JP2005078754A - Thin film magnetic head, head slider, head gimbals assembly, and hard disk device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin film magnetic head capable of adjusting a head floating amount on a recording medium, and to provide a head slider, a head gimbals assembly, and a hard disk device. <P>SOLUTION: This thin film magnetic head 11 is a composite type thin film magnetic head in which a main body part 11a having a reproducing head part 31 and a recording head part 32 disposed inside are formed on a base 20. A piezoelectric element 86 is disposed between the reproducing head part 31 and the base 20. This piezoelectric element 86 is provided with a piezoelectric film 82 made of a piezoelectric material, and lower and upper electrodes 83 and 84 disposed on the base 20 side of the piezoelectric film 82 and the side face of an overcoat layer 21 side to apply voltages. The shape of the piezoelectric film 82 is changed in shape by applying a voltage to the inside, an air bearing surface S is expanded/contracted by the shape change, and thus a space between the thin film magnetic head 11 and the hard disk 2, i.e., a head floating amount, is adjusted. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thin film magnetic head, a head slider, a head gimbal assembly, and a hard disk device that include a magnetoresistive element and an induction type electromagnetic transducer.

  The thin film magnetic head is configured to float from a hard disk as a recording medium during recording / reproduction to / from a hard disk device. Specifically, a thin film magnetic head is formed on a predetermined base to form a head slider, and the head slider is mounted on a gimbal attached to the tip of the suspension arm to thereby mount a head gimbal assembly (HGA). Constitute. Then, an air flow accompanying the rotation of the hard disk flows below the thin film magnetic head, so that the suspension arm bends and the thin film magnetic head floats. As such a thin film magnetic head, for example, the one described in Patent Document 1 is known.

In such a thin film magnetic head, the gap with the hard disk, that is, the flying height of the head tends to be miniaturized as the density of the hard disk increases, and is now reaching the limit of 10 nm or less. In the future, it is expected that the density of the hard disk will be further increased, and accordingly the head flying height of the thin film magnetic head will be further reduced.
JP-A-4-366408

  However, it is difficult to adjust the head flying height of the thin film magnetic head under a situation where the head flying height is very small. If the head flying height cannot be adjusted, for example, a situation in which reproduction output cannot be obtained satisfactorily will be caused.

  An object of the present invention is to provide a thin film magnetic head, a head slider, a head gimbal assembly, and a hard disk device capable of adjusting the head flying height with respect to a recording medium.

  The thin film magnetic head of the present invention has a main body portion in which a magnetoresistive effect element for reproduction is provided, and a piezoelectric element whose shape is deformed when a voltage is further applied inside the main body portion. It is characterized by being provided.

  According to the thin film magnetic head of the present invention, a piezoelectric element is further provided inside the main body portion in which the magnetoresistive effect element for reproduction is provided. By applying a voltage to the piezoelectric element, the piezoelectric element is provided. The shape of the element can be changed to expand or contract the recording medium facing surface of the thin film magnetic head. Thereby, the distance between the thin film magnetic head and the recording medium, that is, the head flying height can be adjusted.

  One of the preferred embodiments that exhibit the above-described effect is one in which a piezoelectric element is provided between a magnetoresistive element and a thin film magnetic head stacking substrate.

  The piezoelectric element may be provided so as to extend substantially parallel to the recording medium facing surface. As a result, the portion of the piezoelectric element facing the recording medium facing surface, that is, the projected area onto the recording medium facing surface is increased, so that the force applied to expand or contract the recording medium facing surface can be increased.

  Further, the piezoelectric element may be provided inclined with respect to the recording medium facing surface. When the piezoelectric element is provided with an inclination, it can be formed by a sputtering method, so that polarization treatment can be omitted. In addition, compared with the case where the recording medium facing surface is provided so as to extend in a direction substantially perpendicular to the recording medium facing surface, the portion facing the recording medium facing surface, that is, the projected area on the recording medium facing surface is increased. The force applied to expand or contract the can be increased.

  Further, it is preferable that the piezoelectric element has a vertically extending portion that extends in a substantially vertical direction with respect to the recording medium facing surface, and is electrically connected to an external power source in the vertically extending portion. Usually, in a thin film magnetic head, an electrode pad is provided on a wire bonding surface orthogonal to the medium facing surface, and each element is electrically connected to the electrode pad, whereby a voltage from an external power source is supplied to each element. The Therefore, the portion where the piezoelectric element extends in a direction substantially perpendicular to the recording medium facing surface is substantially parallel to the wire bonding surface of the thin film magnetic head, so that the connection between the voltage application electrode and the electrode pad is easy. can do.

  In the above thin film magnetic head, the piezoelectric element has a piezoelectric film made of a piezoelectric material and two voltage application electrodes sandwiching the piezoelectric film, and one of the electrodes is a conductive material for laminating the thin film magnetic head. The substrate may be directly connected to the substrate, and the substrate may be grounded.

  The piezoelectric element has a piezoelectric film made of a piezoelectric material and an electrode for applying a voltage to the piezoelectric film, and the piezoelectric film is formed so as to be sandwiched between a conductive substrate and an electrode for laminating a thin film magnetic head. May be. By adopting such a structure in which the piezoelectric film is sandwiched between the conductive substrate and the electrode, a voltage can be applied to the piezoelectric film by the electrode and the substrate. Therefore, since only one voltage application electrode is required, the manufacturing is facilitated.

  A head slider, a head gimbal assembly, and a hard disk device of the present invention each include the above-described thin film magnetic head, and the thin film magnetic head has a main body portion in which a magnetoresistive effect element for reproduction is provided. Further, a piezoelectric element that adjusts the distance from the recording medium by deforming the shape by applying a voltage is provided inside the.

  According to the head slider, the head gimbal assembly, and the hard disk device of the present invention, in the thin film magnetic head, the piezoelectric element is further provided inside the main body portion in which the magnetoresistive effect element for reproduction is provided. By applying a voltage to the piezoelectric element, the shape of the piezoelectric element can be changed, and the recording medium facing surface of the thin film magnetic head can be expanded or contracted. Thereby, the distance between the thin film magnetic head and the recording medium, that is, the head flying height can be adjusted.

  According to the present invention, since the piezoelectric element is provided inside the thin film magnetic head, the head flying height with respect to the recording medium can be adjusted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol shall be used for the same element and the overlapping description is abbreviate | omitted.

  FIG. 1 is a diagram showing a hard disk device provided with a head slider of this embodiment, and FIG. 2 is a head gimbal assembly equipped with the head slider provided with the hard disk device shown in FIG. 1 and having a thin film magnetic head formed thereon. FIG. 3 is an enlarged perspective view of (HGA: Head Gimbals Assembly), and FIG. 3 is a diagram showing a surface located on the tip side of the head gimbal assembly in the head slider shown in FIG. The hard disk device 1 operates the head gimbal assembly 10 to record and reproduce magnetic information by the thin film magnetic head 11 on the recording surface (the upper surface in FIG. 1) of the hard disk 2 that rotates at high speed.

  As shown in FIG. 2, the head gimbal assembly 10 includes a suspension arm 12 that is a thin metal plate. A tongue portion 14 surrounded by a cut is formed on the distal end side of the suspension arm 12, and a head slider 13 on which the thin film magnetic head 11 is formed is mounted on the tongue portion 14.

  On the suspension arm 12, printed wiring 17 is formed by covering wirings 17a to 17c connected to terminals 15a to 15f provided on the distal end side and terminals 16a to 16f provided on the proximal end side with an insulating layer. Is provided. The wirings 17a to 17c are sequentially electrically connected to the piezoelectric element electrode pads 23a and 23b, the recording electrode pads 21a and 21b, and the reproducing electrode pads 22a and 22b (see FIG. 3 for each electrode pad). .

  The printed wiring 17 wraps around the head slider 13 from the terminals 15a to 15f, is turned to the rear of the head slider 13, and extends to the terminals 16a to 16f. With this printed wiring 17, each element of the thin film magnetic head 11 formed on the head slider 13 is energized through terminals 15a to 15f.

  The head slider 13, the printed wiring 17, and the terminals 15a to 15f and 16a to 16f are disposed on the suspension arm 12 via the insulating layer 18, and are insulated from the metal suspension arm 12.

  The head gimbal assembly 10 as described above can be rotated around the support shaft 3 by, for example, a voice coil motor, as shown in FIG. When the head gimbal assembly 10 is rotated, the head slider 13 moves in the radial direction of the hard disk 2, that is, in the direction crossing the track line.

Returning to FIG. 2, the head slider 13 has a substantially rectangular parallelepiped shape, and a thin film magnetic head 11 is formed on a base 20 (details will be described later) made of AlTiC (Al ₂ O ₃ .TiC). In the figure, element portions (described later) 31 and 32 provided in the main body portion 11a of the thin film magnetic head 11 are formed near the center of the base 20 in the horizontal direction. Is not limited.

  The upper surface of the head slider 13 is a recording medium facing surface that faces the recording surface of the hard disk 2 and is referred to as an air bearing surface (ABS). When the hard disk 2 rotates, the head slider 13 floats due to the air flow accompanying this rotation, and the air bearing surface S is separated from the recording surface of the hard disk 2. The air bearing surface S may be coated with DLC (Diamond Like Carbon) or the like.

  An overcoat layer 21 is provided on the front surface of the head slider 13 in the thin film magnetic head 11 in order to protect each element. On the surface of the overcoat layer 21, recording electrode pads 21a and 21b, reproducing electrode pads 22a and 22b, and piezoelectric element electrode pads 23a and 23b are attached. Details of the piezoelectric element will be described later. The recording electrode pads 21a and 21b and the reproducing electrode pads 22a and 22b may be attached to the left and right sides. Further, the attachment position of the electrode pad 23 for the piezoelectric element is not limited, and may be arranged at any position on the surface of the overcoat layer 21.

  The recording electrode pads 21a and 21b, the reproducing electrode pads 22a and 22b, and the piezoelectric element electrode pads 23a and 23b are electrically connected to terminals 15a to 15f provided on the suspension arm 12, respectively. In this embodiment, the recording electrode pads 21a and 21b are respectively connected to the terminals 15e and 15f, the reproducing electrode pads 22a and 22b are respectively connected to the terminals 15a and 15b, and the piezoelectric element electrode pads 23a and 23b are respectively connected to the terminals 15d and 15c. Electrically connected. The wirings 17a to 17c described above are connected to the terminals 15a to 15f.

  When connecting each electrode pad and the terminals 15a to 15f, for example, ball bonding using gold as a bonding material (gold ball bonding) is used.

  4 is a cross-sectional view taken along line IV-IV shown in FIG. The thin film magnetic head 11 includes a reproducing head unit 31 having a reproducing GMR element (Giant Magneto Resistive) 30 on a base 20, and a recording head as an inductive electromagnetic transducer for recording. This is a composite type thin film magnetic head in which the portion 32 is laminated. The GMR element utilizes a giant magnetoresistance effect having a high magnetoresistance change rate. In place of the GMR element, an AMR (Anisotropy Magneto Resistive) element using an anisotropic magnetoresistive effect, a TMR (Tunnel-type Magneto Resistive) element using a magnetoresistive effect generated at a tunnel junction, a CPP-GMR element, etc. May be used.

  The reproducing head unit 31 includes an upper shield layer 45a and a lower shield layer 42 disposed so as to sandwich the reproducing head unit 31.

  The recording head portion 32 includes two layers of thin film coils 35 and 36 partially surrounded by a magnetic pole portion layer 34a and a yoke portion layer 34b.

  An overcoat layer 21 is formed on the recording head unit 32 so as to cover the recording head unit 32.

  A piezoelectric element 86 is provided between the reproducing head unit 31 and the base 20. The piezoelectric element 86 includes a piezoelectric film 82 made of a piezoelectric material, and a voltage applying lower electrode 83 and an upper electrode 84 provided on side surfaces of the piezoelectric film 82 on the base 20 side and the overcoat layer 21 side. Has been. The piezoelectric film 82 changes its shape when a voltage is applied to the inside thereof, and the air bearing surface S is expanded or contracted by the change of the shape, so that the distance between the thin film magnetic head 11 and the hard disk 2, that is, the head flying height. Is to adjust.

  Conductive portions 41 and 41 made of a conductive material such as Cu extending in the vertical direction in the figure are electrically connected to the lower electrode 83 and the upper electrode 84, respectively. The upper ends of the conductive portions 41 and 41 are connected to the piezoelectric element electrode pads 23 a and 23 b attached on the surface A on the surface A of the overcoat layer 21.

  Similarly, with respect to the reproducing head unit 31 and the recording head unit 32, two conductive units made of a conductive material (only the conductive unit 51 for the reproducing head unit 31 is shown in FIG. 4) are electrically connected. The surface A is connected to the above-described reproducing electrode pads 22a and 22b and recording electrode pads 21a and 21b, respectively.

FIG. 5 is a schematic view showing the piezoelectric element 86. The piezoelectric film 82 of the piezoelectric element 86 is made of, for example, a piezoelectric material such as Pb (Zr, Ti) O ₃ (lead zirconate titanate; commonly called PZT) or BaTiO ₃ (barium titanate), and the piezoelectric material is subjected to polarization treatment. It is manufactured by applying. In general, the polarization process refers to a process in which a strong DC electric field is applied to align internal electric dipoles in a certain direction. In addition, the piezoelectric film 82 is rarely formed of pure piezoelectric material only. For example, when PZT is a piezoelectric material, an oxide such as Pb, Mn, Nb or the like may be added in a trace amount depending on the purpose of use. It is configured by adding a small amount of a complex perovskite compound.

  The electrodes 83 and 84 provided so as to sandwich the piezoelectric film 82 are made of, for example, Pt and are connected to the external power source 85. When the voltage is applied to the piezoelectric film 82 subjected to the polarization treatment by the external power source 85 via the electrodes 83 and 84, a so-called reverse piezoelectric effect is generated, for example, in the direction indicated by the arrow in FIG. It is deformed and becomes a state shown by a two-dot chain line. Further, when the polarity of the applied voltage is reversed, that is, when the direction of the electric field generated inside is reversed, the shape of the piezoelectric film 82 is deformed in the direction opposite to the direction indicated by the arrow in FIG.

  FIG. 6 is a schematic diagram showing the relationship between the air bearing surface S of the thin film magnetic head 11 and the recording surface D of the hard disk. When a voltage is applied to the piezoelectric element 86 of the thin film magnetic head 11, the piezoelectric element 86 is deformed as described above and pushes the air bearing surface S toward the recording surface D side of the hard disk. Then, the air bearing surface S in the vicinity of the reproducing head unit 31 and the recording head unit 32, including the vicinity of the piezoelectric element 86, expands toward the recording surface D side of the hard disk (indicated by a two-dot chain line in the figure).

  Further, when the polarity of the voltage applied to the piezoelectric element 86 is reversed and the direction of the electric field generated in the piezoelectric film 82 of the piezoelectric element 86 is reversed, the shape of the piezoelectric element 82 is deformed in the opposite direction. The bearing surface S contracts away from the recording surface D of the hard disk.

  As described above, the thin film magnetic head 11 according to the present embodiment changes the shape of the piezoelectric element 86 by applying a voltage to the piezoelectric element 86 provided inside the main body 11a provided with each element. The air bearing surface S of the thin film magnetic head 11 can be expanded or contracted. Therefore, the distance between the thin film magnetic head 11 and the hard disk, that is, the head flying height can be adjusted.

  Next, an example of a method for manufacturing the thin film magnetic head 11 shown in FIG. 4 will be described with reference to FIGS.

First, as shown in FIG. 7, an insulating material such as alumina (Al ₂ O ₃ ) is formed on a substrate 38 for laminating thin film magnetic heads 11 made of AlTiC (Al ₂ O ₃ .TiC) by sputtering. A base layer 39 made of is formed with a thickness of about 1 μm to about 10 μm. The substrate 38 and the base layer 39 constitute the base 20 of the head slider 13. Then, a lower electrode 83, a piezoelectric film 82, and an upper electrode 84 are sequentially formed on the base layer 39 by sputtering. The lower electrode 83, the piezoelectric film 82, and the upper electrode 84 constitute a piezoelectric element 86.

As a material of the lower electrode 83, for example, Pt, PtO, Ir, IrO, Ru, RuO, LaSrCoO ₃ or the like is used. The upper electrode 84 may be made of any material as long as it can conduct electricity. The lower electrode 83 and the upper electrode 84 are formed with a thickness of about 100 nm, for example. The piezoelectric film 82 is formed of Pb (Zr, Ti) O ₃ (so-called PZT), BaTiO ₃ , (Pb, La) (Zr, Ti) O ₃ , SrBiTaO ₃ , PbTiO ₃ / PbZrO ₃ laminated film, Pb (Mg). It is made of a piezoelectric material such as _1/3 Nb _2/3 ) O ₃ —PbTiO ₃ and has a thickness of about 1 μm, for example. As described above, it is desirable to add a dopant, a composite perovskite compound, or the like to the piezoelectric material according to the purpose of use. The piezoelectric film 82 can also be formed in a polarized state by using a sputtering method. Therefore, if the piezoelectric film 82 is formed in a polarized state using a sputtering method, it is not necessary to perform a polarization process such as sintering, and the manufacturing process can be simplified.

  Next, a subsequent manufacturing process will be described with reference to FIG. A hole 41h for forming the conductive portion 41 of the piezoelectric element 86 is formed, for example, by wet etching, behind the upper electrode 84 as viewed from a virtual surface S ′ (which will be described in this way for convenience) to be the air bearing surface S later. . At this time, the hole 41 h is formed so as to penetrate the upper electrode 84 and the piezoelectric film 82 and expose the lower electrode 83.

  Reference is now made to FIG. A photoresist layer is formed in a predetermined pattern, and two magnetic layers 89 and 89 made of NiFe or the like are formed on the upper electrode 84 and the lower electrode 83, respectively, by frame plating or the like. This figure shows a state in which the photoresist layer is removed. Thereby, the first conductive layers 41a and 41a constituting the conductive portions 41 and 41 are defined.

  Next, as shown in FIG. 10, after an insulating material (insulating layer) 40 such as alumina or resin is stacked by sputtering or the like, the surface is flattened at the upper end positions of the first conductive layers 41a and 41a.

  Next, as shown in FIG. 11, a photoresist layer is formed in a predetermined pattern above the first conductive layers 41a and 41a in the insulating layer 40, and a magnetic layer 90 is formed by plating or the like. Thereby, the lower shield layer 42 and the second conductive layers 41b and 41b constituting the conductive portions 41 and 41 are defined.

  Thereafter, an insulating material 79 is laminated by sputtering or the like, and the surface between the lower shield layer 42 and the second conductive portions 41b and 41b is buried, and then the surface is flattened. Then, a shield gap layer 50 made of an insulating material such as alumina is formed on the lower shield layer 42, the insulating material 79, and the second conductive layer 41b by, for example, a sputtering method.

  Next, as shown in FIG. 12, the GMR element 30 is formed on the shield gap layer 50 on the virtual surface S ′ side. Then, a lead layer 77 electrically connected to the GMR element 30 is formed on the GMR element 30.

Next, an insulating layer 44 made of Al ₂ O ₃ or the like is formed by sputtering, for example, so as to cover the GMR element 30 and the shield gap layer 50. Next, in the insulating layer 44 located in the rear portion of the lead layer 77 as viewed from the virtual surface S ′, a hole 51h for forming the conductive portion of the reproducing head portion 31 is formed using a lithography technique, a milling method, or the like. Simultaneously with the formation of the hole 51h, the insulating layer 44 and the insulating layer 50 are also passed through the second conductive layers 41b and 41b by using a lithography technique and a milling method.

  Next, as shown in FIG. 13, a photoresist layer is formed in a predetermined pattern, and the third conductive layer 41c constituting the magnetic layer 92, the magnetic layer 92 on the hole 51h, and the conductive portions 41, 41 is formed by plating or the like. , 41c. The magnetic layer 92 above the GMR element 30 becomes the first upper shield layer 45a.

  Next, the shield gap layer 53 is formed by sputtering or the like. Next, the magnetic layer 92 over the hole 51h and the shield gap layer 53 over the third conductive layers 41c and 41c are removed. Next, a photoresist layer is formed in a predetermined pattern, and the magnetic layer 93, the magnetic layer 93 above the hole 51h, and the magnetic layer 93 located above the third conductive layers 41c and 41c are formed by plating or the like. Thereby, the fourth conductive layers 41d and 41d constituting the conductive portions 41 and 41 are formed. The magnetic layer 93 above the GMR element 30 becomes the second upper shield layer 45b. Thereafter, the insulating layer 94 is embedded in the removed portions of the magnetic layers 92 and 93 to planarize the whole.

  Next, a recording gap layer 33 made of, for example, an alumina film is formed on the entire surface except for the hole 51h and the fourth conductive layers 41d and 41d.

  Further, on the recording gap layer 33 above the GMR element 30, a thin film coil 36 of the first layer is formed with a thickness of about 1 μm to about 3 μm using an insulating film (not shown) using, for example, a plating method. . The thin film coil 36 is made of, for example, copper (Cu). The thin film coil 36 shown in the figure is shown in a square shape with a simplified cross-sectional shape.

  Next, the magnetic layer 95 is simultaneously formed on a part of the second upper shield layer 45b, the magnetic layer 93 above the hole 51h, and the fourth conductive layers 41d and 41d by using a lithography technique and a milling method. Form. Thus, fifth conductive layers 41e and 41e constituting the conductive portions 41 and 41 are formed. The magnetic layer 95 adjacent to the thin film coil 36 becomes the magnetic pole portion layer 34a.

  Next, as shown in FIG. 14, an insulating layer 81 is stacked and the whole is planarized. Then, a photoresist layer 56 is formed in a predetermined pattern on the insulating layer 81. Next, a second-layer thin film coil 35 is formed on the photoresist layer 56 and above the thin film coil 36. At this time, a layer 96 similar to the thin film coil 35 is formed of the same material as the thin film coil 35 on the magnetic layer 95 above the hole 51h and the fifth conductive layers 41e and 41e. Thereby, sixth conductive layers 41f and 41f constituting the conductive portions 41 and 41 are formed. In this embodiment, two thin-film coils are stacked, but one thin film or three or more multilayers may be used, and the number of layers and the forming procedure are not limited to this.

  Next, as shown in FIG. 15, an insulating layer 97 is formed on the second thin film coil 35, and further, a yoke partial layer is formed so as to cover a part of the thin film coil 35 and to be connected to the magnetic partial layer 34a. 34b is formed. At this time, the layer 98 is formed on the sixth conductive layers 41f and 41f with the same material as the yoke portion layer 34b. Thereby, seventh conductive layers 41g and 41g constituting the conductive portions 41 and 41 are formed. The magnetic pole part layer 34a and the yoke part layer 34b may be integrally formed.

Then, the overcoat layer 21 made of an insulating material such as Al ₂ O ₃ is formed by sputtering, for example, so as to cover the whole. At this time, the conductive portions of the reproducing head portion 31 and the recording head portion 32 are formed to the same height as the upper ends of the conductive portions 41 and 41, similarly to the conductive portions 41 and 41.

  Next, for example, by polishing the overcoat layer 21, the upper ends of the seventh conductive layers 41 g and 41 g are exposed on the surface of the overcoat layer 21 opposite to the base 20.

  Finally, as shown in FIG. 16, piezoelectric element electrode pads 23a and 23b are disposed on the upper ends of the conductive portions 41 and 41 (seventh conductive layers 41g and 41g). At this time, electrode pads are similarly provided for the reproducing head unit 31 and the recording head unit 32.

  Thus, the thin film magnetic head 11 according to the embodiment of the present invention is completed.

  As shown in FIG. 17, in the thin film magnetic head 11, when the substrate 38 for laminating the thin film magnetic head 11 is a conductive substrate, the base layer 39 and the lower electrode 83 are not provided. it can. In this case, the conductive substrate 38 becomes the ground, and the piezoelectric film 82 can be applied by the upper electrode 84 and the substrate 38. By using the conductive substrate 38 in this way, it is not necessary to provide the base layer 39 and the lower electrode 83, so that the thin film magnetic head 11 can be manufactured more easily.

  In addition, the formation position of the piezoelectric element 86 is not limited to the above form. Hereinafter, another example of the formation position of the piezoelectric element 86 in the thin film magnetic head 11 will be described. 18 to 20 are schematic diagrams illustrating other examples of positions where the piezoelectric element 86 is formed.

  The piezoelectric element 86 shown in FIG. 18 is provided behind the reproducing head unit 31 and the recording head unit 32 as viewed from the air bearing surface S so as to extend substantially parallel to the air bearing surface S. The piezoelectric element 86 is formed between the insulating layers 70a and 70b. In addition, the piezoelectric element 86 and the insulating layers 70a and 70b are bent upward in an L shape and extend in a direction substantially perpendicular to the air bearing surface S. In addition, voltage application electrodes 71 a and 71 b of the piezoelectric element 86 are connected to the conductive portions 41 and 41 in portions (vertical extension portions) extending in a direction substantially perpendicular to the air bearing surface S. The conductive portions 41 and 41 are connected to electrode pads 23 a and 23 b provided on the surface A located on the opposite side of the base of the thin film magnetic head 11. As a result, a voltage can be applied to the piezoelectric element 86.

  The piezoelectric film 82 and the electrodes 71a and 71b of the piezoelectric element 86 are formed so as to extend substantially parallel to the air bearing surface S by, for example, the CVD method. At this time, since the piezoelectric film 82 remains a non-polarized piezoelectric material, a polarization process is performed by applying a voltage to the piezoelectric film 82 via the electrodes 71a and 71b.

  In such a thin film magnetic head 11, the shape of the piezoelectric element 86 is deformed so as to expand and contract in a direction perpendicular to the air bearing surface S (the left-right direction in the figure), thereby expanding or contracting the air bearing surface S. Adjust the flying height. In this case, since the piezoelectric element 86 is provided so as to extend substantially parallel to the air bearing surface S, the piezoelectric element 86 extends in a direction substantially perpendicular to the air bearing surface S as shown in FIG. Compared with the case where it is provided, the portion facing the air bearing surface S (projected portion on the air bearing surface S) becomes larger. Therefore, the force for expanding or contracting the air bearing surface S can be further increased.

  The piezoelectric element 86 shown in FIG. 19 is provided behind the reproducing head portion 31 and the recording head portion 32 as viewed from the air bearing surface S, and is inclined with respect to the air bearing surface S. A piezoelectric element 86 shown in FIG. 20 is arranged below the reproducing head portion 31 so as to extend in a direction substantially perpendicular to the air bearing surface S, and the reproducing head portion 31 viewed from the air bearing surface S. In addition, the recording head unit 32 is disposed behind the recording head unit 32 so as to be inclined with respect to the air bearing surface S.

  19 and 20, when the piezoelectric element 86 is provided to be inclined, the piezoelectric element 86 is more easily formed by the sputtering method as the inclination angle with respect to the air bearing S is increased. Therefore, if the piezoelectric element 86 is formed by a sputtering method, the step of applying polarization treatment to the piezoelectric film 82 can be omitted. Further, since the piezoelectric element 86 is inclined, the portion facing the air bearing surface S is larger than the case where the piezoelectric element 86 is provided so as to extend in a direction substantially perpendicular to the air bearing surface S. The force for expanding or contracting S can be increased. As a method of forming the piezoelectric element 86 at an inclination, each layer of the thin film magnetic head 11 is obliquely milled, and the piezoelectric film 82 and the electrodes 71a and 71b are formed in the milled portion. Good.

  In the piezoelectric element 86 shown in FIGS. 18 to 20, either one of the voltage application electrodes 71a and 71b is directly connected to the substrate 38, and the substrate 38 is grounded, whereby a voltage is applied to the piezoelectric film 82. You may make it do. In this case, the conductive part 41 may not be provided for the electrode directly connected to the substrate 38.

  Only one piezoelectric element 86 may be arranged at the position described above, or may be divided into two or more. FIG. 21 is a schematic cross-sectional view showing an example of the thin film magnetic head 11 in which the piezoelectric element 86 is divided into two. In the same figure, the divided piezoelectric elements 86 are arranged at the same height as the piezoelectric elements 86 shown in FIG. In FIG. 21, the divided piezoelectric elements 86 are both disposed at the same height position, but may be disposed at different height positions.

  As mentioned above, although this invention was concretely demonstrated based on embodiment, this invention is not limited to the said embodiment. For example, the second magnetic pole may be integrated without being divided into the magnetic pole part layer and the yoke part layer. Further, the seventh conductive layer 41g (98) may not be the same material as that of the yoke portion layer 34b, as long as it has conductivity.

It is a figure which shows the hard disk drive provided with the head slider of this embodiment. FIG. 2 is an enlarged perspective view of a head gimbal assembly provided in the hard disk device shown in FIG. 1 and mounting a head slider on which a thin film magnetic head is formed. FIG. 3 is a diagram showing a surface located on a tip side of a head gimbal assembly in the head slider shown in FIG. 2. It is the IV-IV sectional view taken on the line shown in FIG. It is the schematic which shows the piezoelectric element which concerns on this embodiment. It is the schematic which shows the relationship between the air bearing surface of a thin film magnetic head, and the recording surface of a hard disk. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a figure which shows an example of the manufacturing method of the thin film magnetic head which concerns on this embodiment. It is a schematic diagram which shows the other example of a piezoelectric element formation position. It is a schematic diagram which shows the other example of a piezoelectric element formation position. It is a schematic diagram which shows the other example of a piezoelectric element formation position. It is a schematic sectional drawing which shows an example of the thin film magnetic head by which the piezoelectric element was divided | segmented and arrange | positioned.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Hard disk apparatus, 2 ... Hard disk, 10 ... Head gimbal assembly, 11 ... Thin film magnetic head, 11a ... Main-body part, 12 ... Suspension arm, 13 ... Head slider, 20 ... Base, 21 ... Overcoat layer, 31 ... Playback Head part 32... Recording head part 33. Recording gap layer 34 b. Yoke part layer 34 a. Magnetic part layer 34 a. Magnetic part layer 35 35 36 Thin film coil 38 Substrate 39 Base layer 40 ... Insulating layer, 41 ... Conductive part, 42 ... Lower shield layer, 44 ... Insulating layer, 45a ... Upper shield layer, 45b ... Upper shield layer, 50 ... Shield gap layer, 50 ... Insulating layer, 51 ... Conductive part, 53 ... Shield gap layer, 56 ... Photoresist layer, 70a, 70b ... Insulating layer, 71a, 71b ... Electrode, 77 ... Lead layer, 79 ... Insulating material DESCRIPTION OF SYMBOLS 81 ... Insulating layer, 82 ... Piezoelectric film, 83 ... Lower electrode, 84 ... Upper electrode, 86 ... Piezoelectric element, 89 ... Magnetic layer, 90 ... Magnetic layer, 92, 93 ... Magnetic layer, 94 ... Insulating layer, 95 ... Magnetic Layer 97 insulating layer D recording surface of hard disk S air bearing surface

Claims (10)

A magnetoresistive effect element for reproduction has a main body provided inside,
A thin film magnetic head, wherein a piezoelectric element whose shape is deformed when a voltage is applied is further provided inside the main body. 2. The thin film magnetic head according to claim 1, wherein the piezoelectric element is provided between the magnetoresistive effect element and a substrate for laminating a thin film magnetic head. 2. The thin film magnetic head according to claim 1, wherein the piezoelectric element is provided so as to extend substantially parallel to the recording medium facing surface. 2. The thin film magnetic head according to claim 1, wherein the piezoelectric element is provided to be inclined with respect to the recording medium facing surface. 2. The piezoelectric element according to claim 1, wherein the piezoelectric element has a vertical extending portion extending in a direction substantially perpendicular to the recording medium facing surface, and is electrically connected to an external power source at the vertical extending portion. 3. A thin film magnetic head according to 3 or 4. The piezoelectric element includes a piezoelectric film made of a piezoelectric material, and two voltage application electrodes sandwiching the piezoelectric film,
6. The thin film magnetic according to claim 1, wherein one of the electrodes is directly connected to a conductive substrate for thin film magnetic head lamination, and the substrate is a ground. head. The piezoelectric element has a piezoelectric film made of a piezoelectric material, and an electrode for applying a voltage to the piezoelectric film,
6. The thin film magnetic head according to claim 1, wherein the piezoelectric film is formed so as to be sandwiched between a conductive substrate for laminating a thin film magnetic head and the electrode. A head slider having a thin film magnetic head,
The thin film magnetic head has a main body portion in which a magnetoresistive effect element for reproduction is provided, and the inside of the main body portion is further distanced from the recording medium by being deformed by application of a voltage. A head slider, characterized in that a piezoelectric element for adjusting the pressure is provided. A head gimbal assembly having a head slider with a thin film magnetic head,
The thin film magnetic head has a main body portion in which a magnetoresistive effect element for reproduction is provided, and the inside of the main body portion is further distanced from the recording medium by being deformed by application of a voltage. A head gimbal assembly comprising a piezoelectric element for adjusting the angle. A hard disk device having a head gimbal assembly with a thin film magnetic head,
The thin film magnetic head has a main body portion in which a magnetoresistive effect element for reproduction is provided, and the inside of the main body portion is further distanced from the recording medium by being deformed by application of a voltage. A hard disk device, characterized in that a piezoelectric element for adjusting the frequency is provided.

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