JP2006053186A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus having shock resistance with which its inside is surely protected. <P>SOLUTION: The imaging apparatus 1 which is equipped with an imaging unit 10 including an imaging element, an optical unit 20 including a lens and a sector drive unit 30 including a sector and also rocking the sector and where the sector drive unit is arranged on the subject side of the optical unit is equipped with a cover member 50 with which the imaging unit, the optical unit and the sector driving unit are covered. Since the cover member 50 is arranged, the inside of the imaging apparatus 1 is surely protected. Even when the imaging apparatus 1 is shocked, shock is transmitted to the inside through the cover member 50, so that load exerted on the inside is made less than that when the apparatus is directly shocked. Particularly, even if other components exist on the periphery part of the imaging apparatus after assembling the apparatus inside electronic equipment, the cover member prevents the apparatus from coming into contact with the components, so that it can surely protect the inside. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imaging apparatus. In particular, the present invention relates to an imaging apparatus in which a sector (shutter blade) is disposed on the subject side of a lens.

  In a conventional general imaging apparatus, an optical unit including a lens is disposed on the most object side, and thereafter an imaging unit including a sector driving apparatus that swings the sector and an imaging element is disposed. However, for example, Patent Document 1 proposes an imaging apparatus in which a sector drive device is arranged on the subject side of an optical unit. This image pickup apparatus has an advantage that it can be easily downsized and the lens can be protected because the sector driving device is located closer to the subject than the optical unit.

Japanese Patent Laid-Open No. 2004-15602

  However, in the image pickup apparatus disclosed in Patent Document 1, the optical unit and the sector drive device are arranged close to each other so that they are easily in contact with each other when receiving an impact or the like. When they come into contact, a load is generated, which may cause damage to parts and operation of the sector drive device. Furthermore, even when the imaging apparatus is subjected to an impact after being incorporated in the electronic device, the same problem may occur due to contact with other components existing in the electronic device.

  Accordingly, an object of the present invention is to provide an imaging device having impact resistance that can reliably protect the inside.

  The above object includes an imaging unit including an imaging device, an optical unit including a lens, and a sector driving unit including a sector and driving the sector, and the sector driving unit is disposed on a subject side of the optical unit. This can be achieved by an imaging apparatus including a cover member that covers the imaging unit, the optical unit, and the sector drive unit.

  According to the present invention, since the cover member is disposed, the inside of the apparatus can be reliably protected. Even when the imaging apparatus receives an impact, it is transmitted to the inside through the cover member, so that the load on the inside can be reduced as compared with the case of receiving a direct impact. In particular, after being incorporated in the electronic apparatus, even if other parts exist in the peripheral part of the imaging apparatus, the cover member prevents contact with these parts, so that the inside can be reliably protected.

  Further, when the cover member employs a structure formed by a plate-like member included in the sector drive unit, an image pickup apparatus capable of protecting the inside while suppressing an increase in the number of parts. And it is good also as a structure where the said plate-shaped member is being fixed to the board | substrate included in the said imaging unit. The cover member is formed by a first plate-like member included in the sector drive unit, and the sector drive unit is a second plate-like member closer to the subject than the first plate-like member. And a leg portion of the first plate member is fixed to a substrate included in the imaging unit, and a head portion of the first plate member is the second plate member. Alternatively, a structure that protrudes toward the subject side may be used.

  Further, the cover member is formed to a size that can accommodate the substrate of the imaging unit, and an inner surface of the cover member is formed with an abutting portion that abuts on the substrate and positions at a predetermined position. A structure may be adopted. In the case of an electronic device such as a mobile phone provided with the above-described image pickup apparatus, a clear image can be taken by stably driving the sector of the image pickup unit.

  According to the present invention, it is possible to provide an imaging device with excellent impact resistance that can reduce and protect the internal load.

  Hereinafter, an embodiment according to the present invention will be described with reference to the drawings. FIG. 1 is a side view showing the internal configuration of the imaging apparatus 1 so that it can be confirmed. The imaging device 1 is formed including three main unit parts. That is, the imaging apparatus 1 includes an imaging unit 10 including an imaging element, an optical unit 20 including a lens, and a sector driving unit 30 that swings the sector. As illustrated in FIG. 1, the imaging apparatus 1 has a structure in which an optical unit 20 and a sector drive unit 30 are sequentially stacked on an imaging unit 10. Each unit is arranged so that a part thereof overlaps in the upper and lower sides. The imaging unit 10 and the optical unit 20 are collectively referred to as an imaging optical module.

  The imaging unit 10 includes an imaging substrate 11, an imaging element 12, a lens barrel 13, and an optical filter 14. The image pickup device 12 is an image sensor such as a CCD or CMOS, and is fixed at a predetermined position on the image pickup substrate 11. The lens barrel 13 is generally cylindrical in shape, and is fixed on the imaging substrate 11 so as to surround the outer periphery of the imaging element 12. An optical filter 14 such as an IR cut filter is disposed in the lower portion 13L of the lens barrel 13. Further, the upper portion 13U of the lens barrel 13 is engaged with a part on the optical unit 20 and sector drive unit 30 side as will be described later. Further, an FPC (Flexible Printed Circuit) 17 for connecting the imaging apparatus 1 to an electronic device such as a camera or a mobile phone is connected to a wiring pattern (not shown) formed on the imaging substrate 11. The FPC 17 is provided with a connector 18 for connecting to a main circuit board (motherboard) on the electronic device side.

  A lens holder 21 forming a part of the optical unit 20 is fitted inside the upper portion 13U of the lens barrel 13. Three lenses 22, 23 and 24 are held in the lens holder 21. Screws that are screwed to each other are formed on the outer peripheral surface of the lens holder 21 and the inner peripheral surface of the upper portion 13 </ b> U of the lens barrel 13. Therefore, by rotating the lens holder 21 with respect to the lens barrel 13, the position in the optical axis direction LA is changed, so that light incident through the lenses 22, 23, and 24 is imaged on the image sensor 12. You can adjust the focus. After the focus adjustment is completed, the lens holder 21 is fixed in the lens barrel 13 using, for example, an adhesive.

  Further, a notch 25 having a stepped outer periphery is formed at the upper end of the lens holder 21 (end on the subject side). The notch 25 has an annular surface 25F perpendicular to the optical axis direction LA. As will be described later, the sector substrate 31 of the sector drive unit 30 contacts the annular surface 25F.

  A sector drive unit 30 is disposed above the optical unit 20. The sector drive unit 30 includes a configuration generally referred to as a sector drive device or a shutter device. In the imaging apparatus 1, the sector drive unit 30 is disposed on the subject side with respect to the optical unit 20. More specifically, a part of the sector substrate 31 included in the sector drive unit 30 is fixed on the lens holder 21 of the optical unit 20. A sector pressing plate 32 is disposed so as to face the sector substrate 31. Three sectors 33, 34, and 35 are disposed in the space SP between the sector substrate 31 and the sector presser plate 32.

  The sector substrate 31 includes a cylindrical portion 37 that is in contact with the lens holder 21 and covers the upper portion 13U of the lens barrel 13, and a motor storage portion 39 in which a step motor 36 as an actuator is installed. Contains. A shutter opening 38 is formed in the upper part of the cylindrical portion 37. The shutter opening 38 is formed so as to be fitted into the notch 25 described above formed in the upper portion of the lens holder 21. That is, the peripheral portion 38 </ b> C of the shutter opening 38 is fixed in a state of being in contact with the annular surface 25 </ b> F of the notch portion 25. The portion of the sector substrate 31 where the shutter opening 38 is formed has a flat plate shape perpendicular to the optical axis direction LA. Therefore, the sector substrate 31 is fixed perpendicularly to the optical axis direction LA when the annular surface 25F of the notch 25 and the peripheral portion 38C of the shutter opening 38 come into contact with each other.

  If the notch 25 on the lens holder 21 side is formed in a step having a right-angled cross section, and the shutter opening 38 is formed so as to be just fitted into the notch 25, the sector substrate with respect to the lens holder 21 is formed. 31 can be fitted with higher positional accuracy.

  The lens holder 21 is fixed in the lens barrel 13 as described above. The lens holder 21 is fitted with a shutter opening 38 of the sector substrate 31. Therefore, in the imaging device 1, the relative position between the lens in the optical unit 20 and the sector drive unit 30 does not change. Therefore, the imaging device 1 is an imaging device in which the angle of view of the lenses 22 to 24 and the amount of incident light are not changed. In the image pickup apparatus 1, the shutter opening 38 of the sector substrate 31 is fitted to the lens holder 21, so that it does not substantially function as a shooting opening. In the imaging apparatus 1, the opening 32HL formed in the sector presser plate 32 is an opening for photographing.

  Further, a positioning structure is formed between the cylindrical portion 37 of the sector substrate 31 and the upper portion 13U of the lens barrel 13. This will be described with reference to FIG. FIG. 2 is a view shown for explaining the engagement relationship between the cylindrical portion 37 of the sector substrate 31 and the upper portion 13U of the lens barrel 13. As shown in FIG. In this drawing, the relationship between the inner surface of the cylindrical portion 37 and the convex portion 13Ua formed on the upper portion 13U of the lens barrel 13 is particularly illustrated. A convex portion 13Ua is formed on the outer peripheral surface of the upper portion 13U of the lens barrel 13 so as to project in the radial direction. The convex portion 13Ua extends with a predetermined length in the optical axis direction LA. Although one piece is shown in FIG. 2, the upper portion 13 </ b> U of the lens barrel 13 is tubular, and a plurality of pieces may be arranged on the outer peripheral surface. Correspondingly, a concave portion 37 a that engages with the convex portion 13 Ua is formed in the cylindrical portion 37 of the sector substrate 31. Therefore, the sector substrate 31 of the sector drive unit 30 can be positioned so as not to rotate around the optical axis of the lenses 2 to 24 with respect to the lens barrel 13 fixed to the imaging substrate 11.

  In the example shown in FIG. 2, a convex portion is formed on the upper portion 13U of the lens barrel 13 and a concave portion is formed on the cylindrical portion 37 of the sector substrate 31. However, the arrangement of the convex portion and the concave portion is reversed. It may be. In short, an engaging portion that engages with each other is formed on the lens barrel 13 side and the cylindrical portion 37 side of the sector substrate 31, and it is only necessary that the position of the cylindrical portion 37 around the optical axis can be regulated by this engaging portion. The cylindrical portion 37 is formed with an inner surface so as to be just fitted into the upper portion 13U of the lens barrel 13.

  After positioning the concave portion 37a of the cylindrical portion 37 on the sector substrate 31 side with respect to the convex portion 13Ua on the side of the lens barrel 13 as described above, an adhesive is applied to the engaging portion to thereby apply the sector substrate to the lens barrel 13. 31 can be fixed with high positional accuracy. Further, such a structure can be confirmed with reference to FIG. Therefore, the imaging device 1 has a structure that can prevent unnecessary light from entering the lens barrel 13 from the side.

  Further, a printed circuit board 40 for connecting the electrode of the step motor 36 to the imaging substrate 11 is joined to the side portion of the sector substrate 31. This printed board is a hard printed board formed of a base material such as polyimide resin, epoxy resin, or glass epoxy resin. The printed board 40 is electrically connected to the imaging board 11 by solder 41 and fixes the imaging board 11 to the imaging board 11 at a substantially right angle. Therefore, the sector drive unit 30 is electrically connected to the imaging board 11 and is reliably supported by the imaging board 11 via the hard printed board 40. Further, as described above, the sector drive unit 30 is fixed to the imaging substrate 11 on the cylindrical portion 37 side via the lens barrel 13. Thus, since the sector drive unit 30 is stably supported by the image pickup substrate 11, the image pickup apparatus 1 has a structure excellent in impact resistance and capable of reducing internal load generation. Therefore, the imaging apparatus 1 does not cause a problem that the sector of the sector drive unit 30 collides with the peripheral portion and is damaged.

  Moreover, since the printed circuit board 40 is connected to the imaging board 11 as described above, the imaging apparatus 1 can control the step motor 36 from the imaging board 11 side. By adopting such a structure, it is possible to arrange electronic components for a motor, which should originally be arranged on the sector drive unit 30 side, on the imaging substrate 11 side. As described above, when there is a space on the image pickup substrate 11 side, the image pickup apparatus 1 can be downsized as a whole by utilizing the space. Such a device for miniaturization is not limited to the imaging apparatus 1. For example, a sector drive IC (control circuit element) for driving and controlling a sector has a relatively large external shape, and therefore, when mounted on the motherboard side of the electronic device, the size increases. In the imaging apparatus 1, the sector driving IC 15 is arranged on the imaging substrate 11 by utilizing space. Therefore, it is possible to reduce the size of the electronic apparatus that employs the imaging device 1.

  The imaging apparatus 1 is devised so as not to increase the size even if the sector driving IC 15 is arranged on the imaging substrate 11 side. This point will be described. As shown in FIG. 1, the right side portion where the lens barrel 13 and the lens holder 21 are stacked is relatively high. On the other hand, there is a space on the imaging substrate 11 facing the motor storage unit 39. A sector driving IC 15 is arranged in this space. Therefore, the imaging apparatus 1 is not increased in size by moving the components used for the sector drive unit 30 to the imaging substrate 11 side, and can be reduced in size as a whole by effectively utilizing the space.

  Further, as described above, the FPC 17 is connected to the imaging board 11 for connection to an electronic device, and the FPC 17 is provided with a connector 18 for connecting to a circuit board (motherboard or the like) on the electronic device side. Yes. Therefore, the imaging unit 10 and the sector drive unit 30 can be controlled simply by connecting the connector 18 to a motherboard or the like of the electronic device. Therefore, compared with the case where the sector drive unit 30 and the imaging optical module are individually controlled as in the prior art, the electrical configuration of the imaging device 1 can be simplified.

  FIG. 3 is a view showing a modification in the case where the printed circuit board 40 for the step motor is fixed to the imaging board 11. In the imaging apparatus 1 shown in FIG. 3, a printed circuit board 40 that is electrically connected to an electrode of the step motor 36 is connected to a terminal pin 45. The terminal pin 45 is inserted into a contact hole 11HL provided in the image pickup substrate 11 and is fixed to the image pickup substrate 11 with solder 41. In the case of this modified structure, since the terminal pin 45 is inserted into the imaging substrate 11, the sector drive unit 30 can be held more firmly. Therefore, the imaging device 1 is a device that can further improve the impact resistance.

  FIG. 4 is a perspective view showing three sectors 33, 34, and 35 and the sector presser plate 32 arranged in the space SP between the sector substrate 31 and the sector presser plate 32 shown in FIG. Each sector 33, 34, 35 has bearing holes 33 RL, 34 RL, 35 RL that fit into a support shaft (not shown) formed in the sector substrate 31, and swings about the support shaft. Further, cam holes 33CA, 34CA, and 35CA are formed in each sector 33, 34, and 35, and an operating pin 36MP fixed to the step motor 36 is engaged with all of the cam holes. Therefore, when the operating pin 36MP moves in a predetermined range by the rotation operation of the step motor 36, each sector 33, 34, 35 swings along a predetermined locus based on the shape of the cam hole.

  The sector 33 is a small diaphragm blade provided with a small diaphragm hole 33HL. The sector 34 is disposed between the sectors 33 and 35 to prevent collision. This sector 34 is designed to always contact and prevent both sectors 33 and 35. The sector 34 has a large-diameter opening 34HL so as not to be an obstacle at the time of imaging even if it exists around the shutter opening. The sector 35 is a shutter blade. The sector 35 has an opening 35HL for weight reduction. The sector pressing plate 32 has an arcuate opening 32AL that receives the operating pin 36MP, and an imaging opening 32HL formed at a position corresponding to the shutter opening 38 of the sector substrate 31.

  Again, with reference to FIG. 1, the manufacturing method of the imaging device 1 is demonstrated collectively. The image sensor 12 is mounted at a predetermined position on the imaging substrate 11 of the imaging unit 10. The optical filter 14 is adhered in the lower portion 13L, and the lens barrel 13 is fixed to the imaging substrate 11. Thus, a portion corresponding to the imaging unit 10 is completed. A lens holder 21 that holds three lenses is screwed into the lens barrel 13 to adjust the focus, and after adjusting the focus, an adhesive is applied to the screwed portion and fixed. Up to this point, the structure in which the optical unit 20 is fixed on the imaging unit 10 is completed to form an imaging optical module.

  Each sector 33, 34, 35 is sandwiched between the sector substrate 31 and the sector pressing plate 32, and the sector substrate 31 and the sector pressing plate 32 are fixed. The step motor 36 is accommodated in the motor accommodating portion 39 of the sector substrate 31. Then, a printed circuit board 40 for a motor is bonded to one end of the sector substrate 31. This completes the preparation on the sector drive unit 30 side. Thereafter, the sector drive unit 30 is fixed on the imaging optical module.

  More specifically, the concave portion 37 a of the cylindrical portion 37 is fitted to the convex portion 13 Ua of the lens barrel 13, and the shutter opening 38 is fitted to the notch portion 25 of the lens holder 21. Thus, since alignment is performed at a plurality of locations, the sector drive unit 30 is accurately arranged on the imaging optical module. An adhesive is applied and fixed to a fitting portion between the convex portion 13Ua of the lens barrel 13 and the concave portion 37a of the cylindrical portion 37. Finally, the printed circuit board 40 bonded to the sector substrate 31 and the imaging substrate 11 of the imaging unit 10 are soldered to complete the imaging device 1 with excellent impact resistance.

  FIG. 5 is a diagram illustrating the imaging device 1 when the sector is in a fully open state, and FIG. 6 is a diagram illustrating the imaging device 1 when the sector is in a small aperture state. FIGS. 5 and 6 are plan views as viewed from the sector pressing plate 32 side in FIG. (B) is a sectional view taken along line XX of (A). Note that, in (B), only main sectors that come to positions facing the openings 32HL of the sector pressing plate 32 and form the respective states are shown.

  In the fully open state shown in FIG. 5, the operating pin 36MP moved by the step motor comes to the right end of the arc-shaped opening 32AL of the sector presser plate 32. At this time, the sectors 33 and 35 are at a position retracted from the opening 32HL, and the sector 34 disposed therebetween is at a position facing the opening 32HL. Since the sector 34 has the large opening 34HL, the fully open state can be formed without hindrance (see FIG. 4).

  Further, in the small aperture state shown in FIG. 6, the operating pin 36MP moved by the step motor comes to the left end of the arc-shaped opening 32AL of the sector presser plate 32. At this time, the sector 35 is at a position retracted from the opening 32HL, and the sector 33 and the sector 34 having small aperture holes are at positions facing the opening 32HL (see FIG. 4). In FIG. 6B, only the sector 33 is illustrated. Although illustration is omitted, a fully closed state is formed when the operating pin 36MP comes to substantially the center of the arc-shaped opening 32AL of the sector pressing plate 32, and all the sectors are at positions facing the opening 32HL.

  The imaging apparatus 1 can perform normal imaging in the fully opened state shown in FIG. Also, macro shooting can be performed in the small aperture state shown in FIG. When the aperture is in a small aperture state, the depth of field becomes deep, so that macro photography can be performed without moving the lens.

  Hereinafter, with reference to FIGS. 7 to 9, the imaging apparatus 1 in which the imaging unit 10, the optical unit 20, and the sector driving unit 30 are covered with a cover member and impact resistance is enhanced will be described. FIG. 7 is a diagram illustrating the imaging device 1 including the cover member 50 that covers the upper portion. (A) shows a structure in which the leg portion of the cover member 50 is fixed on the imaging board 11, and (B) shows a structure in which the imaging board 11 is accommodated in the cover member 50. As the cover member 50, a molded resin material such as plastic can be used. A large opening 50HL is formed in the upper part of the cover member 50 so as not to interfere with photographing.

  As shown in FIG. 7, by covering the whole with the cover member 50, the imaging device 1 can protect the inside when there is an impact. In particular, when the imaging apparatus is incorporated in an electronic device or the like, it is possible to prevent a situation where each unit is damaged due to contact with peripheral components. In (A), since the leg portion of the cover member 50 is fixed on the imaging substrate 11, it is assumed that a load is generated on the imaging substrate 11. However, in (B), since the imaging board 11 is also housed in the cover member 50, the load on the imaging board 11 can be reduced. In the case of adopting the structure (B), the cover member 50 is formed slightly larger so as to accommodate the imaging substrate 11, and the contact portion 51 for positioning the imaging substrate 11 at a predetermined position is formed on the inner surface.

  FIG. 8 shows an example in which the cover member is formed by the sector substrate 31. In the example shown here, the sector substrate 31 is formed slightly larger than the original shape, and its end portion is extended in the vertical direction (optical axis direction). The upper portion (subject side) is a head portion 31U, and the lower portion is a leg portion 31L. (A) shows a structure in which the leg 31L of the sector substrate 31 is fixed on the imaging substrate 11, and (B) shows a structure in which the imaging substrate 11 is accommodated in the leg 31L of the sector substrate 31. In both cases (A) and (B), the head portion 31U protrudes upward from the sector pressing plate 32. FIG. 9 is a perspective view showing the appearance of the imaging apparatus 1 shown in FIG.

  As shown in FIG. 8, the imaging device can be protected by a cover member formed by a part of the sector substrate 31. The sector presser plate 32 positioned above the sector substrate 31 is protected because a protective wall is formed on the periphery by making the head 31U project (see FIG. 9). . Also in the case shown in FIG. 8A, it is assumed that a load is generated on the imaging board 11 because the leg portion 31L of the sector board 31 is fixed on the imaging board 11. However, in (B), since the imaging board 11 is also housed in the leg portion 31L, the load on the imaging board 11 can be reduced. In the structure (B), the leg portion 31L is cut out so that the imaging substrate 11 can be accommodated, and a contact portion 31PR for positioning the imaging substrate 11 is formed.

  Since the imaging device 1 described in detail above includes the cover member, the imaging device 1 is a device resistant to impact that can reliably protect the inside. In particular, after being incorporated in an electronic device, the cover member can reliably prevent contact with peripheral components, so that an internal load can be suppressed. Further, when the cover member is formed by the sector substrate 31, an imaging device having excellent impact resistance can be provided without increasing the number of components.

  In the above embodiment, the cover member is formed by the sector substrate 31, but the sector pressing plate 32 may be processed to form the cover member. Therefore, the sector substrate 31 and the sector presser plate 32 correspond to plate-like members in relation to the claims. When discriminating plate members, the sector substrate 31 corresponds to the first plate member, and the sector presser plate 32 corresponds to the second plate member.

  In the above embodiment, the leg portion of the cover member may be fixed to a member other than the imaging substrate 11. For example, the cover member may be designed so as to be in contact with or fixed to a case or a mother board of an electronic device in which the imaging apparatus is mounted.

  The preferred embodiment of the present invention has been described in detail above, but the present invention is not limited to the specific embodiment, and various modifications can be made within the scope of the gist of the present invention described in the claims.・ Change is possible.

It is the side view shown so that the internal structure of the imaging device which concerns on embodiment could be confirmed. It is the figure shown in order to demonstrate the engagement relation of the cylindrical part of a sector board | substrate, and the upper part of a lens-barrel. It is the figure which showed the modification in the case of fixing the printed circuit board for step motors to an imaging board. FIG. 2 is a perspective view showing three sectors and a sector presser plate existing in a space between a sector substrate and a sector presser plate shown in FIG. 1. It is the figure which showed the imaging device when a sector is a full open state. It is the figure which showed the imaging device when a sector is a small aperture state. It is the figure shown about the imaging device provided with the cover member which covers an upper part. It is the figure which showed the example which formed the cover member with the sector board | substrate. It is a perspective view which shows the external appearance of the imaging device shown in FIG.8 (B).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Imaging device 10 Imaging unit 11 Imaging board 12 Imaging element 13 Lens barrel 13Ua Convex part 17 FPC
18 Connector 20 Optical Unit 21 Lens Holder 25 Notch 30 Sector Drive Unit 31 Sector Substrate 31U Head 31L Leg 31PR Contact 32 Sector Presser Plate 33, 34, 35 Sector 36 Step Motor 37 Cylindrical Part 37a Concave 38 Shutter Opening 39 Motor housing part 36MP Actuation pin 40 Printed circuit board 41 Solder 45 Terminal pin 50 Cover member LA Optical axis direction

Claims (6)

An imaging apparatus comprising: an imaging unit including an imaging element; an optical unit including a lens; and a sector driving unit including a sector and driving the sector, wherein the sector driving unit is disposed on a subject side of the optical unit. There,
An image pickup apparatus comprising a cover member that covers the image pickup unit, the optical unit, and the sector drive unit. The imaging apparatus according to claim 1, wherein the cover member is formed by a plate-like member included in the sector drive unit. The imaging apparatus according to claim 2, wherein the plate member is fixed to a substrate included in the imaging unit. The cover member is formed by a first plate-like member included in the sector drive unit, and the sector drive unit has a second plate-like member closer to the subject side than the first plate-like member. Including
The leg portion of the first plate-like member is fixed to a substrate included in the imaging unit, and the head portion of the first plate-like member protrudes toward the subject side with respect to the second plate-like member. The imaging apparatus according to claim 1, wherein: The cover member is formed in a size that can accommodate the substrate of the imaging unit,
The imaging device according to claim 1, wherein a contact portion that contacts the substrate and is positioned at a predetermined position is formed on an inner surface of the cover member. An electronic apparatus comprising the imaging device according to claim 1.

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