JP2005146110A5 - - Google Patents

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Publication number
JP2005146110A5
JP2005146110A5 JP2003385023A JP2003385023A JP2005146110A5 JP 2005146110 A5 JP2005146110 A5 JP 2005146110A5 JP 2003385023 A JP2003385023 A JP 2003385023A JP 2003385023 A JP2003385023 A JP 2003385023A JP 2005146110 A5 JP2005146110 A5 JP 2005146110A5
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JP
Japan
Prior art keywords
component
curable composition
iii
general formula
compound shown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003385023A
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Japanese (ja)
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JP2005146110A (en
JP4397023B2 (en
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Publication date
Application filed filed Critical
Priority to JP2003385023A priority Critical patent/JP4397023B2/en
Priority claimed from JP2003385023A external-priority patent/JP4397023B2/en
Publication of JP2005146110A publication Critical patent/JP2005146110A/en
Publication of JP2005146110A5 publication Critical patent/JP2005146110A5/ja
Application granted granted Critical
Publication of JP4397023B2 publication Critical patent/JP4397023B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Claims (2)

成分()としてポリエーテル変成シリコーンを含む、請求項1記載の硬化性組成物。 The curable composition of Claim 1 which contains polyether modified silicone as a component ( E ). 成分()として一般式(I)〜(III)で示される化合物以外のフッ素系界面活性剤を含む、請求項1または2記載の硬化性組成物。 The curable composition of Claim 1 or 2 containing fluorine-type surfactant other than the compound shown by general formula (I)-(III) as a component ( F ).
JP2003385023A 2003-11-14 2003-11-14 Curable composition and article Expired - Lifetime JP4397023B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003385023A JP4397023B2 (en) 2003-11-14 2003-11-14 Curable composition and article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003385023A JP4397023B2 (en) 2003-11-14 2003-11-14 Curable composition and article

Publications (3)

Publication Number Publication Date
JP2005146110A JP2005146110A (en) 2005-06-09
JP2005146110A5 true JP2005146110A5 (en) 2006-11-02
JP4397023B2 JP4397023B2 (en) 2010-01-13

Family

ID=34693243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003385023A Expired - Lifetime JP4397023B2 (en) 2003-11-14 2003-11-14 Curable composition and article

Country Status (1)

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JP (1) JP4397023B2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5506010B2 (en) * 2006-03-17 2014-05-28 昭和電工株式会社 Resin composition
JP5024591B2 (en) * 2006-03-29 2012-09-12 Dic株式会社 Coating composition
JP2007314760A (en) * 2006-04-26 2007-12-06 Jsr Corp Curable composition, and cured film and laminate therefrom
JP4239030B2 (en) 2006-07-13 2009-03-18 信越化学工業株式会社 Photo-curable resin composition and article having cured film thereof
JP5151113B2 (en) * 2006-11-02 2013-02-27 Jsr株式会社 Curable composition, cured film and antistatic laminate
KR101277825B1 (en) * 2008-11-14 2013-06-21 미쓰비시마테리알덴시카세이가부시키가이샤 Electrically conductive silica sol composition and molded article produced by using same
KR101600093B1 (en) 2009-01-20 2016-03-04 신에쓰 가가꾸 고교 가부시끼가이샤 Photocurable resin composition and article having cured coating thereof
JP5711452B2 (en) * 2009-09-30 2015-04-30 三洋化成工業株式会社 Active energy ray-curable antistatic composition
JP5509920B2 (en) 2010-02-24 2014-06-04 帝人株式会社 PHOTOCURABLE RESIN COMPOSITION, ARTICLE HAVING THE CURED CELL
JP5664351B2 (en) * 2011-03-07 2015-02-04 帝人株式会社 PHOTOCURABLE RESIN COMPOSITION, ARTICLE HAVING CURED CURTAIN THEREOF, AND PRODUCTION METHOD
JP5760522B2 (en) * 2011-03-07 2015-08-12 帝人株式会社 PHOTOCURABLE RESIN COMPOSITION, ARTICLE HAVING CURED CURTAIN THEREOF, AND PRODUCTION METHOD THEREFOR
JP5680486B2 (en) * 2011-06-03 2015-03-04 尾池工業株式会社 Hard coat film
JP5680503B2 (en) * 2011-08-08 2015-03-04 尾池工業株式会社 Laminated body
JP6589435B2 (en) * 2015-07-22 2019-10-16 三菱ケミカル株式会社 COATING COMPOSITION FOR REFORMING UNDERCOAT LAYER FOR METALLICATION TREATMENT AND RESIN MOLDED MATERIAL

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