JP2006052318A5 - - Google Patents

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JP2006052318A5
JP2006052318A5 JP2004234821A JP2004234821A JP2006052318A5 JP 2006052318 A5 JP2006052318 A5 JP 2006052318A5 JP 2004234821 A JP2004234821 A JP 2004234821A JP 2004234821 A JP2004234821 A JP 2004234821A JP 2006052318 A5 JP2006052318 A5 JP 2006052318A5
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group
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resin composition
thermosetting resin
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JP4815767B2 (en
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（Ａ）成分；ポリアミドイミドと、
（Ｂ）成分；該ポリアミドイミドのアミド基と反応し得る官能基を有し、かつエチレン性不飽和結合を有する化合物と、
を含有することを特徴とする熱硬化性樹脂組成物。 (A) component; polyamideimide,
(B) component; a compound having a functional group capable of reacting with the amide group of the polyamideimide and having an ethylenically unsaturated bond;
A thermosetting resin composition comprising: 前記（Ａ）成分が飽和炭化水素からなる構成単位を有することを特徴とする請求項１記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 1, wherein the component (A) has a structural unit composed of a saturated hydrocarbon. 前記（Ｂ）成分がオキシラン環又はオキセタン環を有することを特徴とする請求項１又は２に記載の熱硬化性樹脂組成物。 The component (B) Gao xylan ring or a thermosetting resin composition according to claim 1 or 2, characterized by having an oxetane ring. 前記（Ｂ）成分における前記エチレン性不飽和結合を有する官能基として、ビニル基、アリル基、アクリル基及びメタクリル基からなる群より選ばれる１種以上の基を有することを特徴とする請求項１〜３のいずれか一項に記載の熱硬化性樹脂組成物。   2. The functional group having an ethylenically unsaturated bond in the component (B) has one or more groups selected from the group consisting of a vinyl group, an allyl group, an acrylic group, and a methacryl group. The thermosetting resin composition as described in any one of -3. 前記（Ｂ）成分がポリブタジエン構造及びオキシラン環を有するエポキシ化合物であることを特徴とする請求項１又は２に記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 1 or 2, wherein the component (B) is an epoxy compound having a polybutadiene structure and an oxirane ring. 前記エポキシ化合物が、フェノール性水酸基、アルコール性水酸基、カルボキシル基、アミド基、アミノ基、イミノ基及び下記式（ＩＩＩ）で表される基からなる群より選ばれる１種以上の基を有する変性ポリブタジエンと、２つ以上のオキシラン環を有する化合物と、を反応させてなる化合物であることを特徴とする請求項５に記載の熱硬化性樹脂組成物。
Figure 2006052318
 A modified polybutadiene in which the epoxy compound has one or more groups selected from the group consisting of phenolic hydroxyl groups, alcoholic hydroxyl groups, carboxyl groups, amide groups, amino groups, imino groups and groups represented by the following formula (III) The thermosetting resin composition according to claim 5, which is a compound obtained by reacting a compound having two or more oxirane rings.
Figure 2006052318
 前記エポキシ化合物が、その側鎖及び／又は末端にビニル基を有することを特徴とする請求項５又は６に記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 5 or 6, wherein the epoxy compound has a vinyl group at a side chain and / or a terminal thereof. 前記エポキシ化合物が、下記一般式（１）、（２）又は（３）で表されるもの、あるいは下記一般式（５）で表される構造単位を有するものであることを特徴とする請求項５記載の熱硬化性樹脂組成物。
Figure 2006052318
 ［式（１）中、ｎは２〜８の整数を示し、ｎ及びｍの合計は１０〜１００００の整数を示す。］
Figure 2006052318
 ［式（２）中、Ｒ１及びＲ２は、それぞれ独立に水素原子又は水酸基を示し、Ｒ３はアクリル基又はオキシラニル基を示す。］
Figure 2006052318
 ［式（３）中、Ｒ４は下記式（４）で表される基を示し、ｉは０〜１００の整数を示し、ｉ及びｊの合計は１０〜１００００の整数を示す。］
Figure 2006052318
Figure 2006052318
 ［式（５）中、ｐは１〜１００００の整数を示し、ｑは１〜１００の整数を示し、ｒ及びｓはそれぞれ独立に０〜１００の整数を示し、ｔは１〜１００００の整数を示す。ただし、ｒ及びｓのいずれかは１以上の整数を示す。］ The epoxy compound is one represented by the following general formula (1), (2) or (3), or having a structural unit represented by the following general formula (5). 5. The thermosetting resin composition according to 5.
Figure 2006052318
 [In Formula (1), n shows the integer of 2-8, and the sum total of n and m shows the integer of 10-10000. ]
Figure 2006052318
 [In Formula (2), R 1 and R 2 each independently represent a hydrogen atom or a hydroxyl group, and R 3 represents an acrylic group or an oxiranyl group. ]
Figure 2006052318
 [In formula (3), R 4 represents a group represented by the following formula (4), i represents an integer of 0 to 100, and the sum of i and j represents an integer of 10 to 10,000. ]
Figure 2006052318
Figure 2006052318
 [In formula (5), p represents an integer of 1 to 10,000, q represents an integer of 1 to 100, r and s each independently represent an integer of 0 to 100, and t represents an integer of 1 to 10,000. Show. However, either r or s represents an integer of 1 or more. ] 前記（Ｂ）成分の配合割合が、前記（Ａ）成分１００質量部に対して５質量部〜２００質量部であることを特徴とする請求項１〜８のいずれか一項に記載の熱硬化性樹脂組成物。   The thermosetting according to any one of claims 1 to 8, wherein a blending ratio of the component (B) is 5 parts by mass to 200 parts by mass with respect to 100 parts by mass of the component (A). Resin composition. （Ａ）成分；ポリアミドイミドと、
（Ｃ）成分；該ポリアミドイミドのアミド基と反応し得る官能基を２つ以上有する化合物と、
（Ｄ）成分；前記（Ｃ）成分と反応し得る官能基を有し、かつエチレン性不飽和結合を有する化合物と、
を含有することを特徴とする熱硬化性樹脂組成物。 (A) component; polyamideimide,
(C) component; a compound having two or more functional groups capable of reacting with the amide group of the polyamideimide;
(D) component; a compound having a functional group capable of reacting with the component (C) and having an ethylenically unsaturated bond;
A thermosetting resin composition comprising: 前記（Ａ）成分が飽和炭化水素からなる構成単位を有することを特徴とする請求項１０記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 10, wherein the component (A) has a structural unit composed of a saturated hydrocarbon. 前記（Ｃ）成分が2つ以上のオキシラン環又はオキセタン環を有することを特徴とする請求項１０又は１１に記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 10 or 11, wherein the component (C) has two or more oxirane rings or oxetane rings. 前記（Ｄ）成分が、その側鎖及び／又は末端にビニル基を有し、かつフェノール性水酸基、アルコール性水酸基、カルボキシル基、アミド基、アミノ基、イミノ基及び上記式（ＩＩＩ）で表される基からなる群より選ばれる１種以上の基を有する変性ポリブタジエンであることを特徴とする請求項１０〜１２のいずれか一項に記載の熱硬化性樹脂組成物。   The component (D) has a vinyl group at its side chain and / or terminal, and is represented by a phenolic hydroxyl group, an alcoholic hydroxyl group, a carboxyl group, an amide group, an amino group, an imino group, and the above formula (III). The thermosetting resin composition according to any one of claims 10 to 12, which is a modified polybutadiene having one or more groups selected from the group consisting of: 前記（Ｃ）成分及び前記（Ｄ）成分の総配合割合が、前記（Ａ）成分１００質量部に対して５質量部〜２００質量部であり、前記（Ｄ）成分の配合割合が、前記（Ｃ）成分１００質量部に対して５質量部〜１０００質量部であることを特徴とする請求項１０〜１３のいずれか一項に記載の熱硬化性樹脂組成物。   The total blending ratio of the component (C) and the component (D) is 5 to 200 parts by weight with respect to 100 parts by weight of the component (A), and the blending ratio of the component (D) is the above ( C) It is 5 mass parts-1000 mass parts with respect to 100 mass parts of components, The thermosetting resin composition as described in any one of Claims 10-13 characterized by the above-mentioned. 請求項１〜１４のいずれか一項に記載の熱硬化性樹脂組成物を溶媒に溶解又は分散させて得られる樹脂ワニス。
A resin varnish obtained by dissolving or dispersing the thermosetting resin composition according to any one of claims 1 to 14 in a solvent.
JP2004234821A 2004-08-11 2004-08-11 Thermosetting resin composition and resin varnish using the same Active JP4815767B2 (en)

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JP2006052318A5 true JP2006052318A5 (en) 2009-12-24
JP4815767B2 JP4815767B2 (en) 2011-11-16

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* Cited by examiner, † Cited by third party
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JP5018011B2 (en) * 2006-04-12 2012-09-05 日立化成工業株式会社 Metal foil-laminated laminate, resin-coated metal foil and multilayer printed wiring board
JP2007326923A (en) * 2006-06-07 2007-12-20 Mitsui Mining & Smelting Co Ltd Resin composition for adhering fluorine resin substrate and metal-clad laminate obtained by using the resin composition for adhering fluorine resin substrate
WO2011152364A1 (en) * 2010-05-31 2011-12-08 日立化成工業株式会社 Modified polyamideimide resin, electrically insulating material, method for improving dielectric breakdown resistance of insulating layer, and insulated wire
DE102013004046A1 (en) * 2013-03-08 2014-09-11 Clariant International Ltd. Flame retardant polyamide composition

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* Cited by examiner, † Cited by third party
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JPS61136565A (en) * 1984-12-07 1986-06-24 Mitsui Petrochem Ind Ltd Adhesive composition
JPS62187736A (en) * 1986-02-13 1987-08-17 Mitsubishi Electric Corp Copper-clad laminate
JP2000226560A (en) * 1999-02-08 2000-08-15 Tomoegawa Paper Co Ltd Adhesive tape for electronic device
JP4441834B2 (en) * 1999-11-29 2010-03-31 日立化成工業株式会社 Heat resistant resin composition
JP3928329B2 (en) * 2000-04-25 2007-06-13 日立化成工業株式会社 Polyamideimide resin composition and film forming material
JP4560886B2 (en) * 2000-05-01 2010-10-13 Ｄｉｃ株式会社 Carboxyl group-containing amideimide resin and / or carboxyl group-containing imide resin
JP3482946B2 (en) * 2000-06-28 2004-01-06 日立化成工業株式会社 Adhesive film and semiconductor device
JP4796687B2 (en) * 2000-08-04 2011-10-19 株式会社カネカ Adhesive composition
JP2002226818A (en) * 2001-02-06 2002-08-14 Hitachi Chem Co Ltd Thermosetting adhesive film

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