JP2006039449A - Optoelectronic apparatus, conductors substrate, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectronic apparatus wherein the occurrence of a contact defect between a semiconductor element and wiring on a substrate can be prevented when mounting the semiconductor element on the substrate. <P>SOLUTION: The optoelectronic apparatus has a liquid crystal panel including a liquid crystal and a FPC 5 connected to the liquid crystal panel. An IC 33 for power supply is mounted on the FPC 5. The IC 33 for power supply is provided with a bump 33a. Wires 36 and 37 are formed on the FPC 5, and land parts 36a and 37a are provided in front ends of wires 36 and 37. The bump 33a of the IC 33 for driving is conductively connected to land parts 36a and 37a. A width T2 of land parts 36a and 37a is made wider than a width T1 of the bump 33a of the IC 33 for power supply. Alternatively at least two land parts are provided for the bump 33a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical device such as a liquid crystal display device, an EL display device, and a plasma display device. The present invention also relates to a wiring board used for the electro-optical device. The present invention also relates to an electronic apparatus configured using the above electro-optical device.

  Currently, electro-optical devices such as liquid crystal display devices and EL devices are widely used in various electronic devices such as mobile phones and portable information terminals. For example, an electro-optical device is used as a display unit for visually displaying various types of information related to electronic devices. In this electro-optical device, a device using liquid crystal as an electro-optical material, that is, a liquid crystal display device is known. An EL device using EL (Electro Luminescence) as an electro-optical material is also known.

  For example, a liquid crystal display device has a liquid crystal panel as an electro-optical panel. This liquid crystal panel generally has a structure in which a liquid crystal layer is interposed between a pair of substrates each having an electrode. This liquid crystal layer is formed, for example, as follows, that is, by forming a space surrounded by a sealing material between the pair of substrates and sealing the liquid crystal in this space. In this liquid crystal display device, the orientation of liquid crystal molecules in the liquid crystal layer is controlled for each pixel by supplying light to the liquid crystal layer and controlling the voltage applied to the liquid crystal layer for each pixel. The light supplied to the liquid crystal layer is modulated according to the alignment state of the liquid crystal molecules, and by supplying the modulated light to the liquid crystal side surface of the polarizing plate, letters, numbers, figures, etc. are formed on the observation side surface of the polarizing plate. Is displayed.

  In general, a flexible wiring board such as an FPC (Flexible Printed Circuit) is connected to the liquid crystal panel. An input terminal is formed on the FPC, and an external power source and various external devices are connected to the input terminal. A signal and power for driving the liquid crystal panel are supplied from an external device or an external power source through the FPC. In addition, a circuit necessary for driving the liquid crystal panel is formed in the FPC. In this circuit, wiring is usually formed in a predetermined pattern on the base substrate, and circuit components such as capacitors, coils, resistors, and semiconductor elements such as ICs (Integrated Circuits) are mounted at predetermined positions on the base substrate. Formed by.

  The IC is mounted on the FPC by thermocompression bonding using, for example, an ACF (Anisotropic Conductive Film). Such a mounting structure is conventionally known (see, for example, Patent Document 1). In this mounting structure, the IC has a plurality of input / output terminals on its active surface. When the IC is mounted on the base substrate, the terminals are conductively connected to a plurality of wirings on the base substrate. In this mounting structure, the width of each wiring formed on the wiring board is formed substantially the same as the width of the terminal of the IC to be mounted.

JP 2002-164628 A (6th page, FIG. 3)

  By the way, when mounting an IC on a wiring board, thermocompression bonding is performed using a bonding tool. At this time, the IC may be inclined with respect to the bonding tool due to foreign matter entering between the bonding tool and the IC. In such a case, the IC may be mounted in a tilted state with respect to the wiring board. As described above, when the IC is inclined, the position of the terminal of the IC may be shifted with respect to the wiring on the wiring board. In the liquid crystal display device disclosed in Patent Document 1, since the width of the wiring on the wiring board and the width of the IC terminal are substantially the same, if the IC terminal is misaligned with respect to the wiring, the terminal and the wiring are not aligned. There was a risk of poor contact.

  The present invention has been made in view of the above problems, and when a semiconductor element such as an IC is mounted on a substrate, a contact failure occurs between the semiconductor element and the wiring on the substrate. An object of the present invention is to provide an electro-optical device, a wiring board, and an electronic apparatus that can prevent the above-described problem.

  In order to achieve the above object, a first electro-optical device according to the present invention includes an electro-optical panel including an electro-optical material, a substrate connected to the panel, a semiconductor element mounted on the substrate, It has a terminal provided in the semiconductor element, a land part to which the terminal is connected and a wiring provided on the substrate, and the width of the land part is wider than the width of the terminal of the semiconductor element. Features.

  According to the first electro-optical device, since the width of the land portion provided on the substrate is wider than the width of the terminal of the semiconductor element, the positional deviation of the semiconductor element with respect to the substrate when the semiconductor element is mounted is The allowable width can be increased. Specifically, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element and the land portion can be reliably contacted. Therefore, it is possible to prevent a defect from occurring when mounting the semiconductor element.

  In the first electro-optical device according to the aspect of the invention, it is preferable that the width of the land is approximately twice the width of the terminal. In this way, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element and the land portion can be more reliably contacted.

  Next, a second electro-optical device according to the present invention is provided with an electro-optical panel containing an electro-optical material, a substrate connected to the panel, a semiconductor element mounted on the substrate, and the semiconductor element. And a wiring provided on the substrate, and at least two lands are provided for the terminals of the semiconductor element. .

  According to the second electro-optical device, since at least two land portions are provided with respect to the terminals of the semiconductor element, the allowable width is widened with respect to the positional deviation of the semiconductor element with respect to the substrate when the semiconductor element is mounted. Can do. Specifically, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element can contact one or both of the two land portions. Therefore, it is possible to prevent contact failure when the semiconductor element is mounted.

  In the second electro-optical device according to the aspect of the invention, it is preferable that an interval between adjacent wirings in the land portion is narrower than a width of the terminal. In this way, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element can always contact one or both of the two land portions.

  In the electro-optical device according to the aspect of the invention, it is preferable that the semiconductor element is a power supply IC for supplying power to the electro-optical panel. By doing so, it is possible to prevent a connection failure from occurring when the power supply IC is mounted, so that power can be reliably supplied to the electro-optical panel.

  In the electro-optical device according to the aspect of the invention, it is preferable that the wiring board is a flexible wiring board. The flexible wiring board is a board on which wiring is formed and has flexibility. As this flexible wiring board, for example, a flexible printed circuit, so-called FPC can be considered.

  Next, a first wiring board according to the present invention includes a board, a semiconductor element mounted on the board, a terminal provided on the semiconductor element, and a land portion to which the terminal is connected, and the board. The land portion has a width wider than that of the terminal of the semiconductor element.

  According to the first wiring board, since the width of the land portion provided on the board is wider than the width of the terminal of the semiconductor element, the tolerance of positional deviation of the semiconductor element with respect to the board when mounting the semiconductor element is allowed. The width can be increased. Specifically, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element and the land portion can be reliably contacted. Therefore, it is possible to prevent a defect from occurring when mounting the semiconductor element.

  Next, a second wiring board according to the present invention includes a board, a semiconductor element mounted on the board, a terminal provided on the semiconductor element, and a land portion to which the terminal is connected, and the board. The land portion is provided at least two with respect to the terminal of the semiconductor element.

  According to the second wiring board, since at least two land portions are provided with respect to the terminals of the semiconductor element, it is possible to widen the allowable width with respect to the positional deviation of the semiconductor element with respect to the board when the semiconductor element is mounted. it can. Specifically, even if the semiconductor element is mounted on the substrate in an inclined state, the terminal of the semiconductor element can contact one or both of the two land portions. Therefore, it is possible to prevent contact failure when the semiconductor element is mounted.

  Next, an electronic apparatus according to the present invention includes the electro-optical device having the above-described configuration. The electro-optical device according to the present invention can prevent contact failure when mounting a semiconductor element because the terminal of the semiconductor element and the land portion can be contacted even when the semiconductor element is mounted on the substrate in an inclined state. it can. For this reason, the electronic apparatus according to the present invention using this electro-optical device can prevent a contact failure from occurring.

(First embodiment of electro-optical device and wiring board)
Hereinafter, a case where the present invention is applied to a liquid crystal display device which is an example of an electro-optical device will be described as an example. In addition, embodiment described below is an example of this invention, Comprising: This invention is not limited. In the following description, the drawings will be referred to as necessary. In this drawing, in order to show the important components of the structure composed of a plurality of components in an easy-to-understand manner, the relative dimensions differ from actual ones. Is shown.

  FIG. 1 shows an embodiment of a liquid crystal display device which is an electro-optical device according to the present invention in an exploded state. FIG. 2 shows a cross-sectional structure of the main part when the liquid crystal display device of FIG. 1 is assembled. In FIG. 1, a liquid crystal display device 1 includes a liquid crystal panel 2 as an electro-optical panel, an FPC 5 as a flexible wiring board, and an illumination device 4. The illumination device 4 is disposed on the back side of the liquid crystal panel 2 when viewed from the observation side (that is, in the direction of arrow A) and functions as a backlight. The illumination device 4 may be disposed on the observation side of the liquid crystal panel 2 and function as a front light.

  The illumination device 4 includes a light guide 7 and an LED (Light Emitting Diode) 6 as a light source disposed so as to face the light incident surface 7a. The light guide 7 is formed of, for example, a light transmissive resin. As shown in FIG. 2, a reflective layer 8 is provided on the back side of the light guide 7 as viewed from the observation side as needed. In addition, a diffusion layer 9 is provided on the observation side of the light guide 7, that is, on the light emission surface 7 b side, as necessary. The light generated from the LED 6 arranged facing the light incident surface 7a is introduced into the light guide 7 through the light incident surface 7a, travels through the light guide 7, and is then planarized from the light emitting surface 7b. Light is emitted and supplied to the liquid crystal panel 2. The light source can also be constituted by a point light source other than the LED 6 or a linear light source such as a cold cathode tube.

  In FIG. 1, the liquid crystal panel 2 has a first substrate 11 and a second substrate 12 opposite to the first substrate 11, and these substrates are bonded together by a square or rectangular frame-shaped sealing material 13 when viewed from the direction of arrow A. Form. A gap, a so-called cell gap, is formed between the first substrate 11 and the second substrate 12, and liquid crystal as an electro-optical material is sealed therein to form a liquid crystal layer.

  As shown in FIG. 2, the first substrate 11 has a first transparent substrate 16a that is rectangular or square when viewed from the direction of arrow A. The first translucent substrate 16a is made of, for example, translucent glass, translucent plastic, or the like. In addition, a retardation plate 26a and a polarizing plate 27a are attached to the outer surface of the first light transmitting substrate 16a by sticking or the like.

  Further, the second substrate 12 facing the first substrate 11 has a second light-transmitting substrate 16b that is rectangular or square when viewed from the direction of the arrow A. The second light transmissive substrate 16b is formed of, for example, light transmissive glass, light transmissive plastic, or the like. A phase difference plate 26b and a polarizing plate 27b are attached to the outer surface of the second light transmissive substrate 16b by sticking or the like.

  The liquid crystal panel 2 can be configured in any display mode. For example, as for the liquid crystal driving method, either a simple matrix method or an active matrix method may be used. As for the type of liquid crystal mode, TN (Twisted Nematic), STN (Super Twisted Nematic), liquid crystal having negative dielectric anisotropy, that is, liquid crystal for vertical alignment, or any other liquid crystal can be used. In terms of the daylighting method, any of a transmissive type, a reflective type, and a transflective type may be used. In the present embodiment, since the illumination device 4 is used as shown in FIG. 1, the daylighting method is a transmissive type or a transflective type.

  The simple matrix method is a matrix method in which each pixel does not have an active element, the intersection between the scanning electrode and the data electrode corresponds to a pixel or a dot, and a drive signal is directly applied. As the liquid crystal mode for this method, TN, STN, and vertical alignment mode are used. Next, in the active matrix system, an active element is provided for each pixel or dot, the active element is turned on in the writing period and the data voltage is written, and the active element is turned off in the other period. Is a matrix method. Active elements used in this method include a three-terminal type and a two-terminal type. An example of a three-terminal active element is a TFT (Thin Film Transistor). An example of a two-terminal active element is a TFD (Thin Film Diode).

  In the liquid crystal panel 2 as described above, when performing color display, a color filter is provided on the first substrate 11 or the second substrate 12. The color filter is a filter that selectively transmits light in a specific wavelength range. Specifically, each of the three primary colors R (red), G (green), and B (blue) is associated with each dot on the first substrate 11 or the second substrate 12, and a predetermined arrangement, for example, Arrange them in stripes, deltas, and mosaics.

  The first translucent substrate 16a constituting the first substrate 11 has an overhanging portion 29 that projects to the outside of the second substrate 12 that is the counter substrate. On the surface of the protruding portion 29 on the second substrate 12 side, the driving IC 3 is mounted by a COG (Chip On Glass) technique using an ACF (Anisotropic Conductive Film) 59, for example. As shown in FIG. 1, three driving ICs 3 are mounted. These driving ICs 3 drive the liquid crystal panel 2 by outputting scanning signals and data signals to the electrodes of the liquid crystal panel 2.

  FIG. 3 is an enlarged view of the portion indicated by the arrow B in FIG. 1, that is, the end portion of the overhang portion 29. A plurality of external connection terminals 58 are formed at the end of the protruding portion 29. As shown in FIG. 2, these external connection terminals 58 are connected to input terminals of the driving IC 3, for example, input bumps. Further, the FPC 5 that is a flexible wiring board is connected to these external connection terminals 58 by, for example, an ACF 59. For the connection between the FPC 5 and the external connection terminal 58, a conductive connection method such as soldering or heat sealing can be used.

  A wiring 51 is formed on the liquid crystal layer side of the overhang portion 29. A plurality of the wirings 51 are formed at intervals from each other in the direction perpendicular to the paper surface of FIG. These wirings 51 are connected to output terminals of the driving IC 3, for example, output bumps. These wirings 51 extend toward the inside of the liquid crystal panel 2, that is, toward the liquid crystal layer, and are connected to the scan electrodes and the data electrodes in the case of a simple matrix system. Further, in the case of the active matrix system, it is connected to active elements such as TFD elements and TFT elements and electrodes.

  The FPC 5 connected to the overhanging portion 29 is a substrate having excellent bendability formed using, for example, a film made of polyimide, polyester, or the like as a base material. The FPC 5 has a surface S1 on the side facing the liquid crystal panel 2 and a surface S2 on the side facing the liquid crystal panel 2 when bent as shown by an arrow C in FIG. The surface S1 is a surface that is bent and extends. On the other hand, the surface S2 is a surface that is bent and contracted. The FPC 5 includes a circuit forming portion 5a, an input terminal 5b, a bent portion 5c, and an output terminal 5d (see FIG. 3). The circuit forming portion 5a is a portion where an electronic circuit is formed. The bent portion 5c is a portion that bends when the FPC 5 is bent as indicated by an arrow C. The input terminal 5b is connected to a control circuit, a power source and the like provided in an electronic device such as a mobile phone or a portable information terminal.

  In the present embodiment, an FPC having a two-layer wiring structure is used as the FPC 5. Accordingly, the circuit forming portion 5a is formed between the surface S1 and the surface S2, and electrical conduction is established between these surfaces by through holes as necessary. A plurality of circuit components 32 necessary for driving the liquid crystal panel 2 are mounted on the circuit forming portion 5a on the surface S1 side. A power supply IC 33 as a semiconductor element is mounted on the circuit forming portion 5a. The power supply IC 33 supplies power for driving the circuit component 32. Further, on the circuit forming portion 5a, a plurality of wirings constituting the circuit by connecting the circuit components 32 are formed by patterning.

  FIG. 4 shows a portion indicated by an arrow D in FIG. 1, that is, a region X where the power supply IC 33 is mounted on the circuit forming portion 5a and the vicinity thereof. FIG. 5 shows a cross section according to the line EE of FIG. As shown in FIG. 4, in the power supply IC mounting region X on the circuit forming portion 5a, a plurality of wirings 36 are formed in the vicinity of two sides facing vertically in FIG. Each wiring 36 is formed so that one end thereof enters the inside of the IC mounting region X. The other end of the wiring 36 extends outside the IC mounting region X and is connected to another circuit component or another wiring in the circuit forming portion 5a. The width T2 of the tip portion of each wiring 36 from the portion located inside the IC mounting region X to the vicinity of the outside thereof is formed wider than the wiring of other portions. In this way, the portion having the wide width T2 is the land portion 36a. The bumps 33a, which are terminals of the power supply IC 33, are electrically connected to the land portion 36a.

  Further, in the IC mounting region X, a plurality of wirings 37 are formed in the vicinity of two sides facing left and right in FIG. Each wiring 37 forms an integrated pattern for electrical connection inside the IC mounting region X. The integrally formed wiring 37 is used as a ground line for obtaining a reference potential. Further, the wiring 37 forms a land portion 37a having a wide width T2 from the vicinity of the IC mounting region X to the inside thereof. The bumps 33a, which are terminals of the power supply IC 33, are electrically connected to the land portions 37a. The width T2 of the land portions 36a and 37a is formed approximately twice as large as the width T1 of the bump 33a of the power supply IC 33.

  For the connection between the land portions 36a and 37a formed on the FPC 5 and the power supply IC 33, for example, an ACF 59 can be used. Specifically, as shown in FIG. 5, with the ACF 59 interposed between the power supply IC 33 and the FPC 5, the power supply IC 33 is pressed against the FPC 5 while being heated and thermocompression bonded. By doing so, the plurality of bumps 33a and the plurality of land portions 36a and 37a are individually connected together through the conductive particles 59a in the ACF 59, and conduction can be obtained.

  In FIG. 3, a plurality of wirings 34 extending from the circuit forming portion 5a toward the liquid crystal panel 2 are provided on the surface S2 of the bent portion 5c. These wirings 34 are wirings for transmitting the output signal of the electronic circuit on the circuit forming portion 5a to the output terminal 5d. The output terminal 5 d is connected to the external connection terminal 58 of the first substrate 11. A signal transmitted from the electronic circuit to the output terminal 5d through the wiring 34 is transmitted to the driving IC 3 in FIG. 1 through the external connection terminal 58 and used to drive the liquid crystal panel 2.

  Incidentally, in order to mount the power supply IC 33 on the FPC 5, as shown in FIG. In this case, the power supply IC 33 is pressed by the bonding tool 57 as indicated by an arrow G and pressed onto the FPC 5. At this time, foreign matter may enter between the bonding tool 57 and the power supply IC 33. In this case, the power supply IC 33 may be inclined with respect to the bonding tool 57. If the power supply IC 33 is mounted on the FPC 5 in such a state, the power supply IC 33 may be mounted in a state inclined with respect to the FPC 5.

  FIG. 9 shows a mounting portion of a power supply IC in a conventional liquid crystal display device. In the FPC 105 used in this conventional liquid crystal display device, the widths T3 of the land portions 136a of the plurality of wirings 136 and the land portions 137a of the plurality of wirings 137 are substantially the same as the bumps 133a of the power supply IC 133, that is, in FIG. The land portions 36a and 37a shown in FIG.

  When the power supply IC 133 is mounted on the FPC 105 having the above structure with respect to the FPC 105 with respect to the vertical direction in FIG. 9, as shown in FIG. 9, the land portions 136a and 137a are Some or all of the plurality of bumps 133a may be displaced. In this case, as the inclination of the power supply IC 133 is larger, the position of the bump 133a is more easily displaced. Further, when the bump 133a is displaced in the width direction of the land portion 136a or 137a, the bump 133a may not come into contact with the land portion 136a or 137a. As a result, there is a possibility that a conduction failure may occur between the power supply IC 133 and the wiring 136 or 137.

  In this regard, in this embodiment, as shown in FIG. 4, the land portion 36 a of the wiring 36 and the land portion 37 a of the wiring 37 are set to a width T 2 that is approximately twice the width T 1 of the bump 33 a of the power supply IC 33. It was made to form. By doing so, the allowable width of the positional deviation of the power supply IC 33 with respect to the FPC 5 when the power supply IC 33 is mounted can be widened. Specifically, even if the power supply IC 33 is mounted on the FPC 5 in an inclined state, the bumps 33a of the power supply IC 33 and the land portions 36a or 37a can be reliably contacted. As a result, it is possible to prevent a defect from occurring when the power supply IC 33 is mounted on the FPC 5.

(Second embodiment of electro-optical device and wiring board)
Next, other embodiments of the electro-optical device and the wiring board according to the present invention will be described. In the present embodiment, the same elements as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 6 shows another embodiment of a liquid crystal display device which is an electro-optical device according to the present invention. Specifically, a portion indicated by an arrow D in FIG. 1, that is, a region X where the power supply IC 33 is mounted on the circuit forming portion 5a and the vicinity thereof are shown.

  In the first embodiment, as shown in FIG. 4, the land portions 36a and 37a are each formed in a single band shape. In addition, the width T2 of the land portions 36a and 37a formed in the band shape is wider than the width of the main line portions 36 and 37 of the wiring. In the present embodiment, as shown in FIG. 6, two land portions 46a and 47a are formed for one wiring 46 and 47, respectively. That is, two land portions 46 or 47 are provided for one bump 33a.

  The distance D0 between the two land portions 46a and 47a branched from one wiring is formed narrower than the width T1 of the bump 33a. Further, the overall width T4 formed by these two adjacent land portions 46a and 47a can be set in the same manner as the width T2 of the land portions 36a and 37a in FIG. That is, the width T4 can be formed approximately twice the width T1 of the bump 33a.

  In the present embodiment, two land portions 46 a and 47 a are provided on the bump 33 a of the power supply IC 33. By doing so, the allowable width of the positional deviation of the power supply IC 33 with respect to the FPC 5 when the power supply IC 33 is mounted can be widened. Specifically, even if the power supply IC 33 is mounted on the FPC 5 in an inclined state, the bump 33a of the power supply IC 33 can contact at least one of the two land portions or both. As a result, it is possible to prevent a defect from occurring when the power supply IC 33 is mounted on the FPC 5.

  Further, the distance D0 between two adjacent land portions 46a and 47a and the entire width T4 of the two land portions 46a and 47a are formed to be the same width as the width T2 of the land portions 36a and 37a shown in FIG. ing. That is, the land portions 46a and 47a of the present embodiment have a shape in which the slits having the interval D0 are provided in the land portions 36a and 37a. In this case, since the area of the entire wiring formed on the FPC 5 in FIG. 6 can be made smaller than the area of the entire wiring in FIG. 1, the FPC 5 can be formed lightly. Thereby, the liquid crystal display device 1 can be lightened.

  Further, in FIG. 6, one width T5 of the land portions 46a and 47a is formed narrower than the width T2 of the land portions 36a and 37a in FIG. In this case, since it is difficult to be affected by the stress generated when the FPC 5 is bent, disconnection hardly occurs at the boundary between the wiring 46 and the land portion 46a.

(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.

  For example, in each of the embodiments described above, as shown in FIG. 4, the width T2 of the land portions 36a and 37a formed on the FPC 5 is formed approximately twice the width T1 of the bump 33a. Further, as shown in FIG. 6, the widths T4 of the land portions 46a and 47a are formed approximately twice as large as the width T1 of the bumps 33a. However, the width T2 of the land portions 36a and 37a and the width T4 of 46a and 47a may not be twice the width T1 of the bump 33a as long as it is wider than the width T1 of the bump 33a. Even in this case, since the tolerance for the positional deviation of the power supply IC 33 can be widened, it is possible to prevent a defect from occurring when the power supply IC 33 is mounted on the FPC 5.

  In each of the above embodiments, the present invention is applied when the power supply IC 33 is used as the semiconductor element. However, the present invention can also be applied when a semiconductor element other than the power supply IC 33 is mounted on the substrate.

  In each of the above embodiments, the present invention is applied when the FPC 5 that is a flexible wiring board is used as the substrate connected to the electro-optical panel. However, the wiring board can be applied to a case where a semiconductor element is mounted on a board having flexibility other than FPC or a board having no flexibility.

  The present invention also relates to an electro-optical device other than a liquid crystal display device, for example, an organic EL device, an inorganic EL device, a plasma display device (PDP), an electrophoretic display (EPD), a field emission display device ( It can also be applied to FED (Field Emission Display).

(Embodiment of electronic device)
Next, an embodiment of an electronic device according to the present invention will be described with reference to the drawings. FIG. 7 shows a block diagram of an embodiment of an electronic apparatus according to the present invention. The electronic apparatus shown here includes a liquid crystal display device 91 and a control circuit 70 that controls the liquid crystal display device 91. The liquid crystal display device 91 includes a liquid crystal panel 71 and a drive circuit 72 composed of a semiconductor IC or the like. The control circuit 70 includes a display information output source 73, a display information processing circuit 74, a power supply circuit 76, and a timing generator 77.

  The display information output source 73 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. Have The display information output source 73 supplies display information to the display information processing circuit 74 in the form of an image signal or the like in a predetermined format based on various clock signals generated by the timing generator 77.

  The display information processing circuit 74 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to obtain image information thereof. Are supplied to the drive circuit 72 together with the clock signal CLK. The drive circuit 72 includes a scanning line drive circuit, a data line drive circuit, and an inspection circuit. The power supply circuit 76 supplies a predetermined voltage to each of the above components.

  The liquid crystal display device 91 can be configured by, for example, the liquid crystal display device 1 shown in FIG. The liquid crystal display device 1 has the wiring structure shown in FIG. 4 or 6 on the FPC 5. In the liquid crystal display device 1, when the power supply IC 33 is mounted on the FPC 5, even if the position of the power supply IC 33 is deviated, it is between the power supply IC 33 and the wirings 36 and 37 even if the position is within an allowable range. Can prevent poor contact. For this reason, even in the present electronic apparatus using the liquid crystal display device 1, it is possible to prevent the occurrence of contact failure, and hence stable display can be performed.

  FIG. 8 shows an embodiment when the present invention is applied to a mobile phone which is an example of an electronic apparatus. A cellular phone 80 shown here has a main body portion 81 and a display body portion 82 provided on the main body portion 81 so as to be opened and closed. A display device 83 configured by an electro-optical device such as a liquid crystal display device is disposed inside the display body portion 82, and various displays related to telephone communication can be visually recognized on the display body portion 82 on the display screen 84. Operation buttons 86 are arranged on the main body 81.

  An antenna 87 is attached to one end of the display body portion 82 so as to be extendable. A speaker (not shown) is arranged inside the receiver unit 88 provided at the upper part of the display body unit 82. In addition, a microphone (not shown) is incorporated in the transmitter 89 provided at the lower end of the main body 81. A control unit for controlling the operation of the display device 83 is stored in the main body 81 or the display body unit 82 as a part of the control unit that controls the entire mobile phone or separately from the control unit. The

  The display device 83 can be configured by, for example, the liquid crystal display device 1 shown in FIG. The liquid crystal display device 1 has the wiring structure shown in FIG. 4 or 6 on the FPC 5. In the liquid crystal display device 1, when the power supply IC 33 is mounted on the FPC 5, even if the position of the power supply IC 33 is deviated, it is between the power supply IC 33 and the wirings 36 and 37 even if the position is within an allowable range. Can prevent poor contact. Therefore, even in the mobile phone 80 of FIG. 8 using the liquid crystal display device 1, it is possible to prevent the occurrence of contact failure, and hence stable display can be performed.

(Modification)
In addition to the mobile phone described above, the electronic device according to the present invention includes a personal computer, a liquid crystal television, a digital still camera, a wristwatch, a viewfinder type or a monitor direct view type video tape recorder, a car navigation device, a pager, An electronic notebook, a calculator, a word processor, a workstation, a video phone, a POS terminal, and other various devices can be considered.

1 is an exploded perspective view showing a liquid crystal display device which is an embodiment of an electro-optical device according to the invention. FIG. It is sectional drawing which shows the cross-section of the principal part in the state which assembled the liquid crystal display device of FIG. It is sectional drawing which expands and shows the part shown by the arrow B of FIG. It is a top view which shows the principal part of one Embodiment of the wiring board which concerns on this invention. It is sectional drawing according to the EE line of FIG. It is a top view which shows the principal part of other embodiment of the wiring board which concerns on this invention. It is a block diagram which shows one Embodiment of the electronic device which concerns on this invention. It is a perspective view which shows other embodiment of the electronic device which concerns on this invention. It is a top view which shows the principal part of an example of the conventional wiring board.

Explanation of symbols

1. 1. liquid crystal display device (electro-optical device), LCD panel (electro-optical panel),
3. Driving IC, 4. 4. lighting device; FPC (wiring board), 5a. Circuit forming section, 5b. Input terminal, 5c. Bent part, 5d. 5. Output terminal LED,
7). Light guide, 7a. 7. light incident surface, 7b, light emitting surface, A reflective layer, 9. Diffusion layer,
11. First substrate, 12. A second substrate, 16a, 16b. Translucent substrate,
26a, 26b. Retardation plate 27a, 27b. Polarizing plate, 29. Overhang,
32. Circuit components, 33. IC for power supply (semiconductor element),
36, 37, 46, 47. Wiring, 36a, 37a, 46a, 47a. Land part,
58. Terminal for external connection, 59. ACF, 80. Mobile phones (electronic devices),
83. Liquid crystal display, S1, S2. Surface, X. Mounting area of power IC

Claims (9)

An electro-optic panel containing an electro-optic material;
A substrate connected to the electro-optic panel;
A semiconductor element mounted on the substrate;
Terminals provided on the semiconductor element;
A land portion to which the terminal is connected and wiring provided on the substrate;
An electro-optical device, wherein a width of the land portion is wider than a width of the terminal of the semiconductor element.   2. The electro-optical device according to claim 1, wherein the width of the land is approximately twice the width of the terminal. An electro-optic panel containing an electro-optic material;
A substrate connected to the electro-optic panel;
A semiconductor element mounted on the substrate;
Terminals provided on the semiconductor element;
A land portion to which the terminal is connected and wiring provided on the substrate;
2. The electro-optical device according to claim 1, wherein at least two land portions are provided for the terminals of the semiconductor element.   4. The electro-optical device according to claim 3, wherein an interval between adjacent wirings among the at least two wirings in the land portion is narrower than a width of the terminal.   5. The electro-optical device according to claim 1, wherein the semiconductor element is a power supply IC for supplying power to the electro-optical panel.   6. The electro-optical device according to claim 1, wherein the wiring board is a flexible wiring board. A substrate,
A semiconductor element mounted on the substrate;
Terminals provided on the semiconductor element;
A land portion to which the terminal is connected and wiring provided on the substrate;
The wiring board, wherein a width of the land portion is wider than a width of the terminal of the semiconductor element. A substrate,
A semiconductor element mounted on the substrate;
Terminals provided on the semiconductor element;
A land portion to which the terminal is connected and wiring provided on the substrate;
The wiring board according to claim 1, wherein at least two land portions are provided for the terminals of the semiconductor element. An electronic apparatus comprising the electro-optical device according to claim 1.

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