JP2006057064A - Thermoplastic resin molded article - Google Patents

Thermoplastic resin molded article Download PDF

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JP2006057064A
JP2006057064A JP2004243414A JP2004243414A JP2006057064A JP 2006057064 A JP2006057064 A JP 2006057064A JP 2004243414 A JP2004243414 A JP 2004243414A JP 2004243414 A JP2004243414 A JP 2004243414A JP 2006057064 A JP2006057064 A JP 2006057064A
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thermoplastic resin
resin molded
molded article
zinc oxide
filler
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Shintaro Komatsu
晋太郎 小松
Mitsuo Maeda
光男 前田
Hiroshi Harada
博史 原田
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin molded article showing high thermal conductivity even on producing the resin molded article by injection molding, and having an excellent molding processability. <P>SOLUTION: This thermoplastic resin molded article is obtained by blending a tetrapod-formed zinc oxide whisker consisting of a core part and needle-like crystal parts extending from the core part in 4 different axial directions and a fine filler material having ≤100 nm mean particle diameter, with a thermoplastic resin. The thermoplastic resin molded article is one that the ratio of total blending amount of the tetrapod-formed zinc oxide whisker and fine filler material is ≥15 vol.%. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、テトラポット状酸化亜鉛ウィスカーおよび微小充填材料を配合せしめてなる熱伝導性および成形加工適性に優れる熱可塑性樹脂成形体に関するものである。   The present invention relates to a thermoplastic resin molded article excellent in thermal conductivity and molding processability obtained by blending a tetrapot-like zinc oxide whisker and a fine filler.

近年、電気・電子部品の小型化、高性能化にともない部品内での発熱が顕著となり、熱の蓄積による機器の性能低下が問題となっている。そこで、安全性や信頼性の観点から熱伝導性に優れた材料が求められている。従来、高い熱伝導性を必要とする材料には金属材料が用いられてきたが、部品の小型化、高性能化のため材料には軽量性や易成形加工性が要求されており、樹脂への代替が進んでいる。しかしながら、樹脂は熱伝導性が元々低く、樹脂自体の高熱伝導化には限界がある。そこで、熱伝導率の高い充填材料(例えば、アルミナ、酸化マグネシウム、窒化ホウ素、炭素繊維等)を樹脂に高充填し、樹脂組成物を高熱伝率化する方法が行われている(例えば特許文献1)。   In recent years, with the miniaturization and high performance of electric / electronic components, heat generation in the components has become remarkable, and there has been a problem that the performance of the equipment is deteriorated due to heat accumulation. Therefore, a material excellent in thermal conductivity is required from the viewpoint of safety and reliability. Conventionally, metal materials have been used for materials that require high thermal conductivity. However, materials are required to be lightweight and easy to process to reduce the size and performance of parts. Substitution is progressing. However, the resin has low thermal conductivity from the beginning, and there is a limit to increasing the thermal conductivity of the resin itself. In view of this, a method has been performed in which a resin having a high thermal conductivity (for example, alumina, magnesium oxide, boron nitride, carbon fiber, or the like) is highly filled in a resin to increase the thermal conductivity of the resin composition (for example, Patent Documents). 1).

特開平8−73651号公報JP-A-8-73651

粒子状充填材料を樹脂に配合した場合、樹脂成形体の高熱伝導化には多量の充填材料が必要となる。充填量が多いと成形体の流動性が低下し成形加工が困難となるため、樹脂化のメリットが小さくなる。繊維状充填材料を配合した場合、繊維同士の接触確率は粒子状充填材料と比較して高く熱伝導路が形成されやすいため、粒子状充填材料より少ない充填量で高い熱伝導率が期待できる。しかしながら、射出成形により樹脂成形体を作製した場合、繊維は射出方向に平行に配向する傾向にあるため、繊維同士の接触確率は繊維がランダムに分散した場合と比較して低くなってしまう。
本発明は、このような問題点に鑑み、射出成形により樹脂成形体を作製した場合においても、高い熱伝導性を示し、優れた成形加工適性を有する熱可塑性樹脂成形体を提供することにある。
When the particulate filler material is blended with the resin, a large amount of filler material is required to increase the thermal conductivity of the resin molded body. When the filling amount is large, the fluidity of the molded body is lowered and the molding process becomes difficult. When the fibrous filler is blended, the contact probability between the fibers is higher than that of the particulate filler, and a heat conduction path is easily formed. Therefore, a high thermal conductivity can be expected with a smaller filling amount than the particulate filler. However, when a resin molded body is produced by injection molding, the fibers tend to be oriented parallel to the injection direction, so the contact probability between the fibers is lower than that when the fibers are randomly dispersed.
In view of such problems, the present invention is to provide a thermoplastic resin molded body that exhibits high thermal conductivity and has excellent molding processability even when a resin molded body is produced by injection molding. .

即ち本発明は、核部と該核部から異なる4軸方向に伸びた針状結晶部とからなるテトラポット状酸化亜鉛ウィスカーおよび平均粒子径が100nm以下の微小充填材料を熱可塑性樹脂に配合して成形して得られる熱可塑性樹脂成形体にかかるものである。   That is, the present invention includes a thermoplastic resin containing a tetrapot-like zinc oxide whisker having a core and needle-like crystal parts extending in different four-axis directions from the core and a fine filler having an average particle size of 100 nm or less. This is related to a thermoplastic resin molded body obtained by molding.

本発明の熱可塑性樹脂成形体に使用される熱可塑性樹脂とは、成形加工が可能な合成樹脂を指すが、特に本発明の目的に効果的な熱可塑性樹脂は液晶ポリエステルである。液晶ポリエステルは、サーモトロピック液晶ポリマーと呼ばれるポリエステルであり、(1)芳香族ヒドロキシカルボン酸と芳香族ジカルボン酸と芳香族ジオールとの組み合わせを反応させて得られるもの、(2)異種の芳香族ヒドロキシカルボン酸を反応させて得られるもの、(3)芳香族ジカルボン酸と芳香族ジオールとの組み合わせを反応させて得られるもの、(4)ポリエチレンテレフタレートなどのポリエステルに芳香族ヒドロキシカルボン酸を反応させて得られるもの、等が挙げられ、400℃以下の温度で異方性溶融体を形成するものが好ましい。
なお、これらの芳香族ジカルボン酸、芳香族ジオールおよび芳香族ヒドロキシカルボン酸の代わりに、それらのエステル形成性誘導体が使用されることもある。
該液晶ポリエステルの繰り返し構造単位としては下記のものを例示することができるが、これらに限定されるものではない。
The thermoplastic resin used in the thermoplastic resin molded article of the present invention refers to a synthetic resin that can be molded, but a particularly effective thermoplastic resin for the purpose of the present invention is a liquid crystalline polyester. The liquid crystal polyester is a polyester called a thermotropic liquid crystal polymer, (1) obtained by reacting a combination of an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid and an aromatic diol, and (2) a different kind of aromatic hydroxy. Obtained by reacting carboxylic acid, (3) obtained by reacting a combination of aromatic dicarboxylic acid and aromatic diol, and (4) reacting aromatic hydroxycarboxylic acid with polyester such as polyethylene terephthalate. What is obtained etc. are mentioned, What forms an anisotropic melt at the temperature of 400 degrees C or less is preferable.
In addition, these ester-forming derivatives may be used in place of these aromatic dicarboxylic acids, aromatic diols and aromatic hydroxycarboxylic acids.
Examples of the repeating structural unit of the liquid crystalline polyester include the following, but are not limited thereto.

芳香族ヒドロキシカルボン酸に由来する繰り返し構造単位:

Figure 2006057064
(上記の繰り返し構造単位は、ハロゲン原子、アルキル基またはアリール基で置換されていてもよい。) Repeating structural units derived from aromatic hydroxycarboxylic acids:
Figure 2006057064
(The above repeating structural unit may be substituted with a halogen atom, an alkyl group or an aryl group.)

芳香族ジカルボン酸に由来する繰り返し構造単位:

Figure 2006057064
(上記の繰り返し構造単位は、ハロゲン原子、アルキル基またはアリール基で置換されていてもよい。) Repeating structural units derived from aromatic dicarboxylic acids:
Figure 2006057064
(The above repeating structural unit may be substituted with a halogen atom, an alkyl group or an aryl group.)

芳香族ジオールに由来する繰り返し構造単位:

Figure 2006057064
Repeating structural units derived from aromatic diols:
Figure 2006057064

Figure 2006057064
(上記の繰り返し構造単位は、ハロゲン原子、アルキル基またはアリール基で置換されていてもよい。)
Figure 2006057064
(The above repeating structural unit may be substituted with a halogen atom, an alkyl group or an aryl group.)

耐熱性、機械的特性、加工性のバランスから特に好ましい液晶ポリエステルは、前記(A1 )で表される繰り返し構造単位を少なくとも30モル%含むものである。 A particularly preferred liquid crystalline polyester from the balance of heat resistance, mechanical properties and processability is one containing at least 30 mol% of the repeating structural unit represented by (A 1 ).

具体的には繰り返し構造単位の組み合わせが下式(a)〜(f)のものが好ましい。
(a):(A1 )、(B1 )または(B1 )と(B2 )の混合物、(C1 )。
(b):(A1 )、(A2 )。
(c):(a)の構造単位の組み合わせのものにおいて、A1 の一部をA2 で置きかえたもの。
(d):(a)の構造単位の組み合わせのものにおいて、B1 の一部をB3 で置きかえたもの。
(e):(a)の構造単位の組み合わせのものにおいて、C1 の一部をC3 で置きかえたもの。
(f):(b)の構造単位の組み合わせたものにB1 とC2 の構造単位を加えたもの。
基本的な構造となる(a)、(b)の液晶ポリエステルについては、それぞれ、例えば特公昭47−47870号公報、特公昭63−3888号公報等に記載されている。
Specifically, the combination of repeating structural units is preferably those of the following formulas (a) to (f).
(A): (A 1 ), (B 1 ) or a mixture of (B 1 ) and (B 2 ), (C 1 ).
(B): (A 1 ), (A 2 ).
(C): A combination of structural units of (a), wherein A 1 is partially replaced by A 2 .
(D): A combination of the structural units of (a), wherein a part of B 1 is replaced with B 3 .
(E): A combination of structural units in (a), wherein a part of C 1 is replaced with C 3 .
(F): A combination of the structural units of (b) plus the structural units of B 1 and C 2 .
The basic liquid crystal polyesters (a) and (b) are described in, for example, Japanese Patent Publication No. 47-47870 and Japanese Patent Publication No. 63-3888.

本発明においては、充填材としては、テトラポット状酸化亜鉛ウィスカーおよび平均粒子径が100nm以下の微小充填材料が必須成分である。   In the present invention, as the filler, a tetrapot-like zinc oxide whisker and a fine filler having an average particle size of 100 nm or less are essential components.

本発明に使用されるテトラポット状酸化亜鉛ウィスカーは、核部と該核部から異なる4軸方向に伸びた針状結晶部とからなり、前記針状結晶部の基部の径は好ましくは0.7〜14μmであり、前記針状結晶部の基部から先端までの長さは好ましくは3〜200μmである。かかるテトラポット状酸化亜鉛ウィスカーは、特開平1−252599号公報記載の方法で得られ、また、松下産業情報機器株式会社から種々のグレードが市販されている。   The tetrapot-like zinc oxide whisker used in the present invention comprises a core part and a needle-like crystal part extending from the core part in different four-axis directions, and the diameter of the base part of the needle-like crystal part is preferably 0.00. The length from the base to the tip of the acicular crystal part is preferably 3 to 200 μm. Such tetrapot-like zinc oxide whiskers are obtained by the method described in JP-A-1-252599, and various grades are commercially available from Matsushita Sangyo Information Equipment Co., Ltd.

本発明に使用される微小充填材料は、平均粒子径が100nm以下であり、好ましくは50nm以下のものである。また、該微小充填材料の熱伝導率は20℃において10W/mK以上であることが好ましい。特に本発明の目的に効果的な微小充填材料は酸化亜鉛および酸化アルミニウムである。   The fine filler material used in the present invention has an average particle size of 100 nm or less, preferably 50 nm or less. Moreover, it is preferable that the thermal conductivity of the fine filling material is 10 W / mK or more at 20 ° C. Particularly effective microfill materials for the purposes of the present invention are zinc oxide and aluminum oxide.

本発明においては、該テトラポット状酸化亜鉛ウィスカーおよび該微小充填材料の配合量合計の樹脂成形体全体に対する体積分率は15体積%以上であることが好ましい。該配合量合計が少ないと、充填材同士の接触点が少なく熱伝導率の向上に効果的でなくなってくる。該配合量合計が多すぎると、成形加工時の流動性が低下し更に成形体が脆くなるため、該配合量合計は70体積%以下であることが好ましい。ここで、テトラポット状酸化亜鉛ウィスカーおよび微小充填材料の合計体積%は、あらかじめ体積を測定しておいた成形体から、例えば樹脂の分解温度以上かつ充填材の分解温度以下で樹脂を分解して除き、残った各充填材のそれぞれの重量と0℃での真比重から得られる体積の和と成形体の体積の比で求められる。   In the present invention, the volume fraction of the total blended amount of the tetrapot-like zinc oxide whisker and the fine filler is preferably 15% by volume or more. When the total amount is small, the number of contact points between the fillers is small, and it is not effective for improving the thermal conductivity. If the total blending amount is too large, the fluidity at the time of molding processing is lowered and the molded body becomes brittle. Therefore, the total blending amount is preferably 70% by volume or less. Here, the total volume% of the tetrapot-like zinc oxide whisker and the fine filling material is obtained by decomposing the resin at a temperature higher than the decomposition temperature of the resin and lower than the decomposition temperature of the filler, for example. Except for this, it is determined by the ratio of the sum of the volume obtained from the weight of each remaining filler and the true specific gravity at 0 ° C. and the volume of the molded body.

該テトラポット状酸化亜鉛ウィスカーと該微小充填材料の配合比は、特に制限はなく広い範囲から適宜選択してよいが、好ましくは90:10〜70:30である。また、従来の樹脂組成物と同様に、樹脂と充填材の密着性を高めるため、充填材の表面を配合に先立ちあらかじめシランカップリング剤等で処理して用いることができる。   The blending ratio of the tetrapot-shaped zinc oxide whisker and the fine filler is not particularly limited and may be appropriately selected from a wide range, but is preferably 90:10 to 70:30. Further, like the conventional resin composition, in order to improve the adhesion between the resin and the filler, the surface of the filler can be treated with a silane coupling agent or the like prior to blending.

なお、本発明においては、本発明の目的を損なわない範囲で、ガラス繊維などの充填材、フッ素樹脂、金属石鹸類などの離型改良剤、染料,顔料などの着色剤、酸化防止剤、熱安定剤、紫外線吸収材、帯電防止剤、界面活性剤などの通常の添加剤を1種以上添加して用いてもよい。また、高級脂肪酸、高級脂肪酸エステル、高級脂肪酸金属塩、フルオロカーボン系界面活性剤等の外部滑剤効果を有するものを1種以上添加して用いてもよい。   In the present invention, a filler such as glass fiber, a mold release improver such as a fluororesin and a metal soap, a colorant such as a dye and a pigment, an antioxidant, a heat, and the like within a range not impairing the object of the present invention. One or more ordinary additives such as stabilizers, ultraviolet absorbers, antistatic agents, and surfactants may be added and used. Moreover, you may add and use 1 or more types which have external lubricant effects, such as a higher fatty acid, a higher fatty acid ester, a higher fatty acid metal salt, and a fluorocarbon type surfactant.

また、本発明における配合手段は特に限定されない。熱可塑性樹脂および充填材をヘンシェルミキサー、タンブラー等を用いて混合した後、押出機を用いて溶融混練することが好ましい。本発明の成形体にはペレット形状のものも含まれるが、本発明は、射出成形して得られる熱可塑性樹脂成形体に特に好適である。本発明の熱可塑性樹脂成形体は、コイルボビン、リレー部品、コネクターなどの電子部品等の材料として有用なものである。   Further, the blending means in the present invention is not particularly limited. It is preferable that the thermoplastic resin and the filler are mixed using a Henschel mixer, a tumbler or the like and then melt-kneaded using an extruder. The molded article of the present invention includes pellets, but the present invention is particularly suitable for a thermoplastic resin molded article obtained by injection molding. The thermoplastic resin molded article of the present invention is useful as a material for electronic parts such as coil bobbins, relay parts, and connectors.

以下、本発明について実施例を用いて説明するが、本発明が実施例により限定されるものではない。
実施例1および比較例1、2
繰り返し構造単位が前記のA1、B1、B2、C1からなり、A1:B1:B2:C1のモル比が60:15:5:20であり、前記の方法で求めた流動温度が323℃である液晶ポリエステル、テトラポット状酸化亜鉛ウィスカーとして「パナテトラWZ−0511」(商品名、松下産業情報機器株式会社製)、および平均粒子径が30nmまたは11μmの酸化亜鉛微粒子を用い、表1に示す各組成で混合後、二軸押出機(池貝鉄工株式会社製PCM−30型)を用いて、溶融混練した後、ストランドを押し出して、該ストランドを水冷後切断してペレットを得た。このペレットを120℃で3時間以上乾燥させた後、形状が100×100×3t(mm)の成形体を射出成形し、射出方向に対して垂直である厚み方向の熱伝導率を熱線法により測定した。この結果を表1に示す。
比較例3、4
液晶ポリエステルと平均粒子径が30nmまたは11μmの酸化亜鉛微粒子を表1に示す組成で混合し、二軸押出機で溶融混練を行ったが、どちらもストランドが脆く、連続的にペレットを得ることができなかった。
EXAMPLES Hereinafter, although this invention is demonstrated using an Example, this invention is not limited by an Example.
Example 1 and Comparative Examples 1 and 2
The repeating structural unit is composed of A 1 , B 1 , B 2 , and C 1 described above, and the molar ratio of A 1 : B 1 : B 2 : C 1 is 60: 15: 5: 20. Liquid crystal polyester having a flow temperature of 323 ° C., “Panatetra WZ-0511” (trade name, manufactured by Matsushita Sangyo Information Equipment Co., Ltd.) as a tetrapotted zinc oxide whisker, and zinc oxide fine particles having an average particle diameter of 30 nm or 11 μm After mixing with each composition shown in Table 1, using a twin screw extruder (PCM-30 type, manufactured by Ikegai Iron Works Co., Ltd.), melt-kneading, then extruding the strand, cooling the strand with water and cutting it into pellets Got. After drying this pellet at 120 ° C. for 3 hours or more, a molded body having a shape of 100 × 100 × 3 t (mm) was injection-molded, and the thermal conductivity in the thickness direction perpendicular to the injection direction was determined by a hot wire method. It was measured. The results are shown in Table 1.
Comparative Examples 3 and 4
Liquid crystal polyester and zinc oxide fine particles having an average particle diameter of 30 nm or 11 μm were mixed in the composition shown in Table 1 and melt kneaded with a twin screw extruder. Both of them were brittle and continuous pellets could be obtained. could not.

Figure 2006057064
Figure 2006057064

Claims (5)

核部と該核部から異なる4軸方向に伸びた針状結晶部とからなるテトラポット状酸化亜鉛ウィスカーおよび平均粒子径が100nm以下の微小充填材料を熱可塑性樹脂に配合して成形して得られる熱可塑性樹脂成形体。   Obtained by blending a thermoplastic resin with a tetrapot-like zinc oxide whisker composed of a core part and needle-like crystal parts extending in different four-axis directions from the core part and a fine filler having an average particle size of 100 nm or less. Thermoplastic resin molded product. 熱可塑性樹脂が下記に定義される流動温度が260〜400℃の液晶ポリエステル樹脂である請求項1記載の熱可塑性樹脂成形体。
流動温度:内径1mm、長さ10mmのノズルを持つ毛細管レオメータを用い、100kg/cm2の荷重下において、4℃/分の昇温速度で加熱溶融体をノズルから押し出すときに、溶融粘度が48000ポイズを示す温度
The thermoplastic resin molded article according to claim 1, wherein the thermoplastic resin is a liquid crystalline polyester resin having a flow temperature defined below of 260 to 400 ° C.
Flow temperature: Using a capillary rheometer with a nozzle with an inner diameter of 1 mm and a length of 10 mm, when a heated melt is extruded from the nozzle at a heating rate of 4 ° C / min under a load of 100 kg / cm 2 , the melt viscosity is 48000 Temperature indicating poise
テトラポット状酸化亜鉛ウィスカーおよび微小充填材料の配合量合計が15体積%以上である請求項1または2記載の熱可塑性樹脂成形体。   The thermoplastic resin molded article according to claim 1 or 2, wherein the total amount of tetrapot-like zinc oxide whisker and fine filler is 15% by volume or more. 微小充填材料の熱伝導率が20℃において10W/mK以上である請求項1〜3のいずれかに記載の熱可塑性樹脂成形体。   The thermoplastic resin molded body according to any one of claims 1 to 3, wherein the thermal conductivity of the microfilling material is 10 W / mK or more at 20 ° C. 微小充填材料が酸化亜鉛である請求項1〜4のいずれかに記載の熱可塑性樹脂成形体。
The thermoplastic resin molded body according to any one of claims 1 to 4, wherein the minute filler is zinc oxide.
JP2004243414A 2004-08-24 2004-08-24 Thermoplastic resin molded article Pending JP2006057064A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008075063A (en) * 2006-08-22 2008-04-03 Sumitomo Chemical Co Ltd Liquid crystalline polymer molding
US8653176B2 (en) 2006-12-26 2014-02-18 Asahi Kasei E-Materials Corporation Thermally conductive material and thermally conductive sheet molded from the thermally conductive material
JP2014074083A (en) * 2012-10-02 2014-04-24 Kaneka Corp High thermal conductive resin molding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008075063A (en) * 2006-08-22 2008-04-03 Sumitomo Chemical Co Ltd Liquid crystalline polymer molding
US8653176B2 (en) 2006-12-26 2014-02-18 Asahi Kasei E-Materials Corporation Thermally conductive material and thermally conductive sheet molded from the thermally conductive material
JP2014074083A (en) * 2012-10-02 2014-04-24 Kaneka Corp High thermal conductive resin molding

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