JP2006041287A - Package for containing electronic component and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for containing an electronic component in which heat generated from the electronic component can be dissipated well to the outside or into the atmosphere, and the electronic component can be bonded rigidly to a heat dissipating member, and to provide an electronic device using the same. <P>SOLUTION: The package 8 for containing an electronic component comprises a planar heat dissipating member 1 having a part 10 for mounting the electronic component 11 on the upper surface, and a frame 5 having a plurality of wiring conductors 6 and fixed onto the upper surface of the heat dissipating member 1 while surrounding the mounting part 10. The heat dissipating member 1 is embedded, from the upper surface to the lower surface in the central part of a frame-like substrate 2, with a through metallic body 3 of copper or an alloy principally comprising copper such that a protrusion 3a provided in the center of the upper surface protrudes from the upper surface of the substrate 2, and a copper layer 4 is formed to cover the upper and lower surfaces of the substrate 2, the lower of the through metallic body 3 and the upper surface of the through metallic body 3 excepting the protrusion 3a. Heat generated from the electronic component can be dissipated well by the through metallic body 3 and the copper layer 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component storage package for storing an electronic component such as a semiconductor element, which has a heat dissipation structure with good heat dissipation characteristics, and an electronic device using the same.

  Conventionally, electronic component storage packages for storing electronic components such as semiconductor elements, piezoelectric vibrators, and light emitting elements are generally made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, and a glass ceramic. It consists of a frame and a heat dissipating member for dissipating heat generated during operation of the electronic component to the outside or the atmosphere, and surrounds the electronic component mounting portion on the upper surface of the heat dissipating member. A plurality of wiring conductors made of tungsten, molybdenum, manganese, copper, silver, etc. are attached to the frame from the inside to the outside of the recesses formed by the frame and the heat dissipation member. Has been derived.

  Then, the electronic component is bonded and fixed to the mounting portion on the upper surface of the heat radiating member via an adhesive such as glass, resin, or brazing material, and each electrode of the electronic component is electrically connected to the wiring conductor via a bonding wire. After that, the lid body is joined to the frame body through a sealing material made of glass, resin, brazing material, etc., and the electronic component is accommodated in the container composed of the heat radiation member, the frame body, and the lid body. As a result, it becomes an electronic device as a product.

  As a specific electronic device, as shown in FIG. 4, second metal materials 104 a and 104 b having higher thermal conductivity than the first metal material 102 are brazed and joined to the upper and lower surfaces of the first metal material 102. In addition, a through hole is formed in the first metal material 102 almost directly below the electronic component 111 mounted on the upper surface of the second metal material 104a, and heat conduction is higher in the through hole than in the first metal material 102. The metal heat sink 101 into which the high-efficiency third metal material 103 is inserted, and the electronic component 111 is mounted on the upper surface of the metal heat sink 101, and is mounted on the upper surface of the metal heat sink 101 so as to surround the electronic component 111 There has been proposed an electronic device 114 that includes the frame body 105 and a lid body placed on the upper surface of the frame body 105 (see, for example, Patent Document 1).

  The first metal material 102 of the electronic device 114 is made of molybdenum, tungsten, iron alloy or the like, the second metal materials 104a and 104b are made of copper or the like, and the third metal material 103 is copper, silver, aluminum or diamond. Etc.

Due to the approximate thermal conductivity of the first metal material 102 and the frame 105 and the electronic component 111, the frame 105 joined to the metal radiator 101 is cracked or the metal radiator 101 is warped. Thus, an electronic device 114 having good heat dissipation can be obtained.
Japanese Patent No. 3333682

  However, in the electronic device described above, the second metal material 104a and the third metal material 103 are formed so that the metal radiator 101 protrudes downward due to a difference in thermal expansion between the first metal material 102 and the frame 105. Since the third metal material 103 tends to be deformed so as to be warped, and particularly the third metal material 103 tends to extend in the through hole of the first metal material 102, the third metal material 103 is large so as to protrude upward and downward from the through hole. Due to the deformation, the metal heat dissipating body 101 may be greatly deformed, and it is difficult to flatten the mounting portion of the electronic component 111. For this reason, the electronic component 111 is easily peeled off from the mounting portion.

  As a result, the electronic component 111 cannot be firmly bonded to the heat radiating member 101, and the heat generated during the operation of the electronic component 111 cannot be dissipated well through the heat radiating member 101. There is a problem that the electronic component 111 cannot be operated normally due to a rise or thermal stress due to a difference in thermal expansion from the heat radiating member 101 to the electronic component 111, resulting in damage such as a crack. was there.

  The present invention has been devised in view of the above-described problems in the prior art, and its purpose is to firmly bond an electronic component to a heat radiating member, and to improve the heat generated by the electronic component to the outside or the atmosphere. An object of the present invention is to provide an electronic component storage package that can be dissipated and an electronic device using the same.

  The electronic component storage package of the present invention includes a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface that is attached to the upper surface of the heat radiating member so as to surround the mounting portion. A through metal body made of copper or an alloy containing copper as a main component from the upper surface to the lower surface of the central portion of the frame-shaped base body. Is embedded in such a manner that a protruding portion provided at the center of the upper surface protrudes from the upper surface of the base body, and excluding the upper and lower surfaces of the base body, the lower surface of the penetrating metal body, and the upper surface of the protruding portion. A copper layer is formed so as to cover the upper surface of the metal body.

  In the electronic component storage package of the present invention, preferably, the through metal body contains ceramic powder in the above configuration.

  The electronic component storage package according to the present invention is preferably configured as described above, wherein the base has a side metal layer attached to a side surface.

  The electronic device according to the present invention includes the electronic component storage package according to the present invention, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the upper surface of the frame. A lid attached to cover the electronic component or a sealing resin filled to cover the electronic component is provided inside the frame.

  According to the electronic component storage package of the present invention, a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface to an outer surface attached to the upper surface of the heat radiating member so as to surround the mounting portion. The heat dissipation member is a through metal body made of copper or an alloy containing copper as a main component from the upper surface to the lower surface of the central portion of the frame-shaped base body. A protrusion provided at the center of the upper surface is embedded so as to protrude from the upper surface of the base, and covers the upper and lower surfaces of the base, the lower surface of the through metal body, and the upper surface of the through metal body excluding the upper surface of the protrusion. Since the copper layer is formed in this way, the protruding part of the penetrating metal body becomes the mounting part of the electronic component, and the protruding part protrudes from the base and is not restrained by the base and is not easily affected by the difference in thermal expansion with the base. The electronic component mounting area It can be such things. Therefore, the electronic component is not peeled off from the mounting portion, and strong bonding is maintained.

  In addition, the through metal body has a shape in which the width of the remaining portion excluding the projecting portion below the through metal body is wider than the width of the projecting portion provided in the center portion of the upper surface and has a large volume. It is possible to quickly dissipate below the penetrating metal body and dissipate from the lower surface of the penetrating metal body to the large-area copper layer formed on the lower surface of the substrate. As a result, the heat generated by the electronic component can be dissipated very well to the outside or the atmosphere, and an electronic component storage package that can operate the electronic component normally and stably over a long period of time can be obtained.

  In the electronic component storage package of the present invention, preferably, the through metal body contains ceramic powder, so that the rigidity of the through metal body is increased and the thermal expansion coefficient of the through metal body is the heat of the base body or the frame body. It is possible to suppress the deformation of the electronic component storage package due to the difference in thermal expansion between the penetrating metal body and the base body or the frame body, approaching the expansion coefficient. Further, since the thermal expansion coefficient approximates the thermal expansion coefficient of the electronic component, it is possible to maintain a strong bond with the electronic component above the penetrating metal body. As a result, the electronic component can be firmly bonded to the mounting portion of the heat dissipation member, and the heat generated by the electronic component can be dissipated well to the outside and the atmosphere, and the base and frame are not deformed and the sealing performance is good In addition, it is possible to provide an electronic component storage package that can operate the electronic component normally and stably over a long period of time.

  In the electronic component storage package of the present invention, preferably, the base has a side metal layer attached to the side surface, so that the center of the copper layer formed on the upper surface of the heat dissipation member out of the heat generated from the electronic component. The heat transferred from the outer part to the outer peripheral part can be conducted to the lower surface side of the heat radiating member on the side surface of the base to dissipate it, and the temperature difference between the central part and the outer peripheral part of the copper layer on the upper surface side can be increased. The heat conduction of the copper layer on the upper surface side can be performed efficiently. Then, by placing and fixing the heat radiating member on the external electric circuit board or the like, the heat generated from the electronic component can be efficiently dissipated to the external electric circuit board or the like on the lower surface of the heat radiating member. As a result, the electronic component can be efficiently cooled and can be operated normally and stably over a long period of time.

  An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on a mounting portion and having an electrode electrically connected to a wiring conductor, and an electronic component covered on an upper surface of a frame. And a sealing resin filled so as to cover the electronic component on the inside of the lid or frame attached to the electronic component storage package. It is possible to provide an electronic device that has the features described above and that allows electronic components to operate stably over a long period of time.

Next, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package and an electronic device using the same according to the present invention, wherein 1 is a heat radiating member having a mounting portion 10 for an electronic component 11 at the center of the upper surface, 2 is a frame-shaped substrate of the heat dissipation member 1, 3 is a through metal body embedded from the upper surface to the lower surface of the central portion of the frame-shaped substrate 2, and 3 a is a protrusion provided at the center of the upper surface of the through metal body 3. 4 is a copper layer formed so as to cover the upper and lower surfaces of the substrate 2, the lower surface of the through metal body 3, and the upper surface of the through metal body 3 excluding the protrusion 3 a (4 a is a copper layer on the upper surface side, 4 b is the lower surface side) 5 is a frame body attached to the upper surface of the heat radiating member 1 so as to surround the mounting portion 10, and 6 is a plurality of wiring conductors led out from the inner surface of the frame body 5 to the outer surface.

  The heat radiation member 1 and the frame 5 constitute an electronic component storage package 8 for storing the electronic component 11. Further, after mounting the electronic component 11 on the mounting portion 10 of the heat radiating member 1 and electrically connecting the electrode of the electronic component 11 to the wiring conductor 6, the electronic component is placed in the recess 5 a formed of the heat radiating member 1 and the frame 5. 11 is filled with sealing resin 13 so as to cover 11, or the electronic component 11 is sealed, or a lid (not shown) is attached to the upper surface of the frame 5 so as to cover the electronic component 11. By sealing the electronic component 11, the electronic device 14 of the present invention is configured.

  The frame 5 is made of an aluminum oxide sintered body, a mullite sintered body, glass ceramics or the like, and surrounds the mounting portion 10 on the upper surface of the heat radiating member 1 via a brazing material such as silver brazing or silver-copper brazing. It is attached by bonding and fixing. Note that a brazing metal layer (not shown) may be formed at the joint portion of the frame body 5 with the heat radiating member 1 when this brazing material is bonded and fixed. The frame 5 may be made of metal. In that case, in order to insulate the wiring conductor 6 from the metal constituting the frame 5, the periphery of the wiring conductor 6 is made of an insulator such as ceramics, resin, or glass. Cover it.

  In addition, the heat dissipating member 1 has an electronic component 11 fixed to the mounting portion 10 at the center of the upper surface of the heat dissipating member 1 through an adhesive such as resin, glass, or brazing material. When a brazing material is used as the adhesive, a brazing metal layer (not shown) may be formed on the mounting portion 10 of the electronic component 11 of the heat dissipation member 1. However, when sufficient brazing can be performed by the copper layer 4a bonded to the mounting portion 10 on the upper surface of the heat radiating member 1, a brazing metal layer is not particularly necessary. The adhesive is selected from those adhesives that can realize a thermally and mechanically strong bond between the electronic component 11 and the mounting portion 10.

  If the frame 5 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide. A ceramic green sheet (ceramic green sheet) is formed by using a doctor blade method or a calender roll method, and then appropriately punching the ceramic green sheet. In addition, conductive paste made by mixing an appropriate organic binder and solvent with metal powder such as tungsten, molybdenum, manganese, copper, silver, nickel, palladium, gold, etc. is applied to the green sheet in advance by screen printing etc. After printing and applying to the pattern of the conductor 6, this green sheet is duplicated. Sheet stacked, is produced by firing at a temperature of about 1600 ° C..

  Further, the frame body 5 is formed with a wiring conductor 6 led out from the inner surface of the recess 5a composed of the heat radiating member 1 and the frame body 5 (around the mounting portion 10) to the outer surface of the frame body 5. Each electrode of the electronic component 11 is electrically connected to one end inside the recess 5 a of the conductor 6 through a bonding wire 12. A lead terminal 7 for connection to an external electric circuit board is connected to the other end of the wiring conductor 6 outside the frame body 5.

  The wiring conductor 6 is made of a refractory metal such as tungsten or molybdenum, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent or the like to a metal powder such as tungsten or molybdenum is preliminarily applied to the ceramic green sheet serving as the frame 5. By printing and applying in a predetermined pattern by a screen printing method or the like, the heat radiating member 1 and the frame body 5 are deposited from the inner surface of the recess 5 a to the outer surface of the frame body 5.

  Further, when the wiring conductor 6 is coated with a metal having excellent corrosion resistance such as nickel and gold on the exposed surface and excellent bonding property of the bonding wire 12 to a thickness of 1 to 20 μm by a plating method, the wiring conductor 6 is obtained. As a result, it is possible to effectively prevent the oxidative corrosion of the bonding wire 12 and to strengthen the connection of the bonding wire 12 to the wiring conductor 6. Therefore, it is desirable that the wiring conductor 6 is coated with a metal having excellent corrosion resistance, such as nickel and gold, and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

The heat radiating member 1 of the present invention has a protruding portion 3a in which a penetrating metal body 3 made of copper or an alloy containing copper as a main component is provided at the center of the upper surface from the upper surface to the lower surface of the central portion of the frame-shaped base 2. The copper layer 4a is embedded so as to protrude from the upper surface of the base 2 and covers the upper and lower surfaces of the base 2, the lower surface of the through metal body 3, and the upper surface of the through metal body 3 excluding the upper surface of the protruding portion 3a. , 4b are formed. In the through metal body 3, the width of the protrusion 3 a provided at the center of the upper surface is narrower than the width of the remaining portion 3 b embedded in the base 2 of the through metal body 3. It has a function of conducting heat generated by the operation, dissipating it into the atmosphere, and conducting it to an external heat radiating plate (not shown). Such a heat radiating member 1 is formed, for example, by fitting the through metal body 3 in a through hole formed in the central portion of the base 2 made of a metal plate such as tungsten or molybdenum. At this time, the protruding portion 3 a protrudes from the upper surface of the base 2, and the remaining portion 3 b is fitted into the base 2. And the base | substrate 2 by which the penetration metal body 3 was engage | inserted is mounted on the copper plate used as the copper layer 4b which covers the lower surface of the base | substrate 2 and the lower surface of the penetration metal body 3, and also the upper surface of the penetration metal body 3 except the protrusion part 3a. And a copper plate 4a covering the upper surface of the substrate 2 is placed, and the copper plate, the substrate 2 and the through metal body 3 are brazed and bonded using silver solder, silver-copper solder or the like. The base 2 and the copper layers 4a and 4b are formed by subjecting a metal ingot to conventionally known metal processing such as rolling, punching, and cutting.

The material of the substrate 2 is preferably selected from those having a thermal expansion coefficient close to that of the frame 5 (4 × 10 ^{−6 to} 9 × 10 ⁻⁶ ) and having a good thermal conductivity. Of tungsten (thermal expansion coefficient: about 4.5 × 10 ^-6 , thermal conductivity: about 177 W / m · K), molybdenum (thermal expansion coefficient: about 5 × 10 ^-6 , thermal conductivity: about 139 W / m · K) In addition, for example, copper-tungsten (thermal expansion coefficient: about 7 × 10 ⁻⁶ , thermal conductivity: about 200 W / m · K), copper-molybdenum (thermal expansion coefficient: about 9.1 × 10 ⁻⁶ , thermal conductivity) : About 260 W / m · K), iron (thermal expansion coefficient: about 11.8 × 10 ⁻⁶ , thermal conductivity: about 83.5 W / m · K) can be used.

  In the electronic component storage package 8 including the heat radiating member 1 composed of the base 2, the thermal expansion coefficient of the heat radiating member 1 is silicon, gallium arsenide, which is a constituent material of the semiconductor element as the electronic component 11, or the frame 5. Since the coefficient of thermal expansion is similar to that of the ceramic material used as the constituent material, it is suitable as an electronic component storage package 8 on which a high heat generating semiconductor element such as a power IC or a high frequency transistor is mounted.

  Preferably, first, a tungsten powder or a molybdenum powder having an average particle size of 5 to 40 μm is pressure-molded so that a through hole is formed in a portion to be the mounting portion 10 of the electronic component 11, and this is formed at 1300 to 1600 ° C. In this atmosphere, a porous body having through holes formed from the upper surface to the lower surface is prepared in advance on the mounting portion 10 of the electronic component 11, and the porous body is heated to about 1200 ° C. in a hydrogen atmosphere. By impregnating 10 to 50% by mass of copper, a sintered body made of tungsten or molybdenum is impregnated with copper (made of a matrix of tungsten or molybdenum and copper), and a flat substrate 2 is produced. Further, a through metal body 3 is embedded in the through hole formed in the central portion of the base body 2 from the upper surface to the lower surface of the base body 2, and further, the upper surface of the through metal body 3 excluding the upper surface of the base body 2 and the protrusion 3 a It may be formed by depositing the copper layer 4b so as to cover the copper layer 4a and the lower surface of the substrate 2 and the through metal body 3 so as to cover the surface.

Here, when the base body 2 is formed by impregnating a sintered body made of tungsten or molybdenum with copper, the thermal conductivity is improved as compared with the case where the base body 2 is made of tungsten alone or molybdenum alone, and the heat dissipation characteristics of the heat radiating member 1 are more excellent. It can be Further, the thermal expansion coefficient is 7 × 10 ^{−6 to} 11.5 × 10 ⁻⁶ , which is suitable as a material for the substrate 2. A material obtained by impregnating copper into a tungsten sintered body is called copper-tungsten, and a material obtained by impregnating copper into a molybdenum sintered body is called copper-molybdenum.

  The through metal body 3 is made of copper or an alloy containing copper as a main component, and includes a remaining portion 3 b fitted into the base 2 and a protrusion 3 a protruding from the upper surface of the base 2. Such a through metal body 3 is formed by subjecting a metal ingot to conventionally known metal processing such as rolling, punching, and cutting.

  The upper surface of the protruding portion 3a protrudes upward from the upper surface of the copper layer 4a. The distance from the upper surface of the protruding portion 3a to the base 2 is moderately large, and the upper surface of the protruding portion 3a becomes the copper layer 4a. Since it is not restrained, it is preferable that the mounting part 10 of the electronic component 11 can be made flatter and less likely to be affected by the difference in thermal expansion with the base body 2. The upper surface of the copper layer 4a is preferably projected from 0.05 mm to 0.5 mm. If the height is less than 0.05 mm, the upper surface of the copper layer 4a and the upper surface of the protruding portion 3a are substantially the same surface, and the upper surface of the protruding portion 3a tends to be easily affected by the deformation of the upper surface of the copper layer 4a. If it exceeds 0.5 mm, the amount of protrusion 3a protruding into recess 5a becomes too large, and electronic component storage package 8 tends to be large.

  The penetrating metal body 3 penetrates because the upper surface of the projecting portion 3a becomes the mounting portion 10 for the electronic component 11, and the projecting portion 3a projects from the base body 2 with a smaller area than the remaining portion 3b and is not constrained by the base body 2. It is difficult to be affected by the difference in thermal expansion between the metal body 3 and the base body 2, and the mounting portion 10 of the electronic component 11 can be flat without warping. Therefore, the electronic component 11 is not peeled off from the mounting portion 10 and strong bonding is maintained.

  Further, since the remaining portion 3b of the through metal body 3 is wider than the width of the protruding portion 3a and its volume is larger than the volume of the protruding portion 3a, the heat generated by the electronic component 11 is transferred to the remaining portion 3b of the through metal body 3. It is possible to dissipate quickly, and dissipate from the remaining portion 3b of the penetrating metal body 3 to the copper layer 4b having a large area formed on the lower surface of the base 2. As a result, the heat generated by the electronic component 11 can be dissipated very well to the outside or the atmosphere, and the electronic component 11 can be operated normally and stably over a long period of time.

  The width of the remaining portion 3b of the penetrating metal body 3 is preferably greater than twice the thickness T of the base 2 than the width of the convex portion 3a (see FIG. 2). As a result, a large amount of heat generated in the electronic component 11 can be transmitted from the mounting portion 10 of the electronic component 11 on the upper surface of the heat radiating member 1 to the lower surface of the heat radiating member 1 and also in the through metal body 3. It becomes possible to give heat spread in a direction parallel to the main surface of the heat dissipation member 1 from the outer periphery to the outside of the electronic component 11, and heat dissipation can be further improved.

  When the width of the remaining portion 3b of the through metal body 3 is larger than twice the thickness T of the base 2 with respect to the width of the convex portion 3a, the thermal expansion of the remaining portion 3b of the through metal body 3 increases and the mounting portion 10 becomes easy to distort. As a result, the electronic component 11 is easily peeled off.

  Preferably, the outer periphery of the protruding portion 3a of the penetrating metal body 3 is not more than the same dimension as the outer periphery of the electronic component 11, and the area of the protruding portion 3a is prevented from becoming too large. Is prevented from becoming too wide and deforming to maintain flatness. In addition, the upper surface of the protruding portion 3 a may be smaller than the outer periphery of the lower surface of the electronic component 11 and may be disposed directly below the heat generating portion of the electronic component 11.

  Preferably, the through metal body 3 contains a ceramic powder in copper or an alloy containing copper as a main component. In this case, the through metal body 3 contains ceramic powder such as alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics or the like in copper or an alloy containing copper as a main component.

  By including the ceramic powder in the through metal body 3, the rigidity of the through metal body 3 is increased, and the thermal expansion coefficient of the through metal body 3 is suppressed from being excessively larger than the thermal expansion coefficients of the base body 2, the frame body 5, and the like. It is possible to reduce the thermal stress due to the difference in thermal expansion between the penetrating metal body 3 and the base body 2 or the frame body 5, thereby suppressing the deformation of the heat radiating member 1 and the like. Therefore, the mounting part 10 of the electronic component 11 can be kept flat, the electronic component 11 is firmly bonded to the heat radiating member 1 and does not peel off, and the heat generated by the electronic component 11 is external to the electronic component storage package 8. It is possible to dissipate well into the atmosphere, and to operate the electronic component 11 normally and stably over a long period of time.

Further, since the through metal body 3 contains ceramic powder, the thermal expansion coefficient of the through metal body 3 is from 18 × 10 ^{−6 to} 20 × 10 ⁻⁶ to 14 × 10 ⁻⁶ to that of copper. It can be lowered to 17 × 10 ⁻⁶ , or can be further lowered as the content of ceramic powder increases, and the thermal expansion coefficient of the penetrating metal body 3 is equal to the thermal expansion coefficient of the electronic component 11 (4 × 10 ^{− 6 to} 6 × 10 ⁻⁶ ), the electronic component 11 above the penetrating metal body 3 is difficult to peel off from the mounting portion 10, and it is possible to maintain strong bonding with the mounting portion 10. As a result, the electronic component 11 can be firmly bonded to the mounting portion 10 of the heat radiating member 1 and the heat generated by the electronic component 11 can be dissipated well to the outside or the atmosphere, and the base body 2 and the frame 5 are deformed. Thus, the electronic component storage package 8 having good sealing performance and capable of operating the electronic component 11 normally and stably over a long period of time can be obtained. The through metal body 3 containing ceramic powder has a thermal conductivity of 320 W / m · K to 360 W / m · K, and can cool the electronic component 11 well.

  For example, when such a penetrating metal body 3 contains alumina ceramics, organic binders, solvents, plasticizers, and dispersants suitable for raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide are used. Etc. are mixed and added to form a granular mixture, and a metal layer is deposited on the surface of the ceramic powder obtained by firing at about 1600 ° C., and then pressed to form a through metal body 3. A ceramic porous body having a predetermined shape is obtained, and thereafter, the ceramic porous body is impregnated with copper or an alloy containing copper as a main component at about 1100 ° C. in a non-oxidizing atmosphere. A substrate 1 containing 5 to 70% by mass of an alloy as a component can be obtained.

  The through metal body 3 containing such a ceramic powder has a structure in which copper is impregnated with a ceramic porous body in which ceramic particles are bonded to each other, and therefore the hardness of the through metal body 3 may be hard. It can be made difficult to deform even if heat is applied to the through metal body 3.

  Alternatively, ceramic powder obtained by firing at about 1600 ° C., metal powder of copper or an alloy containing copper as a main component, an organic binder and a solvent are kneaded, and this is pressure-molded to form a predetermined substrate 1. After obtaining the shape, the organic binder and solvent are thermally decomposed and removed at about 800 ° C. in a non-oxidizing atmosphere, and then copper or copper as a main component at about 1100 ° C. in a non-oxidizing atmosphere By filling the voids formed by melting the alloy to be removed and removing the organic binder and solvent, the base body has a mass ratio of 70 to 99.9% by mass of copper or copper-based alloy as a main component 1 can be obtained.

  The same can be obtained when the penetrating metal body 3 contains other ceramic powder.

  The copper layer 4 is formed by embedding the through metal body 3 in the through hole of the base 2, and then forming a copper plate to be the upper and lower copper layers 4 on the upper and lower surfaces of the base 2 by silver solder, silver-copper solder, gold solder, gold-copper solder. Bonding may be performed by brazing using a brazing material such as, or by ultrasonic bonding. Bonding by ultrasonic bonding is preferable in that it can be bonded to the copper plate to be the base 2 and the copper layer 4 without applying high temperature, and a large difference in thermal expansion is not generated between the base 2 and the copper layer 4. . In addition, the copper layer 4 may be deposited by other methods, such as copper plating on the substrate 2, printing after applying a metal paste containing copper powder, and firing, or tungsten or molybdenum serving as the substrate 2. The sintered body and a predetermined amount of copper are simultaneously heated to melt copper, and the porous sintered body is impregnated with copper by capillary action to obtain tungsten-copper or molybdenum-copper, and at the same time, the substrate 2 penetrates. A method of forming the copper layer 4 on the upper and lower surfaces of the through metal body 3 and the base body 2 in the holes may be used.

  Preferably, in the copper layer 4, the thickness of the copper layer 4 a on the upper surface side, that is, the mounting portion 10 side of the electronic component 11 is preferably thicker than the thickness of the copper layer 4 b on the lower surface side. As a result, the copper layers 4 formed above and below the heat radiating member 1 can transmit more heat generated by the electronic component 11 in the direction parallel to the main surface of the heat radiating member 1, and in particular, the copper layer on the upper surface side. Since 4a is thick, the heat generated from the electronic component 11 can be immediately and well transmitted in both the direction perpendicular to the main surface of the heat radiating member 1 and the direction parallel to it, and the heat dissipation of the electronic component 11 is greatly improved. Can be made. As a result, the electronic component 11 can be operated normally and stably over a long period of time.

  If the thickness of each of the copper layers 4a and 4b is greater than 800 μm, the stress generated due to the difference in thermal expansion between the base 2 and the copper layers 4a and 4b tends to increase, so that sufficient bonding strength cannot be obtained. It is desirable to keep Further, if the thickness of the copper layers 4a and 4b is 50 μm or more, the heat generated by the operation of the electronic component 11 is sufficiently spread in the plane direction of the copper layers 4a and 4b. Therefore, it is desirable to set it to 50 μm or more.

  Preferably, the difference in thickness between the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side of the heat radiating member 1 is 100 μm to 200 μm. As a result, the heat generated from the electronic component 11 is immediately and very well transmitted both in the direction perpendicular to the main surface of the heat radiating member 1 and in the direction parallel to the heat radiation member 1, thereby greatly improving the heat dissipation of the electronic component 11. In addition, even if the heat dissipation member 1 is distorted due to a difference in thermal expansion caused by the difference in thickness between the upper and lower copper layers 4 of the heat dissipation member 1, the heat dissipation member 1 can be well restrained by the frame body 5, The airtight reliability of the component storage package 8 can be maintained satisfactorily.

  Further, the copper layer 4 may be annealed by heating the heat dissipating member 1 to about 780 ° C. By annealing the copper layer 4, the ductility of the copper layer 4 is increased, and the thermal stress caused by the difference in thickness between the upper copper layer 4a and the lower copper layer 4b is reduced. The distortion which arises can be suppressed. In addition, thermal conductivity is hardly impaired by annealing the copper layer 4.

  The arithmetic average roughness Ra of the surface of the copper layer 4b on the lower surface side of the heat radiating member 1, that is, the side opposite to the mounting portion 10 on which the electronic component 11 is mounted, is preferably Ra ≦ 30 (μm). . Usually, the electronic component storage package 8 is connected to a support substrate made of a metal body such as aluminum or copper or a ceramic body having high thermal conductivity by screwing or using a molten metal such as solder or a brazing material. At this time, when the arithmetic average roughness Ra of the lower surface of the copper layer 4b on the lower surface of the base 2 is Ra> 30 (μm), it is difficult to sufficiently bring the electronic component storage package 8 and the support substrate into close contact with each other. As a result, voids and voids are likely to be generated between them, and as a result, there is a possibility that heat generated in the electronic component 11 cannot be efficiently transferred from the electronic component storage package 8 to the support substrate. Therefore, the lower surface, which is the outer surface of the lower copper layer 4b, is preferably a smooth surface with Ra ≦ 30 (μm) so as to obtain good adhesion to the support substrate.

  The material of the copper layer 4 (4a, 4b) bonded to the upper and lower surfaces of the base 2 of the heat radiating member 1 is not limited to pure copper, and has a good thermal conductivity, such as tungsten or Various copper alloys mainly composed of copper may be used as long as sufficient bonding strength can be obtained with the base body 2 which is a matrix of molybdenum and copper. The same applies to the through metal body 3 made of copper.

  Also, the copper layers 4 (4a, 4b) bonded to the upper and lower surfaces of the base 2 of the heat radiating member 1 are formed on the upper and lower surfaces at least in the same area as the bottom surface of the recess 5a made of the heat radiating member 1 and the frame body 5. 1 is sufficient, and it is not always necessary to cover the entire upper and lower surfaces of the heat dissipating member 1 as shown in FIG.

  Preferably, as shown in FIG. 3, the base 2 has a side metal layer 4c attached to the side. With this configuration, the heat transmitted from the central portion of the copper layer 4a formed on the upper surface of the heat dissipation member 1 to the outer peripheral portion of the heat generated from the electronic component 11 is formed on the side surface of the base 2 through the side metal layer 4c. The heat can be conducted to the lower surface side to dissipate heat, and the temperature difference between the central portion and the outer peripheral portion of the copper layer 4a on the upper surface side can be increased, so that the heat conduction of the copper layer 4a on the upper surface side is efficiently performed. Can be made. Then, by placing and fixing the heat radiating member 1 on an external electric circuit board or the like, heat generated from the electronic component 11 can be efficiently dissipated to the external electric circuit board or the like on the lower surface of the heat radiating member 1. As a result, the electronic component 11 can be efficiently cooled and operated normally and stably over a long period of time.

  The side metal layer 4c does not have to be applied over the entire circumference of the side surface of the substrate 2, and the side metal layer 4c in contact with the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side at least partially. It only has to be attached. For example, when the heat radiating member 1 is a quadrangle, the side metal layer 4c in contact with the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side should be attached on at least two side surfaces facing each other. . Even in this configuration, the heat generated from the electronic component 11 can be dissipated sufficiently efficiently from the lower copper layer 4b.

  The side metal layer 4c is preferably made of a material having high thermal conductivity such as copper, silver, or a silver-copper alloy and having excellent heat transfer properties. The side metal layer 4c is attached to the base 2 by the same method as that for the upper surface copper layer 4a and the lower surface copper layer 4b, or the heat radiating member 1 and the frame 5 are bonded and fixed. When the brazing material used is a brazing material such as silver brazing or silver-copper brazing, the brazing material may be realized by brazing the brazing material to the side surface of the base 2. .

  Thus, according to the electronic component storage package 8 described above, the electronic component 11 is bonded and fixed onto the mounting portion 10 of the heat radiating member 1 via an adhesive made of glass, resin, brazing material, and the like. Each electrode is electrically connected to a predetermined wiring conductor 6 via a bonding wire 12, and then an epoxy resin or the like is applied so as to cover the electronic component 11 inside the recess 5a formed of the heat dissipation member 1 and the frame body 5. The electronic component 11 is sealed by filling the sealing resin 13 or the lid made of resin, metal, ceramics or the like is attached to the upper surface of the frame 5 so as to cover the recess 5a. As a result, the electronic device 14 as a product is obtained.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in order to efficiently dissipate the heat generated in the electronic component 11 from the heat radiating member 1 to the atmosphere, the lower surface of the copper layer 4b joined to the lower surface of the base 2 and the through metal body 3 of the heat radiating member 1 is a radiating fin. It may be formed into a shape, or a heat radiating fin may be joined to the copper layer 4b to form a shape in which the heat radiating fin is integrated with the copper layer 4b of the heat radiating member 1. The action of absorbing heat by the heat radiating member 1 and dissipating it into the atmosphere can be further improved.

It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention, and the electronic device of this invention using the same. FIG. 2 is an enlarged plan view of a through metal body of the electronic component storage package of FIG. 1. It is sectional drawing which shows the other example of embodiment of the electronic component storage package of this invention, and the electronic device of this invention using the same. It is sectional drawing of the conventional electronic device.

Explanation of symbols

1: Heat dissipation member 2: Substrate 3: Through metal body 3a: Protruding portion 3b: Remaining portion 4, 4a, 4b: Copper layer 4c: Side metal layer 5: Frame body 6: Wiring conductor 8: Package for storing electronic components
10: Mounted part
11: Electronic components
14: Electronic equipment

Claims (4)

A flat heat dissipation member having an electronic component mounting portion at the center of the upper surface, and a frame having a plurality of wiring conductors led from the inner surface to the outer surface and attached to the upper surface of the heat dissipation member so as to surround the mounting portion The heat radiating member projects from the upper surface to the lower surface of the center portion of the frame-shaped base body, and a through metal body made of copper or a copper-based alloy is provided at the upper surface center portion. The copper is embedded so as to protrude from the upper surface of the base, and covers the upper and lower surfaces of the base, the lower surface of the through metal body, and the upper surface of the through metal body excluding the upper surface of the protrusion. A package for storing electronic parts, wherein a layer is formed. 2. The electronic component storage package according to claim 1, wherein the through metal body contains ceramic powder. 3. The electronic component storage package according to claim 1, wherein a side metal layer is attached to a side surface of the base body. The electronic component storage package according to any one of claims 1 to 3, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an upper surface of the frame body An electronic device comprising: a lid attached to cover the electronic component; or a sealing resin filled inside the frame so as to cover the electronic component.

Images