JP2006064667A - Semiconductor inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a semiconductor inspection device which can realize inspection in an environment close to the actual use condition of a product, without requiring preparation of an expensive LSI tester, in inspecting a semiconductor device for radio communication. <P>SOLUTION: The semiconductor inspection device for inspecting the semiconductor device for radio communication, which converts an inputted analog high-frequency signal into a low-frequency signal to be outputted, and which converts the inputted low-frequency signal into an analog high-frequency signal to be outputted, includes a reference circuit having a function similar to that of the semiconductor device, wherein the characteristics are confirmed, in advance; and a transmission means for inputting the analog high-frequency signal outputted from the reference circuit into the semiconductor device and for inputting the analog high-frequency signal outputted from the semiconductor device into the reference circuit. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor inspection apparatus that inspects a semiconductor device for wireless communication.

  Various semiconductor inspection devices have been proposed for inspecting semiconductor devices for wireless communication (for example, see Patent Document 1). A conventional semiconductor inspection apparatus uses an LSI tester having an analog high-frequency inspection function. A schematic view of a conventional semiconductor inspection apparatus using such an LSI tester is shown in FIG. As illustrated, an LSI tester 103 is connected to a test board 102 on which a semiconductor device (hereinafter referred to as DUT) 101 is mounted.

  The test board 102 has a peripheral circuit 104 for extracting the performance of the DUT 101 and an interface circuit 105 for exchanging signals with the LSI tester 103. The configuration of the test board 102 is designed in advance based on the inspection specification.

  On the other hand, the LSI tester 103 includes a logic pattern generation unit 106 that generates a logic pattern, a time measurement unit 107, a relay switch control unit 108 that controls a relay switch on the test board 102, a power supply 109, a low-frequency signal generator 110, a low-frequency signal generator 110, The apparatus includes a frequency signal measuring device 111, an analog high frequency signal generator 112, an analog high frequency signal measuring device 113, and a control unit 114 that controls these components to execute an inspection.

  Here, the logic pattern generation unit 106, the time measurement unit 107, the relay switch control unit 108, and the power source 109 are connected to the DUT 101 and the peripheral circuit 104 via the signal line 115 and the interface circuit 105.

  Then, the low frequency signal generator 110 generates a low frequency signal, and the low frequency signal measuring device 111 inspects the low frequency signal. The analog high-frequency signal generator 112 is a signal generator that generates an analog high-frequency signal such as a single sine wave or a modulated wave, and has a function of applying modulation corresponding to various modulation methods. The analog high-frequency signal measuring device 113 has a function of analyzing waveforms of various modulated waves by a digital signal processor (DSP).

  Since the DUT 101 is a semiconductor device for wireless communication, it has a transceiver function. Therefore, in order to convert radio waves received from other telephones into voices that can be heard by human ears, a reception system block 116 that converts analog high-frequency signals into low-frequency signals in the voice band is provided. In addition, in order to output a human voice spoken toward the receiver as radio waves, a transmission system block 117 that converts a low-frequency signal in the voice band into an analog high-frequency signal is provided.

  Next, an operation at the time of inspecting a DUT with an analog high frequency signal using the semiconductor inspection apparatus will be described. First, an analog high-frequency signal generated by the analog high-frequency signal generator 112 of the LSI tester 103 is input to the DUT 101 of the test board 102, subjected to signal processing by the reception system block 116, and output as a low-frequency signal. The low frequency signal output from the DUT 101 is input to the low frequency signal measuring device 111 of the LSI tester 103 and inspected.

  Similarly, the low-frequency signal generated by the low-frequency signal generator 110 of the LSI tester 103 is input to the DUT 101 of the test board 102, signal-processed by the transmission system block 117, and output as an analog high-frequency signal. The analog high frequency signal output from the DUT 101 is input to the analog high frequency signal measuring device 113 of the LSI tester 103 and inspected.

JP 2004-48383 A

  In recent years, with the widespread use of mobile phones, not only high-frequency parts such as PLLs and RF amplifiers, but also all functions including modulation, demodulation, and sound processing parts have been integrated into one semiconductor device. When such a semiconductor device is inspected, a modulation signal source, a signal demodulation means, and an analysis means corresponding to the system of the semiconductor device to be inspected are required. Furthermore, when testing a semiconductor device for wireless communication, particularly a semiconductor device that handles signals of 1 GHz or higher, an LSI tester incorporating an analog high-frequency signal generator and an analog high-frequency signal measuring instrument is required. Therefore, there is a problem that an expensive LSI tester must be prepared according to the method of the semiconductor device to be inspected.

  When an inspection is performed using an analog high-frequency signal, the peripheral circuit surrounding the DUT and the signal transmission circuit portion for transmitting a signal from the LSI tester are restricted by the test board and the signal transmission method due to the structure of the LSI tester. . In this case, there is a problem that even if correction is made in the form of correlation, the mounting state when used in an actual product cannot be faithfully reproduced.

  The present invention has been made in order to solve the above-described problems. The purpose of the present invention is to eliminate the need for an expensive LSI tester when inspecting a semiconductor device for wireless communication. A semiconductor inspection apparatus capable of realizing inspection in an environment close to a state is obtained.

  A semiconductor inspection apparatus according to the present invention inspects a semiconductor device for wireless communication that converts an input analog high-frequency signal into a low-frequency signal and outputs the signal, and converts the input low-frequency signal into an analog high-frequency signal and outputs the signal. A semiconductor inspection apparatus having a function similar to that of a semiconductor device, the characteristics of which have been confirmed in advance, and an analog high-frequency signal output from the reference circuit are input to the semiconductor device and output from the semiconductor device Transmission means for inputting the analog high-frequency signal to the reference circuit. Other features of the present invention will become apparent below.

  According to the present invention, when inspecting a semiconductor device for wireless communication, it is not necessary to prepare an expensive LSI tester, and the inspection can be realized in an environment close to the actual use state of the product.

Embodiment 1 FIG.
FIG. 1 is a schematic configuration diagram showing a semiconductor inspection apparatus according to Embodiment 1 of the present invention. As shown in the figure, an LSI tester 13 is connected to a test substrate 12 on which a semiconductor device (hereinafter referred to as DUT) 11 is mounted.

  The test board 12 is provided with a DUT mounting device 14 for mounting the DUT 11 and an auxiliary auxiliary device 15 for inspection. The DUT mounting device 14 is provided with an interface circuit 16 for exchanging signals between the LSI tester 13 and the DUT 11. On the other hand, the auxiliary test device 15 has a function equivalent to that of the DUT 11, and a reference circuit 17 whose characteristics have been confirmed in advance, and an interface circuit 18 for exchanging signals between the LSI tester 13 and the reference circuit 17. Is provided.

  The LSI tester 13 supplies a logic pattern generation unit 21 that generates a pattern for a logic function test, a time measurement unit 22 that measures a time related to inspection, a relay switch control unit 23 that controls a relay switch on the test board 12, and power supply Power supply 24, low-frequency signal generator 25 for generating a low-frequency signal in the audio signal band, low-frequency signal measuring device 26 for inspecting the low-frequency signal in the audio signal band, and controlling these components for inspection A control unit 27 to be executed is included. That is, the LSI tester 13 does not have an analog high-frequency signal generator or an analog high-frequency signal measuring device, unlike the conventional one.

  Here, the control unit 27 controls the other components of the LSI tester 13 to execute a predetermined inspection by executing a program stored in advance in the memory. In addition, the logic pattern generation unit 21, the time measurement unit 22, the relay switch control unit 23, and the power supply 24 are connected to the DUT mounting device 14 and the auxiliary test device 15 for the power supply required for the inspection and the DC voltage of each terminal. AC characteristics such as logic pattern and time inspection are performed for setting, control of relay bits on the test board, and setting of bus data.

  The low frequency signal generated by the low frequency signal generator 25 is input to either the DUT 11 or the reference circuit 17 by switching the relay 28. Then, the low frequency signal output from either the DUT 11 or the reference circuit 17 is input to the low frequency signal measuring device 26 by switching the relay 29.

  Further, since the DUT 11 is a wireless communication semiconductor device, it has a transceiver function. Accordingly, in order to convert radio waves received from other telephones into sound that can be heard by human ears, a reception system block 31 is provided that converts an analog high-frequency signal composed of a modulated signal or a single sine wave into a low-frequency signal in the voice band. . Further, in order to output a human voice spoken toward the receiver as radio waves, a transmission system block 32 that converts a low frequency signal into an analog high frequency signal is provided. Similarly, the reference circuit 17 includes a reception system block 33 and a transmission system block 34.

  The analog high-frequency signal output from the transmission system block 32 of the DUT 11 is input to the reception system block 33 of the reference circuit 17 via the transmission means 35 in the test board 12. The analog high frequency signal output from the transmission system block 34 of the reference circuit 17 is input to the reception system block 31 of the DUT 11 via the transmission means 36 in the test board 12.

  Next, a method for inspecting a semiconductor device for wireless communication using the semiconductor inspection device will be described. However, since a semiconductor device for wireless communication is divided into a transmission system block and a reception system block, each method for inspecting each will be described.

  In order to inspect the transmission system block of the semiconductor device, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system block 32 of the DUT 11. Next, the analog high frequency signal output from the transmission system block 32 of the DUT 11 is input to the reception system block 33 of the reference circuit 17. The low frequency signal output from the reception block 33 of the reference circuit 17 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  On the other hand, to inspect the reception system block of the semiconductor device, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system block 34 of the reference circuit 17. Next, the analog high-frequency signal output from the transmission system block 34 of the reference circuit 17 is input to the reception system block 31 of the DUT 11. The low frequency signal output from the reception system block 31 of the DUT 11 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  FIG. 2 is a detailed configuration diagram showing the DUT. The reception system block of the DUT 11 includes a signal input port 41, a crystal oscillator 42, an oscillation circuit 43, a PLL circuit 44, a first mix circuit 45, an intermediate frequency amplification unit 46, a second mix circuit 47, a demodulation circuit 48, and a low frequency amplification. Part 49 and a signal output port 50. The transmission system block of the DUT 11 includes a signal input port 51, a crystal oscillator 42, an oscillation circuit 43, a PLL circuit 52, a modulation circuit 53, a high frequency amplification unit 54, and a signal output port 55. These are controlled by a control signal transmitted from the control unit 56, and conditions are set by bus data input from the outside via the control signal input unit 57.

  Here, the analog high frequency signal input to the DUT 11 through the signal input port 41 is generated by the PLL circuit 44 in the first mix circuit 45 based on the reference frequency generated by the crystal oscillator 42 and the oscillation circuit 43. Mixed with analog high frequency signal. This mixed signal is a difference between the input analog high frequency signal and the internally generated analog high frequency signal, and becomes a low frequency signal. The low frequency signal is amplified by the intermediate frequency amplification unit 46, mixed with the reference frequency by the second mix circuit 47, demodulated by the demodulation circuit 48, and output from the signal output port 50.

  On the other hand, the low frequency signal input to the DUT 11 through the signal input port 51 is converted into an analog high frequency signal generated by the PLL circuit 52 based on the reference frequency generated by the crystal oscillator 42 and the oscillation circuit 43 in the modulation circuit 53. Modulate the signal. The modulated analog high frequency signal is amplified by the high frequency amplifier 54 and output from the signal output port 55.

  FIG. 3 is a detailed configuration diagram showing a test substrate of the semiconductor inspection apparatus according to the first embodiment. Constituent elements similar to those in FIG.

  The DUT mounting device 14 has an output terminal 61 that outputs an analog high-frequency signal output from the DUT 11 to the outside, and an input terminal 62 that inputs an analog high-frequency signal input from the outside to the DUT 11. The auxiliary test device 15 has an output terminal 63 that outputs an analog high-frequency signal output from the reference circuit 17 to the outside, and an input terminal 64 that inputs an analog high-frequency signal input from the outside to the reference circuit 17.

  The output terminal 61 of the DUT mounting device 14 and the input terminal 64 of the auxiliary auxiliary device 15 are connected by a coaxial cable 65, and the input terminal 62 of the DUT mounting device 14 and the output terminal 63 of the auxiliary auxiliary device 15 are connected by the coaxial cable 66. Connected with. That is, the coaxial cables 65 and 66 are used as transmission means for inputting the analog high frequency signal output from the reference circuit 17 to the DUT 11 and inputting the analog high frequency signal output from the DUT 11 to the reference circuit 17.

  Further, in the auxiliary test device 15, the analog high frequency signal input from the input terminal 64 is input to the reference circuit 17 via the attenuator 67. The analog high frequency signal output from the reference circuit 17 is output from the output terminal 63 via the attenuator 68. The analog high-frequency signal that has passed through the attenuators 67 and 68 is attenuated to an appropriate signal level. However, the attenuation amount of the attenuators 67 and 68 is about 60 dB, and is set to an arbitrary attenuation amount with a minimum step of 0.5 dB or 1 dB.

  The low frequency signal output from the reference circuit 17 is converted into an appropriate signal by the filter circuit 71 and the amplification unit 72. However, whether or not the low frequency signal is allowed to pass through the filter circuit 71 can be switched by the relays 73 and 74, and whether or not the low frequency signal is passed through the amplification unit 72 can be switched by the relays 75 and 76.

  If the LSI tester 13 does not have a built-in low frequency signal measuring device, the low frequency signal output from the DUT 11 is detected by the detector 77 and converted to a DC signal. As a result, the LSI tester 13 can measure as a DC signal.

  However, the reference circuit 17, attenuators 67 and 68, the filter circuit 71, the amplification unit 72, and the detector 77 are controlled by the control unit 78 based on the setting signal from the LSI tester 13.

  In order to draw out the characteristics of the DUT 11, a peripheral circuit unit 79 is provided around the DUT 11. Similarly, a peripheral circuit unit 68 is provided around the reference circuit 17 in order to extract the characteristics of the reference circuit 17.

  FIG. 4 is a detailed block diagram showing the LSI tester. The power sources in the LSI tester 13 are n power sources 81 and a large-capacity power source 82, which are connected to the matrix 83, respectively. However, the connection between the power supply 81 and the matrix 83 is switched by the relay 84 for each of the pins 1 to n, and the connection between the power supply 82 and the matrix 83 is switched by the relay 85. The power supplies 81 and 82 can measure voltage application current and current application voltage.

  The current supplied from the power supplies 81 and 82 is output to the test head 87a or 87b via the matrix 83 and the multiplexer 86. In addition, the logic pattern generation unit 21, the time measurement unit 22, the relay switch control unit 23, the low frequency signal generator 25, and the low frequency signal measurement unit 26 are also connected to the test heads 87a and 87b. Then, power and control signals necessary for the inspection are output from the test heads 87 a and 87 b to the test board 12. However, when there are a plurality of test heads 87 a and 87 b, one test head is selected by the multiplexer 86.

  The logic pattern generation unit 21 includes a driver that outputs a pattern stored in the memory and a comparator that compares and determines a value stored in the memory for each of the pins 1 to n. A logic pattern can be added to or taken into each pin by the multiplexer 86 or the relays in the test heads 87a and 87b.

  As described above, the semiconductor inspection apparatus according to the first embodiment has the reference circuit having the same function as the semiconductor apparatus. Then, an analog high frequency signal to be input to the semiconductor device is generated by the reference circuit, and the analog high frequency signal output from the semiconductor device is converted into a low frequency signal by the reference circuit. Thereby, a semiconductor device for wireless communication can be inspected without using an LSI tester incorporating an analog high-frequency signal generator and an analog high-frequency signal measuring device. Therefore, it is not necessary to prepare an expensive LSI tester, so that the inspection cost can be reduced. Furthermore, since it does not depend on the function of the LSI tester, not only an analog LSI tester but also a logic LSI tester can be used.

  In addition, by providing a reference circuit that has the same function as a semiconductor device and sending and receiving analog high-frequency signals to and from the semiconductor device, inspection can be performed in an environment close to the actual use state of a semiconductor device for wireless communication. Can be realized.

Embodiment 2. FIG.
FIG. 5 is a detailed configuration diagram showing a test substrate of the semiconductor inspection apparatus according to the second embodiment. Constituent elements similar to those in FIG.

  In the first embodiment, coaxial cables 65 and 66 are used as transmission means. On the other hand, in the second embodiment, a means for transmitting and receiving spatial electromagnetic waves between the DUT 11 and the reference circuit 17 is used as the transmission means.

  Specifically, a duplexer 91 is connected to an analog high frequency signal input / output terminal of the DUT 11, and an antenna 92 for efficiently transmitting and receiving the analog high frequency signal is provided at the end. In addition, a duplexer 93 is connected to the input / output terminal of the analog high-frequency signal of the reference circuit 17, and an antenna 94 for efficiently transmitting / receiving the analog high-frequency signal is provided beyond the duplexer 93.

  Next, a method for inspecting the DUT 11 using the semiconductor inspection apparatus will be described. In order to inspect the transmission system block, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system block 32 of the DUT 11. Next, the analog high-frequency signal output from the transmission system block 32 of the DUT 11 is input to the duplexer 91. The duplexer 91 inputs an analog high-frequency signal to the antenna 92, and the signal input to the antenna 92 is emitted into space as an electromagnetic wave. The emitted electromagnetic wave is received by the antenna 94, passed through the duplexer 93, and input to the reception system block 33 of the reference circuit 17. The low frequency signal output from the reception block 33 of the reference circuit 17 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  On the other hand, to inspect the reception system block of the DUT 11, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system block 34 of the reference circuit 17. Next, the analog high-frequency signal output from the transmission system block 34 of the reference circuit 17 is input to the duplexer 93. The duplexer 93 inputs an analog high-frequency signal to the antenna 94, and the signal input to the antenna 94 is emitted into the space as an electromagnetic wave. Then, the emitted electromagnetic wave is received by the antenna 92, passed through the duplexer 91, and input to the reception system block 31 of the DUT 11. The low frequency signal output from the reception system block 31 of the DUT 11 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  Bidirectional signal transmission is possible by changing the frequency of the analog high-frequency signal transmitted and received from the antennas 92 and 94.

  As described above, the semiconductor inspection apparatus according to the second embodiment is configured to transmit and receive spatial electromagnetic waves between the DUT and the reference circuit. Therefore, the inspection can be realized in an environment close to the actual use state of the product of the semiconductor device for wireless communication as compared with the first embodiment or more. Further, since the coaxial cable is not required, it is not necessary to install the DUT mounting device and the auxiliary test device adjacent to each other in the semiconductor inspection device, and the degree of layout is improved.

Embodiment 3 FIG.
FIG. 6 is a detailed configuration diagram showing a test substrate of the semiconductor inspection apparatus according to the third embodiment. Constituent elements similar to those in FIG.

  Although the second embodiment only inspects one semiconductor device, the third embodiment inspects a plurality of semiconductor devices. Here, four DUTs 11a, 11b, 11c, and 11d are provided on the DUT mounting devices 14a, 14b, 14c, and 14d, respectively, and duplexers 91a, 91b, 91c, and 91d, which are transmission means, and antennas 92a, 92b, and 92d, respectively. 92c and 92d.

  Next, a method for inspecting each semiconductor device using the above-described semiconductor inspection apparatus will be described. In order to inspect the transmission system block, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system blocks of the four DUTs 11a, 11b, 11c, and 11d. Next, analog high-frequency signals output from these transmission system blocks are input to duplexers 91a, 91b, 91c, 91d and antennas 92a, 92b, 92c, 92d, respectively, and four different electromagnetic waves set in frequency ranges that do not interfere with each other. To be released into space. Then, the emitted electromagnetic wave is received by the antenna 94 and input to the reception system block 33 of the reference circuit 17 via the duplexer 93. At this time, the frequency of the oscillation circuit in the reception block 33 of the reference circuit 17 is sequentially switched with respect to the output signals of the four DUTs. The low frequency signal output from the reception block 33 of the reference circuit 17 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  On the other hand, to inspect the reception system block of the DUT 11, first, the low frequency signal generated by the low frequency signal generator 25 of the LSI tester 13 is input to the transmission system block 34 of the reference circuit 17. Next, the analog high-frequency signal output from the transmission system block 34 of the reference circuit 17 is input to the duplexer 93 and the antenna 94, and is emitted into space as an electromagnetic wave. The emitted electromagnetic waves are received by the antennas 92a, 92b, 92c, and 92d, respectively, and input to the reception system block 31 of the DUT 11 through the duplexers 91a, 91b, 91c, and 91. The low frequency signal output from the reception system block 31 of the DUT 11 is inspected by the low frequency signal measuring device 26 of the LSI tester 13.

  The semiconductor inspection apparatus according to the third embodiment has the same effect as that of the second embodiment. Further, by setting the spatial electromagnetic waves transmitted and received between each semiconductor device and the reference circuit to a frequency range that does not interfere with each other, a plurality of semiconductor devices can be inspected simultaneously.

It is a schematic block diagram which shows the semiconductor inspection apparatus which concerns on Embodiment 1 of this invention. It is a detailed block diagram which shows DUT. 2 is a detailed configuration diagram illustrating a test substrate of the semiconductor inspection apparatus according to the first embodiment. FIG. It is a detailed block diagram which shows a LSI tester. It is a detailed block diagram which shows the test board | substrate of the semiconductor inspection apparatus which concerns on Embodiment 2 of this invention. FIG. 6 is a detailed configuration diagram illustrating a test substrate of a semiconductor inspection apparatus according to a third embodiment. It is the schematic which shows the conventional semiconductor inspection apparatus.

Explanation of symbols

11 DUT (semiconductor device)
12 Test board 13 LSI tester 17 Reference circuit 35, 36 Transmission means 65, 66 Coaxial cable (transmission means)
91, 91a, 91b, 91c, 91d, 93 Duplexer (transmission means)
92, 92a, 92b, 92c, 92d, 94 Antenna (transmission means)

Claims (4)

A semiconductor inspection apparatus that inspects a semiconductor device for wireless communication that converts an input analog high-frequency signal into a low-frequency signal and outputs the low-frequency signal and converts the input low-frequency signal into an analog high-frequency signal.
A reference circuit having the same function as the semiconductor device and whose characteristics have been confirmed in advance,
A semiconductor inspection apparatus comprising: transmission means for inputting an analog high-frequency signal output from the reference circuit to the semiconductor device and inputting the analog high-frequency signal output from the semiconductor device to the reference circuit.   The semiconductor inspection apparatus according to claim 1, wherein the transmission unit is a coaxial cable.   The semiconductor inspection apparatus according to claim 1, wherein the transmission unit is a unit that transmits and receives a spatial electromagnetic wave between the semiconductor device and the reference circuit. The transmission means is means for transmitting and receiving spatial electromagnetic waves between a plurality of the semiconductor devices and the reference circuit,
2. The semiconductor inspection apparatus according to claim 1, wherein spatial electromagnetic waves transmitted and received between each semiconductor device and the reference circuit are set in a frequency range that does not interfere with each other.

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