JP2006035775A - Antistatic resin molded product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antistatic resin molded product rich in alcohols wiping-off resistance, reduced in the rise of surface resistivity even if the wiping-off washing of a surface is repeated using wiping cloth or the like containing alcohols and capable of keeping a practically sufficient antistatic capacity. <P>SOLUTION: The antistatic resin molded product is obtained by laminating an antistatic layer 2b at least on one side of a resin molded product 1 through an adhesive layer 2a and the antistatic layer 2b is composed of a binder resin 2c and extremely fine conductive fibers 3 while a curing agent 4 is added to the binder resin 2c. Since the antistatic layer 2b is reinforced by the reaction of the binder resin 2c with the curing agent 4 or the curing agent 4 itself and hardly attacked by alcohols, the peeling of the antistatic layer 2b is sharply suppressed even if wiping-off washing of the surface of the antistatic layer 2b is repeated using alcohols, and the rise in the surface resistivity accompanied by the peeling of the antistatic layer 2b becomes slight and a practically sufficient initial antistatic capacity is kept. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an antistatic resin molded article with little increase in surface resistivity even after repeated wiping and cleaning of the surface with a wiping cloth or the like with alcohols, particularly isopropyl alcohol (hereinafter referred to as IPA).

  Conventionally, antistatic resin plates that release static electricity and prevent dust adhesion have been used in applications that hate dust, such as clean room partitions, carrier boxes used in semiconductor and liquid crystal manufacturing, and outer panels of manufacturing equipment. . Also, in order to ensure the cleanliness of a clean room above a certain level, it is indispensable to remove contaminating molecules after construction of the cleanroom or during regular maintenance of the cleanroom. ) Is wiped off with a wiping cloth containing alcohol or the like.

As such an antistatic resin plate, the present applicant has formed an antistatic layer made of a transparent thermoplastic resin containing an ultrafine long carbon fiber that is twisted and intertwined on the surface of a transparent thermoplastic resin substrate. A functional resin plate was proposed (Patent Document 1).
JP 2001-62952 A

  The antistatic resin plate described in Patent Document 1 has many advantages such as little variation in surface resistivity, moderate antistatic properties, and good transparency. Repeated wiping and cleaning of the surface of the antistatic resin plate with a wiping cloth containing alcohols such as the above results in a significant increase in surface resistivity, making it difficult to achieve satisfactory antistatic performance (antistatic performance). This is thought to be because the interface between the antistatic layer on the surface and the base material is attacked by alcohols, the deterioration is accelerated, and the antistatic layer peels off from the base material little by little.

  The present invention has been made to address the above problems, and has excellent resistance to wiping off alcohols. Even if the surface is wiped and cleaned repeatedly with a wiping cloth containing alcohols, the surface resistivity does not increase and is practically used. An object of the present invention is to provide an antistatic resin molded product that can maintain sufficient antistatic performance.

  In order to solve the above problems, the antistatic resin molded article of the present invention is an antistatic resin molded article in which an antistatic layer is laminated on at least one surface of a resin molded article via an adhesive layer, The layer is composed of a binder resin and ultrafine conductive fibers, and the binder resin contains a curing agent.

  In the antistatic resin molded article of the present invention, it is desirable that the curing agent is contained in the binder resin in an amount of 2 to 20% by mass. It is also desirable that the binder resin is a vinyl chloride resin and the curing agent is a polyisocyanate. Further, in a state where the ultrafine conductive fibers of the antistatic layer are separated one by one, or in a state where a plurality of bundles are bundled and separated one by one, they are dispersed and contacted with each other without agglomeration. In particular, it is desirable that the ultrafine conductive fiber is a carbon nanotube. In the present invention, the term “contact” is a term meaning both the case where the ultrafine conductive fibers are actually in contact and the case where the ultrafine conductive fibers are close to each other with a minute gap that allows conduction.

  When the curing agent is contained in the binder resin of the antistatic layer as in the antistatic resin molded body of the present invention, the antistatic layer is reinforced by the reaction between the binder resin and the curing agent or the curing agent itself. Therefore, even if the surface is wiped and washed repeatedly with alcohols such as IPA, the penetration of alcohol into the adhesive layer and the antistatic layer peeling off due to deterioration of the adhesive layer is greatly suppressed. Is done. Therefore, the increase in the surface resistivity accompanying the peeling of the antistatic layer is slight, and the practically sufficient initial antistatic performance is maintained. Such an effect is remarkable in the antistatic resin molding in which 2 to 20% by mass of the curing agent is contained in the binder resin of the antistatic layer.

  In the antistatic resin molded product in which the binder resin of the antistatic layer is a vinyl chloride resin and the curing agent is a polyisocyanate, the polyisocyanate is urethane-bonded to the hydroxyl group derived from the vinyl chloride resin, and the network structure is formed. Since the binder resin portion is considerably strengthened by the formation, even if wiping and washing with alcohol such as IPA is repeated, an increase in surface resistivity due to peeling of the antistatic layer can be sufficiently suppressed.

  Further, in a state where the ultrafine conductive fibers of the antistatic layer are separated one by one, or in a state where a plurality of bundles are bundled and separated one by one, they are dispersed without contacting each other and are in contact with each other Antistatic resin moldings can be used to obtain transparent antistatic resin moldings because the ultrafine conductive fibers can contact each other and exhibit sufficient antistatic performance even if the content of ultrafine conductive fibers is reduced. In particular, when the ultrafine conductive fiber is a carbon nanotube, since the carbon nanotube is thin and long, the content can be further reduced while maintaining sufficient antistatic properties by contacting with each other to improve transparency. It is extremely advantageous for improvement.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing a partially enlarged antistatic resin molded body according to an embodiment of the present invention.

  This embodiment shows a transparent plate-shaped antistatic resin molded body. Basically, a transparent plate-shaped resin molded body 1, an adhesive layer 2a laminated on the surface thereof, and an antistatic layer. 2b.

  The resin molded body 1 is obtained by molding a transparent thermoplastic resin or a curable resin that is cured by heat, ultraviolet rays, electron beams, radiation, or the like into a plate shape. Examples of the thermoplastic resin include polyethylene, polypropylene, and cyclic resin. Olefins such as polyolefin, vinyl resins such as polyvinyl chloride, polymethyl methacrylate and polystyrene, cellulose resins such as nitrocellulose and triacetyl cellulose, esters such as polycarbonate, polyethylene terephthalate, polydimethylcyclohexane terephthalate and aromatic polyester System resins, ABS resins, copolymer resins of these resins, mixed resins of these resins, and the like are used, and as curable resins, for example, epoxy resins, polyimide resins, acrylic resins, and the like are used. A plasticizer, a stabilizer, an ultraviolet absorber, and the like are appropriately added to the resin molded body 1 to improve moldability, thermal stability, weather resistance, and the like. The resin molded body 1 may have a thickness according to the application, and for example, it may be about 0.03 to 10 mm which is a normal thickness of a film and a plate.

  In this embodiment, although the resin molding 1 is shape | molded in the transparent plate-shaped body, you may shape | mold to other unusual shapes, and may mix | blend a filler and a coloring agent and may make it opaque.

  In this embodiment, the adhesive layer 2a and the antistatic layer 2b laminated on the surface of the resin molded body 1 are provided as an antistatic film 2 in which these are laminated and integrated, and are laminated by a method such as laminating. Is. That is, by laminating the antistatic film 2 provided with the antistatic layer on the surface of the adhesive resin film on the surface of the resin molded body 1, the adhesive resin film is used as the adhesive layer 2a.

  As described above, the adhesive layer 2a is made of an adhesive resin film, and as such a film, a transparent film made of a thermoplastic resin that is compatible with the above-mentioned resin molded body 1 or the same type. A typical example is a film made of any one of an acrylic resin, a vinyl chloride resin, and a vinyl chloride-vinyl acetate copolymer resin excellent in adhesiveness, or a mixed resin thereof. As described above, when an adhesive resin film is used as the adhesive layer 2a, the antistatic film 2 having the antistatic layer 2b laminated thereon is formed into a resin molded body by means of, for example, thermocompression bonding, extrusion lamination, or transfer. Thus, the antistatic layer 2b can be laminated and integrated with the surface of the resin molded body 1 with high adhesive strength via the adhesive layer 2a. In this case, the thickness of the adhesive layer 2a is not particularly limited, but it is preferable to use an adhesive layer film 2a having a thickness of about 50 to 250 μm having strength as a base film of the antistatic film 2.

  The antistatic layer 2b laminated on the adhesive layer 3 is a transparent layer composed of a binder resin 2c compatible with the adhesive layer 2a and the ultrafine conductive fiber 3, and the binder resin 2c includes a curing agent. 4 is contained. Then, in a state where the ultrafine conductive fibers 3 are separated one by one, or in a state where a bundle of a plurality of bundles are separated one by one, they are dispersed without being aggregated and in contact with each other. That is, as shown in FIG. 2 (A), the ultrafine conductive fibers 3 are buried in the binder resin 2c and dispersed in the above dispersed state and are in contact with each other, or as shown in FIG. 2 (B). As described above, a part of the ultrafine conductive fiber 3 enters the binder resin 2c, and the other part protrudes or is exposed from the surface of the binder resin 2c, and is dispersed in the dispersed state and in contact with each other, or Some ultrafine conductive fibers 3 are buried in the binder resin 2c as shown in FIG. 2A, and other ultrafine conductive fibers 3 protrude or are exposed from the surface of the binder resin 2c as shown in FIG. 2B. They are dispersed in contact with each other.

  FIG. 3 schematically shows a planar dispersion state of the ultrafine conductive fibers 3. As can be understood from FIG. 3, the ultrafine conductive fibers 3 are slightly bent but separated one by one or one bundle, and are controlled in a state where they are simply crossed without being intricately entangled with each other, that is, without agglomeration. It is dispersed inside or on the surface of the binder resin 2c of the electric layer 2b and is in contact at each intersection. When dispersed in this manner, the ultrafine conductive fibers 3 are present in a wide range as compared with the case where they are aggregated, and the chance of contact between the fine conductive fibers is significantly increased. Even if the amount is reduced, the antistatic layer 2b can exhibit practically sufficient antistatic properties. Accordingly, the transparency is improved by the amount of the ultrafine conductive fiber 3 reduced, and the antistatic layer 2b can be thinned, so that the transparency can be further improved. Furthermore, when the antistatic resin molded body is bent as described above, even if the antistatic resin molded body is bent, even if the bent portion of the ultrafine conductive fiber 3 extends or the contact point is removed, the other ultrafine conductive fiber 3 Since there is no contact between the ultrafine conductive fibers 3, there is no concern that the surface resistivity will decrease. In FIG. 3, the curing agent 4 is not shown.

  The above-mentioned ultrafine conductive fibers 3 do not have to be separated and dispersed completely one by one or one bundle, and there may be small agglomerates that are intertwined with each other, but the size is the antistatic layer 2b. Is observed with an optical microscope, and if there are aggregated lumps, the major axis and minor axis are measured, and the average value is preferably 0.5 μm or less.

  The thickness of the antistatic layer 2b is preferably as thin as 30 to 500 nm. Even if the antistatic layer 2b is formed as thin as described above, the contact with the ultrafine conductive fiber 3 is sufficiently maintained to provide a practically sufficient antistatic property. In addition, transparency will be improved. A more preferable thickness of the antistatic layer 2b is 50 to 300 nm.

  As the ultrafine conductive fiber 3, ultrafine carbon fibers such as carbon nanotubes, carbon nanohorns, carbon nanowires, carbon nanofibers, and graphite fibrils, or metal nanotubes such as platinum, gold, silver, nickel, and silicon, and ultrafine lengths such as nanowires are used. Metal fibers, metal oxide nanotubes such as zinc oxide, and ultrafine metal oxide fibers such as nanowires are 0.3 to 100 nm in diameter and 0.1 to 20 μm in length, preferably 0.1 in length. An ultrafine conductive fiber having a thickness of 10 μm to 10 μm is preferably used.

  Among these ultrafine conductive fibers, carbon nanotubes are most preferably used. This carbon nanotube has a multi-walled carbon nanotube concentrically provided with a plurality of cylindrically closed carbon walls having different diameters around the central axis, and a single cylindrically closed carbon wall around the central axis. There are single-walled carbon nanotubes, both of which are preferably used. Most of the multi-walled carbon nanotubes are dispersed in a state where they are separated one by one, but the two- to three-walled carbon nanotubes may be dispersed in a bundle. On the other hand, single-walled carbon nanotubes do not exist alone, but two or more are present in a bundle, and the bundle is dispersed in a state of being separated one by one.

The content of the ultrafine conductive fiber 3 in the antistatic layer 2b needs to be 2 to 90% by mass in order to obtain antistatic performance, and a more preferable content is in the range of 4 to 30% by mass. When the content of the ultrafine conductive fiber 3 is less than 2% by mass, a practically sufficient antistatic property with a surface resistivity of 10 ⁵ Ω / □ to 10 ¹¹ Ω / □ is obtained even when the thickness of the antistatic layer is 500 nm. Since it becomes difficult to obtain the resin molding which has, it is not preferable. On the other hand, when the content of the ultrafine conductive fiber 3 is more than 90% by mass, it is difficult to sufficiently disperse the ultrafine conductive fiber, or the dispersion stability of the coating liquid is extremely lowered, which is not preferable. Moreover, the thickness of the antistatic layer 2b needs to be 20 to 500 nm, and a more preferable thickness is in the range of 50 to 300 nm. If the thickness of the antistatic layer 2b is smaller than 20 nm, the antistatic layer 2b does not form a uniform layer and does not exhibit practically sufficient antistatic properties, which is not preferable.

  As the binder resin 2c of the antistatic layer 2b, a resin having the same type or compatibility with the adhesive layer 2a is used. Therefore, when the adhesive layer 2a is the aforementioned vinyl chloride resin layer or acrylic resin, vinyl chloride resin, vinyl chloride-vinyl acetate copolymer resin (with vinyl acetate occupying a ratio of 20% by mass or less), chloride A resin such as a vinyl chloride resin such as a mixed resin of vinyl resin and vinyl acetate resin (vinyl acetate resin occupying a ratio of 20% by mass or less) is preferably used.

  The curing agent 4 contained in the binder resin 2c of the antistatic layer 2b serves to reinforce the antistatic layer 2b and improve the resistance to wiping off alcohols. For example, it reacts with the binder resin 2c to crosslink. A curing agent or a curable resin is used.

  When the binder resin 2c is the vinyl chloride resin described above, the curing agent 4 that reacts with the resin is preferably a polyisocyanate, for example, a diisocyanate such as 2,4-tolylene diisocyanate and its isomer or a mixture of isomers. used. When such an isocyanate compound is contained, the isocyanate compound is urethane-bonded with a hydroxyl group derived from the vinyl chloride resin to form a network structure, whereby the binder resin portion is strengthened and the antistatic layer 2b is affected by alcohols. Therefore, even if the surface wiping and washing is repeated with alcohol such as IPA, the penetration of the alcohol to the adhesive layer 2a and the peeling of the antistatic layer 2b due to deterioration of the adhesive layer 2a are greatly suppressed. The increase in surface resistivity accompanying the peeling of the antistatic layer is slight, and the practically sufficient initial antistatic performance is maintained.

  Further, as the curable resin to be contained as the curing agent 4 in the binder resin 2c of the antistatic layer 2b, any resin such as a natural curable type, a photo curable type, an ultraviolet curable type, an electron beam curable type, and a thermosetting type is used. When these curable resins are uniformly contained in the binder resin and strengthened, the deterioration and penetration of the antistatic layer 2b by alcohols such as IPA are suppressed as in the case of the above-described reaction type curing agent. Therefore, the increase in surface resistivity is reduced. As specific curable resins, phenol resins, melamine resins, diallyl phthalate resins, thermosetting polyester resins, urea resins, epoxy resins, polyimide resins, thermosetting acrylic resins and the like are preferably used.

  The content of the curing agent 4 is preferably 2 to 20% by mass with respect to the binder resin 2c of the antistatic layer 2b. If it is less than 2% by mass, the effect of suppressing the penetration of alcohols by strengthening the antistatic layer is insufficient and the effect of suppressing the increase in surface resistivity is hardly observed. On the other hand, if it exceeds 20% by mass, the reaction is caused by the binder resin 2c. The content becomes more than the group, and the reinforcement by the curable resin is not seen, and the material is wasted.

  The antistatic layer 2b is formed by uniformly dispersing the above-mentioned ultrafine conductive fibers in a volatile solvent and adding the above-mentioned curing agent to prepare a coating solution, which is then applied to the adhesive layer 2a (adhesive layer). It is desirable to apply it to the surface of a film of a conductive resin) and dry and solidify it. In that case, in order to form the antistatic layer 2b having excellent antistatic properties, it is necessary to prepare a coating liquid in which very fine conductive fibers are dispersed very finely and uniformly. Therefore, a high-speed impeller, sand mill, attritor It is important to thoroughly mix and disperse with three rolls and other known methods and devices.

  Moreover, in order to improve the dispersibility of the ultrafine conductive fiber 3 in the antistatic layer 2b, it is desirable to add a dispersant. As such a dispersant, a polymer dispersant such as an alkyl ammonium salt solution of an acidic polymer, a tertiary amine-modified acrylic copolymer, a polyoxyethylene-polyoxypropylene copolymer, a coupling agent, or the like is used. In addition, an additive such as an ultraviolet absorber, a surface modifier, and a stabilizer may be appropriately added to the antistatic layer 2c to improve weather resistance and other physical properties.

  The antistatic resin molded body having the above configuration is manufactured, for example, by the following method. First, a coating solution prepared by dispersing ultrafine conductive fibers in a binder resin solution and adding a curing agent on the surface of a film made of an adhesive resin (the film that becomes the adhesive layer 2a) is coated and dried to control electricity. The antistatic film 2 is produced by forming the layer 2b. Then, the antistatic film 2 is manufactured by laminating the antistatic film 2 on the surface of the resin molded body 1 by means such as thermocompression bonding, extrusion lamination, and adhesion.

  Another method is to apply a coating solution prepared by dispersing ultrafine conductive fibers in a binder resin solution and further adding a curing agent on a release film, and drying to form an antistatic layer 2b. A transfer film is formed by applying and drying a resin solution made of an adhesive resin to form the adhesive layer 2a. And it is the method of manufacturing an antistatic resin molding by superimposing the transfer film on the surface of the resin molding 1 so that the adhesive layer 2a is on the resin molding side, and thermocompression-bonding and transferring.

  In the antistatic resin molded body manufactured in this way, the antistatic layer 2b laminated on the surface of the resin molded body 1 via the adhesive layer 2a is reinforced by the curing agent 4 contained in the binder resin 2c. Therefore, even if the surface is wiped and washed repeatedly with alcohol such as IPA, the alcohol penetrates to the adhesive layer 2a and the antistatic layer 2b is peeled off due to deterioration of the adhesive layer 2a. It is greatly suppressed. As a result, the resistance to wiping off alcohols is improved, the increase in surface resistivity accompanying the peeling of the antistatic layer 2b is slight, and the practically sufficient initial antistatic performance can be maintained. In addition, in a state where the ultrafine conductive fibers 3 of the antistatic layer 2b are separated one by one, or in a state where a bundle of a plurality of bundles is separated one by one, they are dispersed without agglomeration and contact each other. Therefore, this antistatic resin molded article can secure sufficient antistatic properties by ensuring the contact between the ultrafine conductive fibers even if the content of the ultrafine conductive fibers 3 is reduced. Transparency can be improved by the amount that 3 can be reduced.

  The antistatic resin molded body of the present embodiment is obtained by laminating the adhesive layer 2a and the antistatic layer 2b on the surface of the resin molded body 1. Further, a thin resin topcoat is formed on the antistatic layer 2b. A layer may be formed. Even if such a topcoat layer is formed, the antistatic performance of the antistatic layer 2b is exhibited, and a molded body having antistatic properties can be obtained.

  Next, more specific examples of the antistatic resin molded body according to the present invention will be described.

[Example 1]
In a solvent (cyclohexanone), a vinyl chloride-vinyl acetate copolymer (with a vinyl acetate ratio of 10% by mass) is dissolved as a binder resin, and single-walled carbon nanotubes [literary chemical physics letters, 323 (2000)]. , Synthesized based on P580-585, diameter 1.3 to 1.8 nm], and an alkylammonium salt solution of an acidic polymer as a dispersing agent is added, mixed and dispersed uniformly, and further a XOX80 hardener as a diisocyanate curing agent. (Manufactured by Dainippon Ink & Chemicals, Inc.), 0.3% by mass of single-walled carbon nanotubes, 0.1% by mass of a dispersant, 2.0% by mass of a binder resin, and 0% of a diisocyanate curing agent. A coating liquid containing 1% by mass (hereinafter referred to as a curing agent-containing CNT coating liquid) It was manufactured.

  Then, a polymethyl methacrylate film (PMMA film) having a thickness of 100 μm, a total light transmittance of 94%, and a haze of 0.6% is used as a film to be an adhesive layer, and the above curing agent-containing CNT coating liquid is applied to the surface. By reacting the curing agent with the binder resin while heating at 50 ° C. for 60 minutes, an antistatic layer having a thickness of 240 nm (the content of the curing agent with respect to the binder resin is 5% by mass) is formed. Produced.

  This antistatic film is laminated on the surface of a 5.0 mm thick polycarbonate resin plate (total light transmittance: 89.5%, haze: 0.2%) and thermocompression bonded into the binder resin of the antistatic layer. A transparent antistatic resin plate containing 5% by mass of a curing agent was produced.

  Table 1 below shows the results of measuring the surface resistivity, total light transmittance, and haze of the antistatic resin plate. In addition, the operation of wiping the surface of the antistatic resin plate (surface of the antistatic layer) with a wiping cloth containing IPA was repeated, and the surface resistivity, total light transmittance, haze after 100, 200, and 300 times were repeated. The results are also shown in Table 1 below.

  The surface resistivity is a value measured with a Hiresta manufactured by Mitsubishi Chemical Corporation, and the total light transmittance and haze are measured with a direct reading haze computer HGM-2DP manufactured by Suga Test Instruments Co., Ltd. according to ASTM D1003. It is the value.

[Example 2]
A curing agent-containing CNT coating liquid having the same composition as in Example 1 was prepared, except that the amount of the diisocyanate curing agent in the curing agent-containing CNT coating liquid of Example 1 was changed from 0.1% by mass to 0.2% by mass. In the same manner as in Example 1, an antistatic resin plate containing 10% by mass of the curing agent in the binder resin of the antistatic layer was produced. For this antistatic resin plate, the surface resistivity, total light transmittance, and haze were measured in the same manner as in Example 1, and the operation of wiping with a wiping cloth containing IPA was performed 100 times, 200 times, and 300 times. The surface resistivity, total light transmittance, and haze after the measurement were repeated, and the results are also shown in Table 1 below.

  A curing agent-containing CNT coating liquid having the same composition as in Example 1 was prepared, except that the amount of the diisocyanate curing agent in the curing agent-containing CNT coating liquid of Example 1 was changed from 0.1% by mass to 0.3% by mass. In the same manner as in Example 1, an antistatic resin plate containing 15% by mass of a curing agent in the binder resin of the antistatic layer was produced. For this antistatic resin plate, the surface resistivity, total light transmittance, and haze were measured in the same manner as in Example 1, and the operation of wiping with a wiping cloth containing IPA was performed 100 times, 200 times, and 300 times. The surface resistivity, total light transmittance, and haze after the measurement were repeated, and the results are also shown in Table 1 below.

[Comparative Example 1]
A CNT coating liquid having the same composition as in Example 1 was prepared except that it did not contain a diisocyanate curing agent. Similarly to Example 1, an antistatic resin containing no curing agent in the binder resin of the antistatic layer. A board was produced. For this antistatic resin plate, the surface resistivity, total light transmittance, and haze were measured in the same manner as in Example 1, and the operation of wiping with a wiping cloth containing IPA was performed 100 times, 200 times, and 300 times. The surface resistivity, total light transmittance, and haze after the measurement were repeated, and the results are also shown in Table 1 below.

From Table 1, the antistatic resin plate of Comparative Example 1 which does not contain a diisocyanate curing agent in the binder resin of the antistatic layer has an initial surface resistivity of 10 ⁸ Ω / □ order and that of Examples 1-3. Despite the fact that it is not much different from that of an electric resin plate, the surface resistivity rapidly increases as the number of wiping operations using a wiping cloth impregnated with IPA increases. It turns out that it rises to 10 ¹⁴ Ω / □ or more and the antistatic performance cannot be exhibited.

In contrast, the antistatic resin plates of Examples 1 to 3 containing 5% by mass, 10% by mass, and 15% by mass of the diisocyanate curing agent in the binder resin of the antistatic layer, respectively, as the number of wiping increases. Although the surface resistivity increases, the increase is slow, and even after 300 wiping operations, the surface resistivity is in the range of 10 ⁹ Ω / □ to 10 ¹¹ Ω / □, which is practically sufficient. It can be seen that the anti-static performance can be demonstrated. In particular, the antistatic resin plate of Example 2 containing 10% by mass of a diisocyanate curing agent has a moderate increase in surface resistivity, and the surface resistivity is on the order of 10 ⁹ Ω / □ even after 300 wiping operations. And the resistance to wiping off alcohols is remarkable.

  From the above, the inclusion of a diisocyanate curing agent in the binder resin of the antistatic layer is effective in improving the anti-alcohol wiping property of the antistatic layer and suppressing an increase in surface resistivity. It can be seen that when the agent is contained at a content of about 10% by mass, excellent alcohol wiping resistance is exhibited.

  The antistatic resin plates of Examples 1 to 3 and the antistatic resin plate of Comparative Example 1 both had an initial total light transmittance of 82.5% or more and an initial haze of 6.5% or less. In addition, although the antistatic layer containing CNT is formed, the transparency is good. This is because the content of CNTs can be reduced as a result of sufficient dispersion and contact conduction of CNTs.

  Furthermore, the antistatic resin plates of Examples 1 to 3 containing a diisocyanate curing agent in the binder resin of the antistatic layer are more haze than the antistatic resin plate of Comparative Example 1 that does not contain the curing agent. From this fact, it can be seen that the inclusion of a curing agent is advantageous in reducing haze and increasing transparency.

It is a schematic cross section which expands and shows the antistatic resin molding which concerns on one Embodiment of this invention partially. (A) is a schematic cross-sectional view showing a dispersion state of ultrafine conductive fibers inside the antistatic layer, and (B) is a schematic cross sectional view showing a dispersion state of ultrafine conductive fibers on the surface of the antistatic layer. It is a schematic plan view which shows the planar dispersion | distribution state of the ultrafine conductive fiber in an antistatic layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin molded object 2 Antistatic film 2a Adhesive layer 2b Antistatic layer 2c Binder resin 3 Extra fine conductive fiber 4 Hardener

Claims (5)

  An antistatic resin molded body in which an antistatic layer is laminated on at least one surface of the resin molded body via an adhesive layer, and the antistatic layer is composed of a binder resin and ultrafine conductive fibers, and is cured in the binder resin. An antistatic resin molded product containing an agent.   The antistatic resin molded article according to claim 1, wherein the curing agent is contained in the binder resin in an amount of 2 to 20% by mass.   The antistatic resin molded article according to claim 1 or 2, wherein the binder resin is a vinyl chloride resin and the curing agent is polyisocyanate.   In a state where the ultrafine conductive fibers of the antistatic layer are separated one by one, or in a state where a plurality of bundles are bundled and separated one by one, they are dispersed without agglomeration and are in contact with each other The antistatic resin molded product according to any one of claims 1 to 3, wherein The antistatic resin molded article according to any one of claims 1 to 4, wherein the ultrafine conductive fiber is a carbon nanotube.

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