiency remains at a high level. Then, it passes through the narrow fin group 23, absorbs heat generated by self-heating of the semiconductor modules de through e, and becomes an endothermic liquid refrigerant f2.

  Next, the endothermic liquid refrigerant f2 that has flowed into the wide fin portion 24 from the terminal side of the small fin group 23 flows to the refrigerant outlet portion 16 side in a state where the endothermic action is reduced, and is discharged to the outside. The endothermic liquid refrigerant f2 when passing through the wide fin portion 24 has a relatively small flow resistance and absorbs a considerable amount of heat, so that the endothermic level is suppressed.

  Next, the endothermic action of the non-endothermic liquid refrigerant f1 will be described.

  The non-endothermic liquid refrigerant f1 is, for example, the refrigerant temperature shown in FIG. 5 between the time when the non-endothermic liquid refrigerant f1 flows from the refrigerant inlet 15 side and the time when it is discharged as the endothermic liquid refrigerant f2 from the refrigerant outlet 16 side. Although it rises as shown by x, it shows that the surface temperature y of the cold plate is in a stable state.

  The temperature of the cold plate surface can be set to an appropriate temperature, but when the heat absorption of the semiconductor modules c to e is intended, the heat resistant temperature of the semiconductor modules c to e is usually 70 to 80 ° C. The temperature can be set on a case-by-case basis in consideration of various conditions such as the amount of heat generated by the semiconductor modules c to e and various heat-resistant temperatures so as not to increase to this temperature.

  According to the cold plate 10, the endothermic liquid refrigerant f <b> 1 that has flowed in from the refrigerant inlet portion 15 side of the refrigerant flow path 14 is discharged to the refrigerant outlet portion 16, and the endothermic effect is exerted on the module installation surface 11 b of the heat exchange fin 11 a. Unequally distributed. Therefore, it is possible to prevent the semiconductor modules c to e arranged in a thermally conductive manner on the module installation surface 11b of the A-side plate 11 of the cold plate 10 from rising above the set management temperature. It can be operated normally and stably.

  Furthermore, the A-plane plate 11 and the B-plate 12 of the cold plate 10 have a multi-stage configuration with a plurality of fin groups of different fin tips in the longitudinal direction so as to increase the flow resistance of the liquid refrigerant f1 (f2). The flow resistance of the liquid refrigerant f1 (f2) can be achieved by various means such as gradually (continuously) narrowing the width of the fin pitch.

  Furthermore, the non-endothermic liquid refrigerant f1 is supplied from a refrigerant supply device (not shown) and the heat-exchanged endothermic refrigerant f2 is discharged to the outside as it is. The endothermic liquid refrigerant f2 is regenerated to the non-endothermic liquid refrigerant f1 again. You may employ | adopt the refrigerant | coolant circulation type cooling cycle used circulating as possible.

  Further, in addition to adopting a set of two plates as the plate body, one integrally formed by a processing method such as extrusion or pultrusion can be used. When using this integrally molded one, if the refrigerant flow path 14 formed at the same time adopts a configuration in which another heat exchange fin is mounted from one side of the refrigerant inlet portion 15 or the refrigerant outlet portion 16. Easy to process.

  Further, the A-side plate 11 and the B-side plate 12 of the cold plate 10 are made of aluminum (alloy), but other materials having good thermal conductivity, such as copper and stainless steel, may be used. it can.

  Further, the cold plate 10 has an optimized shape in accordance with the distribution of the semiconductor modules c to e in which the distribution resistance of the refrigerant flow path 14 is distributed in order to obtain a necessary endothermic effect on the semiconductor modules c to e. It is desirable.

  Further, although one cold plate 10 is exemplified, the case where the heat generation amount of the semiconductor modules c to e individually or as a whole is large, the case where the semiconductor module itself is large, or the number is large is considered. Can be used in combination.

  Furthermore, the cold plate 10 can be installed not only on the A-side plate 11 side but also on the B-side plate 12 side if necessary.

  Further, the radiation fin portions 11 a and 12 a formed on the A-side plate 11 and the B-side plate 12 used in the cold plate 10 can be integrally provided on either the A-side plate 11 or the B-side plate 12. When this configuration is adopted, the other side of the A-side plate 11 and the B-side plate 12 may be simply a flat plate.

  That is, for example, as shown in FIG. 6, the cold plate 30 includes a flat A-surface plate 31, a B-surface plate (plate body) 32 in which a coolant channel is formed, and a press mold in the coolant channel. Offset fins 33a to 33e configured by heat exchange fin cores 33 formed by unequal pitches are provided, and the offset fins 33a to 33e are arranged so that the offset pitches in the longitudinal direction of the refrigerant flow path become unequal pitches. This is a configuration in which a cascade channel is formed.

  The B-side plate 32 is a long plate having a U-shaped recess 32a. The cold plate 30 is configured such that the heat exchange fin core 33 is housed and installed in a hollow portion formed by combining the concave portion 32 a having a U-shaped cross section of the B-surface plate 32 and the A-surface plate 31. Here, the recess 32 a provided in the B-side plate 32 may be provided on the A-side plate 31 side, or may be provided on both plates 31 and 32.

  Further, when the heat exchange fin core 33 is manufactured, the heat exchange fin core 33 can be press-molded into a waveform for each fin pitch by a press die formed in advance at an unequal pitch. That is, for example, as shown in FIG. 7, the heat exchange fin core 33 has offset length fins having a length l, a width d, a height h, and unequal pitches (p1 to p5) having different fin pitches in the length l direction. 33a to 33e are provided.

  In addition, as shown in FIG. 7, the offset fins 33a to 33e are specifically press-molded in a waveform for each fin pitch in the width d direction. Therefore, a cascade flow path is formed in the longitudinal direction of the heat exchange fin core 33 when it is mounted on the refrigerant flow path side.

  Next, when the A-side plate 11, the B-side plate 12 and the heat exchange fin core 33 are integrally fixed, a refrigerant (not shown) formed by first joining the A-side plate 11 and the B-side plate 12 together. It is also possible to adopt a configuration in which the three parts are fitted into the flow path or are joined together by brazing or the like.

  Thus, by making the cold plate 30 into three parts, each part can be easily manufactured, and if each of them is made in advance in advance, it corresponds to the length of various cold plates. Thus, it can be cut into desired dimensions and used. Accordingly, versatility is improved while mass productivity is considered.

  Furthermore, the A-side plate 11 and the B-side plate 12 used in the cold plate 10 may be a plate body that is integrally formed. That is, a configuration may be adopted in which a hollow refrigerant channel is provided in one long plate body (not shown), and the heat exchange fin core 33 shown in FIG.

The side view which shows embodiment of the cold plate which concerns on this invention. The top view which cuts and shows a part of A surface plate of the cold plate shown in FIG. The expanded sectional view which follows the BB line of FIG. The enlarged view of the X section of FIG. The figure which shows the temperature change of the surface of the refrigerant | coolant which moves from the refrigerant | coolant inlet part of a cold plate which concerns on this invention to a refrigerant | coolant outlet part, and a cold plate. The disassembled perspective view which shows the other Example of the cold plate of this invention. The perspective view of the heat exchange fin core shown in FIG. The longitudinal cross-sectional top view of the conventional cold plate. Sectional drawing which follows the DD line | wire of FIG.

Explanation of symbols

10 Cold plate 11 A side plate (plate body)
11a, 12a Heat exchange fin 11b Module installation surface (electronic component installation surface)
12 B side plate (plate body)
12b Heat conduction surface 14 Refrigerant flow path 15 Refrigerant inlet part 16 Refrigerant outlet part 20 Partition fin part 21 Wide fin group 21a Wide fin 22 Medium wide fin group 22a Intermediate wide fin 23 Small fin group 23a Small fin 24 Wide fin part 30 Cold plate 31 A surface plate 32 B surface plate 32a Recess 33 Heat exchange fin cores 33a to 33e Offset fin f1 Non-endothermic liquid refrigerant f2 Endothermic liquid refrigerant c to e Semiconductor module (electronic component)

Claims (7)

A plate main body formed with a refrigerant flow path; and a heat exchange fin provided in the refrigerant flow path in a thermally conductive manner with the plate main body,
The cold plate according to claim 1, wherein the heat exchange fin is formed with a cascade flow path so that the refrigerant flow path resistance in the longitudinal direction of the refrigerant flow path is unevenly distributed. A set of two plate bodies each having a coolant channel formed on one side;
A heat exchange fin attached to a hollow refrigerant flow path formed by joining the refrigerant flow path sides of the set of two plates.
The cold plate according to claim 1, wherein the heat exchange fin is formed with a cascade-like channel so that the refrigerant channel resistance in the longitudinal direction of the refrigerant channel is unevenly distributed. 3. The cold plate according to claim 1, wherein the heat exchange fin is formed integrally with at least one of a set of two plate bodies. A plate main body provided with a hollow refrigerant flow path, and a heat exchange fin mounted in a heat conductive manner with the plate main body in the refrigerant flow path,
The cold plate according to claim 1, wherein the heat exchange fin is formed with a cascade flow path so that the refrigerant flow path resistance in the longitudinal direction of the refrigerant flow path is unevenly distributed. The cascade flow path formed in the heat exchange fin is formed such that a pitch between the fins is gradually or gradually narrowed from a refrigerant inlet portion to a refrigerant outlet portion of the refrigerant flow path. Item 5. The cold plate according to any one of Items 1, 2, and 4. The cold plate according to claim 1, wherein the heat exchange fins are formed at unequal pitches in a longitudinal direction. The plate main body in which the refrigerant flow path is formed, and the refrigerant flow path includes offset fins configured by heat exchange fin cores formed by setting the press molds at unequal pitches. A cold plate plate in which cascade flow paths are formed so that offset pitches in the longitudinal direction of the refrigerant flow paths are unequal.

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