JP2007502904A5 - - Google Patents

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Publication number
JP2007502904A5
JP2007502904A5 JP2006533410A JP2006533410A JP2007502904A5 JP 2007502904 A5 JP2007502904 A5 JP 2007502904A5 JP 2006533410 A JP2006533410 A JP 2006533410A JP 2006533410 A JP2006533410 A JP 2006533410A JP 2007502904 A5 JP2007502904 A5 JP 2007502904A5
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JP
Japan
Prior art keywords
polyphosphonates
epoxy
reactive
represented
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006533410A
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Japanese (ja)
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JP2007502904A (en
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/016459 external-priority patent/WO2004113411A1/en
Publication of JP2007502904A publication Critical patent/JP2007502904A/en
Publication of JP2007502904A5 publication Critical patent/JP2007502904A5/ja
Pending legal-status Critical Current

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Description

Figure 2007502904
Figure 2007502904

Figure 2007502904
Figure 2007502904

Claims (1)

エポキシ−反応性ポリホスホネートが式：
Figure 2007502904
 但しＹはアリーレン基であり、ｎは約２〜３０である、
で示される請求項１〜５のいずれか１項の組成物。 Epoxy-reactive polyphosphonates have the formula:
Figure 2007502904
 However, Y is an arylene group and n is about 2 to 30,
The composition according to any one of claims 1 to 5, represented by
JP2006533410A 2003-05-22 2004-05-19 Polyphosphonate flame retardant curing agent for polyexic resin Pending JP2007502904A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47265403P 2003-05-22 2003-05-22
PCT/US2004/016459 WO2004113411A1 (en) 2003-05-22 2004-05-19 Polyphosphonate flame retardant curing agent for epoxy resin

Publications (2)

Publication Number Publication Date
JP2007502904A JP2007502904A (en) 2007-02-15
JP2007502904A5 true JP2007502904A5 (en) 2007-07-12

Family

ID=33539043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006533410A Pending JP2007502904A (en) 2003-05-22 2004-05-19 Polyphosphonate flame retardant curing agent for polyexic resin

Country Status (6)

Country Link
EP (1) EP1625171A1 (en)
JP (1) JP2007502904A (en)
KR (1) KR20060019547A (en)
CN (1) CN1795223A (en)
CA (1) CA2525856A1 (en)
WO (1) WO2004113411A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006026616A1 (en) * 2004-08-31 2006-03-09 Supresta Llc Process for preparing diaryl alkylphosphonates and oligomeric/polymeric derivatives thereof
CN101679675B (en) * 2007-06-14 2013-06-05 巴斯夫欧洲公司 Flame retardant compositions
WO2010051182A1 (en) * 2008-10-29 2010-05-06 Icl-Ip America Inc. Phosphorus-containing flame retardant epoxy resin composition, prepeg and laminate thereof
US20110132646A1 (en) * 2009-06-12 2011-06-09 Icl-Ip America Inc. Flame retardant epoxy resin composition, prepreg and laminate thereof
KR101424525B1 (en) * 2010-12-22 2014-08-01 에프알엑스 폴리머스, 인코포레이티드 Oligomeric phosphonates and compositions including the same
US20140224529A1 (en) * 2011-06-03 2014-08-14 Arisawa Mfg. Co., Ltd. Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit board
TWI475052B (en) * 2011-12-22 2015-03-01 Frx Polymers Inc Oligomeric phosphonates and compositions including the same
KR101469270B1 (en) * 2011-12-30 2014-12-08 제일모직주식회사 Polyphosphonate copolymer, method for preparing thereof and flame retardant thermoplastic resin composition comprising the same
US10167377B2 (en) 2013-01-22 2019-01-01 Frx Polymers, Inc. Phosphorus containing epoxy compounds and compositions therefrom
CN105801814B (en) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits
CN105802127B (en) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits
CN105330824A (en) * 2015-12-09 2016-02-17 西安元创化工科技股份有限公司 Flame retardant curing agent for epoxy resin and preparation method of flame retardant curing agent
TWI620785B (en) * 2016-08-10 2018-04-11 Taiwan Union Technology Corporation Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the same
TWI620763B (en) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the same
CA3075397C (en) * 2017-09-13 2023-09-26 Hexion Inc. Epoxy resin systems
CN107903383A (en) * 2017-11-22 2018-04-13 吉林省高性能复合材料制造业创新中心有限公司 Middle temperature curing epoxy low resin and preparation method thereof and the application in size tow carbon fiber epoxy composite transmission shaft
CN107778456A (en) * 2017-11-22 2018-03-09 吉林省高性能复合材料制造业创新中心有限公司 Middle temperature curing epoxy low resin and preparation method thereof and the application in large-tow carbon fiber epoxy composite power transmission shaft
CN109705530B (en) * 2018-12-29 2021-06-04 广东生益科技股份有限公司 Thermosetting resin composition, prepreg, laminate and high-frequency circuit board containing the same
CN112480373A (en) * 2019-09-11 2021-03-12 广东广山新材料股份有限公司 Flame-retardant epoxy resin composition and preparation method and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1180178A (en) * 1997-09-12 1999-03-26 Hitachi Chem Co Ltd Oligomer terminated with phosphorus-containing phenol and its production
JP4353589B2 (en) * 1999-07-09 2009-10-28 株式会社Ａｄｅｋａ Flame retardant epoxy resin composition
JP2002363259A (en) * 2001-06-04 2002-12-18 Mitsubishi Gas Chem Co Inc Flame-retardant resin composition
CN100546992C (en) * 2001-10-04 2009-10-07 旭瑞达有限公司 Hydroxy-end capped oligomeric phosphonate
EP1570000B1 (en) * 2002-11-08 2006-09-20 Akzo Nobel N.V. Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler
DE10300462A1 (en) * 2003-01-07 2004-07-15 Bakelite Ag Phosphorus modified epoxy resin

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