JP2006071679A - Manufacturing method for electrooptic apparatus and electrooptic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrooptic apparatus by which the electrooptic apparatus nearly free from generation of display unevenness due to ruggedness of the surface of a color filter can be manufactured. <P>SOLUTION: The manufacturing method for the electrooptic apparatus provided with a pair of substrates including a color filter substrate wherein a light shielding film, a colored layer and a surface protective layer are successively layered and an electrooptic material interposed between the pair of substrates and having a display region consisting of a plurality of pixel regions comprises the steps of: forming the light shielding film having aperture parts respectively corresponding to the pixel regions; forming the colored layers which are made to correspond to the aperture parts respectively and overlap with a part of the light shielding film; and forming the surface protective layer in a region corresponding to at least the display region on the substrate wherein the light shielding film and the colored layer are formed using a resin material having 2.5 to 8 mPa s viscosity (measuring temperature:25°C). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical device manufacturing method and an electro-optical device. In particular, in a color filter substrate having a colored layer, an electro-optical device that can efficiently provide an electro-optical device having excellent display characteristics by flattening the substrate surface in a state in which a surface protective layer is formed The present invention relates to a method and an electro-optical device.

2. Description of the Related Art Conventionally, a liquid crystal display device which is an aspect of an electro-optical device is configured by opposingly arranging a pair of substrates each having an electrode and enclosing a liquid crystal material between the pair of substrates. Then, a voltage is applied between the opposing electrodes and the liquid crystal material is aligned, and light is allowed to pass through the liquid crystal material to display an image.
In addition, when such a liquid crystal display device is a liquid crystal display device capable of displaying a color image, a colored layer is provided on one of the substrates, and usually, color mixing of light passing through adjacent pixel regions is prevented. In order to prevent this, a light shielding film is provided in the inter-pixel region.

  Here, in order to prevent display unevenness of a displayed image, a surface protective layer is formed on a substrate on which a light shielding film and a colored layer are formed in order to form an electrode to be formed on the substrate flatly. The electrode is formed. However, the light-shielding film and the colored layer are formed in different pattern shapes, and unevenness occurs on the surface of the substrate due to the steps of the light-shielding film and the colored layer. Therefore, the substrate with the surface protective layer formed In some cases, the surface was uneven. Therefore, it may be insufficient to prevent display unevenness in the displayed image.

In order to solve the problem of such display unevenness, a liquid crystal display device in which a predetermined flattening film is formed in a non-existing region of a light shielding film has been proposed. More specifically, as shown in FIG. 11, in one substrate having the first electrode, the light shielding film, and the color filter, the light shielding film 703 and the planarization film 733 formed between the light shielding films 703. A liquid crystal display panel in which color filters 704, 705, and 706 are formed over the light-shielding film 703 and the planarization film 733, and a plurality of first electrodes are formed over the color filter. (See Patent Document 1).
In addition, a liquid crystal display panel having excellent surface flatness and sufficient light shielding properties and high quality display quality has been proposed. More specifically, as shown in FIG. 12, a conductive light shielding film 752 provided on the substrate 751, a color filter 754 provided on the light shielding film 752, and a surface protective layer 755 provided on the color filter 754, A liquid crystal display panel having an insulating film 753 provided on the surface protective layer 755 and a transparent electrode 756 provided on the insulating film 753 is disclosed (see Patent Document 2).
JP-A-8-194215 (Claims, FIG. 1) JP-A-6-202098 (Claims, FIG. 3)

However, the liquid crystal display panels described in Patent Documents 1 and 2 are formed with a gap between adjacent colored layers, and unevenness occurs on the surface of the substrate on which the surface protective layer is formed due to a step in the gap portion. The problem that it ends up was seen.
In addition, the liquid crystal display panels described in Patent Documents 1 and 2 are in a state where the material is blocked by a colored layer or the like formed on the surface of the substrate when the material for the surface protective layer is applied in the manufacturing stage. In some cases, it did not spread uniformly. Therefore, the coating unevenness 780 as shown in FIG. 13 is generated, and irregularities are formed on the surface of the substrate on which the surface protective layer 770 is formed, resulting in display unevenness.
In particular, in recent years, in order to realize high-definition image display, the area of each pixel has been reduced, and the influence of surface irregularities on the surface protective layer on image display is increasing.

Accordingly, the inventors of the present invention have made diligent efforts to solve such problems by forming a surface protective film using a resin material having a predetermined viscosity in a method of manufacturing an electro-optical device such as a liquid crystal display device. And the present invention has been completed.
That is, according to the present invention, in the electro-optical device manufacturing method, the substrate surface after the formation of the surface protective layer can be planarized with high accuracy, and an electro-optical device capable of realizing excellent image display can be efficiently manufactured. It is an object of the present invention to provide a method for manufacturing an electro-optical device. Another object of the present invention is to provide an electro-optical device obtained by such a method of manufacturing an electro-optical device.

According to the present invention, a pair of substrates including a color filter substrate in which a light shielding film, a colored layer, and a surface protective layer are sequentially laminated, and an electro-optic material sandwiched between the pair of substrates, And a method of manufacturing an electro-optical device having a display region composed of a plurality of pixel regions, the step of forming a light-shielding film having openings corresponding to the pixel regions on the substrate, respectively, And a step of forming a colored layer so as to overlap with a part of the light shielding film, and a viscosity (measurement temperature: at least in a region corresponding to the display region) on the substrate on which the light shielding film and the colored layer are formed. And a step of forming a surface protective layer using a resin material having a value in the range of 2.5 to 8 mPa · s. To solve the problem Kill.
That is, by setting the viscosity of the resin material for forming the surface protective layer to a predetermined value or less, it can be easily spread when applied on the substrate on which the light-shielding film and the colored layer are formed. The substrate surface on which the protective layer is formed can be flattened with high accuracy. Therefore, it is possible to efficiently manufacture an electro-optical device with less display unevenness due to the unevenness of the substrate surface.

In carrying out the method of manufacturing the electro-optical device of the present invention, it is preferable that the height difference between the uppermost part and the lowermost part of the surface of the surface protective layer is set to a value of 0.3 μm or less.
By implementing in this way, the display nonuniformity in the displayed image can be reduced reliably.

In carrying out the method for manufacturing the electro-optical device of the present invention, it is preferable that the end portion of the colored layer is tapered or stepped.
By carrying out in this way, when the resin material for forming the surface protective layer is applied on the substrate, the resin material is likely to run on the colored layer and easily spread evenly. It becomes easy to planarize the substrate surface in a state where the layer is formed.

In carrying out the method for manufacturing the electro-optical device of the present invention, it is preferable to provide a curved portion in a part of the planar shape of the end portion of the colored layer.
By carrying out in this way, when the resin material for forming the surface protective layer is applied on the substrate, it is less likely to inhibit the resin material from spreading due to the colored layer, and it is easy to spread uniformly. Therefore, it becomes easy to planarize the substrate surface in a state where the surface protective layer is formed.

In carrying out the electro-optical device manufacturing method of the present invention, the spin coater is used to form the colored layer and the surface protective layer, and the substrate is offset each time a plurality of colored layers and the surface protective layer are applied. It is preferable to rotate them.
By carrying out in this way, the surface of the entire substrate can be obtained even when coating unevenness occurs in each constituent material by varying the spreading direction of the material when applying each colored layer and surface protective layer. The influence on the unevenness can be reduced.

In carrying out the electro-optical device manufacturing method of the present invention, a spin coater is used to form the colored layer and the surface protective layer, and the spin coater is rotated each time a plurality of colored layers and the surface protective layer are applied. It is preferable to form the film while reversing the direction.
By carrying out in this way, the spreading direction of the constituent materials of the colored layer and the surface protective layer can be changed, and even when application unevenness occurs in each constituent material, the unevenness of the surface of the entire substrate can be reduced. The influence can be reduced.

In carrying out the method for manufacturing the electro-optical device of the present invention, at least one of AC glow discharge treatment, corona discharge treatment, and surface treatment with hexamethyldisilazane (HMDS) is performed on the surface of the colored layer. It is preferable to process by.
By carrying out in this way, the adhesion between the colored layer and the surface protective layer is improved, so that the resin material for forming the surface protective layer easily spreads uniformly over the entire substrate, and the surface protective layer is formed. In this state, the substrate surface can be flattened.

In addition, the method of manufacturing the electro-optical device according to the present invention further includes a step of forming a planarization film in the opening of the light shielding film after forming the light shielding film and before forming the colored layer. It is preferable.
By implementing in this way, the substrate surface in the state in which the light shielding film is formed can be planarized, and it is easy to planarize the substrate surface in the state in which the colored layer and the surface protective layer are further laminated. Become.

In carrying out the method of manufacturing the electro-optical device of the present invention, when the surface protective layer is the first surface protective layer, the viscosity (measurement temperature: 25 ° C.) is on the first surface protective layer. It is preferable that the method further includes a step of forming the second surface protective layer using a photocurable resin or a thermosetting resin having a value exceeding 8 mPa · s.
By implementing in this way, the film thickness as the whole surface protective layer can be adjusted with a sufficient precision by the 2nd surface protective layer, flattening the substrate surface by the 1st surface protective layer.

Another embodiment of the present invention includes a pair of substrates including a color filter substrate in which a light-shielding film, a coloring layer, and a surface protective layer are sequentially stacked, and an electric current sandwiched between the pair of substrates. An electro-optical device having a display region composed of a plurality of pixel regions, wherein the surface protective layer has a viscosity (measurement temperature: 25 ° C.) in the range of 2.5 to 8 mPa · s. The electro-optical device is formed using a resin material having a value.
That is, by providing a surface protective layer formed using a resin material having a predetermined viscosity, it is possible to provide an electro-optical device in which the substrate surface is flattened with high accuracy and display unevenness is small.

In constructing the electro-optical device of the present invention, a surface protective layer made of a resin material having a viscosity (measurement temperature: 25 ° C.) in a range of 2.5 to 8 mPa · s is referred to as a first surface protective layer. It is preferable to further include a second surface protective layer formed using a resin material having a viscosity (measurement temperature: 25 ° C.) exceeding 8 mPa · s on the first surface protective layer. .
With this configuration, it is possible to provide an electro-optical device having excellent display characteristics by controlling the film thickness of the entire surface protective layer with high accuracy while flattening the substrate surface.

  Hereinafter, embodiments of the method for manufacturing an electro-optical device and the electro-optical device according to the present invention will be specifically described with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

The present embodiment includes a pair of substrates including a color filter substrate in which a light shielding film, a colored layer, and a surface protective layer are sequentially stacked, and an electro-optic material sandwiched between the pair of substrates. An electro-optical device manufacturing method having a display region including a plurality of pixel regions, and an electro-optical device manufactured by the manufacturing method.
A step of forming a light shielding film having openings corresponding to the pixel regions on the substrate; a step of forming a colored layer so as to correspond to each of the openings; and a portion of the light shielding film; and A resin material having a viscosity (measurement temperature: 25 ° C.) in the range of 2.5 to 8 mPa · s is used on at least a region corresponding to the display region on the substrate on which the film and the colored layer are formed. Forming a surface protective layer.
Hereinafter, an embodiment of the present invention includes an active substrate including a first substrate 30 as a color filter substrate and a second substrate 60 as an element substrate having a TFD element (Thin Film Diode) as a two-terminal nonlinear element. A method for manufacturing a liquid crystal display device having a matrix structure will be described as an example.

1. Manufacturing Method (1) First Substrate Manufacturing Process (1) -1 Formation of Light-shielding Film First, as shown in FIGS. 1A to 1B, from soda lime glass, borosilicate glass, alkali-free glass, etc. A light shielding film 39 having a plurality of openings 39a corresponding to the respective pixel regions is formed on the first base 31 to be formed.
As such a light shielding film 39, for example, a metal film such as chromium (Cr) or molybdenum (Mo) is used as the light shielding film 39, or R (red), G (green), and B (blue). A material in which three colorants are dispersed in a resin or other base material, or a material in which a colorant such as a black pigment or dye is dispersed in a resin or other base material can be used. However, it is preferable to use a metal film of chromium or the like as the light-shielding film because the light-shielding property can be ensured even when the film thickness is thin and the step due to the light-shielding film 39 can be reduced.
When the light shielding film 39 is formed using such a metal film, for example, a metal material such as chromium (Cr) is laminated on the first base 31 by vapor deposition or the like, and then an etching process is performed in accordance with a predetermined pattern. Can be formed.
The thickness of the light-shielding film can be usually 1.0 μm when a resin material in which a black pigment is dispersed is used, and is usually about 0.2 μm when a metal film such as chromium is used. It can be.

Next, as shown in FIG. 1C, it is preferable to form a planarizing film 38 in the opening 39 a of the light shielding film 39. The reason for this is that by flattening the surface of the substrate with the light-shielding film 39 formed thereon, when the constituent material of the colored layer 37 is applied, it becomes easier to spread uniformly over the entire substrate, and the application of the colored layer 37 is facilitated. This is because the occurrence of unevenness can be reduced.
The planarizing film 38 can be formed at a predetermined position by applying a transparent resin material such as an acrylic resin using a spin coater or a slit coater and patterning using a photolithography method or the like. Further, in order to planarize the substrate surface on which the light shielding film 39 is formed, it is preferable that the thickness of the planarizing film 38 is substantially the same as the thickness of the light shielding film 39.

(1) -2 Formation of Colored Layer Next, as shown in FIG. 1 (d), on the substrate on which the light shielding film 39 is formed, each of the light shielding films 39 is made to correspond to the opening 39 a and one of the light shielding films 39. The colored layer 37 is formed so as to overlap the part. In other words, the light passing through each pixel region is colored, while the colored layer 37 is overlapped with a part of the light shielding film 39 to prevent the passage of light that is not colored, thereby preventing a decrease in contrast.
For example, the colored layer 37 is formed by applying a photosensitive resin made of a transparent resin in which a coloring material such as a pigment or a dye is dispersed on the substrate 31 on which the light shielding film 39 is formed, using a spin coater or a slit coater. It can be formed by subjecting this to pattern exposure and development processing in sequence. And the said process is repeated for every color, and the colored layers 37r, 37g, 37b of multiple colors are arranged and formed.
In addition, as the arrangement pattern of the colored layer 37, a stripe arrangement is often adopted, but various pattern shapes such as an oblique mosaic arrangement and a delta arrangement can be adopted in addition to the stripe arrangement.

In forming the colored layer 37, as shown in FIG. 1D, exposure is performed using a halftone mask having a predetermined shape, or multistage exposure is performed using a pattern mask having a different pattern shape. Accordingly, it is preferable that the end portions of the respective colored layers 37 are tapered or stepped, and the adjacent colored layers 37r, 37g, and 37b are formed so as to overlap each other at the end portions. This is because the step caused by the gap between the colored layers 37 is eliminated, the substrate surface in the state where the colored layers 37 are formed is flattened, and the resin material for forming the surface protective layer 41 is uniformly applied. It is because it becomes possible to do. In addition, by overlapping the colored layer 37 on the light shielding film 39, it is possible to prevent color mixing of displayed light and to prevent a decrease in image contrast.
Although not shown, the resin material for forming the surface protective layer by forming the end portion in a tapered shape or a stepped shape also for the alignment mark and the inspection pattern, for example, other than the colored layer 37. It is less likely to obstruct the uniform application of.

In the colored layer 37, for example, when the film thickness is changed to adjust the hue for each color of R (red), G (green), and B (blue), the difference in the film thickness is reduced to 0. It is preferable to set the value to 3 μm or less.
This is because the substrate surface on which the colored layer 37 is formed can be planarized as a whole by configuring in this way, so that the substrate surface in a state where the surface protective layer 41 is further formed can be ensured. Flattening can be performed, and display unevenness in the displayed image can be reduced.
Accordingly, in the colored layer 37, when the film thickness is changed for each color, the difference in the film thickness is more preferably set to a value of 0.25 μm or less, and further to a value of 0.2 μm or less. preferable.
Therefore, for example, by setting the R (red) layer to 1.0 μm, the G (green) layer to 1.3 μm, and the B (blue) layer to 1.3 μm, the density of each color is made uniform. Further, display unevenness in an image displayed by reliably flattening the substrate surface in a state where the surface protective layer 41 is formed can be reduced.

Further, as shown in FIG. 3A, it is preferable to provide a curved portion in a part of the planar shape of the end portion of the colored layer 37. More specifically, as shown in FIG. 3B, in the manufacturing stage, a resin material 41X for forming the surface protective layer 41 is formed on the substrate 30 on which the colored layer 37 is formed by using a spin coater or a slit coater. It is preferable to provide a curved portion in the planar shape of the portion corresponding to the direction D in which the resin material flows when the resin material is applied.
This is because the resin material 41X for forming the surface protective layer 41 can smoothly run on the colored layer 37 and thus can be uniformly applied to the entire substrate. It is. Therefore, since the substrate surface with the surface protective layer 41 formed can be planarized, display unevenness in the displayed image can be reduced.

Next, as shown in FIG. 2A, the surface of the colored layer 37 is subjected to at least one of AC glow discharge treatment, corona discharge treatment, and surface treatment with hexamethyldisilazane (HMDS). It is preferable.
This is because the adhesion between the colored layer 37 and the resin material for forming the surface protective layer 41 is improved by performing such treatment, so that the colored layer 37 can be smoothly applied when the resin material is applied. This is because the substrate surface can be spread and spread, the unevenness of coating of the surface protective layer 41 can be prevented, and the substrate surface after the formation of the surface protective layer 41 can be planarized.

(1) -3 Formation of Surface Protective Layer Next, as shown in FIG. 2B, a photocurable or thermosetting resin material is applied over the entire surface of the first substrate 30, and a photolithography method is applied. The surface protective layer 41 is formed at least in a region corresponding to the display region. That is, by flattening the surface of the substrate, the first electrode 33 formed on the surface protective layer can be flattened and the cell gap can be made uniform. It is because it can do.
As this resin material, it can be comprised with an acrylic resin, an epoxy resin, an imide resin, a fluororesin etc., for example. These resins are applied onto a substrate in an uncured state having fluidity, and are cured by appropriate means such as drying, photocuring, and thermosetting. As a coating method, it can apply using a spin coater, a slit coater, etc.

In the method of manufacturing the electro-optical device of the present invention, a resin material having a viscosity in a range of 2.5 to 8 mPa · s when the measurement temperature is 25 ° C. is used with respect to the viscosity of the resin material to be used. It is characterized by using. That is, by using such a relatively low viscosity resin material, even when some unevenness is formed on the surface of the substrate on which the colored layer 37 is formed, after the surface protective layer 41 is formed, This is because the substrate surface can be flattened with high accuracy. On the other hand, when the viscosity of the resin material is excessively low, it may be difficult to adjust the film thickness.
The viscosity of such a resin material can be adjusted by mixing a solvent such as methoxypropyl acetate (MPA) as a main solvent with an acrylic resin or an epoxy resin.

Here, referring to FIG. 4 to FIG. 5, the viscosity of the resin material constituting the surface protective layer, the flatness of the substrate surface in the state where the surface protective layer is formed, and the display unevenness in the displayed image The relationship will be described in more detail.
First, FIGS. 4A to 4C show cross-sectional shapes of the colored layer and the surface protective layer when the surface protective layer is formed using resin materials having different viscosities. FIG. 4A shows a surface protection made of a light shielding film (thickness: 0.2 μm) made of a chromium film, a colored layer, and a resin material having a viscosity of 4 mPa · s (measurement temperature: 25 ° C.) on a glass substrate. The cross-sectional shape of the colored layer and the surface protective layer when the layer is formed is shown. FIG. 4B shows a surface protection made of a light shielding film (thickness: 1 μm) made of a black resin, a colored layer, and a resin material having a viscosity of 3 mPa · s (measurement temperature: 25 ° C.) on a glass substrate. The cross-sectional shape of the colored layer and the surface protective layer when the layer is formed is shown. Further, FIG. 4C shows a light shielding film (thickness: 0.2 μm) made of a chromium film, a colored layer, and a resin material having a viscosity of 15 mPa · s (measurement temperature: 25 ° C.) on a glass substrate. The cross-sectional shape of the colored layer and the surface protective layer when the surface protective layer is formed is shown.

As shown in FIG. 4A, when a chromium film is used as the light shielding film, the film thickness of the light shielding film is 0.2 μm. The difference is about 0.3 μm, and the height difference between the uppermost part and the lowermost part of the surface of the surface protective layer is suppressed to about 0.125 μm. Further, as shown in FIG. 4B, when black resin is used as the light shielding film, the thickness difference of the colored layer surface is about 0.6 μm because the thickness of the light shielding film is 1.0 μm. However, since the surface protective layer is formed of a low-viscosity resin material, the height difference of the surface of the surface protective layer is suppressed to about 0.15 μm.
On the other hand, as shown in FIG. 4C, when a resin material having a high viscosity (15 mPa · s) is used as a resin material for forming the surface protective layer, a chromium film having a small thickness as a light shielding film. Even in the case where is used, the height difference of the surface of the surface protective layer is as large as about 0.5 μm.
Therefore, it can be understood that by using a resin material having a predetermined viscosity as the resin material for forming the surface protective layer, the substrate surface with the surface protective layer formed thereon can be further planarized.

Next, FIG. 5 shows the relationship between the viscosity of the resin material forming the surface protective layer and the coating unevenness of the surface protective layer. In FIG. 5, the horizontal axis represents the viscosity (mPa · s: measurement temperature 25 ° C.) of the resin material, and the vertical axis represents the degree of application unevenness (relative value) of the surface protective layer. In addition, the degree of such coating unevenness is determined by forming a colored layer and a surface protective layer on a substrate on which a chromium film is formed as a light shielding film, and irradiating the substrate with a sodium lamp in a dark room and visually observing it. It was measured.
As can be easily understood from FIG. 5, as the viscosity of the resin material increases, uneven coating of the surface protective layer becomes more visible. In particular, when the viscosity of the resin material exceeds 8 mPa · s, the coating unevenness is more strongly visually recognized. Therefore, in order to further flatten the substrate surface on which the surface protective layer is formed, the viscosity (measurement temperature: 25 ° C.) of the resin material for forming the surface protective layer should be 8 mPa · s or less. It is valid.
From the above, considering the controllability of the film thickness of the surface protective layer, the viscosity (measurement temperature: 25 ° C.) of the resin material for forming the surface protective layer is a value within the range of 2.8 to 7 mPa · s. It is more preferable to set the value within the range of 3 to 6 mPa · s.

(1) -4 Formation of Second Surface Protective Layer Next, as shown in FIG. 2 (c), a comparison is further made on the surface protective layer (first surface protective layer) 41 made of a low-viscosity resin material. It is preferable to form the surface protective layer (second surface protective layer) 44 for adjusting the film thickness by using a highly viscous resin material, for example, a resin material having a viscosity exceeding 8 mPa · s.
This is because when a resin material having a relatively low viscosity is used, it is difficult to control the film thickness, and thus the film thickness can be easily adjusted by using a resin material having such a high viscosity. It is. At this time, since the substrate surface is flattened by the first surface protective layer 41, even when the second surface protective layer 44 is formed using a relatively high viscosity resin material, the substrate The flatness of the surface can be ensured.
However, when the viscosity of the resin material for forming the second surface protective layer 44 is excessively high, it may be difficult to uniformly apply the resin to the substrate surface. More preferably, the viscosity (measurement temperature: 25 ° C.) of the resin material for forming 44 is set to a value within the range of 9 to 12 mPa · s, and more preferably set to a value within the range of 10 to 11 mPa · s. preferable.
Even if the surface protective layer has a single-layer structure made of a resin material having a relatively low viscosity, or even if it has a two-layer structure in which a relatively high viscosity resin material is laminated, the surface protective layer The film thickness of 41 as a whole is usually preferably set to a value in the range of 2 to 5 μm.

As described above, when the colored layers 37r, 37g, and 37b and the surface protective layer 41 are formed, the respective constituent materials are applied onto the substrate using a spin coater, as shown in FIG. Further, it is preferable to rotate the substrate 31 by offsetting it. That is, for example, when the substrate 31 is square, each time the respective constituent materials are applied around the positions P1, P2, and P3 different from the position P where the two diagonal lines intersect on the substrate 31, It is preferable to rotate the substrate 31 by changing the position.
The reason for this is that the flow direction when each constituent material spreads on the substrate can be made different, so that it is possible to effectively prevent uneven coating from occurring along the same position and the same direction. This is because the coating unevenness in the whole can be reduced.

Further, when forming the colored layer 37 and the surface protective layer 41, when the respective constituent materials are applied onto the substrate using a spin coater, as shown in FIGS. 7 (a) to (d), It is preferable to apply while reversing the rotation direction A of the spin coater every time each constituent material is applied.
This is because the spreading direction B can be made different when each constituent material is applied, so that the spread of each constituent material is hindered by the light-shielding film 39 and the colored layer 37 already formed on the substrate. This is because it is possible to effectively prevent uneven coating from occurring along the same position and in the same direction, and to reduce uneven coating on the entire substrate.

(1) -5 Formation of first electrode and first alignment film Next, as shown in FIG. 2E, a transparent conductor such as ITO (indium tin oxide) is entirely formed on the surface protective layer 41. As an example, the transparent conductive layer made of a material is formed by a sputtering method and patterned by using a photolithography method to form the first electrode 33. Next, a first alignment film made of polyimide resin or the like is formed on the substrate on which the first electrode 33 is formed.

(2) Manufacturing Process of Second Substrate First, as shown in FIGS. 8A to 8B, a first substrate 61 made of soda lime glass, borosilicate glass, non-alkali glass, etc. A metal film 71 ′ is formed. The first metal film 71 ′ is made of, for example, tantalum, and can be formed using a sputtering method or an electron beam evaporation method.
In addition, the adhesion of the first metal film 71 ′ to the second base 61 can be remarkably improved before the first metal film 71 ′ is formed, and from the second base 61 to the first metal film 71 ′. Therefore, it is also preferable to form an insulating film made of tantalum oxide (Ta ₂ O ₅ ) or the like on the second base 61.

  Next, as shown in FIG. 8C, an oxide film 72 is formed by oxidizing the surface of the first metal film 71 ′ by an anodic oxidation method. More specifically, after the glass substrate 61 on which the first metal film 71 ′ is formed is immersed in an electrolytic solution such as a citric acid solution, a predetermined amount is provided between the electrolytic solution and the first metal film 71 ′. A voltage can be applied to oxidize the surface of the first metal film 71 ′. Further, the first metal film 71 ′ on which the oxide film 72 is formed is patterned using a photolithography method, and a part thereof is used as the element first electrode 71.

Next, again, a metal film is formed on the entire surface of the substrate including the element first electrode 71 by sputtering or the like, and patterned by photolithography, as shown in FIG. 8D. Second metal films 73 and 74 and electrical wiring (not shown) are formed.
Next, similarly, after forming a transparent conductive layer made of a transparent conductive material such as ITO (indium tin oxide or the like) by sputtering or the like, patterning is performed using a photolithography method, thereby FIG. As shown in FIG. 2, the second electrode 63 is formed.

(3) Subsequent Step Next, although not shown, the sealing material 23 mainly composed of an epoxy resin or the like is formed on the second substrate 60 by patterning so as to surround the display area A by screen printing or a dispenser. . Thereafter, the first substrate 30 and the second substrate 60 on which the sealing material 23 is laminated are overlapped and bonded, and then held under pressure while being heated, so that the first substrate 30 and the second substrate are bonded. A cell structure is formed by pasting 60 together. Then, after the liquid crystal material 21 is injected into the space formed by the first substrate 30 and the second substrate 60 and inside the sealing material 23, the liquid crystal material 21 is sealed with the sealing material 25 or the like.
Next, predetermined polarizing plates 49 and 79 are disposed on the outer surfaces of the first substrate 30 and the second substrate 60, respectively.
In the present embodiment, the sealing material 23 is applied on the second substrate 60, but it may be printed on the first substrate 30.

2. Electro-Optical Device An electro-optical device manufactured by the method for manufacturing an electro-optical device according to the present embodiment will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of a liquid crystal panel 20 used in the liquid crystal display device.
The liquid crystal panel 20 shown in FIG. 9 is a liquid crystal panel 20 having an active matrix type structure using a switching element 69 as a two-terminal type non-linear element, and although not shown, an illumination device such as a backlight or a front light, An electro-optical device is obtained by appropriately attaching a case body or the like as necessary.

  The liquid crystal panel 20 includes a color filter substrate (first substrate) 30 having a transparent glass substrate as a first base 31 and an element substrate (second substrate) having a transparent glass substrate as a second base 61. ) 60 are disposed opposite to each other and are bonded to each other through a sealing material 23 such as an adhesive. In addition, after the liquid crystal material 21 is injected into the space formed by the first substrate 30 and the second substrate 60 into the inner portion of the sealing material 23 through an opening (not shown). And a cell structure sealed with a sealing material (not shown). That is, the liquid crystal material 21 is filled between the first substrate 30 and the second substrate 60.

  A second electrode (sometimes referred to as a pixel electrode) 63 is formed in a matrix on the inner surface of the second base 61, that is, the surface facing the first base 31, and the first base A first electrode (sometimes referred to as a scanning electrode) 33 is formed on the inner surface of 31, that is, on the surface facing the second base 61. In addition, the second electrode 63 is electrically connected to an electrical wiring (sometimes referred to as a data line) 65 through a switching element 69, and the other first electrode 33 is electrically conductive. It is electrically connected to the routing wiring 66 on the second substrate 60 through the sealing material 23 containing the conductive particles. A large number of pixels (hereinafter sometimes referred to as pixel regions) in which the intersecting regions of the second electrode 63 and the first electrode 33 thus configured are arranged in a matrix form are formed. The arrangement of pixels constitutes the liquid crystal display area A as a whole. Therefore, by applying a voltage to a desired pixel, an electric field is generated in the liquid crystal material 21 in the pixel region, and an image such as a character or a figure can be displayed as the entire display region.

Further, the second substrate 60 has a substrate overhanging portion 60T that protrudes outward from the outer shape of the first substrate 30. On the substrate overhanging portion 60T, the electric wiring 65 and the routing wiring 66 are provided. In addition, an external connection terminal 67 made up of a plurality of wirings formed independently is formed.
A semiconductor element (IC) 91 incorporating a liquid crystal driving circuit or the like is mounted so as to be electrically connected to the electrical wiring 65, the routing wiring 66, and the external connection terminal 67. Further, a flexible substrate 93 is mounted on the end portion of the substrate extension 60T so as to be conductively connected to the external connection terminal 67.

The first substrate 30 includes, as an example, a first base 31 made of a transparent glass substrate or the like, a light shielding film 39, a coloring layer 37, a surface protective layer 41, and a first electrode 33. It is configured. In addition, a retardation plate (¼ wavelength plate) 47 and a polarizing plate 49 are arranged at predetermined positions on the first substrate 30 so that a clear image display can be recognized.
The second substrate 60 facing the first substrate 30 includes, as an example, a second base 61 made of a glass substrate or the like, an electric wiring 65, a switching element 69, and a second electrode 63. It is configured. Further, a second alignment film 75 made of the same polyimide resin as the first alignment film 45 in the first substrate 30 is formed on the electric wiring 65 and the second electrode 63. Further, a retardation plate (¼ wavelength plate) 77 and a polarizing plate 79 are also arranged on the outer surface of the second glass substrate 61.

Further, the electrical wiring 65 on the second substrate 60 is configured in a stripe shape in which a plurality of wirings are arranged in parallel. The electrical wiring 65 is electrically connected to a second electrode 63 forming a plurality of pixel electrodes via a switching element 69. Further, on both sides of the region where the driver IC 91 and the like are mounted, routing wiring that is electrically connected to the first electrode 33 on the first substrate 30 via the sealing material 23 including the conductive particles 107. 66 is provided.
As the switching element 69, the electro-optical device according to the first embodiment includes TFD (Thin Film Diode) elements 69a and 69b which are two-terminal nonlinear elements. However, an active matrix type liquid crystal panel including a TFT (Thin Film Transistor) element which is a three-terminal type non-linear element may be used, and further, a passive matrix type liquid crystal panel may be used.

3. Application Example FIG. 10 is a schematic configuration diagram illustrating an overall configuration of an electronic apparatus including an electro-optical device manufactured by the method of manufacturing an electro-optical device according to the present invention. This electronic device has a liquid crystal panel 20 and a control means 200 for controlling the liquid crystal panel 20. In FIG. 10, the liquid crystal panel 20 is conceptually divided into a panel structure 20A and a drive circuit 20B composed of a semiconductor element (IC) 91 or the like. The control unit 200 includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a memory composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., a storage unit composed of a magnetic recording disk, an optical recording disk, etc., and a tuning that outputs a digital image signal in a synchronized manner. And is configured to supply display information to the display processing circuit 202 in the form of an image signal having a predetermined format based on various clock signals generated by the timing generator 204.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied together with the clock signal CLK to the drive circuit 20B. In addition, the drive circuit 20B includes a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
And if it is the electronic device of this embodiment, it has the electro-optical apparatus which formed the surface protective layer in the 1st board | substrate (color filter board | substrate) using the resin material whose viscosity is below a predetermined value. Therefore, since the surface of the first substrate in a state where the surface protective layer is formed is flattened, an electronic device that does not generate display unevenness and can realize excellent image display can be obtained.

  According to the method for manufacturing an electro-optical device and the electro-optical device of the present invention, the surface of the substrate can be flattened by using a resin material having a viscosity equal to or lower than a predetermined value for the surface protective layer. Accordingly, display unevenness in the displayed image can be reduced, and electro-optical devices such as liquid crystal display devices and electronic devices such as mobile phones and personal computers, liquid crystal televisions, viewfinder types, and monitor direct view types. Video tape recorders, car navigation devices, pagers, electrophoresis devices, electronic notebooks, calculators, word processors, workstations, video phones, POS terminals, electronic devices with touch panels, devices with electron-emitting devices (FED: Field Emission) It can be applied to Display and SCEED (Surface-Conduction Electron-Emitter Display).

(A)-(d) is a figure provided in order to demonstrate the manufacturing process of a color filter substrate (the 1). (A)-(e) is a figure provided in order to demonstrate the manufacturing process of a color filter substrate (the 2). (A)-(b) is a figure provided in order to demonstrate the planar shape of a colored layer. (A)-(c) is a figure provided in order to demonstrate the relationship between the viscosity of the resin material which forms a surface protective layer, respectively, and the height from the base | substrate surface. It is a figure provided in order to demonstrate the relationship between the viscosity of the resin material which forms a surface protective layer, and the degree of application | coating nonuniformity. It is a figure provided in order to demonstrate the coating method using a spin coater (the 1). (A)-(d) is a figure provided in order to demonstrate the coating method using a spin coater (the 2). (A)-(e) is a figure provided in order to demonstrate the manufacturing process of an element substrate. It is a schematic sectional drawing of the liquid crystal panel used for an electro-optical apparatus. It is a block diagram which shows schematic structure of the electronic device as an application example. It is a figure explaining the structure of the conventional liquid crystal display panel (the 1). It is a figure explaining the structure of the conventional liquid crystal display panel (the 2). It is a figure provided in order to demonstrate the coating nonuniformity at the time of forming a surface protective layer.

Explanation of symbols

20: Liquid crystal panel, 21: Electro-optical material (liquid crystal material), 23: Sealing material, 30: First substrate (color filter substrate), 31: First substrate, 33: First electrode (scanning electrode), 37: colored layer, 38: planarizing film, 39: light shielding film, 39a: opening, 41: surface protective layer (first surface protective layer), 41X: resin material, 44: second surface protective layer, 60 : Second substrate (element substrate), 61: second substrate, 63: second electrode (scanning electrode), 65: electric wiring (data line), 66: electric wiring (leading wiring), 69: switching Element (TFD element), 121: Pattern mask

Claims (11)

A pair of substrates including a color filter substrate in which a light-shielding film, a colored layer, and a surface protective layer are sequentially stacked, and an electro-optic material sandwiched between the pair of substrates, and a plurality of substrates In a method for manufacturing an electro-optical device having a display area including a pixel area,
Forming the light-shielding film having openings corresponding to the pixel regions on the substrate;
Forming the colored layer so as to correspond to each of the openings and to overlap a part of the light shielding film;
Resin having a viscosity (measurement temperature: 25 ° C.) in the range of 2.5 to 8 mPa · s at least in a region corresponding to the display region on the substrate on which the light shielding film and the colored layer are formed. Forming the surface protective layer using a material;
A method for manufacturing an electro-optical device.   2. The method of manufacturing an electro-optical device according to claim 1, wherein a difference in height between the uppermost part and the lowermost part of the surface of the surface protective layer is set to a value of 0.3 [mu] m or less.   The method of manufacturing an electro-optical device according to claim 1, wherein an end portion of the colored layer is tapered or stepped.   The method for manufacturing an electro-optical device according to claim 1, wherein a curved portion is provided in a part of a planar shape of an end portion of the colored layer.   The spin coater is used when forming the colored layer and the surface protective layer, and the substrate is offset and rotated each time a plurality of the colored layers and the surface protective layer are applied. 5. The method for manufacturing an electro-optical device according to claim 4.   The spin coater is used when forming the colored layer and the surface protective layer, and the spin coater is formed while reversing the rotation direction each time a plurality of colored layers and the surface protective layer are applied. The method for manufacturing an electro-optical device according to claim 1.   The surface of the colored layer is subjected to at least one of an AC glow discharge treatment, a corona discharge treatment, and a surface treatment with hexamethyldisilazane (HMDS). A method for manufacturing the electro-optical device according to claim 1.   8. The method according to claim 1, further comprising a step of forming a planarization film in an opening of the light shielding film after forming the light shielding film and before forming the colored layer. A method for manufacturing an electro-optical device according to one item.   When the surface protective layer is a first surface protective layer, a second resin material having a viscosity (measurement temperature: 25 ° C.) exceeding 8 mPa · s is used on the first surface protective layer. The method for manufacturing an electro-optical device according to claim 1, further comprising a step of forming a surface protective layer.   A pair of substrates including a color filter substrate in which a light-shielding film, a colored layer, and a surface protective layer are sequentially stacked, and an electro-optic material sandwiched between the pair of substrates, and a plurality of substrates In the electro-optical device having a display area including a pixel area, the surface protective layer is formed using a resin material having a viscosity (measurement temperature: 25 ° C.) in a range of 2.5 to 8 mPa · s. An electro-optical device.   When the surface protective layer was used as the first surface protective layer, it was formed on the first surface protective layer using a resin material having a viscosity (measurement temperature: 25 ° C.) exceeding 8 mPa · s. The electro-optical device according to claim 10, further comprising a second surface protective layer.

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