JP2006066337A - Wiring board, electron source, image display apparatus, information display reproducing apparatus and their manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To relieve stress to a board due to a wiring material in a channel in a wiring board in which a wire is embedded in the channel formed in a surface of the board, and increase thickness of the the wire by inhibiting occurrence of crack in the board to reduce resistance of the wire. <P>SOLUTION: Channels 2 are formed in a surface of a board 1 and at least one projecting portion 3 is formed in each of the channels 2 in the surface of the board 1 in the direction of its width. The projecting portion 3 is formed continuously in the longitudinal direction of the channel 2, and an Ag wire 4 is filled in the channel 2 having the projecting portion 3 formed therein. A plurality of channels are formed in parallel to each other in the surface of the board to form the projection portion in the channel and the Ag wire is filled in neighboring channels. Further, the projecting portions 3 are formed at equal space along the longitudinal direction of the channel 2. The projecting portions 3 are not connected with the termination portions of the channel 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring board, and more particularly to an embedded wiring board formed by embedding a wiring material in a groove provided on the surface of the board, an electron source using the same, an image display device, an information display reproducing device, and a manufacturing method thereof. It is.

  Conventionally, wiring is generally formed on the substrate surface as a wiring board, but an embedded wiring board in which wiring is embedded in the board has been proposed for the purpose of ensuring flatness or lowering wiring resistance. (See Patent Document 1 and Patent Document 2).

  In particular, the advantage of the embedded wiring is that cracks in the substrate caused by stress from the wiring are less likely to occur when the wiring film thickness is increased compared to the case where the wiring is formed on a flat substrate surface.

FIG. 13A shows a state in which wiring is formed on the substrate surface, and stress concentration on the edge is large. On the other hand, FIG. 13B schematically shows that the effect of relaxing stress concentration on the edge can be obtained by embedding the wiring in the groove formed on the substrate surface.
Japanese Patent No. 3044434 JP 2000-251680 A

  The above-mentioned embedded wiring board also has a wiring film thickness limit that causes a substrate crack, and the wiring film thickness limits the wiring resistance.

  The present invention has been made in view of the above-described problems, and its object is to provide a wiring board having a lower wiring resistance within the limitation of the wiring width, an electron source using the wiring board, an image display device, an information display reproduction device, and It is in providing the manufacturing method of them.

  In order to achieve the above object, the wiring board of the present invention has a groove formed on the surface of the substrate, the groove on the surface of the substrate has at least one convex portion, and the groove is provided with the wiring. It is characterized by that.

  The method for manufacturing a wiring board according to the present invention is a method for manufacturing a wiring board having wiring filled in a groove on the surface of the board, and a screen printing method is used for the groove of the board having the groove of the first pattern on the surface. And filling the wiring material with the groove, wherein the groove has at least one convex portion at the bottom thereof.

  The present invention also provides an electron source using the wiring substrate and a method for manufacturing the electron source formed using the method for manufacturing the wiring substrate, an image display apparatus using the electron source, a method for manufacturing the image display device, and the image. An information display / reproduction device using the display device is also characterized.

  The inventors of the present application paid attention to the shape of the bottom of the groove where the stress relaxation effect in the thickness direction by the wall surface can be obtained as shown in FIG. That is, as is clear from comparison between FIG. 13B and FIG. 13C, it has been found that when R on the groove bottom surface of the substrate is reduced, the combined stress from the wiring can be reduced as indicated by the thick arrows.

  Therefore, according to the present invention, as shown in FIG. 1 and the like, by providing a convex portion inside the groove, the R (curvature radius) of the groove on both sides of the convex portion is reduced. As a result, in the present invention, the stress from the wiring material to the substrate can be relieved and cracks can be prevented from occurring in the present invention as compared with the case where there is no protrusion in the groove as shown in FIG. can do. As a result, since the film thickness of the wiring material can be increased, the wiring resistance can be reduced.

  According to the present invention, the stress from the wiring to the substrate can be relaxed and cracks can be prevented from occurring in the substrate, so that it is possible to realize a wiring substrate having a lower wiring resistance within the limitation of the wiring width. it can. In addition, by using the wiring substrate of the present invention, it is possible to realize an image display device capable of arranging electron-emitting devices at a high density and displaying a high-definition image.

  Next, the best mode for carrying out the invention will be described in detail with reference to the drawings. First, the wiring board according to the present invention will be described. Here, an example is described in which a convex portion 3 described later is configured by a part of the substrate 1, but in the present invention, the convex portion 3 may be formed of a member different from the substrate 1. However, it is preferable that the convex portion is constituted by a part of the substrate 1. Moreover, although the example which uses silver (Ag) as an example of embodiment shown below as a material of the wiring 4 shows, the material of wiring is not limited to silver in this invention. Therefore, the wiring in the present invention may be basically made of a conductive material because it only needs to satisfy the function as the wiring. For example, a material such as aluminum, chromium, nickel, or copper may be used. Moreover, there is no restriction | limiting in particular in the height (height from the bottom part of a groove | channel) of a convex part. Moreover, the number of the convex parts 3 in the groove | channel 2 does not have a restriction | limiting in particular, A plurality may be arrange | positioned.

  FIG. 1 is a sectional view showing a first embodiment of a wiring board according to the present invention. FIG. 2 shows a plan view. In FIG. 2, a sectional view taken along a-a ′ of the groove 2 (a sectional view in the width direction of the groove 2) is FIG. 1. In this embodiment, the Ag wiring 4 is embedded in the groove 2 disposed on the surface of the substrate 1, and the convex portion 3 is disposed in the groove 2. At least one protrusion 3 is arranged in the width direction of the groove.

  In the present invention, the convex portion 3 may be formed continuously in the length direction of the groove 2 as shown in FIG. 2, but a plurality of convex portions are arranged along the length direction of the groove 2. They may be spaced apart. In addition, the convex part in this embodiment showed the example arrange | positioned from the end of the length direction of the groove | channel 2 to the end. As described above, the convex portion 3 relieves stress from the wiring to the substrate, and as a result, it is possible to increase the film thickness of the wiring material and reduce the wiring resistance.

  FIG. 3 is a sectional view showing a second embodiment of the wiring board according to the present invention. In the present embodiment, the case where the vertex of the convex portion inside the groove 2 (the place farthest from the back surface of the substrate 1) is the same as the position of the surface of the substrate 1 is shown. Therefore, such a groove can be formed by, for example, arranging a plurality of grooves 2 (two in FIG. 3) in parallel on the surface of the substrate 1. A part of the substrate 1 between the plurality of grooves (two grooves in FIG. 3) 2 arranged in parallel constitutes the convex portion 3. Also in this example, the convex portion 3 may be formed continuously in the length direction of the groove 2, but a plurality of convex portions may be spaced apart from each other along the length direction of the groove 2. good. In this example, the Ag wiring 4 is embedded across the two grooves 2. In this configuration, similarly, the stress from the wiring to the substrate can be reduced, and the manufacturing process of the wiring substrate can be simplified.

  FIG. 4 is a diagram showing a third embodiment of a wiring board according to the present invention. 4A is a plan view and FIG. 4B is a cross-sectional view. FIG. 4B is a cross-sectional view taken along line b-b ′ of FIG. In the present embodiment, at least one convex portion is formed in the groove 2 of the substrate 1 as in FIG. 1, the convex portion is formed continuously in the length direction of the groove, and the Ag wiring 4 is formed in the groove 2. Has been. The difference from FIG. 1 is that the convex portion 3 is not arranged up to the end portion of the groove 2 as shown in FIG. In this way, in the configuration in which the convex portion 3 is not arranged up to the end portion of the groove 2, the stress from the wiring to the substrate can be relieved, and the wiring material can wrap around the back surface of the substrate at the end portion of the groove 2 during manufacturing. Since it can prevent that material protrudes from the inside of the groove | channel 2, it is preferable.

  FIG. 5 is a diagram showing a fourth embodiment of a wiring board according to the present invention. 5A is a plan view, and FIG. 5B is a cross-sectional view of the groove 2 in the length direction. FIG. 5B is a cross-sectional view taken along line b-b ′ in FIG. In the present embodiment, a plurality of convex portions 3 are periodically arranged in the length direction of the groove 2. As shown in FIG. 5A, when viewed from above the substrate, the plurality of convex portions 3 are arranged at intervals from each other along the length direction of the groove 2.

  Moreover, the cross section of the width direction of the groove | channel 2 including the convex part 3 shown to Fig.5 (a) is the same as that of FIG. On the other hand, the cross-section in the width direction of the groove 2 that does not include the convex portion 3 has no convex portion and wiring is simply arranged in the groove 2 as shown in FIGS. 14B and 14C. It becomes a cross-sectional shape. The Ag wiring 4 is formed in the groove 2 so as to meander up and down (in the thickness direction of the substrate 1). Even in this configuration, the stress from the wiring to the substrate can be relieved and the volume of the wiring 4 is increased, so that the resistance value of the wiring 4 can be further reduced.

  In addition, the structure which does not connect a convex part to the both ends in the length direction of the groove | channel 2 shown in FIG. 4 is the embodiment shown in FIG. 1, embodiment shown in FIG. 3, and embodiment shown in FIG. Can be applied. Moreover, the structure which arrange | positions a convex part periodically in the length direction of the groove | channel 2 shown in FIG. 5 in the groove | channel 2 is applicable also to embodiment of FIG.

  Next, an embodiment of an application example of the wiring board of the present invention as described above will be described. That is, the wiring board of the present invention is used as a wiring for connecting a power source and a driving circuit to each electron-emitting device in order to drive each of a large number of electron-emitting devices arranged on the substrate. It is also possible to form a source. Furthermore, an image display device using the electron source and an information display / playback device using the image display device can be formed. In addition to the electron-emitting devices, in order to drive each of a large number of electronic devices arranged on the substrate, an electronic device is formed that is used as a wiring for connecting each power supply and drive circuit to each electronic device. It is also possible to do. Although there is no restriction | limiting in particular as such an electronic device, For example, an EL element can be mentioned.

  Next, an example of an electron source and an image display device in which a plurality of electron-emitting devices are arranged on a substrate and individual electron-emitting devices are connected by the above-described wiring will be described with reference to FIGS. 6, 7, and 8.

  FIG. 6 is a diagram schematically showing an electron source provided with an X-direction wiring 72 and a Y-direction wiring 73 connected to each of a plurality of electron-emitting devices 74 arranged on the substrate 71. For the arrangement of the electron-emitting devices 74 on the substrate 71, for example, m X-direction wirings 72 and n Y-direction wirings 73 are prepared, and the first electrode constituting the electron-emitting devices 74 is set to m X-directions. An arrangement form (referred to as “matrix type arrangement”) in which the second electrode constituting the electron-emitting device 74 is connected to one of the wirings 72 and connected to one of the n Y-direction wirings 73 is cited. (M and n are both positive integers).

  The m X-direction wirings 72 are composed of Dx1, Dx2,..., Dxm. These wirings are formed by the above-described wiring according to the present invention, and are embedded in a groove provided on the surface of the insulating substrate 71. It is formed. The X-direction wiring 72 is made of a conductive material, and the material, film thickness, and wiring width are appropriately set so that a substantially uniform voltage is supplied to a large number of electron-emitting devices.

The n Y-direction wirings 73 are composed of n wirings Dy1, Dy2,..., Dyn, are made of a conductive material like the X-direction wiring 72, and can be formed by a photolithography method or a printing method. . An insulating layer (not shown) is disposed between the m X-direction wirings 72 and the n Y-direction wirings 73. The insulating layer can be formed by a vacuum deposition method, a printing method, a sputtering method, or the like. As a material, SiO ₂ or the like can be used. The Y direction wiring 73 is configured to cover the X direction wiring 72 via an insulating layer.

  The Y-direction wiring 73 is electrically connected to a scanning signal applying unit (not shown) that applies a scanning signal. On the other hand, the Y-direction wiring 72 is electrically connected to a modulation signal generating means (not shown) for applying a modulation signal for modulating electrons emitted from each selected electron-emitting device in synchronization with the scanning signal. Is done. In driving such an electron source, a potential (scanning signal) is supplied to a wiring selected from the n Y-direction wirings 73. By supplying this potential, all the electron-emitting devices connected to the selected Y-direction wiring are selected. Then, in synchronism with the supply of the potential to the selected Y-direction wiring, a desired electron emission amount for each of the m X-direction wirings 72 connected to the electron-emitting devices connected to the selected Y-direction wiring. A potential (modulation signal) is applied so that. By repeating this operation, matrix driving is performed. The drive voltage Vf applied to each electron-emitting device is a difference voltage between the applied scanning signal and the modulation signal.

  As an electron-emitting device that can be used in the present invention, a MIM-type electron-emitting device, or a field-emission electron-emitting device (so-called “conical or quadrangular pyramid-shaped electron-emitting device”) Spindt-type field emission electron emission devices), field emission electron emission devices using carbon fibers with nano-sized diameters such as carbon nanotubes and graphite nanofibers as electron emitters, surface conduction electron emission devices, etc. And a cold cathode type electron-emitting device.

  Each of the electron-emitting devices is an electron-emitting device that includes two electrodes arranged at least at intervals and emits electrons by applying a voltage between the two electrodes. Of these, surface conduction electron-emitting devices and field emission electron-emitting devices using carbon fibers as electron emitters can be preferably used.

  Next, an example of an electron source using the above-described matrix-arranged electron source substrate and an image display device will be described with reference to FIGS. FIG. 7 is a basic configuration diagram of the image display device, and FIG. 8 is a diagram showing a fluorescent film.

  In FIG. 7, 71 is an electron source substrate on which a plurality of electron-emitting devices 74 are arranged, 81 is a rear plate to which the electron source substrate 71 is fixed, 86 is a fluorescent film 84, a conductive film 85, etc. on the inner surface of a transparent substrate 83 such as glass. Is a face plate formed. Reference numeral 82 denotes a support frame. The rear plate 81, the support frame 82, and the face plate 86 are sealed by applying an adhesive such as frit glass or indium to the joint and heating in the atmosphere, nitrogen, or vacuum. An envelope 88 is constituted by the worn structure. The conductive film 85 is a member corresponding to the anode electrode.

When the envelope 88 is formed by sealing in the atmosphere or nitrogen, then the internal pressure is set to a desired degree of vacuum (eg, about 1.3 × 10 ⁻⁵ Pa through an unillustrated exhaust pipe). After evacuating until reaching (), the envelope 88 whose inside is maintained in vacuum can be obtained by sealing the exhaust pipe. Further, if sealing is performed in a vacuum, sealing can be performed at the same time as sealing without using the exhaust pipe, so that an envelope 88 whose interior is maintained in vacuum can be easily obtained.

  In addition, a getter (not shown) disposed inside the envelope 88 may be activated before and after sealing the envelope 88. When sealing in a vacuum as described above, a getter (not shown) disposed inside the envelope 88 is activated before and after sealing. By doing in this way, the vacuum degree inside the envelope 88 after sealing can be maintained.

  The envelope 88 can be composed of a face plate 86, a support frame 82, and a rear plate 81. However, since the rear plate 81 is provided mainly for the purpose of reinforcing the strength of the substrate 71, the separate rear plate 81 is not necessary when the substrate 71 itself has sufficient strength. Therefore, the support frame 82 may be directly sealed on the substrate 71, and the envelope 88 may be configured by the face plate 86, the support frame 82 and the substrate 71.

  Further, an envelope 88 having sufficient strength against atmospheric pressure is configured by installing a support member (not shown) called a spacer between the face plate 86 and the rear plate 81 (substrate 71). Can do.

  FIGS. 8A and 8B show examples of specific configurations of the fluorescent film 84 shown in FIG. In the case of monochrome, the fluorescent film 84 is composed of only a monochromatic phosphor 92. However, when configuring a color image display device, the fluorescent film 84 includes phosphors 92 of three primary colors and a light absorbing member 91 disposed between the colors.

  In general, the light absorbing member 91 can be a black member. FIG. 8A shows a form in which the light absorbing members 91 are arranged in a stripe shape. FIG. 8B shows a form in which the light absorbing members 91 are arranged in a matrix.

  In general, the form of FIG. 8A is called “black stripe”, and the form of FIG. 8B is called “black matrix”. The purpose of providing the light-absorbing member 91 is to make the mixed colors of the three primary color phosphors required for color display inconspicuous in the color-separated portion between the phosphors 92 and the contrast of the fluorescent film 84 due to reflection of external light. It is in suppressing the decrease.

  The material of the light absorbing member 91 is not limited to this as long as it is a material that has a low light transmission and reflection, as well as a material that is commonly used as a main component of graphite. Further, it may be conductive or insulating.

  On the inner surface side of the fluorescent film 84, a conductive film 85 that is usually called “metal back” or the like is provided. The purpose of the conductive film 85 is to improve the luminance by specularly reflecting the light emitted from the phosphor 92 toward the electron-emitting device side to the face plate 86 side, and to apply an electron beam acceleration voltage. For example, to suppress the phosphor damage caused by the collision of negative ions generated in the envelope 88.

  The conductive film 85 is usually formed of an aluminum film. The conductive film 85 can be manufactured by performing a smoothing process (usually called “filming”) on the surface of the fluorescent film 84 after the fluorescent film 84 is manufactured, and then depositing Al by vacuum evaporation or the like.

  In order to further increase the conductivity of the fluorescent film 84, a transparent electrode (not shown) made of ITO or the like may be provided between the fluorescent film 84 and the face plate 86 on the face plate 86.

  A voltage is applied to each electron-emitting device in the envelope 88 through the terminals Dox1 to Doxm and Doy1 to Doyn connected to the X-direction wiring 72 and the Y-direction wiring 73 connected to each electron-emitting device in the envelope 88. By applying, so-called “line sequential driving” can be performed by performing the matrix driving described above. At this time, a voltage of 5 kV to 30 kV, preferably 10 kV to 25 kV, is applied to the metal back 85 through the high voltage terminal 87. By doing so, the electrons emitted from the selected electron-emitting device are transmitted through the metal back and collide with the fluorescent film 84. An image is displayed by exciting and emitting the phosphor.

  The X-directional wiring 72 uses the embedded wiring according to the present invention as described above, and is formed so as to be embedded in a groove formed on the surface of the substrate 71. In the configuration described above, the detailed portions such as the material of each member are not limited to the above-described contents, and are appropriately changed according to the purpose.

  In addition, an information display / reproduction device can be configured by using the envelope (image display device) 88 of the present invention described with reference to FIG.

  Specifically, a receiver that receives broadcast signals such as television broadcasts and character broadcasts, and various signals emitted from an information storage device such as a connected digital camera, a tuner that selects the received signals, and a song selected. At least one of video information, character information, and audio information included in the signal is output to an envelope (image display device) 88 to be displayed or reproduced. With this configuration, an information display / playback apparatus such as a television can be configured. Furthermore, a mechanism for outputting the displayed information to a connected printer can be provided.

  Of course, when the broadcast signal is encoded, the information display / playback apparatus of the present invention can also include a decoder. The audio signal is output to audio reproduction means such as a speaker provided separately, and reproduced in synchronization with video information and character information displayed on the envelope (image display device) 88.

  As a method for outputting video information or character information to the envelope (image display device) 88 for display or reproduction, for example, the following can be performed.

  First, an image signal corresponding to each pixel of the envelope (image display device) 88 is generated from the received video information and character information. Then, the generated image signal is input to a drive circuit of an envelope (image display device) 88. Further, based on the image signal input to the drive circuit, the voltage applied from the drive circuit to each electron-emitting device in the envelope (image display device) 88 is controlled to display an image.

  The configuration of the image display device described here is an example of an image display device to which the present invention can be applied, and various modifications can be made based on the technical idea of the present invention. The image display device of the present invention can also be used as a display device such as a video conference system or a computer.

  Next, examples of the present invention will be described.

Example 1
FIG. 9 shows a process flow of the wiring board according to the first embodiment. First, as shown in FIG. 9A, a single layer patterning of a dry film resist 102 was formed on a glass substrate 101. Next, as shown in FIG. 9B, a dry film resist 103 of the second layer was laminated and formed except for the portion that would be a convex portion in the groove. At this time, the width of the groove was 200 μm, the convex portion forming resist pattern was 50 μm wide and the film thickness was 5 μm.

  Next, as shown in FIG. 9C, when the resist substrate was subjected to sand blasting treatment using # 1000 abrasive grains, a groove 103 having a depth of 70 μm was formed as shown in FIG. The height of the convex portion 104 in the groove 103 was 40 μm.

  Thereafter, Ag wiring paste is patterned and printed on a groove-formed substrate from which the dry film resist has been removed by screen printing using a screen printing plate # 325, emulsion thickness 20 μm, opening width of 100 μm (see FIG. 11), and fired at 420 ° C. Then, an Ag wiring was embedded and formed.

  Thus, a wiring board as shown in FIGS. 1 and 2 was produced. The thickness of the Ag wiring 4 after firing was 45 μm, and the wiring resistance of the 920 mm long wiring was 3Ω. The generation of cracks in the glass substrate due to the stress after the formation of the Ag wiring was not observed on this wiring substrate. Further, no disconnection of wiring or protrusion of Ag was observed.

  As described above, in this embodiment, by forming the convex shape of the cross section in the width direction at the groove bottom portion, the stress from the wiring material to the substrate is relieved, and as a result, the thickness of the wiring material to be formed is increased to increase the wiring resistance. Can be reduced.

(Comparative example)
In the comparative example, an embedded wiring board having no convex shape was formed at the groove bottom. Thereafter, patterning printing was performed using a screen printing plate (see FIG. 12), and firing was performed to embed an Ag wiring. However, the emulsion thickness of the screen plate was 10 μm. In this way, a wiring board shown in FIG. 14 was produced. At this time, the wiring film thickness was 39 μm and the wiring resistance was 4Ω. However, the generation of cracks in the glass substrate due to the stress after the formation of the Ag wiring was observed on this wiring board. In addition, disconnection due to poor transfer of the Ag printing paste was observed on this wiring board.

(Example 2)
FIG. 10 shows a process flow of groove formation according to the second embodiment. First, as shown in FIG. 10A, a dry film resist 102 was formed on the glass substrate 101 by patterning. The width of the groove was 200 μm, the convex portion forming resist pattern was 40 μm wide, and the film thickness was 40 μm. Next, as shown in FIG. 10B, when this resist substrate was subjected to sand blasting treatment using # 1000 abrasive grains, a groove 103 having a depth of 70 μm was formed as shown in FIG. 10C. In addition, convex portions 104 were formed between the grooves 103.

  Thereafter, Ag wiring paste is patterned and printed on a groove-formed substrate from which the dry film resist has been removed, using a screen printing method # 325, an emulsion thickness of 20 μm, and an opening width of 100 μm (see FIG. 11). Then, an Ag wiring was buried and formed. In this way, a wiring board as shown in FIG. 3 was produced.

  The film thickness of the Ag wiring after firing was 45 μm, and the wiring resistance of the wiring having a length of 920 mm was 3Ω. The generation of cracks in the glass substrate due to the stress after the formation of the Ag wiring was not observed on this wiring substrate. Further, no disconnection of the wiring or protrusion of Ag from the side surface of the groove was observed.

(Example 3)
Similarly to Example 1, a groove having a depth of 70 μm was formed in the substrate, and an Ag wiring was embedded in the groove by screen printing. However, as shown in FIG. 4B, the groove is deeply formed at the terminal portion in the length direction of the groove of the substrate, and the convex portion is not connected to the terminal portion of the groove. Thus, the wiring board shown in FIG. 4 was produced. The generation of cracks in the glass substrate due to the stress after the formation of the Ag wiring was not observed on this wiring substrate. Also, no bleeding of Ag at the end of the groove was observed. This is because, as described above, the structure in which the convex portion is not connected to the groove end portion has the effect of preventing the bleeding of Ag at the groove end portion.

Example 4
In Example 4, a dry film resist 102 was formed by patterning on the glass substrate 101 as shown in FIG. In this case, however, the dry film resist was formed by patterning in a broken line as shown in FIG. The width of the groove was 200 μm, the convex portion forming resist pattern was 40 μm wide, and the film thickness was 40 μm. Next, as shown in FIG. 10B, when this resist substrate was sandblasted using # 1000 abrasive grains, a groove having a depth of 70 μm was formed as shown in FIG. 10C.

  Then, Ag wiring paste is patterned and printed on a groove-formed substrate from which the dry film resist is removed by screen printing using a screen printing plate # 325, emulsion thickness 20 μm, opening width of 100 μm, and fired at 420 ° C. to form Ag wiring. Embedded and formed.

  Thus, the wiring board shown in FIG. 5 was produced. The film thickness of the Ag wiring after firing was 45 μm, and the wiring resistance of the wiring having a length of 920 mm was 2.5Ω. The generation of cracks in the glass substrate due to the stress after the formation of the Ag wiring was not observed on this wiring substrate. Further, no disconnection of wiring or protrusion of Ag was observed.

(Example 5)
In Example 5, the electron source shown in FIG. 6 was created using the manufacturing method of Example 4, and the image display apparatus shown in FIG. 7 was formed using this electron source. A surface conduction electron-emitting device was used as the electron-emitting device 74. Specifically, the X-direction wiring 72 was formed on the electron source substrate 71 shown in FIG. 7 by using the manufacturing method of Example 4 (or the manufacturing methods of Examples 1 to 3). At this time, the wiring shown in FIG. 5 was formed on the substrate 71. Then, it was formed by printing an insulating layer mainly composed of SiO ₂ in the region where the X-direction wiring 72 and Y-direction wirings 73 intersect. Further, the Y-direction wiring 73 was formed on the insulating layer by screen printing using Ag paste. Each surface conduction electron-emitting device 74 was connected to one of the X direction wirings 72 and one of the Y direction wirings 73. Then, as described above, the image display device shown in FIG. 7 was manufactured by assembling using the rear plate 81, the support frame 82, the face plate 86, and the like. A scanning signal output circuit was connected to the Y direction wiring 73, and a modulation signal output circuit was connected to the X direction wiring 72. The image display device thus formed is connected to a receiving device that receives the above-mentioned signal and a tuner that selects the received signal, and a television broadcast is displayed. Was able to display a good image.

It is sectional drawing which shows 1st Embodiment of the wiring board which concerns on this invention. It is a top view of FIG. It is sectional drawing which shows 2nd Embodiment of the wiring board which concerns on this invention. It is a figure which shows 3rd Embodiment of the wiring board which concerns on this invention. It is a figure which shows 4th Embodiment of the wiring board which concerns on this invention. It is a figure which shows the matrix wiring using the wiring of this invention. 1 is a perspective view showing an embodiment of an electron source and an image display device using wiring according to the present invention. It is a figure which shows the fluorescent film used for the image display apparatus of FIG. It is a figure which shows the manufacturing process of the wiring board by Example 1 of this invention. It is a figure which shows the manufacturing process of the wiring board by Example 2 of this invention. It is a figure explaining a mode that Ag wiring is patterned and printed in Example 1 of this invention using a screen printing method. It is a figure explaining a mode that Ag wiring is patterned and printed using the screen printing method in the comparative example of this invention. It is a figure explaining the stress from wiring to a board | substrate with the past and this invention. It is sectional drawing which shows the conventional wiring embedding board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Groove 3 Protrusion 4 Ag wiring 71 Insulating substrate (electron source substrate)
72 X-direction wiring 73 Y-direction wiring 74 Electron emitter 81 Rear plate 82 Support frame 83 Transparent substrate 84 Fluorescent film 85 Conductive film 86 Face plate 88 Envelope

Claims (17)

A wiring board comprising a groove on a substrate surface, wherein at least one convex portion is disposed inside the groove, and wiring is filled in the groove in which the convex portion is disposed. The wiring board according to claim 1, wherein the convex portions are continuously arranged along a length direction of the groove. The said groove | channel is comprised from the some groove | channel arrange | positioned in parallel with the said board | substrate surface, and wiring is arrange | positioned ranging over these groove | channels, The Claim 1 or 2 characterized by the above-mentioned. Wiring board. 4. The wiring board according to claim 1, wherein convex portions are periodically formed along a length direction of the groove. 5. The wiring substrate according to claim 1, wherein the convex portion is not connected to an end portion in the longitudinal direction of the groove. The wiring board according to claim 1, wherein a height of the convex portion from a bottom surface of the groove is 4 μm or more. A method of manufacturing a wiring board having wiring filled in a groove on a substrate surface,
Filling the groove of the substrate having the groove of the first pattern on the surface with a wiring material using a screen printing method,
The method of manufacturing a wiring board, wherein the groove is formed so as to have at least one convex portion at a bottom thereof. In an electron source having a plurality of electron-emitting devices and a substrate having a wiring connected to each of the plurality of electron-emitting devices, the wiring is filled in a groove formed on the surface of the substrate. An electron source, wherein at least one convex portion is disposed inside the groove. The electron source according to claim 8, wherein the convex portions are continuously arranged along a length direction of the groove. The said groove | channel is comprised from the some groove | channel arrange | positioned in parallel with the said board | substrate surface, and wiring is arranged and arranged across these groove | channels, It is characterized by the above-mentioned. Electron source. 11. The electron source according to claim 8, wherein convex portions are periodically formed along a length direction of the groove. The electron source according to claim 8, wherein the convex portion is not connected to an end portion in a longitudinal direction of the groove. The electron source according to any one of claims 8 to 12, wherein a height of the convex portion from a bottom surface of the groove is 4 µm or more. 14. An image display device comprising: an electron source; and a light emitter that emits light when irradiated with electrons emitted from the electron source, wherein the electron source is an electron according to claim 8. An image display device characterized by being a source. An information display / playback device comprising: a receiver that outputs at least one of video information, text information, and audio information included in a received broadcast signal; and an image display device connected to the receiver, An information display / playback apparatus, wherein the display apparatus is the image display apparatus according to claim 14. A method of manufacturing an electron source having a substrate comprising a plurality of electron-emitting devices and wiring connected to each of the plurality of electron-emitting devices,
Filling the groove of the substrate having a groove of a desired pattern on the surface with a wiring material using a screen printing method,
The method of manufacturing an electron source, wherein the groove includes at least one convex portion at a bottom thereof. An image display device comprising: an electron source; and a light emitter that emits light when irradiated with electrons emitted from the electron source, wherein the electron source is produced by the method according to claim 16. A manufacturing method of an image display device, characterized by being manufactured.

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