JP2006051645A - Laminated film and its forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated film (gas barrier film) having high gas barrier properties and capable of holding high gas barrier properties to a high level even if treated at a high temperature using a retort or the like. <P>SOLUTION: The laminated film is constituted of a base material film such as a polyethylene terephthalate film or the like, an inorganic layer which is at least constituted of a silicon component formed at least on one side of the base material film and the barrier layer formed on the inorganic layer and constituted of a reaction product (A) of a compound (a1) having an amino group and a compound (a2) having a functional group capable of being reacted with the amino group of the compound (a1). The reaction product (A) may be a condensate containing the compound (a1) having the amino group such as polyalkyleneimine or the like, an organometal compound (a2) having the functional group capable of being reacted with the amino group of the compound (a1) and a hydrolytically condensable group and an organosilicon compound (a3) as condensation components. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminated film (gas barrier film) that is excellent in gas barrier properties against water vapor, oxygen, and the like and is suitable as a packaging film for foods and the like, and a method for producing the same.

  Packaging films used for foods, pharmaceuticals, precision electronic parts, etc. are required to have high transparency for the visibility and aesthetics of the contents, as well as to prevent deterioration of the contents due to moisture absorption and oxidation. Therefore, a high gas barrier property is required. In recent years, with the spread of microwave ovens, cooked or semi-cooked foods (hereinafter collectively referred to as cooked foods) may be heated in a microwave oven while being packaged. In addition, the cooked food is often retorted after packaging. Therefore, such a packaging film may be required to have resistance to retort processing and heating in a microwave oven.

  As such a packaging film, JP-A-1-202435 (Patent Document 1) and JP-A-1-202436 (Patent Document 2) include a silicon oxide vapor-deposited layer on the surface of a base film, A packaging material for a microwave oven and a packaging material for a retort food in which a heat seal layer or a protective layer is formed are disclosed. In these documents, the heat seal layer is composed of a laminate layer of a heat sealable resin film such as polypropylene, and the protective layer is a laminate layer of a film such as an ethylene-vinyl alcohol copolymer, or a thermosetting material. It is described that it can be composed of a resin coating layer. However, such a film has poor flexibility, and the vapor deposition layer of silicon oxide is easily broken, so that the gas barrier performance is likely to deteriorate.

  In addition, in Japanese Patent Application Laid-Open No. 7-285191 (Patent Document 3) and Japanese Patent No. 3219570 (Patent Document 4), at least one surface of the base film layer (1) is an inorganic layer (2 ), And a gas barrier packaging material in which the barrier resin coating layer is covered with a heat seal layer is disclosed. These documents describe that the barrier resin coating layer can be composed of a vinylidene chloride copolymer, an ethylene-vinyl alcohol copolymer, or the like.

  Further, JP-A-8-309913 (Patent Document 5) includes a silane coupling agent through an inorganic thin film layer in which at least one surface of a base film layer is composed of silicon oxide or the like. A barrier composite film coated with a barrier resin layer is disclosed. In this document, as a silane coupling agent, a halogen-containing silane coupling agent, an epoxy group-containing silane coupling agent (such as 3-glycidyloxypropyltrimethoxysilane), an amino group-containing silane coupling agent, a mercapto group-containing silane cup It describes that a ring agent, a vinyl group-containing silane coupling agent, a (meth) acryloyl group-containing silane coupling agent, and the like can be used. Further, in this document, vinylidene chloride copolymers and ethylene-vinyl alcohol copolymers are exemplified as preferable resins constituting the barrier resin layer.

  However, in such films, when vinylidene chloride resin is used, it may contaminate the environment if it is disposed as combustible waste. In addition, when ethylene-vinyl alcohol copolymer is used, it may be exposed to high humidity. Or after heat treatment (boil, retort, etc.), the ethylene-vinyl alcohol copolymer absorbs moisture, the coating film swells, and the barrier performance may be temporarily lowered.

On the other hand, Japanese Patent No. 3119113 (Patent Document 6) discloses a polymer organic compound (A) having a primary and / or secondary amino group in a molecule such as polyethyleneimine and a functional group capable of reacting with the amino group. Disclosed is a surface-treated resin molded article in which the surface of a resin molded article is coated with a surface coating composition containing a group-containing compound (B), an organosilane compound (C) and / or a hydrolysis condensate thereof, and an alcohol. Has been. In this document, (i) a thermoplastic film such as polyethylene terephthalate can be used as the molded body, and (ii) a metal or metal oxide deposited layer is laminated on the treated surface of the surface-treated resin molded body. It is described that (iii) a thermoplastic resin can be laminated on the treated surface of the surface-treated resin molded product or the above-mentioned vapor-deposited layer in order to impart performance such as heat sealability, printability, and safety. Yes. And as a concrete said aspect (iii), in Example 10, the adhesive agent was apply | coated to the vapor deposition layer of PET film which vapor-deposited silicon monoxide on the surface coating film, and after drying, the polypropylene film of thickness 50 micrometers was used. It is described that the oxygen permeability of this film was 0.4 cc / m ² · 24 hrs · atm.

Japanese Patent Application Laid-Open No. 2003-128121 (Patent Document 7) discloses an organic compound having in its molecule a nitrogen atom having active hydrogen bonded to at least a part of the surface of a molded body (A) made of polyester, polyolefin or polyamide. A gas barrier layer (B) and a metal layer or metal oxide layer (C) using a composition obtained by reacting (I) with an organic compound (II) having a functional group capable of reacting with active hydrogen, A packaging material is disclosed which has a water vapor transmission rate of 5 g / m ² · 24 hours at 40 ° C. and 90% RH. In this document, as a specific example of the packaging material, in the examples, the gas barrier composition having the above composition is applied to one side of a PET film (thickness 12 μm) with a thickness of 1 μm, dried, and aged. After that, silicon oxide was vapor-deposited with a thickness of 500 mm to obtain a packaging material film (Examples 1 and 2), and a 40 μm-thick unstretched polypropylene was laminated on the packaging material film by a dry laminating method. (Examples 3 and 4) are described. In addition, it is described that the water vapor permeability (unit: g / m ² · 24 hours) of the films obtained in Examples 1 and 2 was 1.9 and 0.6, respectively.

However, in the films of these documents (Patent Documents 6 and 7), that is, in the film obtained by overcoating the composition (surface coating composition) on the base film (polyethylene terephthalate film) on which silica is deposited, There is a risk that the gas barrier property (particularly after the retort treatment at 120 ° C.) may be deteriorated, and it is difficult to use in applications where such a gas barrier property after heat treatment is required.
JP-A-1-202435 (Claims) JP-A-1-202436 (Claims) JP-A-7-285191 (Claims) Japanese Patent No. 3219570 (Claims) JP-A-8-309913 (claims, paragraph number [0027]) Japanese Patent No. 3119113 (claims, paragraph numbers [0023], [0026], [0027], Examples) JP 2003-128121 A (Claims, Examples)

  Accordingly, an object of the present invention is to provide a laminated film (packaging film) that can maintain gas barrier properties (particularly water vapor barrier properties) at a high level even when treated (eg, boiled) at high temperatures, and a method for producing the same. is there.

  Another object of the present invention is to provide a non-chlorinated laminated film having a high gas barrier property (particularly water vapor barrier property) and capable of suppressing a decrease in gas barrier property even when treated at a high temperature, and a method for producing the same. .

  As a result of earnest studies to achieve the above-mentioned problems, the present inventors have found that a base film, an inorganic layer formed on the base film, (a1) a compound having an amino group, (a2) this compound ( a barrier layer (particularly a barrier coating layer) composed of a reaction product (A) with a compound having a functional group capable of reacting with an amino group of a1), and forming the inorganic layer with a silicon oxide If it is composed of silicon components such as, non-chlorine laminated films (packaging) that can maintain gas barrier properties (especially water vapor barrier properties) at a high level even when processed at high temperatures (for example, boil) and have excellent gas barrier properties. The present invention was completed.

  That is, the laminated film (gas barrier laminate film) of the present invention is composed of a base film, an inorganic layer formed on at least one surface of the base film, and a barrier layer formed on the inorganic layer. The inorganic layer is composed of at least a silicon component, and the barrier layer reacts with the compound (a1) having an amino group and (a2) the amino group of the compound (a1). It consists of a reaction product (A) with a compound having a possible functional group. The base film may be composed of a polyolefin resin, a polyester resin, a polyamide resin, or the like. For example, the base film may be composed of a polypropylene resin, a polyester resin, or a polyamide resin. Preferred base film includes polyethylene terephthalate film and the like. The inorganic layer may have transparency and be composed of at least a silicon oxide.

The reaction product (A) may be a condensate of the compound (a1) and the compound (a2). For example, (a1) a compound having an amino group and (a2) an amino group of the compound It may be a condensate containing at least a condensing component with an organometallic compound having a functional group capable of reacting and a hydrolytic condensable group. The compound (a1) may be composed of a polyalkyleneimine (eg, poly C _2-4 alkyleneimine), and the compound (a2) is a hydrolytic condensable organometallic compound having an epoxy group (particularly an alkoxy group). Silanes) may be used. The condensate may further be a condensate containing another condensing component (a3) not belonging to the category of the compound (a2) as a condensing component. For example, for the amino group of the compound (a1) It may be a condensate containing a non-reactive organosilicon compound (organosilane compound) as a condensation component. Such an organosilicon compound (a3) may be a tetraalkoxysilane and / or a condensate thereof (particularly, a tetraalkoxysilane condensate).

A typical laminated film of the present invention includes a base film composed of a polyester resin or a polyamide resin and stretched, and formed on at least one surface of the base film, and at least a silicon oxide. A laminated film composed of a structured transparent inorganic layer and a barrier layer formed directly on the inorganic layer, wherein the barrier layer comprises (a1) a polyalkyleneimine and (a2) an epoxy group And (a3) a tetra _C1-4 alkoxysilane and / or a condensate thereof (particularly, a tetra _C1-4 alkoxysilane condensate). Such as laminated film.

  In the laminated film of the present invention, a heat seal layer may be further formed. For example, a heat seal layer may be further formed on the barrier layer.

The laminated film of the present invention is excellent in gas barrier properties, and can maintain gas barrier properties even when processed at a high temperature as described above. For example, in the laminated film, the oxygen permeability after retorting (or boiling) for 30 minutes at a temperature of 120 ° C. is 20 ml / m ² · day · MPa or less (for example, 0.1 to 20 ml / m ² · day). -About MPa). Further, in the laminated film, water vapor permeability after retort treatment for 30 minutes at a temperature 120 ° C. is a 2g / m ² · day or less (e.g., 0.03~1.9g / m ² · about day) Also good. In a typical laminated film, the oxygen permeability after retorting at a temperature of 120 ° C. for 30 minutes is 10 ml / m ² · day · MPa or less (eg, 1 to 10 ml / m ² · day · MPa). 120 water vapor permeability after retort treatment for 30 minutes at ℃ is, 1.7g / m ² · day or less (e.g., 0.08~1.6g / m about ² · day) may be.

  The laminated film of the present invention is usually formed on the inorganic layer of a composite film formed of a base film and an inorganic layer formed on at least one surface of the base film and composed of at least a silicon component. a coating solution containing a reaction product (A) of a1) a compound having an amino group and (a2) a compound having a functional group capable of reacting with the amino group of the compound (a1) (for example, an organometallic compound) You may manufacture by apply | coating.

  The laminated film of the present invention forms (overcoats) a barrier layer containing a specific reaction product (especially a condensate) on a specific inorganic layer composed of a silicon component. ), Gas barrier properties (particularly water vapor barrier properties) can be maintained at a high level. Moreover, the laminated film of the present invention can be composed of a non-chlorine resin (such as a non-vinylidene chloride resin), has a high gas barrier property (particularly water vapor barrier property), and suppresses a decrease in gas barrier property even when processed at a high temperature. it can.

  The laminated film of the present invention includes a base film, an inorganic layer formed on at least one surface of the base film, and a barrier layer formed on the inorganic layer.

[Base film]
Examples of the resin constituting the base film (base film layer) include various resins that can be formed, such as olefin resins [eg, polyethylene resins (polyethylene, ethylene-propylene copolymer, ethylene-ethyl acrylate). Copolymer, ionomer, etc.), polypropylene resin (for example, polypropylene, propylene-ethylene copolymer, propylene-butene-1 copolymer, propylene-ethylene-butene-1 copolymer, etc.) containing 80% by weight or more Propylene resin, etc.), polyolefins such as poly-4-methylpentene-1, etc.], polyester resins [eg, polyalkylene terephthalate (polyethylene terephthalate, polybutylene terephthalate, etc.), polyalkylene naphthalate (polyethylene-2,6) -NA Homo- or copolyalkylene arylates such as talates, liquid crystalline polyesters, etc.], polyamide resins (nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, nylon 6/66, nylon 66/610, nylon MXD, etc.) , Vinyl chloride resin (polyvinyl chloride, etc.), vinylidene chloride resin (polyvinylidene chloride, vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-acrylonitrile copolymer, vinylidene chloride- (meth) acrylic acid ester copolymer) ), Fluororesin (polytrifluorochloroethylene, fluorinated ethylene-propylene copolymer, etc.), styrene resin (polystyrene, styrene-acrylonitrile copolymer, styrene-acrylonitrile-butadiene copolymer, etc.), polyvinyl chloride Alcohol resins (polyvinyl alcohol, ethylene-vinyl alcohol copolymers, etc.), polyimide resins (polyimide, polyamideimide, polyetherimide, etc.), polycarbonate resins, polysulfone resins (polysulfone, polyethersulfone, etc.), polyphenylene ether Resin, polyphenylene sulfide resin (polyphenylene sulfide, etc.), cellulose resin (cellulose ester resin, cellophane, etc.), polyetheretherketone, polyparaxylene, polyacrylonitrile, hydrochloric acid rubber, and the components of these various polymers Examples thereof include copolymers. These polymers may be used alone or in combination of two or more.

The base film may be a single base film, or a composite base film composed of a plurality of layers (for example, a laminated paper of paper and plastic, a laminate of a plastic film and an aluminum foil, plastics Or the like. Among these base films, non-chlorine resins such as olefin resins (polypropylene resins such as polypropylene), polyester resins (eg, aromatic polyesters such as poly C _2-4 alkylene arylate or copolyester) Resin) and a polyamide-based resin are preferable, and a base film composed of a polypropylene-based resin, a polyester-based resin, or a polyamide-based resin (particularly a polyester-based resin) is particularly preferable. In many cases, the base film is usually composed of a thermoplastic resin.

  For the base film, stabilizers (antioxidants, UV absorbers, light stabilizers, heat stabilizers, etc.), crystal nucleating agents, flame retardants, flame retardant aids, fillers, plastics, as necessary. Agent, impact resistance improver, reinforcing agent, colorant, dispersant, antistatic agent, foaming agent, antibacterial agent, lubricant (for example, inorganic lubricants such as silica fine powder, alumina fine powder, polyethylene fine powder, acrylic Organic lubricants such as fine powders), hydrocarbon polymers (styrene resins, terpene resins, petroleum resins, dicyclopentadiene resins, coumarone resins such as coumarone indene resins, phenol resins, rosin and its derivatives and their ), Waxes (higher fatty acid amides, higher fatty acids and their salts, higher fatty acid esters, mineral and plant-based natural waxes, synthetic waxes such as polyethylene), etc. It may be. These additives can be used alone or in combination of two or more.

  The base film may be an unstretched film, but is usually stretched (uniaxial or biaxial). As the stretched film, a biaxially stretched film is usually used in many cases. As the stretching method, for example, a conventional stretching method such as roll stretching, roll stretching, belt stretching, tenter stretching, tube stretching, or a combination of these can be applied. The draw ratio can be appropriately set according to the desired film properties, and is, for example, about 1.5 to 20 times, preferably about 2 to 15 times in at least one direction.

  The thickness of the base film can be appropriately selected in consideration of packaging suitability, mechanical strength, flexibility and the like, and is usually 5 to 200 μm, preferably 7 to 100 μm, more preferably 8 to 50 μm, and particularly 10 to 30 μm. It may be about (for example, 10 to 25 μm).

  The surface of the base film may be subjected to a surface treatment such as a discharge treatment such as corona discharge or glow discharge, an acid treatment such as chromic acid treatment, or a wrinkle treatment.

  In addition, an undercoat layer may be formed on the surface of the base film layer instead of or together with the surface treatment. The undercoat layer can be composed of various resins such as a thermoplastic resin, a thermosetting resin, a light curable resin (such as an electron beam curable resin and an ultraviolet curable resin), and a coupling agent. Examples of the component of the undercoat layer include acrylic resins, vinyl chloride-vinyl acetate copolymers, polyvinyl butyral, polycarbonate, cellulose polymers such as nitrocellulose and cellulose acetate, and thermoplastic resins such as rosin-modified maleic resin; Examples thereof include thermosetting resins such as urethane resins, urea resins, melamine resins, urea-melamine resins, and epoxy resins; and photocurable resins such as epoxy (meth) acrylates and urethane (meth) acrylates. These components can be used alone or in combination of two or more. The undercoat layer may contain a colorant such as a general-purpose dye or pigment. The content of the colorant is appropriately selected within a range that does not impair the transparency of the film, and may usually be about 1 to 30% by weight with respect to the resin constituting the undercoat layer. The thickness of the undercoat layer is not particularly limited, and may usually be about 0.1 to 5 μm. The method for forming the primer layer is not particularly limited, and an organic or aqueous coating agent containing the components of the primer layer is applied by a conventional coating method such as a roll coating method, a gravure coating method, a reverse coating method, or a spray coating method. And drying or curing. In addition, when using a photocurable resin, you may irradiate actinic light.

  In the present invention, an inorganic layer described later may be directly formed on the base film without forming such an undercoat layer.

  Further, the light transmittance of the base film may be transparent or opaque depending on the use of the laminated film. However, in the laminated film for applications where visibility and aesthetics are required, the total light with white light is used. The transmittance is usually 40% or more (for example, about 45 to 99%), preferably 60% or more (for example, about 70 to 98%), more preferably 80% or more (for example, about 85 to 95%). There may be.

[Inorganic layer]
The inorganic layer is composed of at least a silicon component. In the present invention, by combining an inorganic layer composed of such a silicon component and a barrier layer composed of a specific component described later, a gas barrier can be used even at a high temperature (for example, boil or retort treatment). The sex can be maintained at a high level. Such an inorganic layer should just be formed in at least one surface of a base film, and may be formed in both surfaces of a base film. The inorganic layer may be usually formed on one surface of the base film. In addition, although an inorganic layer may be transparent or opaque, in the laminated | multilayer film of the use for which visibility etc. are requested | required, it usually has transparency in many cases.

  The silicon component constituting the inorganic layer is preferably an inorganic substance capable of forming a thin film (in particular, a transparent thin film). For example, silicon, a compound containing silicon element (usually an inorganic compound), such as an oxide (silicon oxide) Product or silicon oxide), halides, carbides, nitrides, and the like. A silicon component may be individual or may combine 2 or more types. Of these silicon components, the inorganic layer is preferably formed of silicon alone or silicon oxide (particularly at least silicon oxide).

  Among the silicon components, in addition to being excellent in transparency and barrier properties, silicon oxide can form a dense thin film, and adhesion (or affinity) with the base film and components of the barrier layer described later. ) Is high. Therefore, even if a mechanical external force is applied, cracks and defects are not generated in the inorganic layer, and high gas barrier properties can be maintained for a long period of time. In packaging materials (for example, packaging materials for electromagnetic wave heating), non-conductive inorganic materials such as silicon components having low conductivity, such as oxides, halides, carbides, and nitrides, can be suitably used. Preferred non-conductive silicon components include silicon oxide (or silica) and the like.

  The silicon oxide (silicon oxide) includes not only silicon monoxide and silicon dioxide but also a composition formula SiOx (where 0 <x ≦ 2, preferably 0.8 ≦ x ≦ 1.5). Silicon oxide.

  The inorganic layer may be composed of at least a silicon component, may be composed of a silicon component alone, and may contain other inorganic substances (metal components) in addition to the silicon component. Examples of such an inorganic substance (or second metal component) include group 2A elements (metal elements) such as beryllium, magnesium, calcium, strontium, and barium; transitions such as titanium, zirconium, ruthenium, hafnium, and tantalum. Periodic table 2B elements such as zinc; periodic table 3B elements such as aluminum, gallium, indium and thallium; periodic table 4B elements such as germanium and tin; periodic table 6B elements such as selenium and tellurium Examples include simple substances (metal simple substances) and compounds containing these elements (usually inorganic compounds), such as oxides, halides, carbides, and nitrides. These inorganic substances can be used alone or in combination of two or more. Preferred inorganic materials to be combined with the silicon component include, for example, periodic table group 2A elements such as magnesium, calcium, and barium; transition metal elements such as titanium, zirconium, tantalum, and ruthenium; periodic table group 2B elements such as zinc; aluminum, indium, A periodic table group 3B element such as thallium; a periodic table group 4B element such as tin; a simple substance of a periodic table group 6B element such as selenium, or an oxide containing these elements. In particular, the silicon component may be combined with a metal simple substance or an oxide thereof [for example, aluminum oxide (for example, alumina)] of Group 3B elements (particularly, aluminum) of the periodic table.

  When combining a silicon component and another inorganic substance (aluminum oxide etc.), the ratio of another inorganic substance is 1-200 weight part with respect to 100 weight part of silicon components, Preferably 3-150 weight part, More preferably, it may be about 5 to 100 parts by weight (for example, 10 to 80 parts by weight).

  The thickness of the inorganic layer is usually 100 to 5000 angstrom (0.01 to 0.5 μm), preferably 200 to 3000 angstrom (0.02 to 0.3 μm), more preferably 300 to 1500 angstrom (0.03). Can be selected from a range of about 0.15 μm).

[Barrier layer]
The barrier layer (barrier coating layer) may be formed on the inorganic layer, and includes (a1) a compound having an amino group (hereinafter sometimes referred to as an amino compound), (a2) an amino group of this compound (a1). It comprises a reaction product (A) with a compound having a functional group capable of reacting with a group (specifically, a functional group capable of forming a bond by reacting with an amino group). In the present invention, by combining the barrier layer having such a configuration with the inorganic layer composed of the silicon component, the gas barrier property can be improved, and the gas barrier property after heat treatment such as boiling or retort is at a high level. Can be maintained. In addition, when such a barrier layer is formed, the flexibility of the laminated film (or barrier layer) can be improved due to the reaction product (A).

(Compound (a1))
In the compound (a1), the amino group includes an amino group (—NH ₂ ), a substituted amino group (eg, an N-alkylamino group such as a methylamino group), an imino group (—NH—), and the like. . A preferred amino group is a group containing a nitrogen atom to which a hydrogen atom (active hydrogen atom) capable of reacting with the compound (a2) described later is bonded, for example, an amino group (—NH ₂ ) or an imino group (—NH—). . The compound (a1) may have these amino groups alone or in combination of two or more thereof (for example, amino group and imino group).

The amino compound (a1) is a low molecular weight compound [for example, an alkanolamine (C _2-6 alkanolamine such as ethanolamine) depending on the type of the compound (a2) described later (for example, a crosslinkable compound or a multifunctional compound). , Preferably C _2-4 alkanolamine, etc.), etc., but is usually a polymer (or oligomer) having the amino group.

The polymer having a typical amino group (or polymeric compounds), for example, polyalkylene imine (poly C _1-6 alkylene imines etc.), poly C _2-6 alkenyl amine such polyalkenylamine (polyallylamine, preferably And poly _C2-4 alkenylamine), polyoxyethylene alkylamine (polyoxyethylene alkylamine, etc.) and the like.

The polyalkylene imines, polymethylene imine, polyethyleneimine, polypropyleneimine, poly isopropylene imine, polybutylene imine, homo C _1-6 alkylene imine such as polyisobutylene imine (preferably poly C _1-4 alkylene imine), these And copolyalkyleneimines (copoly C _1-4 alkyleneimines etc.) corresponding to these homopolyalkyleneimines. The structure of the polyalkyleneimine may be linear or branched and is usually branched.

  The polyalkyleneimine may be synthesized by a conventional method [such as ring-opening polymerization of alkyleneimine (for example, ethyleneimine)], or a commercially available product may be used. For example, polyalkyleneimine (polyethyleneimine) is available from, for example, Nippon Shokubai Co., Ltd. Epomin series ("Epomin SP-003", "Epomin SP-006", "Epomin SP-012", "Epomin SP-018"). ”,“ Epomin SP-103 ”,“ Epomin SP-110 ”,“ Epomin SP-200 ”,“ Epomin SP-300 ”,“ Epomin SP-1000 ”,“ Epomin SP-1020 ”, etc.).

  Further, polyalkenylamine (polyallylamine) may be synthesized by a conventional method (such as radical polymerization of alkenylamine), and is commercially available (for example, “PAA-L”, “PAA-” manufactured by Nitto Boseki Co., Ltd.). H "etc.) may be used.

  A preferred amino compound (a1) is a polyalkyleneimine (particularly polyethyleneimine). Polyalkyleneimine is excellent in film formability, transparency, flexibility and the like, and can be suitably used.

  The number average molecular weight of the polymer (or oligomer) having an amino group is, for example, 250 or more (for example, about 250 to 200,000), preferably 300 or more (for example, about 300 to 100,000), more preferably 400 or more (for example, 400 To about 50,000), and usually 500 or more (for example, about 500 to 10,000).

(Compound (a2))
In the compound (a2) (hereinafter sometimes referred to as a reactive compound), the functional group capable of reacting with an amino group is an epoxy group, a carboxyl group or an inductive group thereof (an acid anhydride group, an acid halide). Groups), isocyanate groups, thioisocyanate groups, oxazolinyl groups, aldehyde groups, ketone groups, alkyl halide groups, and the like. Among these functional groups, an epoxy group and an isocyanate group are preferable from the viewpoints of reactivity, water resistance (or hot water resistance), and an epoxy group is particularly preferable. The said compound (a2) may have these functional groups individually or in combination of 2 or more types.

  The reactive compound (a2) may be a compound having at least one functional group, and may be a monofunctional compound (for example, monoglycidyl ethers such as 2-ethylhexyl glycidyl ether and phenyl glycidyl ether). Usually, it is usually a polyfunctional compound (or a crosslinkable compound) having a functional group for at least one amino group. Such a polyfunctional compound (a compound having two or more functions) may be any group in which at least one functional group is reactive with an amino group (for example, an epoxy group). It may be a compound that is a functional group reactive to a group, a functional group reactive to an amino group (for example, an epoxy group) and a functional group that is non-reactive to the amino group (for example, It may be a compound (usually an organometallic compound) having a hydrolytic condensable group such as an alkoxy group.

Examples of the non-reactive functional group include an alkoxy group (for example, a C _1-6 alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, and an isobutoxy group, preferably a C _1-4 alkoxy group. And more preferably, a C _1-2 alkoxy group), a halogen atom (a chlorine atom, a bromine atom, etc.), a hydrolytic condensable group (or a hydrolyzable polymerizable group) such as a hydroxyl group, and the like. The hydrolytic condensable group may be substituted with a metal atom (a silicon atom, an aluminum atom, a titanium atom, etc., particularly a silicon atom). For example, the reactive compound (a2) may be an organometallic compound having the amino group and a hydrolytic condensable group. Of these hydrolytic condensable groups, a C _1-4 alkoxy group, particularly a methoxy group, an ethoxy group, a propoxy group (in particular, a methoxy group and an ethoxy group) and the like are preferable.

  Specific compounds (a2) include polyfunctional compounds having an epoxy group, polyfunctional compounds having an isocyanate group, polyfunctional compounds having a carboxyl group (aliphatic dicarboxylic acids such as adipic acid and tartaric acid, polyacrylic compounds, and the like. Acid, etc.).

  As a typical polyfunctional compound having an epoxy group, an epoxy group such as an alkoxysilane having an epoxy group and an organometallic compound having a hydrolytic condensable group can be given.

Examples of alkoxysilanes having an epoxy group include dialkoxysilanes having an epoxy group [for example, 3-glycidyloxypropylmethyldimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropylethyldiethoxysilane, etc. (Glycidyloxy C _2-4 alkyl) C _1-4 alkyldiC _1-4 alkoxysilane etc.], trialkoxysilanes having an epoxy group {eg (glycidyloxyalkyl) trialkoxysilane (eg 2-glycidyloxy Glycidyloxy C _2-4 alkyltri C _1- such as ethyltrimethoxysilane, 2-glycidyloxyethyltriethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane ₄ alkoxysilane etc.), epoxycycloalkyltrialkoxysilane [for example, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 3- (3 4-epoxycyclohexyl) propyltrimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltriethoxysilane and other epoxy C _5-8 cycloalkyl C _2-4 alkyltri C _1-4 alkoxysilane etc.] etc. Is mentioned.

  Polyfunctional compounds having an epoxy group include polyglycidyl ethers, polyglycidyl esters and the like. As the polyfunctional compound having an epoxy group, usually, an organometallic compound having the epoxy group and a hydrolytic condensable group is often used. Such an organometallic compound, a polyglycidyl ether, a polyglycidyl ester is often used. You may use it in combination with a kind.

  Polyglycidyl ethers include alkanediol diglycidyl ether (such as ethylene glycol diglycidyl ether), (poly) oxyalkylene glycol diglycidyl ether (diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, Nonaethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, glycerol diglycidyl ether, tri Aliphatic jigs such as methylolpropane diglycidyl ether Diether ethers; aliphatic tri- or tetraglycidyl ethers such as glycerol triglycidyl ether, diglycerol triglycidyl ether, triglycidyl tris (2-hydroxyethyl) isocyanurate, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether; In addition to diglycidyl ethers of bisphenols such as bisphenol A diglycidyl ether, resorcinol diglycidyl ether, hydroquinone diglycidyl ether, bisphenol S diglycidyl ether, bisphenol F diglycidyl ether, and the like described in JP 2003-128121 A Glycidyl ethers (glycidyls having an aromatic ring or a hydrogenated ring thereof, glycidyl group as a functional group) The polyglycidyl esters include aliphatic dicarboxylic acid diglycidyl esters (such as adipic acid diglycidyl esters), aromatic dicarboxylic acid diglycidyl esters (o-phthalic acid diglycidyl esters), and the like. Etc.).

Further, typical polyfunctional compounds having an isocyanate group include, for example, alkoxysilanes having an isocyanate group (for example, isocyano C ₂ such as γ-isocyanopropyltrimethoxysilane, γ-isocyanopropyltriethoxysilane). _In addition to organometallic compounds having an isocyanate group and a hydrolytic condensable group such as _-4 alkyltri-C _1-4 alkoxysilane), diisocyanates (hexamethylene diisocyanate, tolylene diisocyanate, 1,4-diphenylmethane diisocyanate, 1, 5-naphthalene diisocyanate, triphenylmethane triisocyanate, tolidine diisocyanate, xylylene diisocyanate, di- or triisocyanate such as dicyclohexylmethane) and the like. As the polyfunctional compound having an isocyanate group, an organometallic compound having at least an isocyanate group and a hydrolytic condensable group is usually used in many cases.

  Compound (a2) may be used alone or in combination of two or more.

Among these compounds (a2), from the viewpoint of adhesion and the like, an organometallic compound having a functional group capable of reacting with the amino group and a hydrolytic condensable group, for example, an alkoxysilane having an epoxy group (particularly Epoxy groups such as glycidyloxy C _2-4 alkyltri C _1-4 alkoxysilanes, epoxy C _5-8 cycloalkyl C _2-4 alkyltri C _1-4 alkoxysilanes and the like. And organometallic compounds having hydrolytic condensable groups (particularly organosilicon compounds) are preferred.

  In the present invention, although the reaction product (A) depends on the combination of the compound (a1) and the compound (a2), the amine compound (a1) and the reactive compound (a2) (especially the amino A condensate containing a functional group capable of reacting with a group and a compound having a hydrolytic condensable group) as a condensing component may be used. Specifically, the reaction product (A) includes the amine compound (a1) and the reactive compound (a2) bonded via the amino group, the reactive compound (a2), and a condensation described later. It may be a condensate condensed with the hydrolytic condensable group of component (a3). Such a condensate (or cross-linked product) may be a precondensate having an unreacted (or remaining) hydrolytic condensable group (for example, an alkoxy group).

  The condensate may include at least the amine compound (a1) and the reactive compound (a2) as a condensation component, and may further include (a3) another condensation component (or cocondensation component). When such other condensation components are used, the gas barrier property can be further improved.

(Condensation component (a3))
Examples of the condensation component (a3) include organometallic compounds that do not belong to the category of the compound (a2) (or organometallic compounds that are non-reactive with respect to the amino group). Examples of such coupling agents (non-reactive coupling agents) include organosilicon compounds, organoaluminum compounds [for example, tri-C alkoxy compounds such as trialkoxyaluminate (trimethoxyaluminate, triethoxyaluminate, tripropoxyaluminate). _1-4 alkoxyaluminate, etc.)], organotitanium compounds [eg, dialkoxytitanates, such as dialkyldiC _1-4 alkoxytitanates (eg, diethyldiethoxytitanate); tri-C _1-4 alkoxytitanates (eg, trimethoxytitanate) ), an alkyl tri C _1-4 alkoxy titanates (ethyl trimethoxy titanate), tri alkoxy titanates such as Arirutori C _1-4 alkoxy titanates (such as phenyltrimethoxysilane titanate); tetramethoxy titanate Tetraethoxy titanate, etc. tetraalkoxy titanates such as tetra-C _1-4 alkoxy titanates such as tetra propoxy titanate) and the like. Of these, organosilicon compounds are particularly preferred. The organometallic compounds may be used alone or in combination of two or more.

  Examples of the organosilicon compound that is non-reactive with respect to the amino group include alkoxysilanes that are non-reactive with respect to the amino group, such as alkoxysilanes represented by the following formula (1) or condensates thereof. Can be mentioned.

R ¹ _m Si (OR ² ) _n (1)
(In the formula, R ¹ represents a hydrogen atom, a hydroxyl group or a hydrocarbon group which may have a functional group non-reactive with the amino group, R ² represents an alkyl group or a cycloalkyl group, and m represents 0 or an integer of 1 or more, n is an integer of 1 or more, and m + n = 4.)
In the formula (1), examples of the hydrocarbon group represented by the group R ¹ include linear groups such as an alkyl group (for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an isobutyl group) A branched C _1-8 alkyl group, preferably a C _1-6 alkyl group, more preferably a C _1-4 alkyl group, an alkenyl group (for example, a C _2-6 alkenyl group such as a vinyl group, an allyl group, preferably Is a C _2-4 alkenyl group, more preferably a C _2-3 alkenyl group), a cycloalkyl group (for example, a C _3-8 cycloalkyl group such as a cyclopropyl group, a cyclobutyl group, a cyclohexyl group), an aryl group (for example, C _6-15 aryl group such as phenyl group and tolyl group, preferably C _6-10 aryl group, more preferably C _6-8 aryl group). Of these, preferred hydrocarbon groups include alkyl groups (C _1-4 alkyl groups and the like) and the like.

In the hydrocarbon group represented by the group R ¹ , examples of the functional group that is non-reactive with the amino group include an amino group or a substituted amino group [for example, an aminoalkylamino group (such as a 2-aminoethylamino group). Amino _C2-4 alkylamino group, etc.), alkenylamino group ( _C2-4 alkenylamino group such as allylamino group, etc.)], mercapto group, (meth) acryloyloxy group and the like. These functional groups may be substituted alone or in combination of two or more with a hydrocarbon group. In addition, when the substitution number m is plural, the plural groups R ¹ may be the same or different.

Examples of the alkyl group represented by the group R ² include linear or branched C _1-6 alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group and isobutyl group, preferably C Examples thereof include a _1-4 alkyl group, more preferably a C _1-2 alkyl group. Examples of the cycloalkyl group represented by the group R ² include C _3-8 cycloalkyl groups such as a cyclopropyl group, a cyclobutyl group, and a cyclohexyl group. Of these, the preferred group R ² is an alkyl group (eg, a C _1-4 alkyl group, preferably a C _1-2 alkyl group). The preferable number n of substitution is 2 to 4, more preferably 3 or 4. In addition, when the substitution number n is plural, the groups R ² may be the same or different.

  Examples of the alkoxysilane represented by the formula (1) include monoalkoxysilanes (for example, vinyldimethylethoxysilane), dialkoxysilanes, trialkoxysilanes, and tetraalkoxysilanes.

Representative dialkoxysilanes include, for example, dialkyl dialkoxysilanes (for example, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldiisopropoxysilane, dimethyldibutoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldioxysilane). tetraisopropoxysilane, and di C _1-4 alkyl di C _1-4 alkoxysilane such as diethyl dibutoxy silane), diaryl dialkoxy silanes (e.g., diphenyl dimethoxysilane, di-C _6-10 aryldi C ₁ such as diphenyldiethoxysilane _-4 alkoxysilane, etc.), dialkoxysilane having an amino group (for example, amino C _2-4 alkyl C _1-4 alkyl di C _1- such as 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane) ₄ alkoxysilanes; (amino C _2-4 alkylamino) C _1-4 alkyl-C _1-4 alkyldiC _1-4 alkoxysilanes such as 3- [N- (2-aminoethyl) amino] propylmethyldimethoxysilane ), dialkoxysilane having a mercapto group (e.g., mercapto C _2-4 alkyl C _1-4 alkyl di C _1-4 alkoxysilane such as 3-mercaptopropyl methyl dimethoxy silane), dialkoxysilane having an alkenyl group [for example, C _2-4 alkenyl C _1-4 alkyl di C _1-4 alkoxysilane such as vinyldimethoxymethylsilane; and di C _2-4 Arukeniruji C _1-4 alkoxysilane such as divinyl dimethoxysilane, having a (meth) acryloyl groups Dialkoxysilane (eg, 3- (meth) acryloxypropylmethyldimethoxysilane) (Meth) acryloyloxy C _2-4 alkyl C _1-4 alkyldiC _1-4 alkoxysilane and the like.

Typical trialkoxysilanes include, for example, trialkoxysilane (eg, tri-C _1-4 alkoxysilane such as trimethoxysilane), alkyltrialkoxysilane (eg, methyltrimethoxysilane, methyltriethoxysilane, Methyltriisopropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane, ethyltributoxysilane, propyltrimethoxysilane, isopropyltrimethoxysilane, propyltriethoxysilane, isopropyltriethoxy such as C _1-4 alkyl tri C _1-4 alkoxysilane such as silane), aryl trialkoxysilane (e.g., C _6-10 Arirutori C _1-4 alkoxysilane such as phenyltrimethoxysilane Emissions, etc.), a trialkoxysilane having an amino group (e.g., amino C _2-4 alkyl tri C _1-4 alkoxysilane such as 2-aminoethyl trimethoxysilane; 2- [N-(2-aminoethyl) amino] N- (amino C _2-4 alkyl) amino C _2-4 alkyltri C _1-4 alkoxysilane etc.) such as ethyltrimethoxysilane, trialkoxysilane having a mercapto group (for example, 3-mercaptopropyltrimethoxysilane, Mercapto C _2-4 alkyltri C _1-4 alkoxysilanes such as 3-mercaptopropyltriethoxysilane), trialkoxysilanes having an alkenyl group (eg, C _2-4 alkenyls such as vinyltrimethoxysilane, vinyltriethoxysilane) and tri C _1-4 alkoxy silane), birds having a (meth) acryloyl groups Lucoxysilane [for example, 2- (meth) acryloxyethyltrimethoxysilane, 2- (meth) acryloxyethyltriethoxysilane, 3- (meth) acryloxypropyltrimethoxysilane, 3- (meth) acryloxypropyltriethoxy (Meth) acryloyloxy C _2-4 alkyltri C _1-4 alkoxysilane etc. such as silane] and the like.

Typical tetraalkoxysilanes include tetraalkoxysilanes corresponding to the above-exemplified di- or trialkoxysilanes, such as tetraalkoxysilanes [tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, _1-4 alkoxysilane, etc.].

  Examples of the alkoxysilane condensate (or hydrolysis condensate) include the alkoxysilane condensate (or polymerized product) represented by the formula (1). Such a condensate (or partial condensate) may be a condensate of a single alkoxysilane, or a condensate of a plurality of alkoxysilanes (for example, a condensate of different types of tetraalkoxysilanes). Also good.

  The alkoxysilane condensate (alkoxysilane condensate) may be, for example, an oligomer of about 2 to 10 mer, preferably about 2 to 8 mer, more preferably about 3 to 6 mer.

  The alkoxysilane condensate may be a network condensate (or partial condensate), or may be a linear or linear condensate (or partial condensate). Typical alkoxysilane condensates include condensates (partial condensates) of tetraalkoxysilanes (tetraalkoxysilanes exemplified above), for example, linear alkoxysilane condensation represented by the following formula (2) Things are included.

(In the formula, R ² is the same as above. D represents an integer of 2 or more)
In the above formula (2), preferred groups R ² include C _1-4 alkyl groups (particularly C _1-2 alkyl groups) such as a methyl group and an ethyl group. As described above, the plurality of groups R ² may be the same group or different groups. Further, the preferable degree of condensation d may be, for example, about 2 to 8, preferably about 2 to 6, and more preferably about 3 to 5.

  Further, the organosilicon compounds that are non-reactive with the amino group include complex compounds of the alkoxysilanes, triacyloxysilanes (such as methyltriacetoxysilane), trialkylsilanols (such as trimethylsilanol), and these compounds. High molecular organosilicon compounds containing

Preferred organosilicon compounds include tetraalkoxy silanes (eg, tetra C _1-4 alkoxy silanes such as tetramethoxy silane, tetraethoxy silane, especially tetra C _1-2 alkoxy silanes), and tetraalkoxy silane condensates (eg, 2-10 mer).

  The organosilicon compounds (alkoxysilanes) may be used alone or in combination of two or more.

(Ratio of each component)
The usage-amount of the said reactive compound (a2) can be selected from the range of about 1-70 weight part with respect to 100 weight part of said amine compounds (a1), for example, 5-50 weight part, Preferably it is 8-40. It may be about 10 to 30 parts by weight, more preferably about 10 to 30 parts by weight.

  The amount of the condensation component (a3) (for example, the organosilicon compound such as tetraalkoxysilane and tetraalkoxysilane condensate) is 100 weights of the total amount of the amine compound (a1) and the reactive compound (a2). Part can be selected from the range of about 0 to 200 parts by weight (for example, 3 to 180 parts by weight), for example, 5 to 150 parts by weight, preferably 8 to 130 parts by weight, and more preferably 10 to 100 parts by weight. It may be about (for example, 20 to 100 parts by weight).

  The preparation of the reaction product (A) is not particularly limited as long as at least the amino compound (a1) and the reactive compound (a2) are reacted. The reaction product (A) is appropriately prepared according to the types of these components, combinations thereof, and the like. it can. For example, the amine compound (a1), the reactive compound (a2), and, if necessary, the condensation component (a3) may be reacted (or combined) or the like.

  In the preparation method, at least the reaction of the amino group of the amine compound (a1) and the reactive group of the reactive compound (a2) (first reaction) may be performed, and the first reaction and the condensation reaction (second reaction). (That is, the condensation reaction of the hydrolytic condensable group of the reactive compound (a2)). In the present invention, the first reaction and the second reaction may usually be performed. The second reaction (condensation reaction) may be performed together with (or in parallel with) the first reaction, or may be performed after the first reaction. When the condensation component (a3) is used, the second reaction may be performed in the presence of the condensation component (a3). For example, after performing at least the first reaction between the amine compound (a1) and the reactive compound (a2), the second reaction may be performed in the presence of the condensation component (a3). Specifically, (i) after performing the first reaction with the amine compound (a1) and the reactive compound (a2), the second reaction may be performed in the presence of the condensation component (a3). (Ii) After performing the first reaction and the second reaction (or preliminary second reaction) with the amine compound (a1) and the reactive compound (a2), in the presence of the condensation component (a3) Further, a second reaction may be performed.

  The reaction (first reaction, first reaction and second reaction) of the amine compound (a1), the reactive compound (a2) and, if necessary, the condensation component (a3) can be usually carried out in a solvent. . Such a solvent is not particularly limited as long as each component (compound (a1), compound (a2), condensation component (a3), etc.) can be dissolved (or dispersed). For example, alcohols [methanol, ethanol, Alkanols such as 2-propanol, butanol and pentanol; alkylene glycols such as ethylene glycol; (poly) oxyalkylene glycols such as diethylene glycol and triethylene glycol; alkylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether; diethylene glycol (Poly) oxyalkylene glycol monoalkyl ethers such as monomethyl ether and triethylene glycol monomethyl ether], ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone) , Cyclohexanone, etc.), hydrocarbons (aromatic hydrocarbons such as toluene, benzene, xylene; aliphatic hydrocarbons such as hexane, heptane, octane), esters (methyl acetate, ethyl acetate, propyl acetate, butyl) Acetates such as acetate), ethers (cyclic ethers such as ethylphenol ether, propyl ether, and tetrahydrofuran), water and the like. Among these, alcohols such as methanol and ethanol are preferable from the viewpoint of stability and the like. A solvent can be used individually or in combination of 2 or more types.

  The reaction may be performed in the same solvent system or may be performed by newly adding a solvent. For example, a solvent may be added in the second reaction. The addition of the solvent may be performed in one step or may be performed in multiple steps. Specifically, the amine compound (a1), the reactive compound (a2) and, if necessary, the condensation component (a3) are reacted in a solvent [first reaction, first reaction and second reaction (precondensation). )], A solvent may be added and condensed. When the condensation component (a3) is used, for example, (1) the amine compound (a1) and the reactive compound (a2) are reacted in the solvent (first reaction, first reaction and second reaction). (2), the condensation component (a3) and a solvent may be further added and condensed (second reaction). (2) The amine compound (a1) and the reactive compound ( a2) is reacted (first reaction, first reaction and second reaction), and further condensed by adding a solvent (second reaction), and then condensed component (a3) (and if necessary) Further, a solvent) may be added for condensation (second reaction).

  In the condensation reaction, the solvent to be newly added is not particularly limited as long as it is a solvent capable of hydrolyzing the reactive compound (a2) or the condensation component (a3). For example, water, alcohols (the above examples such as methanol) Alcohol). These solvents may be used alone or in combination of two or more.

  The amount of solvent used in the reaction (bond formation reaction, condensation reaction) is, for example, 100 parts by weight of the total amount of the constituent components of the barrier layer (amine compound (a1), reaction compound (a2), condensation component (a3), etc.) Can be selected from the range of 10 to 3000 parts by weight, for example, 30 to 2000 parts by weight, preferably 50 to 1500 parts by weight (for example, 80 to 1000 parts by weight), and more preferably 90 to 900 parts by weight. It may be about (for example, 100 to 800 parts by weight).

  The reaction (bond formation reaction, condensation reaction) may be performed at room temperature or under heating, or may be performed in air or under an inert atmosphere.

  The reaction product (A) may be prepared by referring to the methods described in JP-A Nos. 8-295848 and 2003-128121.

  The barrier layer contains, as a resin component, a conventional gas barrier resin (for example, a chlorine resin such as a vinylidene chloride copolymer, a vinyl alcohol polymer such as an ethylene-vinyl alcohol copolymer or polyvinyl alcohol). May be. In the present invention, usually, even if the barrier layer does not contain such a conventional gas barrier resin (particularly, vinylidene chloride resin) as a resin component, the gas barrier property can be improved at a high level efficiently.

  Moreover, the barrier layer may contain the same additive as the said base film, if necessary. In particular, the antistatic agent can efficiently prevent charging of the laminated film, and can prevent the molding efficiency of the laminated film and various electrostatic disturbances (such as peeling charging). As the antistatic agent, a conventional antistatic agent (surfactant) can be used, and any of nonionic, anionic, cationic and amphoteric antistatic agents (surfactants) may be used.

  Furthermore, the barrier layer includes an antifoaming agent, a viscosity modifier, an antiseptic, an acrylic resin (polyacrylic acid, etc.), a cellulose resin [alkyl cellulose (eg, methylcellulose), hydroxyalkylcellulose (eg, hydroxymethylcellulose, hydroxyethylcellulose), Cellulose ethers such as carboxymethyl cellulose], polysaccharides or derivatives thereof (starch, amylose, amylopectin, pullulan, curdlan, xanthan, chitin, chitosan, etc.), water-soluble polymers, curing agents or curing catalysts, etc. May be.

  The thickness of the barrier layer (thickness after drying) can be selected from the range of about 0.01 to 20 μm (for example, 0.1 to 10 μm), for example, 0.2 to 5 μm, preferably 0.3 to 3 μm, and more preferably. May be about 0.5 to 2 μm.

[Heat seal layer]
The laminated film of the present invention may further form a heat seal layer in order to easily form a bag. Such a heat seal layer may be formed on the barrier layer, may be formed on the other surface (the surface where the inorganic layer is not formed) of the base film, or a combination thereof. When forming a heat seal layer, usually, a heat seal layer is often formed at least on the barrier layer.

  Examples of the polymer (or sealant) constituting the heat seal layer include heat bondable polymers (heat seal polymers) such as olefin polymers, vinyl acetate-vinyl chloride copolymers, polyesters, polyamides, rubber polymers, and the like. It is done. These heat bondable polymers can be used alone or in combination of two or more.

  Examples of the heat-sealable olefin polymer include polyethylene such as low density polyethylene and linear low density polyethylene, ethylene-butene-1 copolymer, ethylene- (4-methylpentene-1) copolymer, ethylene- Hexene-1 copolymer, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylate copolymer, ionomer, polypropylene, propylene-butene-1 copolymer, ethylene -Propylene copolymer, ethylene-propylene-butene-1 copolymer, ethylene-propylene-diene copolymer, modified polyolefin such as maleic anhydride-modified polyethylene and maleic anhydride-modified polypropylene. Preferred olefin-based polymers include polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, amorphous polyolefin (for example, amorphous polypropylene), ethylene-propylene copolymer, and the like. When the heat seal layer is formed by laminating, preferred heat-bonding polymers (films) include unstretched polypropylene films, unstretched ethylene-propylene copolymer films, and the like.

  The heat-sealable polyester includes an amorphous polyester, for example, an aliphatic diol, at least one dicarboxylic acid selected from an aliphatic dicarboxylic acid and an asymmetric aromatic dicarboxylic acid (such as isophthalic acid), and a symmetric structure as necessary. Aliphatic polyesters containing aromatic dicarboxylic acids (such as terephthalic acid) as constituent components are included. Examples of the heat-sealable polyamide include nylon 11, nylon 12, nylon 6/12, and the like. Examples of the rubber-based polymer include butyl rubber, isobutylene rubber, chloroprene rubber, styrene-acrylonitrile copolymer, styrene-butadiene copolymer, styrene-acrylonitrile-butadiene copolymer, and the like.

  The thickness of the heat seal layer can be appropriately selected, for example, in the range of about 3 to 100 μm, depending on the use of the laminated film. When the heat seal layer is formed by laminating the film, for example, 20 to 100 μm, Preferably, it may be about 30 to 80 μm.

  The heat seal layer may be formed on a predetermined part of the surface of the barrier layer, for example, a part used for heat sealing, but is often formed on the entire surface of the barrier layer. Moreover, you may form a heat seal layer in the heat seal site | part of the other surface of the base film layer, or the whole as mentioned above. In addition, the heat seal layer may contain the additive as necessary.

[Laminated film]
As described above, the laminated film of the present invention can be composed of a base film, an inorganic layer, a barrier layer, and, if necessary, a heat seal layer. ing. The laminated film forms an anchor coat layer (adhesive layer) between the inorganic layer and the barrier layer, between the barrier layer and the heat seal layer, or between the base film and the heat seal layer. May be. In the present invention, each layer (inorganic layer, barrier layer, heat seal layer) can be directly formed without using such an anchor coat layer. In particular, at least the barrier layer (or barrier coating layer) is an inorganic layer. Often formed directly on. The total thickness of the laminated film may be, for example, about 5 to 300 μm, preferably 10 to 200 μm, and more preferably about 15 to 100 μm (for example, 20 to 80 μm).

  In addition, as an adhesive component (for example, adhesive resin) that constitutes an adhesive layer (for example, an adhesive layer between the barrier layer and the heat seal layer), for example, a urethane-based resin (such as an isocyanate group-containing polymer), Examples include imino group-containing polymers (polyalkyleneimines such as polyethyleneimine), polyester resins, olefin resins (modified polyolefins such as ethylene- (meth) acrylic acid copolymers), rubber adhesives, and the like. These adhesive components can be used alone or in combination of two or more. The thickness of the adhesive layer may be about 0.01 to 10 μm, preferably about 0.3 to 7 μm, and more preferably about 0.5 to 5 μm.

The laminated film (gas barrier laminate film) of the present invention is excellent in gas barrier properties (or fragrance retention). For example, the oxygen permeability (unit: ml / m ² · day · MPa) in an atmosphere of 20 ° C. and 90% humidity is 10 or less (for example, 0.1 to 9), preferably 9 or less (for example, 0 3 to 7), more preferably 8 or less (for example, 0.5 to 6.5), and particularly about 0.8 to 5.5 (for example, 1 to 4.5). The laminated film of the present invention is also excellent in water vapor barrier properties under high humidity. For example, the water vapor permeability (unit: g / m ² · day) in a temperature 40 ° C. and humidity 90% RH atmosphere is 1 or less. (E.g., about 0.01 to 0.8), 0.7 or less (e.g., about 0.02 to 0.65), preferably 0.6 or less (e.g., 0.03 to 0. 0). About 55), more preferably about 0.05 to 0.45 (for example, 0.08 to 0.40), particularly about 0.08 to 0.4 (for example, 0.15 to 0.3).

As described above, the laminated film of the present invention maintains a high gas barrier property (oxygen barrier property, water vapor barrier property) even after treatment (heat treatment) at a high temperature such as boil treatment or retort treatment. For example, the oxygen permeability (unit ml / m ² · day · MPa) after the laminated film of the present invention is retorted at 120 ° C. for 30 minutes is in the range of 20 or less (for example, 0.1 to 20). For example, 18 or less (for example, 0.3 to 16), preferably 15 or less (for example, 0.5 to 12), more preferably 10 or less (for example, 1 to 10), particularly 1 to 8 (for example, 1.5-6). Moreover, the water vapor permeability (unit: g / m ² · day) after retorting the laminated film of the present invention for 30 minutes at a temperature of 120 ° C. is within a range of 3 or less (for example, 0.01 to 2.5). For example, 2 or less (for example, about 0.03 to 1.9), preferably 1.8 or less (for example, about 0.05 to 1.7), more preferably 1.7 or less (for example, 0 0.08 to 1.6), particularly 0.1 to 1.1 (for example, 0.15 to 0.7), and the water vapor barrier property after heat treatment is very excellent.

Thus, the laminated film of the present invention can maintain gas barrier properties at a high level even after being processed at a high temperature. For example, the oxygen permeability before retorting at 120 ° C. for 30 minutes (unit: ml / ml). m ² · day · MPa) and oxygen permeability after retorting at 120 ° C. for 30 minutes (unit: ml / m ² · day · MPa) [that is, (oxygen permeability before the treatment) − (Oxygen permeability after the treatment)] (or absolute value thereof) is 0 to 10, preferably 0.1 to 8 (for example, 0.2 to 7), more preferably 0.2 to 5 (for example, 0.3 to 3), particularly about 0.3 to 2 (for example, 0.3 to 1.5). In the laminated film of the present invention, the water vapor permeability before retorting at 120 ° C. for 30 minutes (unit g / m ² · day) and the water vapor permeability after retorting at 120 ° C. for 30 minutes (units) g / m ² · day) [ie (water vapor permeability before the treatment) − (water vapor permeability after the treatment)] (or its absolute value) is 0 to 6 (for example, 0.01 To 5), for example, 0.02 to 3, preferably 0.03 to 2 (for example, 0.03 to 1.8), more preferably 0.05 to 1.5 (for example, 0). 0.07 to 1.3), particularly about 0.08 to 1 (for example, 0.08 to 0.5).

  The laminated film is also excellent in transparency. For example, the haze is 10% or less (for example, 1 to 10%), preferably 9% or less (for example, 1 to 9%), and more preferably 8% or less ( For example, it is about 1 to 8%).

  The laminated film of the present invention has various coating layers and laminate layers, such as a slipping layer, an antistatic layer, a decorative printing film layer, and a reinforcing layer made of nylon film, depending on the type and use of the film. In addition, an ultraviolet blocking layer (for example, a UV blocking coating layer described in JP-A-2003-128121) may be formed.

[Production method of laminated film]
In the laminated film (gas barrier laminated film) of the present invention, the inorganic layer is formed on at least one surface of the base film, the barrier layer is formed on the inorganic layer, and the barrier layer ( And / or the other surface of the substrate film).

  The inorganic layer may be formed by a conventional method such as a physical method (vacuum deposition method, reactive deposition method, sputtering method, reactive sputtering method, ion plating method, reactive ion plating method, etc.), chemical method (CVD The surface of the base film can be formed by covering the surface with the inorganic material by a method such as a plasma CVD method or a laser CVD method. The inorganic layer is often formed by a physical method such as vapor deposition, and the inorganic layer can be formed on one side or both sides of the base film layer.

  The barrier layer is the inorganic layer of the composite film formed as described above (that is, the inorganic layer of the composite film composed of the base film and the inorganic layer formed on at least one surface of the base film) Layer). The barrier layer (barrier coating layer) is usually directly formed on at least one surface of the base film directly without forming an anchor coat layer or the like, and the reaction product (A) [and as necessary. It can be formed by applying a coating liquid (coating liquid) containing other components (such as additives)]. By applying such a coating solution, the gas barrier property can be improved more efficiently than when forming an inorganic layer on the barrier layer or laminating the barrier layer of the inorganic layer. In addition to the adhesiveness of the barrier layer, the adhesiveness (or adhesiveness) of the inorganic layer to the base film can be significantly improved. In addition, when such a coating solution is coated, it is possible to efficiently prevent the gas barrier property from being lowered even if mechanical external force or the like is applied due to high adhesion (and flexibility). Therefore, gas barrier properties can be maintained over a long period even after high temperature treatment.

  The coating solution may be prepared by selecting an appropriate solvent according to the type of the reaction product (A). The solvent (such as methanol) used in the preparation of the reaction product (A) and the above A preparation liquid containing the reaction product (A) may be used as it is as a coating liquid. Such a coating liquid may be in the form of either a solution or a dispersion.

  The coating method of the coating solution is not particularly limited as long as cracks and defects are not generated in the inorganic layer, and conventional methods such as a roll coating method, a dip coating method, a bar coating method, a nozzle coating method, a die coating method, and a spray coating are used. Various printing methods such as a method, a spin coating method, a curtain coating method, a flow coating method, screen printing, gravure printing, and curved surface printing, or a combination of these can be employed.

  And after apply | coating the said coating liquid, you may form a barrier coating layer by drying at suitable temperature (For example, 50-150 degreeC, Preferably about 80-120 degreeC), for example. In addition, after the barrier layer is formed, a predetermined time [for example, about 12 hours or more (for example, about 1 to 20 days) at a predetermined temperature (for example, about 35 to 80 ° C., preferably about 45 to 75 ° C.), preferably 3 Aging may be performed over a period of days (for example, about 3 to 15 days), more preferably 4 days or more (for example, about 5 to 10 days)].

  In addition, the surface of the barrier layer may be subjected to the conventional surface treatment exemplified in the section of the base film, if necessary, regardless of the presence or absence of the heat seal layer, and the portion without performing the surface treatment. The adhesive layer or the protective layer may be formed on the target or the entire surface. Such an adhesive layer or protective layer can be formed by a conventional method (for example, a coating method), and when formed by a coating method, drying or aging treatment may be performed in the same manner as described above.

  The heat seal layer can be formed by a conventional method such as a dry laminating method, an extrusion laminating method, or a coating method according to the kind of the heat bondable polymer (sealant). When the heat seal layer is formed on the other surface of the base film, the heat seal layer can be formed after the adhesive layer is formed on the base film by the same method as described above.

  As described above, the laminated film (packaging material) of the present invention has a high gas barrier property and maintains (or maintains) a high gas barrier property even after heat treatment such as retort or boiling. Also excellent in properties. Moreover, since the laminated film (base film, barrier layer, and heat seal layer) of the present invention can be composed of a non-chlorine resin, it does not pollute the environment even if it is discarded as combustible waste. Therefore, laminated film is a variety of packaging materials such as food for microwave oven, retort food, frozen food, microwave sterilization (packaging material for microwave sterilization), flavor barrier (packaging material for flavor barrier), pharmaceuticals, precision electronic parts, etc. It can be suitably used as a forming material for balloons such as balloons. In addition, when food is packaged, the contents can be stored for a long period of time while suppressing deterioration and alteration.

  Although the form of the package (or packaging bag) using the laminated film of the present invention is not particularly limited, for example, a solid packaging bag such as hamburger, shumai, gyoza, and liquid products such as curry, soup, coffee, and tea It can be used as a packaging bag. A packaging bag containing these foods can be retorted or heated in a microwave oven as it is. Further, by using it as an inner bag of a paper container such as a sake pack, the contents can be heated by microwave heating or the like.

  In addition, the packaging form of the packaging material of the present invention includes bags, cups, tubes, standing bags, trays and other containers, lid materials, and paper packs containing sake, soy sauce, mirin, oil, milk, juice, etc. An adhesive material etc. are mentioned.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

Example 1
Polyethyleneimine (Nippon Shokubai Co., Ltd., “Epomin SP-018”) 2.6 kg, γ-glycidoxypropyltrimethoxysilane (3-glycidyloxypropyltrimethoxysilane) 2.3 g, and methanol 54 kg were mixed, The mixture was reacted at 60 ° C. under a nitrogen atmosphere for 3 hours and cooled to room temperature. Next, a mixed liquid of 1.0 kg of water and 5.4 kg of methanol was added to the reaction solution and reacted for 30 minutes, and further an oligomer of tetramethoxysilane (manufactured by Tama Chemical Industry Co., Ltd., “M silicate 51”) 11. A mixed solution of 3 kg and 24 kg of methanol was added and reacted at room temperature for 24 hours to prepare a coating solution.

The obtained coating solution was coated with a metal vapor deposition film using a wire bar at three coating amounts of 0.3 g / m ² , 0.6 g / m ² and 0.9 g / m ² (dry weight), respectively. After coating on (silica-based vapor-deposited polyethylene terephthalate film, manufactured by Mitsubishi Resin Co., Ltd., “Tech Barrier T”, 12 μm) and drying at 100 ° C. for 10 seconds, a barrier layer was formed. And the metal vapor deposition film in which this barrier layer was formed was sealed in the aluminum (Al) bag, and was aged at 100 degreeC for 4 days.

Furthermore, on the surface of these barrier layers, a urethane-based adhesive [manufactured by Toyo Morton Co., Ltd., “TM-250HV” (retort grade)] was applied at a thickness of 2.3 g / m ² (dry weight), After drying at 80 ° C. for 30 seconds and aging treatment at 40 ° C. for 24 hours, an unstretched polypropylene film (Toyobo Co., Ltd., “Pyrene P1153”, 50 μm) is dry-laminated to form a packaging film (barrier layer thickness) Three types of packaging films) with different sizes were prepared.

(Example 2)
In Example 1, a packaging film was produced in the same manner as in Example 1 except that a silica-based vapor-deposited polyethylene terephthalate film (Mitsubishi Resin Co., Ltd., “Techbarrier V”, 12 μm) was used as the metal vapor-deposited film. did.

(Example 3)
In Example 1, a packaging film was obtained in the same manner as in Example 1 except that a silica-based vapor-deposited polyethylene terephthalate film (Oike Industry Co., Ltd., “MOS-TB”, 12 μm) was used as the metal vapor-deposited film. Produced.

Example 4
In Example 1, a packaging film was prepared in the same manner as in Example 1 except that a silica-alumina-based vapor-deposited polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., “Ecosia VE100”, 12 μm) was used as the metal vapor-deposited film. Produced.

(Comparative Example 1)
In Example 1, a packaging film was prepared in the same manner as in Example 1 except that an alumina-based vapor-deposited polyethylene terephthalate film (manufactured by Toyo Metallizing Co., Ltd., “Barrier Rocks 1011HG”, 12 μm) was used as the metal vapor-deposited film. Produced.

The water vapor permeability (unit: g / m ² · day) and oxygen permeability (unit: ml / m ² · day · MPa) of the obtained packaging film were measured by the following methods before and after the retort treatment, respectively. . The packaging film was subjected to a retort treatment at a temperature of 120 ° C. for 30 minutes using a sterilizer (manufactured by Ashida, first type pressure vessel). The water vapor permeability and oxygen permeability after retorting were measured after cooling the retort-treated packaging film with water (water similar to room temperature) for 5 minutes.

  Further, for comparison, the water vapor permeability and the oxygen permeability of the metal vapor deposition film alone (base paper) used in Examples and Comparative Examples were also measured.

[Water vapor transmission rate (WV-TR)]
The water vapor transmission rate (water vapor transmission rate) was measured using a water vapor transmission rate measuring device ("PERMATRAN-W MODEL 3/33" manufactured by MOCON). The measurement conditions are 40 ° C. and relative humidity 90% RH.

[Oxygen permeability (O2-TR)]
In accordance with ASTM D-3985, oxygen permeability (oxygen permeability) was measured using an oxygen permeability measuring device (“OX-TRAN 2/20 SH MODULE” manufactured by MOCON). The measurement conditions are 20 ° C. and relative humidity 90% RH.

  These results are shown in Table 1. In Table 1, “coated product” means a packaging film obtained in Examples and Comparative Examples, and “base paper” means a metal vapor deposition film used in Examples and Comparative Examples.

  As is apparent from the results in Table 1, the packaging films of the examples have high gas barrier properties (water vapor barrier properties and oxygen barrier properties, particularly water vapor barrier properties), and even when subjected to boiling (retort) treatment, the gas barrier properties. Can be maintained at a high level.

Claims (14)

  A laminated film comprising a base film, an inorganic layer formed on at least one surface of the base film, and a barrier layer formed on the inorganic layer, wherein the inorganic layer includes at least a silicon component And the barrier layer is a reaction product (A) of (a1) a compound having an amino group and (a2) a compound having a functional group capable of reacting with the amino group of the compound (a1) (A) A laminated film composed of   The laminated film according to claim 1, wherein the base film is composed of a polypropylene resin, a polyester resin, or a polyamide resin.   The laminated film according to claim 1, wherein the base film is a polyethylene terephthalate film.   The laminated film according to claim 1, wherein the inorganic layer has transparency and is composed of at least a silicon oxide.   The reaction product (A) comprises at least a condensation component of (a1) a compound having an amino group and (a2) an organometallic compound having a functional group capable of reacting with the amino group of this compound and a hydrolytic condensable group. The laminated film according to claim 1, which is a condensate.   The laminated film according to claim 5, wherein the compound (a1) is composed of a polyalkyleneimine and the compound (a2) is composed of an alkoxysilane having an epoxy group.   6. The laminated film according to claim 5, wherein the condensate is a condensate further comprising (a3) an organosilicon compound that is non-reactive with the amino group of the compound (a1).   The laminated film according to claim 7, wherein the organosilicon compound (a3) is tetraalkoxysilane and / or a condensate thereof. A base film composed of a polyester-based resin or a polyamide-based resin and stretched; and an inorganic layer having transparency formed on at least one surface of the base film and composed of at least a silicon oxide; A laminated film comprising a barrier layer directly formed on the inorganic layer, wherein the barrier layer comprises (a1) a polyalkyleneimine, (a2) an alkoxysilane having an epoxy group, and (a3) tetra The laminated film according to claim 1, wherein the laminated film is formed of a condensate containing a C _1-4 alkoxysilane and / or a condensate thereof as a condensing component.   The laminated film according to claim 1, wherein a heat seal layer is further formed on the barrier layer. The laminated film according to claim 1, wherein the oxygen permeability after retorting at 120 ° C for 30 minutes is 20 ml / m ² · day · MPa or less. The laminated film according to claim 1, wherein the water vapor permeability after retorting at 120 ° C for 30 minutes is 2 g / m ² · day or less. The oxygen permeability after retorting at 120 ° C. for 30 minutes is 10 ml / m ² · day · MPa or less, and the water vapor permeability after retorting at 120 ° C. for 30 minutes is 1.7 g / m ^2. The laminated film according to claim 1, which is not more than day.   (A1) a compound having an amino group in the inorganic layer of the composite film formed of a base film and an inorganic layer formed on at least one surface of the base film and configured with at least a silicon component; (A2) The method for producing a laminated film according to claim 1, wherein a coating liquid containing a reaction product (A) with a compound having a functional group capable of reacting with the amino group of the compound (a1) is applied.