JP2006078439A - Semiconductor inspecting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a probe inspection via a light signal, and to enable electrical inspection of a semiconductor device (LSI) to be carried out, even when the probe inspection of a type which makes a probe needle to come into contact, cannot be carried out. <P>SOLUTION: A semiconductor inspection apparatus is provided, which inspects the electrical characteristics of the semiconductor device that is optically connectable to the outside via an optical interface, and which is equipped with a measuring device 10 for generating a testing electric signal to be fed to the semiconductor device and carrying out a measurement, based on a testing optical signal from the semiconductor device, in response to the testing electrical signal; a photoelectric converter 11 for converting the testing electrical signal into an optical signal and converting the testing optical signal into an electrical signal; and a probe card 12 for guiding the optical signal from the photoelectric converter 11 to the semiconductor device, and guiding the optical signal from the semiconductor device to the photoelectric converter 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor inspection apparatus for inspecting electrical characteristics of a semiconductor device.

In the conventional semiconductor inspection apparatus, the electrical characteristics are inspected by bringing the probe needle (probe terminal) into contact with the external connection terminal (connection pin, pad, bump electrode, etc.) of the semiconductor device to be inspected ( For example, see Patent Document 1).
JP 11-94910 A

  Most of the current LSIs have a type of package structure in which external connection terminals are derived to the outside, but in the future, there is a possibility that those having a package structure with input / output terminals for optical signals will appear. (For example, in an LSI equipped with an optical computer, an input / output interface is also performed using an optical signal). Such a type of semiconductor device (LSI) cannot be subjected to a conventional probe test in which a probe needle (probe terminal) is brought into contact.

  In addition, for example, the number of necessary external connection terminals is insufficient, or a special three-dimensional structure such as a cubic type makes it difficult to contact the probe needle. The occurrence of a situation in which the probe inspection of the type in which the probe needle (probe terminal) is brought into contact cannot be performed. In the case as described above, it is necessary to adopt a probe inspection method other than the method in which the probe needle (probe terminal) is brought into contact.

  An object of the present invention is to realize a probe inspection via an optical signal, and to perform an electrical inspection of a semiconductor device (LSI) even when a probe inspection of a type in which a probe needle is brought into contact cannot be performed. .

  The semiconductor inspection apparatus of the present invention is a semiconductor inspection apparatus that inspects the electrical characteristics of a semiconductor device that can be optically connected to the outside via an optical interface, and that is a test electric signal supplied to the semiconductor device. Means for generating and measuring the test electrical signal based on the test optical signal from the semiconductor device; converting the test electrical signal into an optical signal; and converting the test optical signal into the electrical signal Means for performing conversion, means for guiding the optical signal output from the photoelectric conversion means to the semiconductor device, and means for guiding the optical signal output from the semiconductor device to the photoelectric conversion means. .

  When the semiconductor device to be inspected has an optical input / output interface, an optical fiber can be used in place of the probe needle to realize a probe inspection (non-contact type) via an optical signal. It can also be applied to cases where it is difficult to contact the probe needle, and problems such as bending and wear of the probe needle do not occur. Also, using optical communication technology (modulation, multiplexing, etc.), optical signals (test signals and measurement signals from semiconductor devices) are efficiently multiplexed and a large amount of information is transmitted. By demodulating and distributing to a predetermined circuit, it is possible to realize an inspection system that can process a large amount of information that has not been conventionally available at an extremely high speed.

  In one embodiment of a semiconductor device including an optical input / output interface, a light receiving element that converts an optical signal into an electric signal and a light emitting element that converts an electric signal into an optical signal are incorporated in the package structure. The inspection target semiconductor device itself has a built-in light receiving element and light emitting element, and defines a case where an input / output interface using an optical signal is directly possible. There is an advantage that an efficient inspection can be performed by utilizing the function of the semiconductor device.

  In another aspect of the semiconductor device, a light receiving element that converts an optical signal into an electrical signal and an optical interface unit that incorporates a light emitting element that converts an electrical signal into an optical signal are externally configured. The optical interface unit is externally attached to the semiconductor device to be inspected, and the case where optical signals can be input / output through the optical interface unit is defined. It is possible to perform a probe inspection via an optical signal even for a semiconductor device that does not include or cannot incorporate an optical element. Further, by devising the mounting structure (detachable structure) of the optical interface means to the semiconductor device, optical probe inspection can be applied to various types of packages.

  According to the present invention, an optical fiber can be used in place of a probe needle to realize a probe inspection (non-contact method) via an optical signal. Therefore, even when a probe inspection of a type in which the probe needle is brought into contact cannot be performed, an electrical inspection of the semiconductor device (IC) can be performed.

  FIG. 1 is a diagram showing an outline of the entire configuration of a semiconductor inspection apparatus according to the present invention. As illustrated, the semiconductor inspection apparatus of the present invention includes a measuring instrument 10, a photoelectric conversion device 11, and a probe card 12 including an optical fiber that functions as a probe needle (probe terminal) ( In FIG. 1, the optical fiber is not shown).

  The measuring instrument 10 and the photoelectric converter 11 are connected by an electric signal input line (Lin1) and an electric signal output line (Lout1). The photoelectric converter 11 and the probe card 12 are connected by an optical signal input line (Lin2) and an optical signal output line (Lout2).

  The measuring device 10 outputs an electrical signal for testing via an electrical signal output line (Lout1). The electrical signal for testing is converted into an optical signal by the photoelectric converter 11. The optical signal generated by the photoelectric conversion is sent to the probe card 12 via the optical signal output line (Lout2), and is sent to the semiconductor device (IC: not shown) to be inspected via the optical fiber (not shown). Sent.

  An optical signal (a measurement signal having a predetermined electrical characteristic) sent from the semiconductor device to be inspected passes through the optical fiber of the probe card 12 and further undergoes photoelectric conversion via the optical signal input line (Lin2). It reaches the device 11 and is converted into an electric signal by photoelectric conversion. The electric signal obtained by the photoelectric conversion is input to the measuring instrument 10 via the electric signal input line (Lin1). The measuring instrument 10 performs measurement and predetermined inspection (non-defective / defective product determination, etc.) based on this input signal.

  FIG. 2 is a diagram showing an outline of transmission / reception of an optical signal between an optical fiber provided in the probe card and a device on the inspection object side. As shown in the drawing, an optical signal (IN1) output from the photoelectric converter 11 is input from one end of an optical fiber 21a (corresponding to Lout2 in FIG. 1) that functions as a probe needle (probe terminal). The optical signal (IN2) propagated through the fiber 21a is taken out from the other end of the optical fiber 21a and guided to the light receiving element 30 on the inspection target device (including the inspection target semiconductor device) 40. Then, it is converted into an electric signal and supplied as appropriate to the internal circuit of the semiconductor device (IC) to be inspected.

  Similarly, the light (OUT1) emitted from the light emitting element 31 on the inspection target apparatus (including the inspection target semiconductor device) 40 is one end (inspection target) of the optical fiber 21b (corresponding to Lin2 in FIG. 1). The optical signal (OUT2) that is input from one end near the device 40 on the side and propagates through the optical fiber 21b is taken out from the other end of the optical fiber 21b, led to the photoelectric conversion device 11, and converted into an electrical signal. Input to the measuring instrument 10.

  FIG. 3 is a diagram showing a configuration example of a signal processing path in the semiconductor inspection apparatus shown in FIGS. 1 and 2. In FIG. 3, only a path for transmitting a signal from the measuring instrument 10 to the apparatus 40 on the inspection target side (including the semiconductor apparatus to be inspected) is drawn (the reverse path has the same configuration). As illustrated, the photoelectric converter 11 adjacent to the measuring instrument 11 includes a resistor R1 and a light emitting diode D1 connected in series. Further, the light receiving element 30 connected to the inspection-side device (including the inspection-target semiconductor device) 40 is composed of at least one photodiode (or phototransistor).

  As is apparent from FIG. 3, in the semiconductor inspection apparatus of the present embodiment, information is exchanged by optical communication via an optical fiber instead of physical contact with a conductor as in the prior art. It is a structural feature that both the measuring instrument 10 side) and the device 40 on the inspection object side (including the semiconductor device to be inspected) are provided with optical interface means.

  According to the present invention, it is possible to perform a non-contact type probe inspection which is completely different from the conventional type in which the probe needle (probe terminal) is connected to the external connection terminal of the IC, and the probe needle (probe terminal) is deformed. As a result, problems such as wear are solved, the reliability of inspection is improved, and unprecedented high-speed inspection can be performed.

  Since the semiconductor inspection apparatus of the present invention can realize a probe inspection (non-contact type) via an optical signal by using an optical fiber instead of a probe needle, Even when the probe inspection cannot be performed, the semiconductor device (IC) can be electrically inspected, and is useful as a semiconductor inspection device for inspecting the electrical characteristics of the semiconductor device.

The figure which shows the outline of the whole structure of the semiconductor inspection apparatus of this invention The figure which shows the outline of the transmission and reception of the optical signal between the optical fiber with which the probe card is equipped, and the inspection side device The figure which shows the structural example of the signal processing path | route in the semiconductor inspection apparatus shown by FIG. 1 and FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Measuring instrument 11 Photoelectric converter 12 Probe card 21a, 21b Optical fiber which functions as a probe terminal 30 Light receiving element 31 Light emitting element 40 Apparatus by inspection side (including semiconductor device to be inspected)

Claims (1)

A semiconductor inspection apparatus for inspecting electrical characteristics of a semiconductor device optically connectable to the outside through an optical interface,
Measurement means for performing generation of a test electrical signal supplied to the semiconductor device and measurement based on a test optical signal from the semiconductor device for the test electrical signal;
Conversion means for converting the test electrical signal into an optical signal and converting the test optical signal into an electrical signal;
Guiding means for guiding the converted optical signal to the semiconductor device and guiding the optical signal output from the semiconductor device to the converting means;
A semiconductor inspection apparatus.

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