JP2006080055A - Electronic equipment, lighting device, and lighting fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic equipment having waterproof performance, of light weight, and capable of improving assembling work performance. <P>SOLUTION: The electronic equipment is equipped with a circuit module 21, a tray 41, and a filler 55. The module 21 has a circuit board 22 of electric insulation and various electric components 26 to form a lighting circuit by being mounted on the board. The tray 41 houses the module 21. A raised bottom portion 49 which protrudes to the circuit board 22 side is formed at the tray 41. The filler 55 has both waterproofness and electric insulation. This filler 55 is filled in the tray by immersing the circuit board 22 and the electric components 26. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic device having excellent waterproof performance, a lighting device for lighting a discharge lamp with the electronic device, and a lighting fixture including the lighting device.

  In a lighting fixture installed outdoors or in a high humidity environment, a lighting device for lighting a discharge lamp included in the fixture may be exposed to high humidity. The lighting device for this application is required to be waterproof.

  An inverter lighting device is an electronic device in which a plurality of electrical components and a wire connector are mounted on a circuit board. Conventionally, a technique for waterproofing an inverter lighting device using a waterproof case is known (for example, see Patent Document 1).

The waterproof case used in this technique is formed of a cylindrical storage case and a side plate and stores the inverter lighting device. The side plates hermetically seal the opening portions at both ends of a cylindrical storage case made of an integrally molded product having a seamless cross section.
Japanese Unexamined Patent Publication No. 2003-7122 (paragraphs 0004, 0005, 0008-0019, FIGS. 1-14, 17, 17)

  In the technique of Patent Document 1, the inverter lighting device itself is assembled with a case that forms an outline thereof, and this lighting device is accommodated in a waterproof case. For this reason, the waterproof case which makes the outline of the whole lighting device is large. At the same time, in addition to the labor for assembling the inverter lighting device, the labor for housing the device in the cylindrical case and the labor for assembling the waterproof case thereafter are required. Therefore, the number of assembling steps for the lighting device is large. Therefore, as described above, in addition to an increase in cost due to the use of a large waterproof case itself, a large cost is required for assembling, so that the cost is high.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device, a lighting device, and a lighting fixture that have waterproof performance and are lightweight and can improve assembly workability.

  In order to solve the above problems, an electronic apparatus according to a first aspect of the present invention includes a circuit board and a circuit module including a plurality of electrical components mounted on the board to form an electronic circuit; A tray having a raised bottom portion protruding toward the circuit board; and a filler having waterproofness and electrical insulation, filling the circuit board and electrical components and filling the tray. It is characterized by.

  In the present invention, the tray can be made of, for example, a synthetic resin or rubber. As a synthetic resin for making the tray, a synthetic resin having a low material cost and having heat resistance that can withstand the temperature of the heat curing treatment of the filler, such as polypropylene ( PP) and polyethylene terephthalate (PET) can be preferably used. For example, ethylene propylene rubber (EPDM) can be used as the rubber for making the tray. In the present invention, one or more raised bottom portions of the tray can be provided. The raised bottom portion is preferably provided corresponding to a region where the arrangement density of the electrical components of the circuit module is low and a region where the electrical components such as chip components are gathered. The raised bottom may be provided continuously on the side wall of the tray. The raised bottom portion can be separated from the side wall of the tray, and a passage can be formed in the separated portion.

  In the present invention, a synthetic resin such as a silicon resin, a urethane resin, an epoxy resin, an unsaturated polyester resin, or the like can be used as the filler. Use of a urethane resin is preferable in that the material cost is low. When silicon resin, unsaturated polyester resin, or the like is used, higher heat dissipation can be obtained. In the present invention, an electrical component such as a chip component may be surface-mounted on the soldering surface of the circuit board.

  According to the first aspect of the present invention, a tray is provided, and at least the circuit board and electrical components of the circuit module accommodated in the tray are embedded in an electrically insulating and waterproof filler filled in the tray. For this reason, the circuit board and electrical components of the circuit module can be waterproofed by the filler in the tray so as to withstand a high humidity environment. In addition, a waterproof case is not required for waterproofing the circuit module. Furthermore, by providing the raised bottom on the tray, the amount of filler used is small, and the electronic device can be reduced in weight. Moreover, the time required to inject the filler into the tray can be shortened by the raised bottom. In addition, since the raised bottom improves the strength of the tray, workability when the tray is placed on the circuit module can be improved.

  According to a second aspect of the present invention, which is a preferred embodiment of the present invention, the raised bottom portion has a crossing groove that crosses the bottom portion, and both ends of the crossover groove are open to the side surface of the raised bottom portion.

  In the present invention, the transition groove is formed in at least a part of the raised bottom. It is preferable that the transition groove is provided on at least one of the adjacent raised bottoms with a narrow interval, and one end of the transition groove is opened in the narrow gap.

  The raised bottom can be a factor that blocks the flow of uncured filler injected into the tray within the tray. However, in the invention of claim 2, the uncured filler blocked by the raised bottom can be moved in the tray through the crossover groove. As a result, the entire area of the tray can be reliably filled with the filler.

  According to a third aspect of the present invention, which is a preferred form of the present invention, a part cap that covers a part of the plurality of electrical parts and isolates the electrical part from the filler is provided. Yes.

  In the present invention, the component cap is formed of an electrical insulator such as synthetic resin or synthetic rubber. The component cap is formed in a size that covers one or more electrical components. The component cap may be prevented from moving from a predetermined position as the filler is injected into the tray. For this purpose, for example, the component cap may be fixed to the circuit board using an adhesive. The electrical component isolated from the filler by the component cap is an electrical component that is not preferably embedded in contact with the filler. Examples of this type of electrical component include an electrolytic capacitor and a variable resistor.

  According to the third aspect of the present invention, the part cap can isolate a part of the electrical components mounted on the circuit board from the filler filled in the tray. For this reason, it can suppress that the functional failure of the isolated electrical component is brought about by the filler.

  According to a fourth aspect of the present invention, which is a preferred embodiment of the present invention, the circuit module includes an electric wire connector connected to the electronic circuit and mounted on the circuit board, and the tray includes a connector cap that covers the electric wire connector. It is characterized by being.

  In the present invention, the connector cap can be made of synthetic resin or rubber. EPDM can be cited as a rubber for making the connector cap. The connector cap may be formed separately from the synthetic resin or rubber tray, or may be formed integrally with the tray.

  In the invention of claim 4, since the connector cap covers the wire connector, the uncured filler filled in the tray can be prevented from entering the wire connector. For this reason, the connection failure of the electric wire inserted and connected to an electric wire connector can be prevented.

  According to a fifth aspect of the present invention, which is a preferred embodiment of the present invention, the tray includes a tray main body having a cap through hole and the connector cap formed separately from the main body and penetrating the cap through hole. An annular groove is provided on the outer periphery of the cap, and a hole edge of the cap through hole is fitted into this groove.

  In the invention of claim 5, the connector cap and the tray are joined to the tray body by fitting the hole edge of the cap through hole and the annular groove on the outer periphery of the connector cap. For this reason, the uncured filler injected into the tray can be prevented from entering the electric wire connector through the joint.

  In order to solve the above-mentioned problem, a lighting device according to a sixth aspect of the present invention is characterized in that a discharge lamp is turned on by the electronic device according to any one of the first to fifth aspects.

  The lighting device of the present invention may be a lamp that is normally lit or may be lit in an emergency such as a power failure. The lighting device according to claim 6 is preferably used by being housed in an outer case that houses a waterproof assembly including a tray, a circuit module, and a filler. In this case, it is preferable that the outer case accommodates the waterproof assembly in a full state in order to promote downsizing and improve heat dissipation from the waterproof assembly to the outer case. Here, the full state is preferably a state in which the waterproof assembly is housed in the outer case in a state where each surface thereof is in thermal contact with each surface of the outer case. However, at least a part of the waterproof assembly, preferably the solder cover layer of the filler covering the soldering surface of the circuit board is brought into thermal contact with the outer case, and the other part is slightly separated from the outer case. Also included. The outer case can be made of synthetic resin, but is preferably made of a metal having good thermal conductivity such as an aluminum alloy in order to obtain heat radiation performance to the outside.

  Since the invention of claim 6 is a lighting device for lighting a discharge lamp by the electronic device according to any one of claims 1 to 5, the circuit board of the circuit module and the electrical parts are waterproofed by the filling material filled in the tray. it can. For this reason, the waterproof performance which can endure a high humidity environment without requiring a waterproof case can be obtained. Furthermore, the raised bottom of the tray reduces the amount of filler used and can reduce the weight. Moreover, in addition to shortening the time required to inject the filler into the tray, the strength of the tray is improved at the raised bottom, and the workability when the tray is put on the circuit module can be improved.

  In order to solve the above-mentioned problem, a lighting fixture according to a seventh aspect of the present invention includes a chassis; a lamp socket attached to the chassis; a discharge lamp removably supported by the socket; and attached to the chassis. And a lighting device according to claim 6 for lighting the discharge lamp.

  Since the lighting device included in the lighting fixture of the present invention is the one described in claim 6, it is possible to provide a lighting fixture including a lighting device that has waterproof performance and is lightweight and can improve assembly workability.

  According to the electronic device of the first aspect of the present invention, it is possible to obtain a waterproof performance that can withstand a high humidity environment, and to reduce the weight and improve the assembly workability.

  According to the electronic device of the second aspect of the invention, it is possible to reliably spread the uncured filler throughout the entire tray and obtain a predetermined waterproof performance.

  According to the electronic device of the third aspect of the invention, it is possible to prevent the filler from causing a functional failure of the electrical component isolated by the component cap from the filler filled in the tray.

  According to the electronic device of the invention which concerns on Claim 4 and 5, the poor connection of the electric wire inserted and connected to an electric wire connector can be prevented.

  According to the lighting device of the sixth aspect of the invention, it is possible to obtain a waterproof performance that can withstand a high humidity environment, and it is lightweight and can improve the assembly workability.

  According to the luminaire of the invention according to claim 7, it is possible to provide a luminaire including a lighting device that can obtain a waterproof performance that can withstand a high-humidity environment and is lightweight and can improve assembly workability.

  A first embodiment of the present invention will be described with reference to FIGS.

  The luminaire denoted by reference numeral 1 in FIG. 1 is used with a favorable waterproof property as an outdoor lamp, a tunnel lamp installed in a tunnel, an eaves lamp of a station building, or the like. The luminaire 1 includes a chassis 2, a lamp socket 3, a discharge lamp such as a straight tube fluorescent lamp 4, and a waterproof electronic device such as a waterproof lighting device 5. The lighting device 5 functions as an electronic ballast for lighting the fluorescent lamp 4.

  The chassis 2 illustrated in FIG. 1 is made of metal and has a rectangular parallelepiped shape. The lamp sockets 3 protrude downward, for example, at both ends in the longitudinal direction of the chassis 2. The fluorescent lamp 4 is detachably supported by the lamp socket 3. A lighting device 5 for lighting the fluorescent lamp 4 is built in the chassis 2.

  As shown in FIGS. 2 to 4, the lighting device 5 includes an outer case 11, a circuit module 21, a tray 41, and a filler 55.

  The outer case 11 has an accommodation base 12 and a cover 15 connected thereto. For example, the housing base 12 and the cover 15 are connected to each other by hooking a notch-raised piece (not shown) on a receiving part such as a hole or a notch. A cut and raised piece is formed on one of the accommodation base 12 and the cover 15, and a receiving part is formed on the other.

  The housing base 12 and the cover 15 are preferably made of metal, for example, aluminum alloy having excellent heat dissipation. It can replace with this and the accommodation base 12 and the cover 15 can also be made from ferrous metal with a low material cost.

  As shown in FIGS. 2 and 3, the storage base 12 includes a base wall 12a and side walls 12b bent at right angles from both edges in the width direction. The overall length of the housing base 12 is longer than the circuit board 22 described later. Fixed portions 13 are formed at both longitudinal ends of the base wall 12a. The fixing portion 13 is formed by a hole or a notch. The lighting device 5 is attached to the chassis 2 by bringing the base wall 12 a into contact with the chassis 2 by a fixing part such as a screw passing through these fixing parts 13. The housing base 12 functions as a heat transfer surface to the chassis 2.

  As shown in FIGS. 2 to 4, the cover 15 includes, for example, a cover main wall 15a, a side wall 15b, and an end wall 15c. The cover main wall 15 a has portions bent obliquely on both sides in the width direction of the cover 15. The side wall 15b is bent from these portions. The end walls 15c are bent at right angles from both longitudinal ends of the cover main wall 15a. The end wall 15c is provided so as to close both ends in the longitudinal direction of the recumbent shape formed by the cover main wall 15a and the side wall 15b.

  The cover 15 is formed shorter than the housing base 12 to the extent that the fixing portion 13 is exposed. The side wall 15 b of the cover 15 is in contact with the inner surface of the side wall 12 b of the housing base 12. These side walls 12b and 15b are connected. The accommodation base 12 and the cover 15 can conduct heat through the overlapped side walls 12b and 15b.

  A hole 16 is formed at one end of the cover 15 in the longitudinal direction. A hole 17 is opened at the other longitudinal end of the cover 15. These hole-shaped parts 16 and 17 are quadrangular. One hole 16 is provided to expose a connector cap 43 on the input side, which will be described later. The other hole-like portion 17 is provided to expose an output-side connector cap 44 described later.

  The circuit module 21 for lighting the fluorescent lamp 4 includes an electrically insulating circuit board 22, a lighting circuit 23 (see FIGS. 7 and 9), an input wire connector 24, and an output wire connector 25. ing.

  The circuit board 22 is electrically insulating and has a long rectangular shape that is large enough to fit within the cover 15. One surface of the circuit board 22 is used as a component mounting surface 22a. The other surface of the circuit board 22 is used as a soldering surface 22b. A circuit pattern is printed on the soldering surface 22b. The soldering surface 22b is covered with an insulating resist layer (not shown).

  The circuit board 22 has, for example, a plurality of cutouts 22c as filling material passing portions over the front and back surfaces thereof. These notches 22c are respectively provided on both side edges of the circuit board 22 as shown in FIGS. These notches 22c avoid circuit patterns. The filler passing portion may be provided anywhere as long as the circuit pattern is not cut off. Further, the filler passage portion can be formed by a hole located between both side edges of the circuit board 22 and can be used in combination with the hole and the notch.

  The lighting circuit 23 is a combination of a circuit pattern and a plurality of electrical components 26 (see FIG. 4 and FIG. 8) connected to the circuit pattern, and includes, for example, an inverter circuit unit. Examples of the electrical component 26 include a semiconductor such as a power transistor, a resistor, a capacitor, a coil, a transformer, a diode, and other various chip components.

  In FIG. 8, reference numeral 26a denotes a power transistor which is one of the electrical components 26, which is accompanied by heat generation. Reference numeral 27 denotes a heat sink thermally connected to the power transistor 26a. The heat radiating plate 27 is erected along one side edge of the circuit board 22 so as to be perpendicular to the component mounting surface 22 a and slightly protrudes outside the side edge of the circuit board 22.

  The lighting circuit 23 is formed across both front and back surfaces of the intermediate portion excluding both longitudinal ends of the circuit board 22. Most of the electrical components constituting the lighting circuit 23 are mounted on the component mounting surface 22a. The electrical component 26 includes a plurality of electrical components mounted on the circuit board 22 by flow soldering processing in addition to surface mounting components such as chip components. An electrical component to be subjected to flow soldering has a pin-like terminal 29 that penetrates the circuit board 22. The electrical component to be flow soldered is mounted on the circuit board 22 by passing the circuit board 22 through the flow solder layer and soldering the terminals 29 to each land of the circuit pattern.

  As shown in FIG. 8, the input (high voltage side) wire connector 24 is soldered to one end of the circuit board 22 in the longitudinal direction. The output (low voltage side) electric wire connector 25 is soldered to the other longitudinal end of the circuit board 22. These electric wire connectors 24 and 25 also have pin-like terminals 30. The electric wire connectors 24 and 25 together with the electric parts having the terminals 29 are mounted on the circuit board 22 by flow soldering. A core wire of a power supply-side insulation-coated electric wire (not shown) is inserted and connected to the electric wire connector 24. A core wire of an insulation coated electric wire (not shown) for wiring in the instrument is inserted and connected to the electric wire connector 25.

  4 and 8, reference numeral 35 denotes a component cap. The component cap 35 is formed of an electrical insulator such as hard synthetic resin or synthetic rubber. The component cap 35 is covered by a part of the electrical components, and is provided so that the filler 55 does not contact the electrical components. The electrical component isolated from the filler 55 by the component cap 35 is an electrical component that is not preferably embedded in contact with the filler 55. An example of this type of electrical component is an electrolytic capacitor 26b. The electrical component 26 covered with the component cap 35 may or may not contact the inner surface of the component cap 35.

  The opening surface of the component cap 35 is in contact with the component mounting surface 22 a of the circuit board 22. It is preferable to fix the component cap 35 to the component mounting surface 22a with an adhesive (not shown). Thereby, it is possible to obtain a sealing function that prevents the component cap 35 from being held on the circuit board 22 and prevents the uncured filler from entering the component cap 35.

  The tray 41 is a filling container for filling the filling material 55. As shown in FIGS. 3 and 4, the tray 41 has a tray body 42 and a plurality of, for example, a pair of connector caps 43 and 44. The tray main body 42 is slightly smaller than the cover 15 and is accommodated along this inner surface shape so as to contact the inner surface of the cover 15. The connector caps 43 and 44 are formed separately from the tray main body 42.

  The tray main body 42 is preferably made of an inexpensive electrical insulating material having heat resistance, for example, a film-like molded product made of polypropylene ethylene (PP). As shown in FIGS. 6 to 8, 10, 12, etc., the tray body 42 has cap connection portions 42 a at both ends in the longitudinal direction. The depth of the tray main body 42 between the cap connecting portions 42a is deeper than the depth of the tray main body 42 at the cap connecting portion 42a. This deep part is formed in the size which contacts the inner surface of the cover 15. For example, a rectangular cap through hole 42d is formed in each cap connecting portion 42a as shown in FIG.

  3 and 5 to 8, reference numeral 42 b indicates a side plate of the tray main body 42. Reference numeral 42 c in FIG. 5 indicates an opening edge of the tray main body 42. The opening edge 42c is continuous from the deep part of the tray body 42 to the left and right cap connecting portions 42a, and has a rectangular shape, for example.

  The opening edge 42c is formed by cutting the cut edge 42e of the molded tray body 42. That is, reference numeral 42f in FIGS. 7 to 12 excluding FIG. 9 indicates a corner corresponding to the opening edge 42c. The cut edge 42e is integrally connected to the corner 42f. The cut edge 42e is formed slightly larger than the corner 42f and has a skirt shape. By cutting along the corner portion 42f, the cut edge portion 42e is removed and the opening edge 42c is formed.

  As shown in FIGS. 5 to 8, a plurality of rib-like convex portions 42 g are provided on each of the side plates 42 b of the tray main body 42. These rib-shaped convex portions 42g are provided at predetermined intervals in the longitudinal direction of the side plate 42b and extend in a direction orthogonal to the longitudinal direction of the side plate 42b. The rib-like convex portion 42g protrudes from the inner surface of the side plate 42b with the side plate 42b recessed from the outside. The rib-shaped convex part 42g can also be made to protrude from the inner surface of the side plate 42b with the side plate 42b recessed from the inside. The rib-like convex portion 42g reinforces the side plate 42b.

  As shown in FIG. 7 and the like, a plurality of support convex portions 45 are formed on the tray body 42. These support protrusions 45 protrude from the inner surface of the side plate 42 b and extend in the thickness direction (vertical direction) of the tray 41. A plurality of raised bottom portions 46 to 52 are integrally formed on the tray 41 between the cap connection portions 42a. The raised bottom portions 47 to 51 are gathered at the center in the longitudinal direction of the tray main body 42.

  The raised bottom portions 46 to 52 are provided corresponding to a region where the arrangement density of the electrical components 26 of the circuit module 21 is low and a region where electrical components such as chip components are gathered. Therefore, as shown in FIG. 4 and FIG. 8 and the like, the outer surface of the tray main body 42 is bumpy, and this bumpy shape corresponds to the arrangement and height of the electrical component 26.

  The raised bottom portions 46 to 52 are all separated from the side plate 42 b of the tray body 42. Accordingly, a passage P (see FIGS. 10 and 14) is formed between the tray 41 and the side plate 42b before the tray 55 is filled with the filler 55. These passages P communicate with both sides in the longitudinal direction of the tray 41 with the raised bottoms 46 to 52 as a boundary.

  In the configuration in which the passage P is provided and the raised bottom portions 46 to 52 are formed, the cross-sectional modulus of the transverse section of the tray body 42 passing through the raised bottom portions 46 to 52 is increased, and the strength of the tray body 42 can be improved. Thereby, although the plate | board thickness of the tray 41 is thin, the center part of the tray main body 42 can be made difficult to bend, and the handling can be made easy. Therefore, when the lighting device 5 is assembled, it is possible to contribute to facilitating the work of placing the tray 41 on the circuit module 21. The strength of the both ends of the tray main body 42 is improved by the cap connecting portion 42a.

  The connector caps 43 and 44 are made of synthetic rubber, for example. One connector cap 43 is formed so as to be tightly fitted to the input electric wire connector 24 by its elastic deformation. The connector cap 43 penetrates the cap through hole 42d of one cap connection portion 42a in a liquid-tight manner. The other connector cap 44 is formed so as to be tightly fitted to the output wire connector 25 by its elastic deformation. The connector cap 44 penetrates the cap through hole 42d of the other cap connecting portion 42a in a liquid-tight manner.

  The structure in which the connector caps 43 and 44 penetrate the cap through hole 42d in a liquid-tight manner is the same. Therefore, the relationship between the connector cap 44 and the cap through hole 42d corresponding thereto will be described as a representative. The connector cap 44 has an annular groove 52 (see FIGS. 12 and 13) on the outer periphery on the open end face 44a side. A hole edge of the cap through hole 42d is fitted in the groove 52. Thereby, the liquid tightness between the connector cap 44 and the cap through hole 42d is achieved.

  The open end surfaces 43 a and 44 a of the connector caps 43 and 44 are positioned in the tray main body 42, and the height position thereof is substantially the same as the height position of the support convex portion 45. The height positions of the bottom surfaces of the raised bottom portions 46 to 52 are lower than the height positions of the open end surfaces 43a and 44a. The open end faces 43 a and 44 a of the connector caps 43 and 44 are in contact with the component mounting surface 22 a of the circuit board 22. It is preferable to fix the connector caps 43 and 44 to the component mounting surface 22a with an adhesive 53 representatively shown in FIG. Thereby, the gap between the connector caps 43 and 44 and the circuit board 22 can be sealed to prevent the uncured filler from entering the connector caps 43 and 44.

  As shown in FIG. 8, each of the connector caps 43 and 44 has a plurality of electric wire insertion portions 54 into which the terminal portions of the insulated coated electric wires for power supply or in-apparatus wiring are inserted. As represented by the connector cap 44 shown in FIG. 12, the wire insertion portion 54 has a thin portion 54a with a small hole. A plurality of annular protrusions 54 b are provided on the inner surface of the wire insertion portion 54.

  The core wire and the terminal portion exposed at the terminal portion of the electric wire can be inserted into the electric wire insertion portion 54 through the thin portion 54a. With this insertion, the outer periphery of the wire terminal portion is brought into close contact with each annular protrusion 54b, thereby achieving liquid tightness. The core wire of the wire end portion inserted into the wire insertion portion 54 is inserted into the wire connector 24 or 25. The inserted core wire is inserted into a terminal (not shown) built in the electric wire connectors 24 and 25 to be electrically and mechanically connected.

  The circuit module 21 is housed in the tray 41 with its component mounting surface 22a facing the inside of the tray 41. Prior to this housing, a component cap 35 is attached to the component mounting surface 22a so as to cover the electrolytic capacitor 26b. Further, the connector cap 43 is already fitted on the wire connector 24. Similarly, a connector cap 44 is fitted on the electric wire connector 25. Moreover, when the circuit module 21 is accommodated in the tray 41, the grooves 52 of the connector caps 43 and 44 and the hole edges of the cap through holes 42d are fitted.

  With the above accommodation, both ends in the longitudinal direction of the circuit board 22 are supported on the open end surfaces 43a and 44a of the connector caps 43 and 44, respectively. Similarly, the intermediate portion of the circuit board 22 is placed on and supported by the plurality of support protrusions 45 by the housing. The circuit module 21 is positioned at a predetermined position of the tray 41 by such support and the fitting of the hole edge of the cap through hole 42d to the connector caps 43 and 44.

  The terminals 29 of the electrical components 26 of the circuit module 21 accommodated in the tray 41 and the terminals 30 of the wire connectors 24 and 25 thus protrude upward from the soldering surface 22b of the circuit board 22, respectively. However, the terminals 29 and 30 are arranged lower than the corners 42f corresponding to the opening edges 42c of the tray 41 (see FIG. 12).

  Further, as illustrated in FIGS. 3 and 4, the tips (lower ends in FIGS. 3 and 4) of each electrical component 26 are all separated from the inner surface of the tray body 42. Moreover, the raised bottom portion 46 of the tray main body 42 is divided into a region where the electrical component 26 of the circuit module 21 is disposed at a low density and a region where electrical components such as chip components are gathered and disposed. To 52 are opposed to each other.

  The filler 55 is a synthetic resin having electrical insulation and waterproof properties. In this embodiment, a urethane resin mixed with a filler (not shown) is used. The filler is made of an inorganic material such as aluminum oxide. The mixing of the filler is preferable for improving the heat dissipation of the filler 55. The filling material 55 is filled in the tray 41 by embedding the circuit module 21 accommodated in the tray 41.

  This filling is performed by injecting an uncured filling material 55w through a gap between the opening edge 42c of the tray 41 and the circuit board 22, particularly through the notch 22c. This situation is indicated by a two-dot chain line in FIG.

  In this pouring operation, the opening through which the uncured filler 55w flows to the lower side of the circuit board 22 is widened by the notch 22c from the other gap. In addition, the air below the circuit board 22 easily escapes through the other notches 22c that are not used for injection. For this reason, even the uncured filler 55w having a certain degree of viscosity can be smoothly injected into the tray 41 and filled.

  For this reason, when the lighting device 5 is assembled, the time required for filling the filler 55 is shortened, which can contribute to cost reduction. Moreover, when filling the filler 55w, the filler 55w flowing in the tray 41 along its longitudinal direction can be passed through the passage P between the side plate 42b and the raised bottoms 46 to 52. This also shortens the time required for filling.

  As described above, since the replacement of the filler 55w with air is good, filling failure can be suppressed. That is, a cavity caused by residual air can be prevented from being formed between the component mounting surface 22a and the tray body 42. If the cavities remain in the filler 55, moisture may accumulate there, which is not preferable from the viewpoint of waterproofing and insulation.

  The notch 22c that is not used for filling when the filling material 55w described above is filled is also used as a return path for the surplus of the filled material 55w. Through this return passage, the already injected filler 55 w can be made to flow backward from the lower side of the circuit board 22 to the upper side of the circuit board 22.

  Thereby, the soldering surface 22b is covered with the filler 55w, and the soldering surface 22b can be insulated. This state is shown in FIG. The filling of the filling material 55w is stopped when the upper surface of the filling material 55w reaches the corner portion 42f, using the corner portion 42f of the tray 41 as a guide.

  In the above filling, the weight of the filler 55w is applied to the side plate 42b of the tray 41. The side plate 42b is reinforced with a plurality of rib-shaped convex portions 42g provided therein. For this reason, it can suppress that the side plate 42b deform | transforms outside so that the width | variety of the tray 41 may spread. Therefore, it is easy to maintain the shape of the tray 41, and variations in the filling amount of the filler 55w can be suppressed.

  Connector caps 43 and 44 that are individually covered and held on the wire connectors 24 and 25 pass through the cap through holes 42 d of the tray 41. In this through portion, the hole edge of the cap through hole 42d is fitted in the annular groove 52 of the connector cap 43, 44. For this reason, it is possible to prevent the uncured filler 55w from leaking out of the tray 41 through the penetrating portion. Thereby, while being able to prevent the external appearance defect of the waterproof assembly 31, the dispersion | variation in the filling amount of the filler 55w can also be suppressed.

  The filling operation is preferably performed in a state where the tray 41 in which the circuit module 21 is housed is fitted inside the cover 15 (see a two-dot chain line in FIG. 11). In this case, the cover 15 can reliably prevent the side plate 42b from being deformed due to the filling. In a state where the tray 41 is fitted in the cover 15, the connector caps 43 and 44 are exposed to the hole-like portions 16 and 17 that face each other. Thereby, it will be in the state in which the insertion of the electric wire to the electric wire insertion part 54 of the connector caps 43 and 44 is possible.

  3, 4, and 11, reference numeral 55 a indicates a solder cover layer of the filler 55 that covers the soldering surface 22 b of the circuit board 22. The terminals 29 and 30 are embedded in the solder cover layer 55a. The surface of the solder cover layer 55a is preferably a flat surface. The height of the surface is the same as the height of the corner 42f corresponding to the opening edge 42c of the tray 41, for example. The height of the surface of the solder cover layer 55a can be lower than the corner portion 42f.

  The tray 41 that is substantially filled with the filler 55w is passed through a heating and curing furnace (not shown), whereby the filler 55w is cured. The tray 41 made of PET can exhibit sufficient heat resistance against the heat given by this heat treatment. The cut edge 42e of the tray 41 is used when handling the tray 41 from the filling of the filler 55w to the heat treatment. Further, the cut edge portion 42e functions as a dike that suppresses spilling of the uncured filler 55w in the tray 41 during handling of the tray 41.

  In the above filling, it is preferable to use an uncured filler 55w that has been defoamed in advance. Further, it is preferable to perform a defoaming process on the uncured filler 55 w being injected into the tray 41 or the filler 55 w injected into the tray 41. The defoaming process is performed by placing the filler 55w in a reduced pressure atmosphere. By such defoaming treatment, it is possible to prevent cavities due to residual bubbles from being formed in the cured filler 55.

  After the heat treatment, the cut edge 42e is cut. By this cutting, the opening edge 42c of the tray 41 and the surface of the solder cover layer 55a are continuously in a flush state. The filler 55, the tray 41, and the circuit module 21 assembled in this way form a waterproof assembly 31. The waterproof assembly 31 ensures the waterproof property to the circuit module 21 by the waterproof performance of the filler 55.

  In the waterproof assembly 31, since the tray 41 has the raised bottom portions 46 to 52, the amount of the filler 55 used can be reduced as compared with the configuration using the tray without the raised bottom portion. Thereby, it is possible to shorten the filling operation time and reduce the cost of the lighting device 5.

  The waterproof assembly 31 is accommodated in the cover 15 so that the outer surface of the tray 41 contacts the inner surface of the cover 15. In other words, the tray 41 is accommodated with respect to the cover 15 in a full state. Thereby, heat conduction from the waterproof assembly 31 to the cover 15 is possible. In this heat conduction, the rib-like convex portion 42g does not become a spacer between the side wall 15b and the side plate 42b. Further, the heat radiating plate 27 protruding from the circuit board 22 is brought into a close contact state by strongly pressing one side plate 42 b of the tray 41 against one side wall 15 b of the cover 15. Since the heat sink 27 is connected to the power transistor 26a that generates a large amount of heat, heat conduction from the power transistor 26a to the cover 15 via the heat sink 27 is reliable.

  The housing base 12 is covered with the cover 15 in which the waterproof assembly 31 is housed. Thereafter, the housing base 12 and the cover 15 are connected, and the outer case 11 is assembled. By this assembly, the solder cover layer 55a of the filler 55 is covered with the base wall 12a of the storage base 12. Moreover, the base wall 12a and the solder cover layer 55a are in surface contact as shown in FIGS. The solder cover layer 55a has electrical insulation. For this reason, in spite of the said surface contact, the sheet | seat member which aims at the electrical insulation between the accommodation base 12 and the circuit module 21 is not required.

  A wide contact area is ensured by the surface contact. Therefore, the heat of the waterproof assembly 31 can be smoothly conducted to the housing base 12. When a gap is generated between the base wall 12a and the solder cover layer 55a, the heat transfer member may be sandwiched between the base wall 12a and the solder cover layer 55a. This heat transfer member is made of a highly heat-conductive sheet having a thickness corresponding to the gap. With this heat transfer member, smooth heat conduction between the base wall 12a and the solder cover layer 55a can be achieved.

  Each of the accommodation base 12 and the cover 15 of the outer case 11 is provided with a drainage portion. That is, as shown in FIGS. 2 to 4, a plurality of drainage portions 14 are opened in the base wall 12 a of the housing base 12. At the same time, a plurality of drainage portions 18 are also opened in the cover main wall 15 a of the cover 15. These drainage parts 14 and 18 consist of holes.

  Moisture or the like may condense between the outer case 11 and the tray 41, the solder cover layer 55a, or the like. In this case, the condensed water can be discharged to the outside of the outer case 11 through the drainage parts 14 and 18. Therefore, the electrical insulation performance of the lighting device 5 can be improved. Such drainage is also effective in suppressing the occurrence of rust in the outer case 11 when the outer case 11 is made of a ferrous metal.

  The lighting device 5 having the above configuration includes a tray 41 that is accommodated in the cover 15 of the outer case 11, and the circuit module 21 accommodated in the tray 41 is filled in the tray 41 except for the wire connectors 24 and 25. It is embedded in the material 55.

  The filler 55 is electrically insulating and waterproof. For this reason, the circuit board 22, the electrical component 26, the soldering surface 22b, etc. of the circuit module 21 can be waterproofed by the filler 55.

  The tray 41 is sized to be accommodated in the cover 15 in a full state. Since the above-described waterproofing is realized inside the outer case 11 using the tray 41, the outer case 11 does not become large due to the waterproof structure. Thereby, it is also possible to use an outer case made of existing manufacturing equipment. At the same time, the waterproof structure in the outer case 11 described above makes it possible to obtain a waterproof performance that can withstand a high humidity environment without requiring a large waterproof case for housing the outer case 11.

  For this reason, the lighting device 5 can be configured in a small size. Moreover, in addition to the assembly of the lighting device 5, the trouble of housing the lighting device 5 in the waterproof case and the trouble of assembling the waterproof case thereafter are unnecessary. Thereby, the lighting device 5 can be assembled easily.

  As described above, the cost increase due to the use of the waterproof case itself can be eliminated. In addition, the assembly cost can be reduced. Therefore, it is possible to reduce the cost of the lighting device 5 and thus the lighting fixture 1 including the lighting device 5.

  Further, since the cover 15 is provided with the raised bottom portions 46 to 52, the strength of the cover 15 can be increased to facilitate the assembly. In addition, the raised bottom portions 46 to 52 can reduce the filling volume of the filling material 55 and reduce the filling amount. Also in this respect, the lighting device 5 and, consequently, the lighting fixture 1 including the lighting device 5 can be reduced in cost.

  The filler 55 of the lighting device 5 has not only waterproof performance but also heat dissipation performance. For this reason, heat of the power transistor 26 a and other electrical components that generate heat can be conducted to the outer case 11 through the filler 55. In this case, the capacity of the filler 55 is large, and the heat conduction area from the filler 55 to the outer case 11 is also large. Therefore, excellent heat dissipation characteristics can be obtained. In particular, by employing the filler 55 mixed with an inorganic filler, the heat dissipation characteristics can be further improved.

  Moreover, since the circuit module 21 is embedded in the filler 55 as described above, the filler 55 can reliably prevent dust. Thereby, it is suitable also as the lighting device 5 used in the place where there is a lot of dust, and thus the dust-proof lighting fixture 1 including the lighting device 5.

  Connector caps 43 and 44 that are tightly fitted to the electric wire connectors 24 and 25 are bonded to the component mounting surface 22 a of the circuit board 22. For this reason, when the waterproof assembly 31 is manufactured, the uncured filler 55 w injected into the tray 41 is prevented from entering the connector caps 43 and 44. Thereby, the filler 55w does not enter the electric wire connectors 24, 25. Therefore, when an insulation-coated electric wire is inserted and connected to the electric wire connectors 24 and 25 of the manufactured lighting device 5, there is no fear that this connection cannot be made by the cured filler 55.

  When the waterproof assembly 31 is manufactured, the electrolytic capacitor 26b is isolated from the uncured filling material 55w filled in the tray 41 by the component cap 35 covering the electrolytic capacitor 26b. That is, the filling material 55w filled in the tray 41 does not contact the electrolytic capacitor 26b and does not fill the electrolytic capacitor 26b. For this reason, there is no fear that the function of the electrolytic capacitor 26b is lowered by the cured filler 55, and the intended function can be exhibited in the electrolytic capacitor 26b.

  15 to 17 show a second embodiment of the present invention. The second embodiment is the same as the first embodiment except for the items described below. Therefore, the same or functionally similar configuration as in the first embodiment is assigned the same reference numeral as in the first embodiment, and the description is omitted.

  In the second embodiment, crossing grooves 48a, 49a, 51a are individually provided in some raised bottom portions 48, 49, 51. These raised bottom portions 48, 49, 51 are longer in length across the cover 15 than the other raised bottom portions.

  The transition groove 48 a crosses the raised bottom portion 48. Both ends of the crossing groove 48a are opened to two side surfaces of the raised bottom portion 48, preferably two side surfaces corresponding to the longitudinal direction of the tray 41 as shown in FIG.

  The transition groove 49 a crosses the raised bottom 49. Both ends of the crossing groove 49a are open to two side faces of the raised bottom 49, preferably two side faces corresponding to the longitudinal direction of the tray 41 as shown in FIG.

  The transition groove 51 a crosses the raised bottom 49. Both ends of the crossing groove 51a are open to two side faces of the raised bottom 51, preferably two side faces corresponding to the longitudinal direction of the tray 41 as shown in FIG.

  The configuration other than the items described above is the same as that of the first embodiment. Therefore, the second embodiment can obtain the same operation as the first embodiment and can solve the problem of the present invention. In addition, since the grooves 48a, 49a, 51a are provided in the raised bottom portions 48, 49, 51, respectively, the following points are excellent.

  Each of the raised bottom portions 48, 49, 51 has a long length across the cover 15 in the width direction. Thereby, it is easy to dam the uncured filler 55w which is injected into the tray 41 and tends to flow in the longitudinal direction of the tray 41. As a result, as shown in FIG. 15, it is difficult for the filler 55 w to fill the narrow gap G between the adjacent raised bottom portions 48 and 49.

  However, the uncured filler 55w that has been dammed can move in the tray 41 using the crossing grooves 48a, 49a, 51a as passages. As a result, the entire area of the tray 41 can be easily and reliably filled with the filler 55w. Moreover, the ends of the grooves 48 a and 49 a are continuous across the gap G. For this reason, the uncured filler 55w can be easily and reliably filled into the gap G through the cross grooves 48a and 49a. Therefore, since it can suppress that the space | gap G remains as a space | gap, the reliability on the waterproofing and insulation of the lighting device 5 is improved.

  FIG. 18 shows a third embodiment of the present invention. The third embodiment is the same as the first embodiment except for the items described below. Therefore, the same or functionally similar configuration as in the first embodiment is assigned the same reference numeral as in the first embodiment, and the description is omitted.

  In 3rd Embodiment, the both ends of the tray 41 are formed in the depth which can accommodate the electric wire connectors 24 and 25. FIG. The connector cover used in the first embodiment is omitted. Furthermore, the tray main body 42 does not have a connector connecting portion. Insulated coated wires 57 and 58 are individually inserted and connected to the wire connectors 24 and 25, respectively. These insulated wires 57 and 58 penetrate the tray 41 and the cover 15. A bush 59 made of synthetic rubber or the like is provided in the penetrating portion. The bush 59 protects the insulation-coated electric wires 57 and 58 and prevents the uncured filler filled in the tray 41 from leaking through the through portion.

  Injecting the uncured filler into the tray 41 is performed by connecting the insulation-coated wires 57 and 58 to the wire connectors 24 and 25 in advance, and using the bushes 59 to penetrate the insulation-coated wires 57 and 58 with respect to the tray 41 and the cover 15. This is done in a sealed state. Therefore, the entire circuit module 21 including the circuit board 22, the electrical component 26, and the wire connectors 24 and 25 is embedded in the filler 55.

  The configuration other than the items described above is the same as that of the first embodiment. Therefore, even in the third embodiment, the same operation as in the first embodiment can be obtained and the problem of the present invention can be solved.

  In the present invention, the circuit module may not include an electrical connector. In this case, the insulated coated electric wire may be directly connected to the circuit board of the circuit board by soldering or the like. This insulated wire is drawn out of the circuit module through the filler.

  When implementing this invention as an electronic device, implementation is not restrict | limited to a lighting device. For example, the present invention can be applied as an electronic device forming an electric circuit of a waterproof radio. Furthermore, the present invention can also be applied to portable electronic devices and the like that need to have a waterproof function enhanced.

The perspective view which shows the lighting fixture which concerns on 1st Embodiment of this invention. The perspective view which shows the lighting device which concerns on 1st Embodiment of this invention with which the lighting fixture of FIG. 1 is provided. Sectional drawing which follows the F3-F3 line | wire in FIG. Sectional drawing which follows the F4-F4 line | wire in FIG. The perspective view which shows the waterproof assembly of the lighting device of FIG. 2 as seen from the back side. The perspective view which shows the tray with which the waterproof assembly of FIG. 5 is provided seeing from the front side. The perspective view shown from the back side in the state which isolate | separated the tray of FIG. 6, and the circuit module accommodated in this. FIG. 7 is a perspective view showing a part of the tray shown in FIG. 6 and a circuit module accommodated in the tray in an exploded state as viewed from the front side. FIG. 6 is a rear view showing the waterproof assembly of FIG. FIG. 6 is a rear view showing a tray provided in the waterproof assembly of FIG. 5. Sectional drawing which shows the state by which the filler was inject | poured into the tray which accommodated the circuit module shown in FIG. Sectional drawing which shows the relationship between the tray with which the waterproof assembly of FIG. 5 is equipped, and a connector cover. The perspective view which shows the connector cover with which the waterproof assembly of FIG. 5 is provided. Sectional drawing of the tray shown along F11-F11 line | wire in FIG. The back view which shows the tray with which the lighting device which concerns on 2nd Embodiment of this invention is provided. Sectional drawing of the tray shown along F16-F16 line | wire in FIG. Sectional drawing which shows the lighting device which concerns on 2nd Embodiment. Sectional drawing which shows the lighting device which concerns on 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Lighting fixture, 2 ... Chassis, 3 ... Lamp socket, 4 ... Fluorescent lamp (discharge lamp), 5 ... Lighting apparatus (electronic device), 11 ... Outer case, 12 ... Housing base, 15 ... Cover, 16, 17 ... Hole part, 21 ... Circuit module, 22 ... Circuit board, 22a ... Component mounting surface, 22b ... Soldering surface, 22c ... Notch (filler through part), 23 ... Lighting circuit, 24, 25 ... Electric wire connector, 26 ... Electrical parts, 26a ... Electrolytic capacitors (some electrical parts), 29, 30 ... Terminals, 31 ... Waterproof assembly, 35 ... Part caps, 41 ... Tray, 42 ... Tray body, 42a ... Cap connecting part, 42d ... Cap Through hole, 43, 44 ... Connector cap, 46 to 52 ... Raised bottom, 48a, 49a, 51a ... Crossing groove, 52 ... Annular groove, 55 ... Filler, 55a ... Solder cover layer

Claims (7)

A circuit module comprising a circuit board and a plurality of electrical components mounted on the board to form an electronic circuit;
A tray containing the circuit module and having a raised bottom portion protruding toward the circuit board;
A filling material having waterproofness and electrical insulation, and filling the tray by filling the circuit board and electrical components;
An electronic apparatus comprising:   2. The electronic apparatus according to claim 1, wherein the raised bottom portion has a crossing groove that crosses the bottom portion, and both ends of the crossover groove are open to a side surface of the raised bottom portion.   The electronic device according to claim 1, further comprising a component cap that covers a part of the plurality of electrical components and isolates the electrical component from the filler.   4. The circuit module according to claim 1, wherein the circuit module includes an electric wire connector connected to the electronic circuit and mounted on the circuit board, and the tray includes a connector cap that covers the electric wire connector. One electronic device.   The tray includes a tray main body having a cap through hole and the connector cap formed separately from the main body and penetrating through the cap through hole, and an annular groove is provided on an outer periphery of the connector cap. The electronic device according to claim 4, wherein a hole edge of the cap through hole is fitted.   A lighting device for lighting a discharge lamp by the electronic apparatus according to claim 1. With chassis;
A lamp socket attached to this chassis;
A discharge lamp removably supported in the socket;
The lighting device according to claim 6 attached to the chassis and lighting the discharge lamp;
The lighting fixture characterized by comprising.

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