JP2006035343A - Method for detecting cracking of glass plate and device therefor, and method for polishing glass plate and device therefor - Google Patents

Method for detecting cracking of glass plate and device therefor, and method for polishing glass plate and device therefor Download PDF

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JP2006035343A
JP2006035343A JP2004216048A JP2004216048A JP2006035343A JP 2006035343 A JP2006035343 A JP 2006035343A JP 2004216048 A JP2004216048 A JP 2004216048A JP 2004216048 A JP2004216048 A JP 2004216048A JP 2006035343 A JP2006035343 A JP 2006035343A
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sound
glass plate
polishing
processing
sound level
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JP4569749B2 (en
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Atsushi Shiroyama
厚 城山
Masashi Yaku
昌司 夜久
Yoshihiro Tomaru
善寛 戸丸
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AGC Display Glass Yonezawa Co Ltd
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Asahi Glass Fine Techno Co Ltd
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Priority to JP2004216048A priority Critical patent/JP4569749B2/en
Priority to PCT/JP2005/013419 priority patent/WO2006009222A1/en
Priority to KR1020067026726A priority patent/KR100856361B1/en
Priority to TW094125061A priority patent/TW200613089A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/0053Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Abstract

<P>PROBLEM TO BE SOLVED: To detect a cracking sound of a glass plate during polishing distinctly from cracking sounds or the like of the other glass plates. <P>SOLUTION: Sounds are collected by a microphone 30. A high-frequency sound is extracted by a filter 40. Next, a sound level, which becomes maximum in a prescribed time T1 (T1=10 milliseconds), is acquired for each prescribed time T1 regarding the high-frequency sound extracted by the filter 40. After that, a sound level, which is minimum among the sound levels acquired in a past prescribed time T2 (T2=300 milliseconds) from the present, is acquired as a stationary sound level. Then, one count is added when a ratio of the present sound level acquired for each T1 and the stationary sound level exceeds a prescribed value (2.5). Third and fourth steps are repeated for each prescribed time T1 until the count reaches ten counts. When the count reaches ten counts within a prescribed time T3 (5 seconds), it is determined that cracking occurs to the glass plate G, and a signal showing the cracking is outputted to a control part 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ガラス板を加工する際に、加工中のガラス板に生じる割れを検出するガラス板の割れ検出方法及びその装置並びにガラス板の研磨方法及びその装置に関する。   The present invention relates to a glass plate crack detection method and apparatus, and a glass plate polishing method and apparatus for detecting a crack generated in a glass plate during processing when the glass plate is processed.

ガラスの製造工程では、種々の加工等(切断、面取り、孔明け、研磨、加熱成形、風冷強化等)がガラス板に施される。例えば、液晶ディスプレイ用に使用されるガラス基板は、その表面の微小な凹凸やうねりが画像に歪みを与える原因となるため、その微小な凹凸やうねりを研磨装置によって除去するようにしている。このような研磨装置として、ガラス板を載置して搬送する移動テーブルと、この移動テーブルの上方に連続して並設された複数の研磨ヘッドとを備えた研磨装置が知られている。この研磨装置によれば、移動テーブルによってガラス板を搬送しながら、複数の研磨ヘッドによってガラス板を漸次研磨する。   In the glass manufacturing process, various processes (cutting, chamfering, drilling, polishing, heat forming, air cooling strengthening, etc.) are performed on the glass plate. For example, in a glass substrate used for a liquid crystal display, minute irregularities and undulations on the surface cause distortion of the image. Therefore, the minute irregularities and undulations are removed by a polishing apparatus. As such a polishing apparatus, there has been known a polishing apparatus including a moving table on which a glass plate is placed and conveyed, and a plurality of polishing heads arranged continuously above the moving table. According to this polishing apparatus, the glass plate is gradually polished by the plurality of polishing heads while the glass plate is conveyed by the moving table.

ところで、研磨装置によるガラス板の研磨中にガラス板が割れてしまい、この状態で研磨動作を継続すると、割れたガラス片によって研磨ヘッドの研磨パッドが損傷する他、ガラス板及び研磨液処理工数が増大し、また、連続研磨の際に他のガラス板に悪影響等を与えるという不具合が生じる。このため、ガラス板の割れを早期に検出し、研磨装置を迅速に停止する必要がある。ガラス板が割れた際に、その加工機を迅速に停止することは、他の加工工程の加工機においても同様である。   By the way, the glass plate breaks during polishing of the glass plate by the polishing apparatus, and if the polishing operation is continued in this state, the polishing pad of the polishing head is damaged by the broken glass piece, and the glass plate and the polishing liquid processing man-hour are reduced. In addition, there is a problem that other glass plates are adversely affected during continuous polishing. For this reason, it is necessary to detect the crack of a glass plate at an early stage, and to stop a grinding | polishing apparatus rapidly. When the glass plate is broken, stopping the processing machine quickly is the same for processing machines in other processing steps.

特許文献1には、自動車用窓ガラスの割れを検出する検出装置が開示されている。このガラス割れ検出装置は、マイクロホンによって集音された音のなかからガラス割れ固有の周波数をフィルタによって抽出し、この周波数の検出中にガラス割れと判定する装置である。また、この検出装置は、ガラス割れ音検出時に短時間の予備警報を出す通常警戒モードと、ガラス割れ音検出時に長時間の本警報を出す特別警戒モードとを有し、特別警戒モードは、その予備段階としての通常警戒モードで1回のガラス割れ音を検出した後に移行される。そして、特別警戒モードに移行後、一定時間内にガラス割れ音を再び検出しない場合には通常警戒モードに戻る。
特開平4−195298号公報
Patent Document 1 discloses a detection device that detects a break in a window glass for an automobile. This glass breakage detection device is a device that extracts a frequency specific to glass breakage from a sound collected by a microphone using a filter, and determines that the glass breakage occurs during detection of this frequency. In addition, this detection device has a normal warning mode that gives a short warning when a glass breaking sound is detected, and a special warning mode that gives a long warning when a glass breaking sound is detected. The transition is made after detecting one glass breaking sound in the normal alert mode as a preliminary stage. Then, after the transition to the special alert mode, if the glass breaking sound is not detected again within a certain time, the normal alert mode is restored.
JP-A-4-195298

しかしながら、例えばガラス板の研磨装置が設置される工場は、ガラス板を研磨する音の他にガラス板の割れに類似する音、たとえばガラス板の切断後の耳部処理、不良ガラス板のカレット処理等を行う際の音が混在している。このため、特許文献1の検出装置の如く、単にガラス割れ音の周波数をフィルタによって抽出するだけでは、研磨中のガラス板の割れ音を研磨音や他のガラス板の割れ音等と区別して検出することが難しいという問題があった。   However, for example, in a factory where a glass plate polishing apparatus is installed, in addition to the sound of polishing a glass plate, sound similar to cracking of the glass plate, for example, ear processing after cutting the glass plate, cullet processing of defective glass plates The sound when performing etc. is mixed. For this reason, as in the detection device of Patent Document 1, simply by extracting the frequency of the glass breaking sound with a filter, the cracking sound of the glass plate being polished is distinguished from the polishing sound and the cracking sound of other glass plates. There was a problem that it was difficult to do.

本発明は、このような事情に鑑みてなされたもので、加工中のガラス板の割れ音を加工音や他のガラス板の割れ音等と区別して検出することができるガラス板の割れ検出方法及びその装置並びにガラス板の研磨方法及びその装置を提供することを目的とする。   The present invention has been made in view of such circumstances, and a method for detecting cracks in a glass plate capable of detecting the cracking sound of a glass plate being processed separately from the processing sound, cracking sound of other glass plates, and the like. Another object of the present invention is to provide a glass plate polishing method and apparatus therefor.

請求項1に記載の発明は、前記目的を達成するために、加工手段によってガラス板を加工するとともに、加工中に発生している加工音を集音手段によって集音し、集音した加工音から所定の周波数の音をフィルタによって抽出し、前記抽出された音について現在の音レベルと現在から過去所定時間内における定常音レベルとを比較することにより、ガラス板の割れを判定することを特徴とする割れ検出方法を提供する。   In order to achieve the above object, the invention according to claim 1 processes the glass plate by the processing means, collects the processing sound generated during the processing by the sound collecting means, and collects the processed sound. A sound of a predetermined frequency is extracted from the filter by a filter, and a crack of the glass plate is determined by comparing a current sound level of the extracted sound with a steady sound level within a predetermined time in the past from the present. A crack detection method is provided.

請求項6に記載の発明は、前記目的を達成するために、ガラス板を加工する加工手段と、前記加工手段による前記ガラス板の加工音をマイクロホンによって集音する集音手段と、前記集音手段によって集音した加工音から所定の周波数の音を抽出するフィルタと、前記フィルタによって前記抽出された音について現在の音レベルと現在から過去所定時間内における定常音レベルとを比較することにより、ガラス板の割れを判定する判定手段と、を有することを特徴とする割れ検出装置を提供する。   In order to achieve the object, the invention described in claim 6 is a processing means for processing a glass plate, a sound collection means for collecting a processing sound of the glass plate by the processing means with a microphone, and the sound collection A filter that extracts a sound of a predetermined frequency from the processed sound collected by the means, and by comparing a current sound level and a steady sound level within a past predetermined time from the present for the sound extracted by the filter, And a determination means for determining a crack in the glass plate.

ガラス板の加工に伴ってガラス板から開放されるエネルギーの一部は、音波となって伝播する。この現象はアコースチックエミッションと呼ばれ、ガラス板が割れた際に生じる音波の周波数は、請求項3、8に記載の如く3kHz以上の高周波音であることを実験にて確認した。一方、ガラス板の加工音は、低周波から高周波までの広い範囲の音であり、ガラス板の割れ音の音レベルよりは小さいが、ガラス板の割れ音と同じ3kHz以上の音も含んでいる。   A part of the energy released from the glass plate as the glass plate is processed propagates as sound waves. This phenomenon is called acoustic emission, and it was experimentally confirmed that the frequency of the sound wave generated when the glass plate was broken was a high-frequency sound of 3 kHz or more as described in claims 3 and 8. On the other hand, the processing sound of the glass plate is a wide range of sound from low frequency to high frequency, which is lower than the sound level of the cracking sound of the glass plate, but also includes the same 3 kHz or higher sound as the cracking sound of the glass plate. .

請求項1、6に記載の発明は、加工音を集音手段によって集音し、前記3kHz以上の高周波数の音をフィルタによって抽出し、定常音、割れ音及びこれに類似する音をまず取得する。次に、判定手段は、フィルタにより抽出された音について、現在の音レベルと現在から過去所定時間内における定常音レベルとを比較することにより、加工音に含まれたガラス板の割れを判定する。請求項4、9に記載の如く、音レベルとは、加工音の振幅の大きさであり、定常音レベルとは、加工中のガラス板に割れが生じていない時に発生している加工音の振幅の大きさである。したがって、判定手段は、現在の音レベルと、割れ音のない定常音レベルとを比較し、現在の音レベルが定常音レベルよりも所定量大きくなった時にガラス板に割れが発生したと判定する。   According to the first and sixth aspects of the invention, the processed sound is collected by the sound collecting means, the high frequency sound of 3 kHz or higher is extracted by the filter, and the stationary sound, cracking sound and similar sound are first acquired. To do. Next, the determination means determines the breakage of the glass plate included in the processed sound by comparing the current sound level and the steady sound level within the past predetermined time from the present for the sound extracted by the filter. . As described in claims 4 and 9, the sound level is the amplitude of the processed sound, and the steady sound level is the processed sound generated when the glass plate being processed is not cracked. It is the magnitude of the amplitude. Therefore, the determination means compares the current sound level with a steady sound level without a cracking sound, and determines that a crack has occurred in the glass plate when the current sound level is a predetermined amount greater than the steady sound level. .

そして、判定手段によってガラス板に割れが発生したと判定されると、請求項5、10に記載の研磨方法及びその装置如く、研磨制御手段が研磨手段を制御してガラス板の研磨を停止させる。   And when it determines with the determination means having cracked in a glass plate, like the grinding | polishing method and its apparatus of Claim 5, 10, a grinding | polishing control means controls a grinding | polishing means and stops grinding | polishing of a glass plate. .

請求項2に記載の発明は、前記目的を達成するために、加工手段によって板ガラスを加工するとともに、加工中に発生している加工音を集音手段によって集音し、集音した加工音から所定の周波数の音をフィルタによって抽出する第1の工程と、前記抽出された音について、所定時間T1内で最大となる音レベルを所定時間T1毎に取得する第2の工程と、現在から過去所定時間T2(T2>T1)内で、前記第2の工程で取得された音レベルの中で最小の音レベルを定常音レベルとして取得する第3の工程と、現在の音レベルと前記定常音レベルとの比が、所定の値を超えた際に1カウント加算する第4の工程と、前記所定時間T1毎に前記第3の工程と第4の工程とを繰り返し、所定時間T3(T3>T2)内に所定カウントに達すると、ガラス板に割れが発生したと判定する第5の工程と、を有することを特徴とする割れ検出方法を提供する。   In order to achieve the above object, the invention according to claim 2 processes the plate glass by the processing means, collects the processing sound generated during the processing by the sound collecting means, and collects the processed sound from the collected processing sound. A first step of extracting a sound having a predetermined frequency by a filter; a second step of acquiring a maximum sound level within a predetermined time T1 for the extracted sound every predetermined time T1; A third step of acquiring a minimum sound level among the sound levels acquired in the second step as a steady sound level within a predetermined time T2 (T2> T1), a current sound level and the steady sound; The fourth step of adding 1 count when the ratio to the level exceeds a predetermined value, and the third step and the fourth step are repeated every predetermined time T1, and the predetermined time T3 (T3>) When a predetermined count is reached within T2) Provides a crack detection method characterized in that it comprises a fifth step of determining a crack in the glass plate has occurred, the.

請求項7に記載の発明は、前記目的を達成するために、ガラス板を加工する加工手段と、前記加工手段による前記ガラス板の加工音をマイクロホンによって集音する集音手段と、前記集音手段によって集音した加工音から所定の周波数の音を抽出するフィルタと、前記フィルタによって前記抽出された音について、第1の取得工程にて、所定時間T1内で最大となる音レベルを所定時間T1毎に取得し、第2の取得工程にて、現在から過去所定時間T2(T2>T1)内で、前記第1の取得工程にて取得された音レベルの中で最小の音レベルを定常音レベルとして取得し、加算工程にて、現在の音レベルと前記第2の取得工程にて取得された前記定常音レベルとの比が、所定の値を超えた際に1カウント加算し、前記所定時間T1毎に前記第2の取得工程と前記加算工程とを繰り返し、所定時間T3(T3>T2)内に所定カウントに達すると、ガラス板に割れが発生したと判定する判定手段と、を有することを特徴とする割れ検出装置を提供する。   In order to achieve the above object, a seventh aspect of the present invention provides a processing means for processing a glass plate, a sound collecting means for collecting processing sound of the glass plate by the processing means with a microphone, and the sound collecting A filter for extracting a sound of a predetermined frequency from the processed sound collected by the means, and a sound level that is maximum within a predetermined time T1 in the first acquisition step for the sound extracted by the filter in a predetermined time Acquired every T1, and in the second acquisition step, the minimum sound level among the sound levels acquired in the first acquisition step is steady within the past predetermined time T2 (T2> T1) from the present. Acquired as a sound level, and in the addition step, when the ratio between the current sound level and the steady sound level acquired in the second acquisition step exceeds a predetermined value, 1 count is added, The predetermined time T1 And the adding step are repeated, and when the predetermined count is reached within a predetermined time T3 (T3> T2), determination means for determining that a crack has occurred in the glass plate is provided. Providing equipment.

請求項2、7に記載の発明は、加工音を集音手段によって集音し、前述した3kHz以上の高周波数の音をフィルタによって抽出し、定常音、割れ音及びこれに類似する音をまず取得する。次に、判定手段は、フィルタによって抽出した音について、所定時間T1内で最大となる音レベルを所定時間T1毎に取得する。次に、現在から過去所定時間T2(T2>T1)内で、前記取得された音レベルの中で最小の音レベルを定常音レベルとして取得する。次いで、現在の音レベルと前記定常音レベルとの比が、所定の値を超えた際に1カウント加算し、前記所定時間T1毎に前記第3の工程(第2の取得工程)と第4の工程(加算工程)とを繰り返し、所定時間T3(T3>T2)内に所定カウントに達すると、ガラス板に割れが発生したと判定する。これにより、加工機周辺で不定期に発生するガラス板の切断後の耳部処理、不良ガラス板のカレット処理音等を判定対象音から排除することができ、加工中に割れが発生した際に定期的に発生する割れ音のみを判定対象音とすることができる。したがって、混在する多数の音から加工中の割れ音のみを検出することができる。   According to the second and seventh aspects of the present invention, the processed sound is collected by the sound collecting means, the above-described high frequency sound of 3 kHz or higher is extracted by the filter, and the steady sound, cracking sound and similar sound are first obtained. get. Next, the determination unit obtains the maximum sound level within a predetermined time T1 for each sound extracted by the filter every predetermined time T1. Next, within the past predetermined time T2 (T2> T1) from the present, the minimum sound level among the acquired sound levels is acquired as a steady sound level. Next, when the ratio between the current sound level and the steady sound level exceeds a predetermined value, one count is added, and the third step (second acquisition step) and the fourth step are performed every predetermined time T1. When the predetermined count is reached within a predetermined time T3 (T3> T2), it is determined that a crack has occurred in the glass plate. As a result, it is possible to eliminate the ear processing after cutting of the glass plate that occurs irregularly around the processing machine, the cullet processing sound of the defective glass plate, etc. from the judgment target sound, and when a crack occurs during processing Only cracking sounds that are generated periodically can be set as judgment target sounds. Therefore, it is possible to detect only the cracking sound being processed from many mixed sounds.

そして、判定手段によってガラス板に割れが発生したと判定されると、請求項5、10に記載の研磨方法及びその装置の如く、研磨制御手段が研磨手段を制御してガラス板の研磨を停止させる。   And when it determines with the determination means having cracked in the glass plate, like the grinding | polishing method and apparatus of Claim 5, 10, a grinding | polishing control means controls a grinding | polishing means and stops grinding | polishing of a glass plate. Let

以上説明したように本発明に係るガラス板の割れ検出方法及びその装置並びに研磨方法及びその装置によれば、加工中にガラス板に割れが発生したことを、早期にかつ確実に検出することができる。また、ガラス板の割れ検出のための計算をFFT(高速フーリエ・コサイン・サイン変換)を用いることなく、簡単な演算式により算出し判定することができるので、低コストで高速に判定処理することができる。特に、加工が研磨である場合には、研磨中のガラス板の割れを早期に検出して研磨手段を迅速に停止させることができるので、研磨パッドの損傷を防止でき、また、ガラス板及び研磨液処理工数を低減でき、更にまた、連続研磨の際に他のガラス板への影響を阻止することができ、効果的である。これにより、品質、稼働率、及び歩留りがそれぞれ向上する。   As described above, according to the method and apparatus for detecting cracks in a glass plate and the polishing method and apparatus according to the present invention, it is possible to detect early and reliably that a crack has occurred in a glass plate during processing. it can. In addition, calculation for detecting cracks in a glass plate can be calculated and judged with a simple arithmetic expression without using FFT (Fast Fourier, Cosine, and Sine Transform). Can do. In particular, when the processing is polishing, it is possible to quickly detect the cracking of the glass plate being polished and stop the polishing means quickly, so that the polishing pad can be prevented from being damaged. The number of liquid processing steps can be reduced, and furthermore, the influence on other glass plates can be prevented during continuous polishing, which is effective. Thereby, quality, an operating rate, and a yield improve, respectively.

以下、添付図面に従って本発明に係るガラス板の割れ検出方法及びその装置並びに研磨方法及びその装置の好ましい実施の形態を詳説する。   Hereinafter, preferred embodiments of a glass plate crack detection method and apparatus, a polishing method and apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

図1は、実施の形態のガラス板の割れ検出装置10が適用されたガラス板研磨装置12の要部が示されている。この研磨装置12は、ガラス板G(例えば、一辺が700mm〜2500mm、厚み0.5mm〜1.3mm)の片面を液晶ディスプレイ用ガラス基板に必要な平坦度へ研磨する研磨装置であり、研磨対象のガラス板Gを搬送するテーブル14、テーブル14の上方に設置された研磨ヘッド16等から構成される。研磨前のガラス板Gは、テーブル14の上流側においてテーブル14上に載置された後、テーブル14の移動によって研磨ヘッド16の下方に位置したところで、研磨ヘッド16の研磨パッド18によってその片面(図1では上面)が研磨される。なお、研磨中においては、研磨ヘッド16の近傍に設置された不図示のスラリ供給部から、酸化セリウム水溶液等の研磨スラリがガラス板Gの上面に供給される。また、研磨パッド18としては、例えば発泡ポリウレタンタイプやスウェードタイプのものが使用されている。なお、実施の形態では、ガラス板の加工手段として研磨装置12を例示したが、これに限定されるものではなく、ガラス板の切断装置、面取り装置、孔明け装置、加熱成形装置、又は風冷強化装置であってもよい。   FIG. 1 shows a main part of a glass plate polishing apparatus 12 to which the glass plate crack detection apparatus 10 of the embodiment is applied. The polishing apparatus 12 is a polishing apparatus that polishes one side of a glass plate G (for example, one side of 700 mm to 2500 mm and a thickness of 0.5 mm to 1.3 mm) to a flatness necessary for a glass substrate for a liquid crystal display, and is a polishing target. The table 14 conveys the glass plate G, and the polishing head 16 installed above the table 14. The glass plate G before polishing is placed on the table 14 on the upstream side of the table 14 and then positioned on the lower side of the polishing head 16 by the movement of the table 14. The upper surface in FIG. 1 is polished. During polishing, a polishing slurry such as a cerium oxide aqueous solution is supplied to the upper surface of the glass plate G from a slurry supply unit (not shown) installed in the vicinity of the polishing head 16. Further, as the polishing pad 18, for example, a foamed polyurethane type or a suede type is used. In the embodiment, the polishing apparatus 12 is exemplified as the glass plate processing means. However, the polishing apparatus 12 is not limited to this, and the glass plate cutting device, chamfering device, drilling device, heat forming device, or air cooling is not limited thereto. It may be a strengthening device.

研磨ヘッド16の上部には、スピンドル20が固定され、このスピンドル20には回転/昇降装置(研磨手段)22が連結されている。回転/昇降装置22は、研磨装置12全体を統括制御する制御部(研磨制御手段)24によって、テーブル14によるガラス板Gの搬送タイミングに同期して回転及び昇降動作が制御されている。すなわち、回転/昇降装置22は、油圧シリンダ装置等の昇降機構を制御して研磨ヘッド16を研磨位置の上方に位置する退避位置に予め位置させておき、ガラス板Gが研磨ヘッド16の下方位置に搬送されたタイミングで前記退避位置から前記研磨位置に下降移動させる。この動作により、研磨パッド20がガラス板Gの上面に所定の圧力をもって押圧され、この後、回転/昇降装置22は、モータを制御して研磨ヘッド16を所定の回転数(例えば、50〜250rpm)で回転させる。なお、研磨装置12としては、研磨ヘッド16がテーブル14の上方に複数台並列配置された連続研磨式の研磨装置を適用してもよく、この研磨装置によれば、ガラス板Gはテーブル14によって間欠搬送されながら、複数台の研磨ヘッド16、16…によって漸次研磨され、最終的に必要とされる平坦度に研磨される。また、研磨パッド16の形状は円形でも矩形でもよく、円形及び矩形の研磨パッド16を混在させてもよい。   A spindle 20 is fixed to the upper part of the polishing head 16, and a rotation / lifting device (polishing means) 22 is connected to the spindle 20. The rotation / elevating device 22 is controlled to rotate and elevate in synchronization with the conveyance timing of the glass sheet G by the table 14 by a control unit (polishing control means) 24 that comprehensively controls the entire polishing device 12. That is, the rotation / lifting device 22 controls the lifting mechanism such as a hydraulic cylinder device to place the polishing head 16 in a retracted position above the polishing position in advance, and the glass plate G is positioned below the polishing head 16. Is moved downward from the retracted position to the polishing position at the timing of being conveyed. By this operation, the polishing pad 20 is pressed against the upper surface of the glass plate G with a predetermined pressure. Thereafter, the rotation / lifting device 22 controls the motor to move the polishing head 16 to a predetermined rotation speed (for example, 50 to 250 rpm). ) To rotate. In addition, as the polishing apparatus 12, a continuous polishing type polishing apparatus in which a plurality of polishing heads 16 are arranged in parallel above the table 14 may be applied. While being intermittently transported, it is gradually polished by a plurality of polishing heads 16, 16... And finally polished to the required flatness. The shape of the polishing pad 16 may be circular or rectangular, and circular and rectangular polishing pads 16 may be mixed.

ガラス板の割れ検出装置10は、マイクロホン(集音手段)30、演算用パソコン本体32、キーボード34、ディスプレイ36から構成されるとともに、研磨中に発生するガラス板Gの割れを判定するためのアルゴリズムが組み込まれたCD−ROM等の記録媒体38から構成されている。   The glass plate crack detection device 10 is composed of a microphone (sound collecting means) 30, an operation personal computer main body 32, a keyboard 34, and a display 36, and an algorithm for determining a glass plate G crack that occurs during polishing. Is built in a recording medium 38 such as a CD-ROM.

マイクロホン30は、研磨ヘッド16の近傍に設置され、研磨中のガラス板Gから発生している研磨音を集音する。また、マイクロホン30は、前記研磨音の他、この研磨装置12を構成する回転/昇降装置22、及びテーブル14の移動装置等から生じている音も集音するとともに、研磨装置12の近傍のガラス切断後の耳部処理、不良ガラス板のカレット処理等を行う際に生じる割れ音も集音する。すなわち、マイクロホン30は、研磨中の割れ音の他にガラス板の割れ音に類似する音、及び各種装置から生じている低周波から高周波音も集音する。マイクロホン30によって集音された音情報は電気信号に変換されてパソコン本体32に送信される。   The microphone 30 is installed in the vicinity of the polishing head 16 and collects the polishing sound generated from the glass plate G being polished. The microphone 30 collects sound generated from the rotating / lifting device 22 constituting the polishing device 12 and the moving device of the table 14 in addition to the polishing sound, and glass near the polishing device 12. It also collects cracking sounds that occur when cutting the ears after cutting and culleting the defective glass plate. That is, the microphone 30 collects not only the cracking sound during polishing but also sounds similar to the cracking sound of the glass plate and low to high frequency sounds generated from various devices. Sound information collected by the microphone 30 is converted into an electrical signal and transmitted to the personal computer main body 32.

パソコン本体32には、ディスプレイ36が接続され、このディスプレイ36には、マイクロホン30によって集音された音情報をパソコン本体32によって処理された情報が表示される。   A display 36 is connected to the personal computer main body 32, and information obtained by processing the sound information collected by the microphone 30 by the personal computer main body 32 is displayed on the display 36.

表示される情報としては、例えば図2に示した音波形、及び図3に示した音波形がある。図2は割れ音を含む音波形が示され、この音波形のうち、符号Aで示す音波形は、マイクロホン30によって集音された音を、パソコン本体32に内蔵されたフィルタ40(図4参照)によって抽出した音の入力音波形である。このフィルタ40は、3kHz以上の高周波数の音を抽出するフィルタであるが、好ましくは3kHz〜12kHz、更に好ましくは3.5kHz〜6kHzの高周波数の音を抽出するフィルタが使用される。   The displayed information includes, for example, the sound waveform shown in FIG. 2 and the sound waveform shown in FIG. FIG. 2 shows a sound waveform including a cracking sound. Among the sound waveforms, the sound waveform indicated by the symbol A is a filter 40 (see FIG. 4) in which sound collected by the microphone 30 is collected in the personal computer main body 32. ) Is the input sound waveform of the sound extracted by. The filter 40 is a filter that extracts a high frequency sound of 3 kHz or more, and a filter that extracts a high frequency sound of preferably 3 kHz to 12 kHz, more preferably 3.5 kHz to 6 kHz is used.

符号Bで示す音波形は、所定時間T1(T1=10msec(好ましくは0.1〜1000msec、特に好ましくは1〜100msec))内で最大となる音レベル(研磨音の振幅)を所定時間T1毎に取得して作成された音波形である。更に、符号Cで示す音波形は、所定時間T2(T2=300msec(好ましくは1msec〜10sec、特に好ましくは100〜1000msec))内で、前記取得した音レベルの中で最小となる音レベル(研磨音の振幅)を定常音レベルとして取得するために作成された音波形である。ここで言う定常音レベルとは、研磨中のガラス板Gに割れが生じていない時に発生している研磨音の振幅の大きさを意味している。なお、音情報のサンプリング周期は40kHz(25μsec)であるが、好ましくは20〜60kHz、特に好ましくは30〜50kHzである。   The sound waveform indicated by symbol B has a maximum sound level (amplitude of polishing sound) within a predetermined time T1 (T1 = 10 msec (preferably 0.1 to 1000 msec, particularly preferably 1 to 100 msec)) every predetermined time T1. It is a sound waveform created and acquired. Furthermore, the sound waveform indicated by the symbol C has a sound level (polishing) that is the minimum of the acquired sound levels within a predetermined time T2 (T2 = 300 msec (preferably 1 msec to 10 sec, particularly preferably 100 to 1000 msec)). This is a sound waveform created to obtain the sound amplitude) as a steady sound level. The steady sound level mentioned here means the magnitude of the amplitude of the polishing sound that is generated when the glass plate G being polished is not cracked. The sound information sampling period is 40 kHz (25 μsec), preferably 20 to 60 kHz, and particularly preferably 30 to 50 kHz.

一方、図3には判定用に加工した音波形が示され、この音波形は、所定時間T1毎に取得する現在の音レベルと、取得した定常音レベルとの比を示した波形であり、同図では、その比(しきい値)が2.5に設定され、その比を超えた音レベルに■マークが付されている。しきい値としては、1〜10が好ましく、特に好ましくは1.5〜5である。   On the other hand, FIG. 3 shows a sound waveform processed for determination, and this sound waveform is a waveform showing the ratio between the current sound level acquired every predetermined time T1 and the acquired steady sound level, In the figure, the ratio (threshold value) is set to 2.5, and the mark ■ is attached to the sound level exceeding the ratio. As a threshold value, 1-10 are preferable, Most preferably, it is 1.5-5.

また、パソコン本体32には、マイクロホン30によって集音された音情報に基づいてガラス板Gの割れを判定する判定部42(図4参照)が内臓されている。この判定部42については後述する。   In addition, the personal computer main body 32 includes a determination unit 42 (see FIG. 4) that determines whether the glass plate G is broken based on sound information collected by the microphone 30. The determination unit 42 will be described later.

更に、図1のパソコン本体32には、記録媒体38を着脱可能に装着する記録媒体装着部44と、記録媒体38に対して画像データ等の情報を記録したり読み出したりする記録媒体インターフェース(不図示)とが設けられている。   Further, in the personal computer main body 32 of FIG. 1, a recording medium mounting unit 44 for detachably mounting the recording medium 38, and a recording medium interface (not suitable) for recording and reading information such as image data with respect to the recording medium 38. Are provided).

また、パソコン本体32には、パソコン本体32を統括制御するCPUを動作させるプログラムが記録されるとともにCPUが処理を実行する際の作業領域となるメモリと、パソコン本体32の処理に関する各種定数やネットワーク上の通信機器に通信接続する際のダイヤルアップ電話番号、アドレス、サイトアドレス等の接続情報、計算式、演算テーブル等の各種の情報を記録するハードディスクが設けられている。   The personal computer main body 32 stores a program for operating a CPU that performs overall control of the personal computer main body 32, a memory serving as a work area when the CPU executes processing, and various constants and networks related to processing of the personal computer main body 32. A hard disk is provided for recording various information such as connection information such as dial-up telephone numbers, addresses, and site addresses, calculation formulas, calculation tables, and the like for communication connection with the above communication device.

次に、パソコン本体32に内蔵された判定部42による割れ判定方法を、図5のフローチャートを参照しながら説明する。判定部42は、以下の処理を行うように所定の言語でプログラムされている。   Next, a crack determination method by the determination unit 42 built in the personal computer main body 32 will be described with reference to the flowchart of FIG. The determination unit 42 is programmed in a predetermined language so as to perform the following processing.

マイクロホン30によって集音し、フィルタ40によって3kHz以上の高周波数の音を抽出する(ステップ(S)100、第1の工程)。これにより、回転/昇降装置22、テーブル移動装置等の各種装置から生じている低周波数の音を判定対象音から排除する。次に、フィルタ40によって抽出された高周波数の音について、まず、所定時間T1(T1=10msec)内で最大となる音レベルを所定時間T1毎に取得する(ステップ(S)110、第2の工程)。次に、現在から過去所定時間T2(T2=300msec)内で、前記取得された音レベルの中で最小の音レベルを定常音レベルとして取得する(S120、第3の工程、第2の取得工程)。次いで、T1如く取得している現在の音レベルと前記定常音レベルとの比が、所定の値(2.5)を超えた際に1カウント加算する(S130、第4の工程、加算工程)。そして、カウントが10カウントになるまで所定時間T1毎に前記第3の工程と第4の工程とを繰り返し(S140)、所定時間T3(5sec(好ましくは1〜60sec、特に好ましくは1〜10sec))内に10カウント(好ましくは5〜100、特に好ましくは10〜20)に達すると、ガラス板Gに割れが発生したと判定(第5の工程)し、図1の制御部24に割れを示す信号を出力する。これにより、制御部24は、回転/昇降装置22を制御して、研磨ヘッド16の回転を停止させるとともに研磨ヘッド16を研磨位置から退避位置に上昇させ、研磨を停止させる(S150)。   Sound is collected by the microphone 30, and high-frequency sound of 3 kHz or higher is extracted by the filter 40 (step (S) 100, first step). As a result, low-frequency sounds generated from various devices such as the rotation / lifting device 22 and the table moving device are excluded from the determination target sound. Next, for the high-frequency sound extracted by the filter 40, first, the maximum sound level within the predetermined time T1 (T1 = 10 msec) is acquired every predetermined time T1 (step (S) 110, second Process). Next, within the past predetermined time T2 (T2 = 300 msec) from the present time, the minimum sound level among the acquired sound levels is acquired as a steady sound level (S120, third step, second acquisition step). ). Next, one count is added when the ratio between the current sound level acquired as T1 and the steady sound level exceeds a predetermined value (2.5) (S130, fourth step, addition step). . Then, the third step and the fourth step are repeated every predetermined time T1 until the count reaches 10 counts (S140), and the predetermined time T3 (5 sec (preferably 1 to 60 sec, particularly preferably 1 to 10 sec) is set. ) Within 10 counts (preferably 5 to 100, particularly preferably 10 to 20), it is determined that a crack has occurred in the glass plate G (fifth step), and the control unit 24 in FIG. The signal shown is output. Accordingly, the control unit 24 controls the rotation / lifting device 22 to stop the rotation of the polishing head 16 and raise the polishing head 16 from the polishing position to the retracted position, thereby stopping the polishing (S150).

この判定方法により、ガラス割れ音に類似する音であって不定期に発生するガラス板の切断後の耳部処理、不良ガラス板のカレット処理音等を判定対象音から排除することができ、研磨中に割れが発生した際の定期的に発生するガラス板Gの割れ音のみを判定対象音として検出することができる。したがって、実施の形態の判定方法によれば、ガラス板を研磨する音や他のガラス板の割れ音等の低周波音、高周波音を含む広範囲な周波数帯域の音から研磨中の割れ音のみを検出することができる。   By this determination method, it is possible to eliminate the ear processing after cutting of the glass plate that is similar to the sound of glass breaking sound and the cullet processing sound of the defective glass plate from the determination target sound, and polishing. Only the cracking sound of the glass plate G that is regularly generated when a crack is generated can be detected as the determination target sound. Therefore, according to the determination method of the embodiment, only the cracking sound during polishing from the sound of a wide frequency band including low-frequency sound and high-frequency sound such as sound of polishing a glass plate and cracking sound of another glass plate. Can be detected.

以上の如く実施の形態のガラス板Gの割れ検出装置10によれば、研磨中にガラス板Gに割れが発生したことを、早期にかつ確実に検出することができる。   As described above, according to the crack detection device 10 of the glass plate G of the embodiment, it is possible to detect early and reliably that a crack has occurred in the glass plate G during polishing.

また、ガラス板Gの割れ検出のための計算をFFT(高速フーリエ・コサイン・サイン変換)を用いることなく、簡単な演算式により算出し判定することができるので、低コストで高速に判定処理することができる。   In addition, the calculation for detecting cracks in the glass sheet G can be calculated and determined by a simple arithmetic expression without using FFT (Fast Fourier / Cosine / Sine Transform). be able to.

更に、研磨中のガラス板Gの割れを早期に検出して研磨装置10を迅速に停止させることができるので、研磨パッド18の損傷を防止でき、また、ガラス板G及び研磨液処理工数を低減でき、更にまた、連続研磨の際に他のガラス板Gへの影響を阻止することができる。これにより、品質、稼働率、及び歩留りがそれぞれ向上する。   Furthermore, since the cracking of the glass plate G during polishing can be detected at an early stage and the polishing apparatus 10 can be stopped quickly, damage to the polishing pad 18 can be prevented, and the man-hours for processing the glass plate G and the polishing liquid can be reduced. Furthermore, the influence on the other glass plate G can be prevented during continuous polishing. Thereby, quality, an operating rate, and a yield improve, respectively.

本発明の実施の形態に係るガラス板の割れ検出装置が適用されたガラス板研磨装置の構成図1 is a configuration diagram of a glass plate polishing apparatus to which a glass plate crack detection device according to an embodiment of the present invention is applied. マイクロホンによって集音される研磨音の音波形図Sound wave form of polishing sound collected by microphone 現在の音レベルと定常音レベルとの比を示した波形図Waveform diagram showing the ratio between the current sound level and the steady sound level マイクロホン、フィルタ、及び判定部の構成を示したブロック図Block diagram showing configurations of microphone, filter, and determination unit 割れ検出装置による割れ検出方法のフローチャートFlow chart of crack detection method by crack detector

符号の説明Explanation of symbols

10…ガラス板の割れ検出装置、12…ガラス板研磨装置、14…テーブル、16…研磨ヘッド、18…研磨パッド、20…スピンドル、22…回転/昇降装置、30…マイクロホン、32…演算用パソコン本体、34…キーボード、36…ディスプレイ、38…記録媒体、40…フィルタ、42…判定部   DESCRIPTION OF SYMBOLS 10 ... Glass plate crack detection device, 12 ... Glass plate polishing device, 14 ... Table, 16 ... Polishing head, 18 ... Polishing pad, 20 ... Spindle, 22 ... Rotation / lifting device, 30 ... Microphone, 32 ... Computer for calculation Main body, 34 ... keyboard, 36 ... display, 38 ... recording medium, 40 ... filter, 42 ... determination unit

Claims (10)

加工手段によってガラス板を加工するとともに、加工中に発生している加工音を集音手段によって集音し、集音した加工音から所定の周波数の音をフィルタによって抽出し、
前記抽出された加工音について現在の音レベルと現在から過去所定時間内における定常音レベルとを比較することにより、ガラス板の割れを判定することを特徴とするガラス板の割れ検出方法。
While processing the glass plate by the processing means, the processing sound generated during processing is collected by the sound collecting means, and the sound of a predetermined frequency is extracted from the collected processing sound by a filter,
A method of detecting a crack in a glass plate, comprising: determining a crack in the glass plate by comparing a current sound level with respect to the extracted processed sound and a steady sound level in a past predetermined time from the present.
加工手段によって板ガラスを加工するとともに、加工中に発生している加工音を集音手段によって集音し、集音した加工音から所定の周波数の音をフィルタによって抽出する第1の工程と、
前記抽出された音について、所定時間T1内で最大となる音レベルを所定時間T1毎に取得する第2の工程と、
現在から過去所定時間T2(T2>T1)内で、前記第2の工程で取得された音レベルの中で最小の音レベルを定常音レベルとして取得する第3の工程と、
現在の音レベルと前記定常音レベルとの比が、所定の値を超えた際に1カウント加算する第4の工程と、
前記所定時間T1毎に前記第3の工程と第4の工程とを繰り返し、所定時間T3(T3>T2)内に所定カウントに達すると、ガラス板に割れが発生したと判定する第5の工程と、
を有することを特徴とするガラス板の割れ検出方法。
A first step of processing the plate glass by the processing means, collecting the processing sound generated during the processing by the sound collecting means, and extracting the sound of a predetermined frequency from the collected processing sound by a filter;
A second step of obtaining a maximum sound level for each of the extracted sounds at a predetermined time T1 within a predetermined time T1;
A third step of acquiring a minimum sound level among the sound levels acquired in the second step as a steady sound level within a predetermined time T2 (T2> T1) from the present;
A fourth step of adding one count when the ratio between the current sound level and the steady sound level exceeds a predetermined value;
The third step and the fourth step are repeated every predetermined time T1, and when the predetermined count is reached within the predetermined time T3 (T3> T2), a fifth step of determining that a crack has occurred in the glass plate. When,
A method for detecting cracks in a glass plate, comprising:
前記フィルタによって抽出される前記所定の周波数の音は、ガラス割れ音を含む3kHz以上の高周波音であることを特徴とする請求項1、又は2に記載のガラス板の割れ検出方法。   The glass plate crack detection method according to claim 1, wherein the sound having the predetermined frequency extracted by the filter is a high-frequency sound of 3 kHz or more including a glass cracking sound. 前記音レベルとは、前記加工音の振幅の大きさであり、前記定常音レベルとは、加工中のガラス板に割れが生じていない時に発生している加工音の振幅の大きさであることを特徴とする請求項1、2又は3のうちいずれか一つに記載のガラス板の割れ検出方法。   The sound level is the amplitude of the processed sound, and the steady sound level is the amplitude of the processed sound generated when the glass plate being processed is not cracked. The method for detecting a crack in a glass plate according to any one of claims 1, 2, and 3. 請求項1、2、3又は4のうちいずれか一つに記載のガラス板の割れ検出方法が適用され、前記加工手段であるガラス板を研磨する研磨手段によるガラス板の研磨中に、ガラス板に割れが発生したと判定されると、前記研磨手段を制御する研磨制御手段によってガラス板の研磨を停止させることを特徴とするガラス板の研磨方法。   A method for detecting a crack in a glass plate according to any one of claims 1, 2, 3 or 4, wherein the glass plate is polished during polishing of the glass plate by a polishing means for polishing the glass plate as the processing means. When it is determined that a crack has occurred in the glass plate, polishing of the glass plate is stopped by a polishing control unit that controls the polishing unit. ガラス板を加工する加工手段と、
前記加工手段による前記ガラス板の加工音をマイクロホンによって集音する集音手段と、
前記集音手段によって集音した加工音から所定の周波数の音を抽出するフィルタと、
前記フィルタによって前記抽出された音について現在の音レベルと現在から過去所定時間内における定常音レベルとを比較することにより、ガラス板の割れを判定する判定手段と、
を有することを特徴とするガラス板の割れ検出装置。
Processing means for processing a glass plate;
Sound collecting means for collecting the processing sound of the glass plate by the processing means with a microphone;
A filter for extracting a sound of a predetermined frequency from the processed sound collected by the sound collecting means;
Determination means for determining the breakage of the glass plate by comparing the current sound level and the steady sound level in the past predetermined time from the present for the sound extracted by the filter;
An apparatus for detecting a crack in a glass plate, comprising:
ガラス板を加工する加工手段と、
前記加工手段による前記ガラス板の加工音をマイクロホンによって集音する集音手段と、
前記集音手段によって集音した加工音から所定の周波数の音を抽出するフィルタと、
前記フィルタによって前記抽出された音について、第1の取得工程にて、所定時間T1内で最大となる音レベルを所定時間T1毎に取得し、第2の取得工程にて、現在から過去所定時間T2(T2>T1)内で、前記第1の取得工程にて取得された音レベルの中で最小の音レベルを定常音レベルとして取得し、加算工程にて、現在の音レベルと前記第2の取得工程にて取得された前記定常音レベルとの比が、所定の値を超えた際に1カウント加算し、前記所定時間T1毎に前記第2の取得工程と前記加算工程とを繰り返し、所定時間T3(T3>T2)内に所定カウントに達すると、ガラス板に割れが発生したと判定する判定手段と、
を有することを特徴とするガラス板の割れ検出装置。
Processing means for processing a glass plate;
Sound collecting means for collecting the processing sound of the glass plate by the processing means with a microphone;
A filter for extracting a sound of a predetermined frequency from the processed sound collected by the sound collecting means;
For the sound extracted by the filter, in the first acquisition step, a sound level that is maximum within the predetermined time T1 is acquired every predetermined time T1, and in the second acquisition step, the sound is acquired for a predetermined past time from the present time. Within T2 (T2> T1), the minimum sound level among the sound levels acquired in the first acquisition step is acquired as a steady sound level, and in the addition step, the current sound level and the second sound level are acquired. When the ratio of the steady sound level acquired in the acquisition step exceeds a predetermined value, 1 count is added, and the second acquisition step and the addition step are repeated every predetermined time T1, A determination means for determining that a crack has occurred in the glass plate when a predetermined count is reached within a predetermined time T3 (T3>T2);
An apparatus for detecting a crack in a glass plate, comprising:
前記フィルタによって抽出される前記所定の周波数の音は、ガラス割れ音を含む3kHz以上の高周波音であることを特徴とする請求項6、又は7に記載のガラス板の割れ検出装置。   The glass plate crack detection device according to claim 6 or 7, wherein the sound having the predetermined frequency extracted by the filter is a high-frequency sound of 3 kHz or more including glass cracking sound. 前記音レベルとは、前記加工音の振幅の大きさであり、前記定常音レベルとは、加工中のガラス板に割れが生じていない時に発生している加工音の振幅の大きさであることを特徴とする請求項6、7又は8のうちいずれか一つに記載のガラス板の割れ検出装置。   The sound level is the amplitude of the processed sound, and the steady sound level is the amplitude of the processed sound generated when the glass plate being processed is not cracked. The glass plate crack detection device according to any one of claims 6, 7 and 8. 請求項6、7、8又は9のうちいずれか一つに記載のガラス板の割れ検出装置が設置され、前記加工手段であるガラス板を研磨する研磨手段によるガラス板の研磨中に、前記判定手段によってガラス板に割れが発生したと判定されると、前記研磨手段を制御してガラス板の研磨を停止させる研磨制御手段を備えたことを特徴とするガラス板の研磨装置。   The glass plate crack detection device according to any one of claims 6, 7, 8, or 9, wherein the determination is performed during polishing of the glass plate by a polishing unit that polishes the glass plate as the processing unit. An apparatus for polishing a glass plate, comprising: a polishing control unit that controls the polishing unit to stop polishing the glass plate when it is determined that a crack has occurred in the glass plate.
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