JP2006057043A5 - - Google Patents
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- JP2006057043A5 JP2006057043A5 JP2004242191A JP2004242191A JP2006057043A5 JP 2006057043 A5 JP2006057043 A5 JP 2006057043A5 JP 2004242191 A JP2004242191 A JP 2004242191A JP 2004242191 A JP2004242191 A JP 2004242191A JP 2006057043 A5 JP2006057043 A5 JP 2006057043A5
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- JP
- Japan
- Prior art keywords
- crystalline polyester
- contained
- weight
- polytetrafluoroethylene
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
本発明は結晶性ポリエステル（Ａ）、熱可塑性樹脂（Ｂ）、ポリテトラフルオロエチレ
ン（Ｃ）を含む接着剤組成物である。
本発明で言う結晶性ポリエステルとは以下のように定義する。まずポリエステル試料を１２０℃で一時間熱処理を行い、２５℃で４８時間放置する。次に示差走査型熱量計（ＤＳＣ）を用いて、その熱処理試料の測定を行う。測定条件は窒素雰囲気下、−１００℃〜３００℃まで２０℃／ｍｉｎで昇温し、次に−１００℃まで５０℃／ｍｉｎで降温し、続いて−１００℃〜３００℃まで２０℃／ｍｉｎで昇温する。その２度の昇温過程において、どちらかの昇温過程に明確な融点ピークを示すものを結晶性ポリエステルとする。いずれの昇温過程においても結晶融解ピークが見られないものを非晶性ポリエステルとする。
The present invention is an adhesive composition containing a crystalline polyester (A), a thermoplastic resin (B), and polytetrafluoroethylene (C).
The crystalline polyester referred to in the present invention is defined as follows. First, a polyester sample is heat-treated at 120 ° C. for 1 hour and left at 25 ° C. for 48 hours. Next, the heat-treated sample is measured using a differential scanning calorimeter (DSC). The measurement condition is that the temperature is raised from −100 ° C. to 300 ° C. at 20 ° C./min in a nitrogen atmosphere, then the temperature is lowered to −100 ° C. at 50 ° C./min, and then from −100 ° C. to 300 ° C. Raise the temperature. In the two temperature raising processes, a polyester having a clear melting point peak in either temperature raising process is referred to as crystalline polyester. An amorphous polyester is one in which no crystal melting peak is observed in any temperature rising process.
Claims (1)
（ａ）融点が２００℃以下の結晶性ポリエステル（Ａ）を１００重量部とした場合、熱可塑性樹脂（Ｂ）を０．５〜１１０重量部含有する。
（ｂ）融点が２００℃以下の結晶性ポリエステル（Ａ）を１００重量部とした場合、ポリテトラフルオロエチレン（Ｃ）を０．０００１〜１０重量部含有する。
（ｃ）接着剤組成物の２００℃、せん断速度５０ｓ−１における溶融粘度が５００ｄＰａ・ｓ〜５００００ｄＰａ・ｓである。 It contains crystalline polyester (A) having a melting point of 200 ° C. or lower, thermoplastic resin (B), polytetrafluoroethylene (C), and satisfies all of the following (a) to (c): Adhesive composition.
(A) When crystalline polyester (A) whose melting | fusing point is 200 degrees C or less is made into 100 weight part, 0.5-110 weight part of thermoplastic resins (B) are contained.
(B) When 100 parts by weight of crystalline polyester (A) having a melting point of 200 ° C. or less is contained, 0.0001 to 10 parts by weight of polytetrafluoroethylene (C) is contained.
(C) The melt viscosity of the adhesive composition at 200 ° C. and a shear rate of 50 s −1 is 500 dPa · s to 50000 dPa · s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004242191A JP4715130B2 (en) | 2004-08-23 | 2004-08-23 | Adhesive composition and laminate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004242191A JP4715130B2 (en) | 2004-08-23 | 2004-08-23 | Adhesive composition and laminate using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006057043A JP2006057043A (en) | 2006-03-02 |
| JP2006057043A5 true JP2006057043A5 (en) | 2007-10-04 |
| JP4715130B2 JP4715130B2 (en) | 2011-07-06 |
Family
ID=36104782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004242191A Active JP4715130B2 (en) | 2004-08-23 | 2004-08-23 | Adhesive composition and laminate using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4715130B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103608648B (en) | 2011-05-27 | 2016-03-02 | 松下电器产业株式会社 | Ultrasonic transmitter-receiver and manufacture method thereof and ultrasonic flow meter |
| WO2012164836A1 (en) * | 2011-05-31 | 2012-12-06 | タツタ電線株式会社 | Adhesive composition and adhesive film |
| JP6101922B2 (en) | 2012-06-05 | 2017-03-29 | パナソニックＩｐマネジメント株式会社 | Ultrasonic flow measurement unit and manufacturing method thereof |
| DE102013201392A1 (en) * | 2013-01-29 | 2014-07-31 | Evonik Industries Ag | Adhesion promoter and primer compositions for hybrid metal-plastic components |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61281A (en) * | 1984-06-13 | 1986-01-06 | Sumitomo Chem Co Ltd | Bondable resin composition |
| JPH01254788A (en) * | 1988-04-04 | 1989-10-11 | Toagosei Chem Ind Co Ltd | Resin composition for bonding precoated steel sheet |
| JPH0827453A (en) * | 1994-07-14 | 1996-01-30 | Nitto Denko Corp | Flame-retardant adhesive |
| JP3883651B2 (en) * | 1997-06-13 | 2007-02-21 | 大日本印刷株式会社 | Flat cable covering material and flat cable using the same |
| JP4432145B2 (en) * | 1999-03-26 | 2010-03-17 | 東レ株式会社 | Adhesive composition for flexible printed circuit board, coverlay film using the same, and flexible printed circuit board |
| JP2002371258A (en) * | 2001-06-13 | 2002-12-26 | Toyobo Co Ltd | Solvent-soluble crystalline polyester adhesive composition, laminate, and flat cable |
-
2004
- 2004-08-23 JP JP2004242191A patent/JP4715130B2/en active Active
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