JP2006040447A - Method for manufacturing slider - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a slider, capable of sufficiently reducing a distance between a thin-film magnetic head and a hard disk while suppressing contact between the thin-film magnetic head and the hard disk. <P>SOLUTION: This method includes the step A of preparing a bar 30 in which a plurality of thin-film magnetic heads 10 are arranged in a row on a conductive substrate, and the step B of wrapping the side face S of the bar 30. Each thin-film magnetic head 10 is provided with reading and writing elements 40 and 60, a cover part 100 for covering them, and first and second heaters 70 and 80. The bar 30 has a first connection line 75 for electrically interconnecting the first heaters 70 of the thin-film magnetic heads 10 in series, and a second connection line 88 for electrically interconnecting the second heaters 80 of the thin-film magnetic heads 10. In the step B, a current is serially conducted to the first heaters 70 through the first connection line 75 to wrap the side face S. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a slider having a thin film magnetic head.

  In the hard disk, the track width of the writing element and the reading element is becoming narrower, and accordingly, further improvement in the writing ability of the writing element and the reading ability of the reading element is required. In order to improve these, the distance between the air bearing surface (Air Bearing Surface) of the slider that floats on the recording medium and the recording medium, in particular, the distance between the exposed portion of the writing element or reading element and the recording medium is sufficient. It is necessary to lower it. Here, the slider has a thin film magnetic head provided on a substrate, and the thin film magnetic head has a writing element, a reading element, and a covering portion covering these elements.

Recently, in order to sufficiently reduce the distance between the air bearing surface of the slider and the recording medium, for example, as described in Patent Documents 1 to 4, the thin film magnetic head is heated. There is known a slider provided with a heater. In such a slider, the heat generation of the heater causes the thin film magnetic head to thermally expand during reading or writing, thereby controlling the distance between the writing element or reading element and the recording medium to be smaller.
JP 2003-168274 A JP 2003-272335 A US Pat. No. 5,991,113 JP 2000-306215 A

  However, in the slider having the above-described heater, when the thin film magnetic head is thermally expanded by the heater, the protruding amount of the portion other than the writing element and the reading element, typically the portion far from the substrate in the covering portion (particularly the covering portion). It has been found that there is a case where the protruding amount of the leading end portion of the recording element is larger than the protruding amount of the writing element or the reading element. If a portion other than the writing element and the reading element of the thin film magnetic head, for example, the tip portion of the covering portion protrudes too much, this portion easily comes into contact with the recording medium. Therefore, it is practically difficult to sufficiently reduce the distance between the writing element or reading element and the recording medium by causing the heater to generate heat.

  The present invention has been made in view of the above problems, and provides a slider manufacturing method capable of sufficiently reducing the distance between the thin film magnetic head and the hard disk while suppressing contact between the thin film magnetic head and the hard disk. It is to be.

  As a result of diligent research by the present inventors, the air bearing surface is formed while the heater of the thin film magnetic head is energized, that is, the side surface of the slider is lapped (polished), whereby the thin film magnetic head is written in advance. It has been found that a portion that is more likely to protrude than a scanning element or a reading element can be selectively removed. As described above, if the portion of the thin film magnetic head that is prone to protrude is removed in advance, even if the thin film magnetic head is heated by the heater during reading or writing, the portion other than the writing element and the reading element remains in the recording medium. And the distance between the writing element or reading element and the recording medium can be sufficiently reduced.

  Therefore, the thin film magnetic head wrapping method according to the present invention comprises a step A for preparing a laminated body in which a plurality of thin film magnetic heads are arranged in a line on a conductive substrate, and a direction in which the thin film magnetic heads are arranged in the laminated body. And B step of wrapping the side surface along the line.

  Here, each thin film magnetic head has a reading element and / or a writing element, a covering for covering the writing element and / or the reading element, and a first heater and a second heater that generate heat when energized. ing.

  The laminated body also includes a first connection line that electrically connects the first heaters of each thin film magnetic head in series, and a first connection line that electrically connects one end of the second heater of each thin film magnetic head and the substrate. Has two connecting lines.

  And in B process which performs lapping, the said side is lapped, supplying an electric current in series with respect to each 1st heater via a 1st connection line.

  According to the present invention, each thin film magnetic head has a first heater and a second heater different from the first heater.

  When the air bearing surface is formed, the first heater is energized. When the first heater generates heat by energization of the first heater, the thin film magnetic head is thermally expanded by heating, and a portion different from the reading element and / or writing element on the side surface along the parallel direction of the thin film magnetic head in the laminated body, typically Specifically, the tip of the covering portion on the side surface (portion farthest from the substrate) protrudes compared to the reading element and / or writing element. Therefore, when this side surface is polished in this state to form the air bearing surface, the portion that protrudes more easily than the reading element and / or the writing element is selectively removed as compared with the other portions. Therefore, when reading or writing with the air bearing surface of the thin film magnetic head facing the hard disk, the second heater is energized to reduce the distance between the reading element or the writing element and the hard disk. Even if the head is heated, the amount of protrusion of portions other than the reading element and the writing element is sufficiently suppressed as compared with the conventional case. Thereby, the reading element and the writing element can be sufficiently protruded and brought close to the hard disk without worrying about the protruding amount of the tip of the covering portion or the like.

  One end of each second heater is electrically connected to the conductive substrate by a second connection line. When writing information to the hard disk or reading information from the hard disk using a slider using a conductive substrate such as Altic, it is necessary to ground the substrate in order to release the charge on the substrate. Conventionally, the slider and a flexure (suspension) that supports the slider are bonded together by silver paste or the like. However, in the present invention, since the one end of the second heater and the substrate are electrically connected, the wiring connected to the one end of the second heater from the outside for energizing the second heater is used for grounding the substrate. Can be shared as. Accordingly, the substrate can be reliably grounded without bonding the substrate and the suspension with the silver paste.

  In the laminate of the present invention, one end of each second heater is electrically connected to the substrate by a second connection line due to the above-described circumstances, while each first heater is serially connected to each other by the first connection line. It is connected. When the thin film magnetic head is heated during lapping, a current is passed in series with the first heater using the first connection line instead of the second heater. As a result, it is possible to equalize the amount of heat generated in each first heater, that is, the amount of expansion of each thin film magnetic head, with the same current flowing through each first heater. Therefore, the polishing amount of each thin film magnetic head can be easily controlled, and a slider having an air bearing surface having a desired shape formed by lapping can be efficiently manufactured.

  When the thin film magnetic head is heated by energizing the second heater instead of the first heater during lapping, it is difficult to accurately control the expansion amount of each thin film magnetic head.

  For example, since one end of each second heater is electrically connected via the substrate and each second connection line, it is difficult to energize each second heater in series. In addition, a third connection line that electrically connects the other ends of the second heaters to the laminate is provided in advance, and a voltage is applied between the second connection line and the third connection line, so that each second heater Although it is conceivable to pass a current in parallel to the heater, the length of the third connection line changes depending on the position of each second heater, and the resistance of each third connection line cannot be ignored. In energization by the method, the voltage applied to each second heater varies. Therefore, it is difficult to control the expansion amount of each thin film magnetic head in the laminate.

  Here, the substrate in the laminate is preferably formed from a sintered body containing alumina and titanium carbide. Such a substrate is particularly suitable as a conductive substrate for forming a thin film magnetic head.

  In the laminate, the first heater and the second heater are preferably provided on the same plane parallel to the surface of the substrate.

  In the laminated body having such a structure, the first heater and the second heater can be simultaneously formed by one photolithography process, and can be manufactured at low cost.

  In the laminate, the first heater is preferably provided at a position closer to the side surface than the second heater.

  When such a laminate is used, when the thin film magnetic head is projected by energizing the first heater during lapping, the tip of the covering portion is projected more with less power than when energizing the second heater. Can do.

  Further, in the thin film magnetic head, the first heater is preferably further away from the substrate than the reading element and the writing element. In such a structure, the front-end | tip part of a coating | coated part can be protruded more efficiently by supplying with electricity to a 1st heater.

  According to the present invention, there is provided a method for manufacturing a slider capable of reducing the distance between a thin film magnetic head and a hard disk while suppressing contact between the thin film magnetic head and the hard disk.

  Hereinafter, a method for manufacturing a slider according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol shall be used for the same element and the overlapping description is abbreviate | omitted.

First, as shown in FIG. 1, a laminated substrate 20 in which a plurality of thin film magnetic heads 10 are formed on a substrate 13 is prepared. This laminated substrate 20 is obtained by providing a large number of thin film magnetic heads 10 in a matrix on a single substrate 13 made of AlTiC, that is, a sintered body containing Al ₂ O ₃ and TiC. As the material of the substrate 13, relative to Al ₂ O ₃ and TiC, further it may include TiO ₂ or MgO or the like, may also be used other than this conductive ceramic material or the like.

  Subsequently, as shown in FIG. 2, the multilayer substrate 20 is cut in the row direction or the column direction of the thin film magnetic head 10 along the dotted line in FIG. 1 to form a plurality of bars (laminates) 30. The bar 30 has a large number of thin film magnetic heads 10 arranged in a row on a rod-shaped substrate 13.

  Subsequently, lapping for adjusting the MR height and the like is performed on the side surface S along the direction in which the thin film magnetic heads 10 are arranged in the bar 30 shown in FIG. The MR height refers to the distance in the depth direction in the read element for reproduction as viewed from the side surface S. By the lapping process, a reading element and a writing element, which will be described later, are exposed on the side surface S, and finally, an air bearing surface (Air Bearing Surface) facing the recording surface of the hard disk is formed.

  In the present embodiment, lapping is performed while energizing a heater (described in detail later) before, during, or during lapping of the side surface S for adjusting MR height and the like. Here, as an example, the case where the side surface S of the bar 30 is wrapped while energizing the heater after the MR height is generally adjusted will be described.

  Here, the bar 30 in a state where the adjustment of the MR height is completed will be described in detail. 3 is a cross-sectional view perpendicular to the length direction of the bar 4, FIG. 4 is a top view of the bar 30, and FIG. 5 is a partially cutaway view of the bar 30 viewed from the IV direction of FIG.

  As described above, the bar 30 has a large number of thin film magnetic heads 10 provided in a row on an elongated substrate 13.

  The thin film magnetic head 10 provided on the substrate 13 includes a reading element 40 that reads magnetic information recorded on a hard disk, an inductive writing element 60 that writes magnetic information to the hard disk, and a first element that generates heat when energized. The composite thin film magnetic head mainly includes one heater 70 and a second heater 80 and a covering portion 100 covering them.

The substrate 13 is made of a conductive material such as AlTiC (Al ₂ O ₃ · TiC) as described above.

  As the reading element 40, for example, a GMR (Giant Magneto Resistive) element using a giant magnetoresistance effect, an AMR (Anisotropy Magneto Resistive) element using an anisotropic magnetoresistance effect, or a magnetoresistance effect generated at a tunnel junction is used. A TMR (Tunnel-type Magneto Resistive) element or the like can be used. Such a reading element 40 has a multilayer structure (not shown), a part of which is exposed on the air bearing surface S, detects a change in the magnetic field from the hard disk based on the magnetoresistive effect, and magnetically Read information.

  A pair of shield layers 41 and 42 that sandwich the reading element 40 from above and below are provided above and below the reading element 40. The shield layers 41 and 42 are made of a soft magnetic material such as NiFe. Further, the end surfaces of the shield layers 41 and 42 are exposed on the side surface S.

  The writing element 60 employs a so-called in-plane recording method, and includes a lower magnetic pole 61 and an upper magnetic pole 64 in order from the substrate 13 side, and further includes a thin film coil 66.

  The end surfaces of the lower magnetic pole 61 and the upper magnetic pole 64 on the air bearing surface S side are exposed to the air bearing surface S, and the exposed portions of the lower magnetic pole 61 and the upper magnetic pole 64 are separated by a predetermined distance to form a recording gap G. . On the other hand, the end 64B of the upper magnetic pole 64 on the side away from the air bearing surface S is bent toward the lower magnetic pole 61, and this end 64B is on the side of the lower magnetic pole 61 on the side away from the air bearing surface S. Magnetically connected to the end. Thus, a magnetic circuit that sandwiches the gap G is formed by the upper magnetic pole 64 and the lower magnetic pole 61.

  The thin film coil 66 is disposed so as to surround the end portion 64B of the upper magnetic pole 64, and generates a magnetic field between the recording gaps G by electromagnetic induction, thereby recording magnetic information on the recording surface of the hard disk.

  As shown in FIG. 4, on the surface (upper surface) A different from the air bearing surface S in the bar 30, a pair of read electrode pads 93 and 93 and a pair of write electrode pads are provided for each thin film magnetic head 10. 94 and 94 are provided, respectively. Although not shown, the reading element 40 is electrically connected to the reading electrode pads 93 and 93, and both ends of the coil of the writing element 60 are electrically connected to the writing electrode pads 94 and 94. Has been.

  As shown in FIG. 3, the first heater 70 and the second heater 80 are thin film coils arranged side by side at substantially the same height from the substrate 13. More specifically, the first heater 70 and the second heater 80 are disposed at a position farther from the substrate 13 than the writing element 60. Furthermore, the first heater 70 is disposed at a position closer to the side surface S than the second heater 80. The first heater 70 is disposed at a position where the write element 60 and the shield layers 41 and 42 are sandwiched between the substrate 13 and the second heater 80 is provided with the write element 60 and the shield layers 41 and 42 on the substrate. 13 is not sandwiched between.

  Specifically, for example, the distance 70D from the side surface S to the first heater 70 is about 5 to 50 μm, the distance 80D from the side surface S to the second heater 80 is about 40 to 100 μm, and from the upper magnetic pole 64 of the writing element 60. The distance 80H in the stacking direction of the thin film magnetic head to the first heater 70 and the second heater 80 can be about 2 to 10 μm.

  The first heater 70 and the second heater 80 are made of Cu, NiFe, NiCu, Ta, Ti, CoNiFe alloy, FeAlSi alloy, or the like. The first heater 70 and the second heater 80 generate heat when energized and thermally expand the surroundings.

  More specifically, as shown in FIG. 5, each of the first heater 70 and the second heater 80 has a structure in which one line is meandered. The resistance values of the first heaters 70 are preferably the same as each other. For example, the resistance value is preferably about 30 to 130Ω. Moreover, it is preferable that the resistance value of each 2nd heater 80 is also mutually the same, for example, it is preferable that it is a resistance value of about 30-130 (ohm).

  The ends of the adjacent first heaters 70 are electrically connected by a first connection line 75, and these first connection lines 75 are connected to each thin film magnetic head 10 as shown in FIGS. 4 and 5. The first heaters 70 are electrically connected in series. Connection wires 76 are electrically connected to the ends of the first heaters 70 disposed on the thin film magnetic heads 10 at both ends of the bar 30.

  As shown in FIG. 4, first heater electrode pads 91 are provided at both end portions on the upper surface A of the bar 30. Each connection line 76 is electrically connected to the first heater electrode pad 91 by a conductive member 78 shown in detail in FIG. 3 (see FIGS. 3 and 5).

  On the other hand, as shown in FIG. 5, connection lines 85 are connected to both ends of each second heater 80. As shown in FIG. 4, on the upper surface A of the bar 30, a pair of second heater electrode pads 92, 92 is provided for each thin film magnetic head 10, that is, for each second heater 80. Each connection line 85 is electrically connected to the second heater electrode pad 92 by a conductive member 86 shown in FIGS. 3 to 5 (see FIGS. 3 and 4).

  Further, as shown in FIG. 3, the connection line 85 and the substrate 13 are electrically connected by a conductive member 87. That is, one end of the second heater 80 is electrically connected to the substrate 13 by the second connection line 88 including the connection line 85 and the conductive member 87.

  The reading element 40, the shield layers 41 and 42, the writing element 60, the first heater 70, the second heater 80, and the like are covered with an insulating covering portion 100 and embedded in the covering portion 100. Here, in the covering portion 100, a portion on the opposite side of the substrate 13 with the reading element 40 and the writing element 60 interposed therebetween is defined as a covering portion 100a.

  Here, specifically, the covering portion 100 is provided between the shield layer 42 and the write element 60, between the upper magnetic pole 64 and the lower magnetic pole 61, and between the read element 40 and the shield layers 41 and 42. Separated. As a material of the covering portion 100, an insulating material such as alumina is mainly cited.

  The bar 30 in this state creates a laminated substrate 20 in which a large number of thin film magnetic heads 10 having a laminated structure like the bar 30 are formed in a matrix, and the laminated substrates 20 are arranged in columns or rows as described above. A bar 30 is obtained by cutting along the side, and the side S of the bar can be formed by lapping with a known grinder so as to have a desired MR height.

  Moreover, the thin film magnetic head 10 in the laminated substrate 20 having such a laminated structure includes, for example, a shield layer 41, a read element 40, a shield layer 42, a write element 60, and an insulating material covering them on the substrate 13. Further, the first heater 70, the second heater 80, the first connection line 75, the connection line 76, and the connection line 85 are formed on the insulating material layer by photolithography, and these are further formed into the insulating material layer. It can be easily manufactured by forming the covering portion 100 by covering with. A known sputtering method or frame plating method can be employed for laminating each film.

  In this way, when the first heater 70, the second heater 80, the first connection line 75, the connection line 76, and the connection line 85 are arranged on the same plane parallel to the surface of the substrate 13, the first heater 70, the second heater 80, etc. are preferable because they can be simultaneously formed by an appropriate photolithography method. Needless to say, the height of the first heater 70 and the second heater 80 from the surface of the substrate 13 may be varied.

  Next, the side surface S of the bar 30 in such a state is lapped while the first heater 70 is energized.

  Here, for example, such wrapping can be performed by a wrapping apparatus 190 as shown in FIG. The lapping apparatus 190 includes a bar holder 151 that holds the bar 30 and a polishing machine 161.

  The bar holder 151 includes a main body portion 152, a holding rubber portion 153 provided at a lower portion of the main body portion 152 for holding the bar 30, a power source 132 having a pair of terminals 132a and 132b, and each terminal of the power source 132. 132a and 132b are provided with wirings 155 and 155 having one ends connected thereto. Moreover, the polisher 161 forms the rotary polishing surface R on the upper surface.

  When wrapping the side surface S of the bar 30, first, the bar 30 is attached to the holding rubber portion 153 of the bar holder 151 so that the side surface S of the bar 30 faces the outside, that is, the rotating polishing surface R.

  Next, the other end of one wiring 155 is electrically connected to one first heater electrode pad 91 of the bar 30, and the other end of the other wiring 155 is connected to the other first heater electrode of the bar 30. Electrically connected to the pad 91. Then, a predetermined voltage is applied between the terminals 132 a and 132 b by the power source 132.

  Then, power from the power source 132 is supplied in series to the first heaters 70 of the bar 30 through the wiring 155. As a result, each first heater 70 generates heat, each first heater 70 and the vicinity thereof are heated, and each thin film magnetic head 10 is thermally expanded.

  As a result, as indicated by a two-dot chain line in FIG. 7, the thin film magnetic head 10 protrudes due to thermal expansion, and the side surface S becomes a state like the side surface S1 in the drawing. That is, due to the heat generated by the first heater 70, the coating part 100 a far from the substrate 13 in the thin film magnetic head 10, particularly the tip T of the coating part 100 a most protrudes.

  Such a tendency to protrude is the same when the first heater 70 and the second heater 80 are heated when actually writing to or reading from the hard disk, not during lapping. When such a tendency is exhibited, when the thin film magnetic head 10 is used for reading or writing magnetic information, there is a high possibility that the tip T contacts the recording surface D of the hard disk. In addition, it has been difficult to sufficiently reduce the distance between the writing element 60 or the reading element 40 and the hard disk by causing the second heater 80 to generate heat.

  However, in this embodiment, the thin film magnetic head 10 is heated by energizing the first heater 70 as described above, and the bar holder 151 is lowered while the covering portion 100 is projected, and the polishing machine 161 rotates. The side surface S of the bar 4 is brought into contact with the polishing surface R. Then, the portion from the corner T of the covering portion 100 shown in FIG. 7 to the portion indicated by the dotted line L is polished. The side surface after the polishing becomes an air bearing surface that faces the hard disk.

  FIG. 8 shows a cross section of the bar 30 in a state where the thin film magnetic head 10 is sufficiently cooled after the lapping process. In FIG. 8, a two-dot chain line indicates a portion scraped by lapping while energizing according to the present embodiment. Moreover, S2 has shown the formed air bearing surface. FIG. 9 shows an example of the shape after lapping. In some cases, polishing is performed from the corner portion T of the covering portion 100 to the writing element 60 or the reading element 40.

  This is the step of wrapping the side surface S of the bar 30 while energizing.

  Thereafter, the bar 30 is cut perpendicularly to the direction in which the thin film magnetic heads 10 are arranged, and the thin film magnetic heads 10 are separated to complete the slider 35 as shown in FIG. Here, a groove 34 or the like can be formed in the air bearing surface S as necessary.

  Such a slider 35 can constitute the head gimbal assembly 200. The head gimbal assembly 200 includes a load beam 211, a flexure 212 fixed to the load beam 211 and having elasticity, a base plate 213 provided at the base of the load beam 211, and a wiring member 214 provided on the flexure 212. And a slider 35 fixed to the tip of the flexure 212.

  The wiring member 214 is provided along the flexure 212, and a total of six electrode pads 215 provided at the end of the flexure 212 on the base plate 213 side, and each electrode pad 215, respectively, along the flexure 212, the slider 35. And lead conductors 216 electrically connected to the respective electrode pads 92, 94, 94, 93, 93, 92 formed on the slider 35.

  Although not shown, a head driving IC chip may be mounted in the middle of the flexure 212.

  Such a head gimbal assembly can be applied to a hard disk drive by a known method.

  Next, the operation of the slider manufacturing method according to the present embodiment will be described. According to this embodiment, when the air bearing surface is formed by lapping the side surface S, the first heater 70 is energized. When the first heater 70 generates heat by energization of the first heater 70, the thin film magnetic head 10 is heated, and the side surface S of the thin film magnetic head 10 in the bar 30, particularly the tip of the covering portion 100a (the portion farthest from the substrate) is the other. It protrudes compared to the part. Therefore, when the side surface S is polished in this state to form the air bearing surface, the tip of the covering portion 100a is removed more than the other portions. Therefore, after that, when reading or writing with the air bearing surface S of the thin film magnetic head 10 facing the hard disk, the second heater 80 is used to reduce the distance between the reading element 40 or the writing element 60 and the hard disk. Even if the thin film magnetic head 10 is thermally expanded by energizing the current, the amount of protrusion at the tip of the covering portion 100a is sufficiently suppressed as compared with the conventional case. Thereby, the reading element 40 and the writing element 60 can be sufficiently protruded and brought close to the hard disk without worrying about the protruding amount of the tip of the covering portion 100a.

  One end of each second heater 80 is electrically connected to the conductive substrate 13 by a second connection line 88. When writing information to the hard disk or reading information from the hard disk using the slider 35 using the conductive substrate 13 such as Altic, it is necessary to ground the substrate 13 in order to release the charge of the substrate 13. is there. Conventionally, the slider 35 and the flexure 212 that supports the slider 35 are bonded to each other with silver paste or the like. However, in this embodiment, since the second heater 80 and the substrate 13 are electrically connected by the second connection line 88, one end side of the second heater 80 is externally supplied to the second heater 80. The wiring 216 (see FIG. 9) connected to the terminal can be shared for grounding the substrate 13. Therefore, reliable grounding of the substrate 13 can be easily performed without bonding the substrate 13 and the flexure 212 with the silver paste.

  In the present embodiment, the bar 30 is configured such that each second heater 80 is electrically connected to the substrate 13 by the second connection line 88 due to the above-described circumstances, while each first heater 70 is connected to the first connection line 88. 75 are connected in series with each other. When the thin film magnetic head 10 is heated at the time of lapping, a current is passed in series to the first heater 70 using the first connection line 75 instead of the second heater 80. As a result, it is possible to equalize the amount of heat generated in each first heater 70, that is, the amount of expansion of each thin film magnetic head 10, with the same current flowing through each first heater 70. Therefore, it becomes easy to control the polishing amount of each thin film magnetic head 10 in the bar 30. Thereby, the slider 35 in which the air bearing surface of a desired shape is formed by lapping can be efficiently manufactured.

  Furthermore, according to the present embodiment, the air bearing surface is formed on the bar 30 in which a plurality of thin film magnetic heads 10 are arranged in a row on the substrate 13. Lapping is preferable because it can be performed quickly and efficiently.

  In the thin film magnetic head 10, the first heater 70 is provided at a position closer to the side surface S than the second heater 80, so that the thin film magnetic head 10 is thermally expanded by energizing the first heater 70 during lapping. Sometimes, the tip portion of the covering portion 100a can be protruded more with less power than when the second heater 80 is supplied and expanded. When the second heater 80 is behind the writing element 60 and the reading element 40 when viewed from the side surface S, the second heater 80 at the time of reading or writing causes the writing element to be more than the tip of the covering portion 100a. 60 and the reading element 40 can be suitably protruded.

  Further, in the thin film magnetic head 10, the first heater 70 is farther from the substrate 13 than the reading element 40 and the writing element 60. The tip can be more efficiently projected.

  Although the present invention has been specifically described above based on the embodiment, the present invention is not limited to the above embodiment.

  For example, in the above embodiment, the first heater 70 and the second heater 80 are provided in the covering portion 100 of the thin film magnetic head 10, but as shown in FIG. Even if 80, the first connection line 75, the connection line 76, and the connection line 85 are provided, the operation is possible.

  Furthermore, in the above embodiment, one first heater 70 and one second heater 80 are provided for each thin film magnetic head 10, but a plurality of first heaters 70 and second heaters 80 are provided as shown in FIG. 11. You may arrange them one by one.

  In the above embodiment, the thin film magnetic head includes the writing element 60 and the reading element 40. However, even a head including any one of these elements has the same effect. Needless to say.

  In the above embodiment, the thin film magnetic head is the in-plane recording system, but it is of course applicable to a perpendicular recording type thin film magnetic head.

  Furthermore, the arrangement of the first heater electrode pads 91, 91, the second heater electrode pads 92, 92, the reading electrode pads 93, 93, and the writing electrode pads 94, 94 is also arbitrary.

  Next, the protrusion operation of the thin film magnetic head when the heater of the bar is energized will be described more specifically with reference to the examples.

(Examples 1-3)
First, the distance 70D from the side surface S to the first heater 70 is 20 μm, the distance 80D from the side surface S to the second heater 80 is 50 μm, and from the upper magnetic pole 64 of the writing element 60 to the first heater 70 and the second heater 80. The distance 30H in the stacking direction was 8 μm, and the bar 30 having the structure as shown in FIGS. 3 to 5 was formed. Here, Al material of the substrate 100 ticks (Al ₂ O ₃ -TiC), primarily the material of the covering portion 100 Al ₂ O _3, material NiFe (thickness 2.0 .mu.m) of the shield layer 41 and the upper shield layer 42, MR element 40 is GMR element (thickness 30 nm), lower magnetic pole layer 61 and upper magnetic pole layer 64 are made of NiFe (thickness 2.5 μm), coil 70 is made of Cu (thickness 2 μm), first heater 70 and second heater The material of 80 is NiFe, the thickness of the first heater 70 and the second heater 80 is 300 nm, and the thickness of the thin film magnetic head 110 is 40 μm.

  In the first embodiment, the first heater 70 of the bar 30 is energized in series by applying a voltage between the first heater electrode pads 91, 91, the temperature of the reading element 40 is increased, and the energized heater is energized. And the protruding amount of the reading element 40, the writing element (gap position) 60, and the covering portion (tip position) were measured. Here, energization was controlled so that 100 mW of power was supplied to each first heater 70.

  In Examples 2 and 3, energization was controlled in the same manner as in Example 1 except that electric power of 50 mW and 25 mW was supplied to each first heater 70.

(Comparative Example 1)
In Comparative Example 1, the bar created in Example 1 was used, and the first heater 70 was not energized and the second heater 80 was energized. By the way, in this bar, since the one ends of the second heaters 80 are electrically connected by the second connection line 85 and the substrate 13, it is difficult to energize each of the second heaters 80 in series. In addition, it is extremely complicated and impractical to apply a voltage by connecting connection lines to the second heater electrode pads 92 and 92 of each thin film magnetic head 10. Further, a third connection line for electrically connecting the other ends of the respective second heaters is provided, and a voltage is applied between the third connection line and, for example, the substrate to parallel the second heaters 80. Even if a voltage is applied to the second heater, the length of the third connection line changes for each second heater due to the difference in the position of each second heater, and the resistance of the third connection line cannot be ignored. The voltage applied to the two heaters varies and the amount of heat generated also varies. Therefore, it is difficult to make the expansion amounts of the thin film magnetic heads of the bar uniform.

  Therefore, in Comparative Example 1, one thin film magnetic head 10 in the bar was selected, and the second heater 80 of the thin film magnetic head 10 was energized. Specifically, a voltage was applied between the second heater electrode pads 92 of the thin film magnetic head 10 so that the energization amount was 100 mW. For the thin-film magnetic head 10, the temperature rise of the reading element 40 and the temperature rise of the energized heater are measured, and the protruding amount of the reading element 40, the writing element (gap position) 60 and the covering portion (tip position) is measured. It was measured.

  In Examples 1 to 3 and Comparative Example 1, the temperature rise of the reading element 40, the temperature rise of the energized heater, the protruding amount of the reading element 40, the protruding amount of the writing element 60, and the protruding amount of the covering portion (tip) 100 Is shown in FIG. For Examples 1 to 3, the values of one thin film magnetic head are shown. For Examples 1 to 3 and Comparative Example 1, the profile of the amount of protrusion along the thickness direction of the thin film magnetic head on the side surface S of one thin film magnetic head is shown in FIG. Here, in FIG. 12 and FIG. 13, the protrusion amount is a value when a predetermined position on the side surface S of the bar (a position 50 μm away from the interface between the substrate and the thin film magnetic head toward the substrate) is used as a reference. A vertical line A in FIG. 13 indicates the position of the gap of the writing element.

  In Examples 1 to 3, by energizing each first heater 70 in series, the expansion amount (projection amount) of each thin film magnetic head was substantially uniform. Therefore, it is easy to align the polishing amount of each thin film magnetic head 10 in the side surface S lapping, and it is easy to align the air bearing surface of the thin film magnetic head in a desired shape.

  Further, as apparent from the comparison between Example 1 and Comparative Example 1, in Example 1, since the first heater 70 is disposed closer to the side surface S than the second heater 80, the same electric power is supplied. The amount of protrusion is larger than that of Comparative Example 1 supplied to the two heaters. And the protrusion amount of the comparative example 1 is substantially equivalent to the protrusion amount of the example 2 which supplied about half the electric power of the comparative example 1. Therefore, with the heater arrangement as in the first to third embodiments, the thin film magnetic head can be efficiently projected during lapping with a small amount of power.

FIG. 1 is a perspective view showing a laminated substrate used in a slider manufacturing method according to an embodiment of the present invention. FIG. 2 is a perspective view showing a state where a plurality of bars in which thin film magnetic heads are arranged in a row are manufactured by cutting the laminated substrate of FIG. FIG. 3 is a cross-sectional view showing the bar after MR height adjustment. FIG. 4 is a top view of the bar 4 shown in FIG. FIG. 5 is a partially cutaway view of the vicinity of the first heater and the second heater in FIG. FIG. 6 is an explanatory diagram showing a state in which the side surface of the bar in FIG. 3 is wrapped while energizing the first heater. FIG. 7 is a cross-sectional view of the bar of FIG. FIG. 8 is a cross-sectional view of the bar after the process of FIG. FIG. 9 is a schematic perspective view of a head gimbal assembly including a slider obtained by cutting the bar of FIG. It is a top view which shows an example of other embodiment of a bar. It is a top view which shows an example of other embodiment of a bar. 6 is a table showing the temperature rise of the reading element, the temperature rise of the coil, the protruding amount of the reading element, the protruding amount of the writing element, and the protruding amount of the covering portion (tip) in Examples 1 to 3 and Comparative Example 1. 5 is a graph showing profiles along the thickness direction of a thin film magnetic head on a side surface S of one thin film magnetic head for Examples 1 to 3 and Comparative Example 1.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Thin-film magnetic head, 20 ... Substrate, 30 ... Bar (laminated body), 35 ... Slider, 40 ... Reading element, 60 ... Writing element, 100 ... Covering part, 70 ... First heater, 80 ... Second heater, 75 ... 1st connection line, 88 ... 2nd connection line, S ... Side surface (air bearing surface).

Claims (5)

Preparing a laminate in which a plurality of thin film magnetic heads are arranged in a row on a conductive substrate;
Wrapping a side surface along the juxtaposed direction in the laminate, and
Each of the thin film magnetic heads includes a reading element and / or a writing element, a covering that covers the writing element and / or the reading element, and a first heater and a second heater that generate heat when energized,
The laminate further includes a first connection line for electrically connecting the first heaters of the thin film magnetic heads in series, and an end of the second heater of the thin film magnetic heads and the substrate electrically. Having a second connecting line to connect,
In the lapping step, the slider is manufactured by lapping the side surface while energizing each first heater in series via the first connection line.   The method for manufacturing a slider according to claim 1, wherein the substrate in the laminate is formed of a sintered body containing alumina and titanium carbide.   3. The method for manufacturing a slider according to claim 1, wherein the first heater and the second heater are provided on the same plane parallel to the surface of the substrate.   4. The slider manufacturing method according to claim 1, wherein the first heater is provided at a position closer to the side surface than the second heater.   5. The method of manufacturing a slider according to claim 1, wherein in the thin film magnetic head, the first heater is further away from the substrate than the reading element and the writing element.

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