JP2006035263A - Electron beam surface treatment method and electron beam surface treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electron beam surface treatment method where the surface of a work can be finished so as to have a fine surface roughness of about 1 μm in a relatively short period of time, and further, the surface can be uniformly finished over the whole of an objective region to be subjected to surface treatment, and to provide a device therefor. <P>SOLUTION: In the case that the surface layer is melted and solidified, and subjected to surface treatment by irradiating the surface of the work W with an electron beam, region information prescribing the objective region to be subjected to surface treatment in the work W is beforehand registered into a memory 19, and, based on the region information, the electron beam is two-dimensionally scanned in such a manner that a locus with the shape of a curved line is drawn in the objective region to be treated in the work W. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electron beam surface treatment method for performing surface treatment by irradiating an object with an electron beam, and an electron beam surface treatment apparatus used in the method.

  In general, various dies for plastic injection molding and semiconductor component manufacturing are subjected to surface treatment so as to have a fine surface roughness by electrical discharge machining, chemical etching, etc. after roughing in advance with a cutting machine. Yes.

  However, the surface roughness after electrical discharge machining is about several μm to several tens of μm, and it is difficult to achieve the surface roughness of several μm or less that is usually required in a mold. In contrast, when a chemical etching method is used, it is possible to finish the surface with a surface roughness of about 1 μm, but it is extremely difficult to control the processing conditions. Therefore, conventionally, for example, after performing electric discharge machining, surface treatment is performed by polishing paper or polishing powder so that the surface roughness is about 0.1 μm to 1 μm.

  However, since all the polishing operations for smoothing are performed manually, there are many cases where the skill of the skilled worker is relied on and much time is required to complete the surface finishing. In particular, when the shape of the object to be processed is complicated, it is difficult to uniformly polish the surface, and it takes a long time for the polishing operation, and the efficiency of the surface treatment cannot be sufficiently achieved.

  Therefore, conventionally, in order to smooth the surface of the object to be processed without manual work, the surface treatment is performed by irradiating the object to be processed with an ion beam, or the surface of the object to be processed. A technology that performs surface treatment by irradiating an electron beam over a wide range, and a technology that performs surface treatment by scanning the surface of the workpiece so that the electron beam draws a circular trajectory. It has been proposed (see, for example, Patent Documents 1 to 3).

JP 55-165288 A JP 2004-1086 A Japanese Patent Laid-Open No. 9-216075

  However, since the technique described in Patent Document 1 performs smoothing by irradiating an object with an ion beam and sputtering the convex portions on the surface, even if the shape of the object to be processed is complicated Although it is possible to cope with it, it is difficult to improve the efficiency of the surface treatment because the processing speed is slow and it is not much different from the case where the surface is polished manually.

  Moreover, in the technique described in Patent Document 2, it is possible to finish the surface with a fine surface roughness in a relatively short time. However, due to the pulse irradiation of the electron beam over a wide area of the object to be processed, the object to be processed If the shape of the object is complicated, the surface cannot be irradiated with an electron beam uniformly. For this reason, local unevenness is likely to occur in the surface roughness. Further, even when the surface is flat, an electron beam is simultaneously irradiated over a wide area of the object to be processed, so that when the surface layer is irradiated with a heat amount that melts and solidifies, tensile residual stress is likely to occur, and the surface of the object to be processed Cause fine cracks.

  Furthermore, with the technique described in Patent Document 3, it is possible to finish the surface with a fine surface roughness in a relatively short time. However, when the surface of the workpiece is irradiated with the electron beam, the electron beam is circular. Since scanning is performed so as to form a locus, heat tends to concentrate on a tangential portion where the circular locus overlaps, and uneven melting is likely to occur, and it is difficult to perform uniform surface finishing.

  Moreover, in the technique described in Patent Document 3, since the focal point on which the electron beam is converged is always set to be constant, there is a difference in the irradiation energy of the electron beam when the object to be processed has an uneven portion. As a result, a uniform surface roughness cannot be obtained.

  The present invention has been made to solve the above-described problems, and it is possible to finish the surface of the object to be processed to a fine surface roughness of about 1 μm within a relatively short time. Another object of the present invention is to provide an electron beam surface treatment method capable of uniformly finishing the entire region to be treated that requires surface treatment, and an electron beam surface treatment apparatus used in this method.

  In order to achieve the above object, the electron beam surface treatment method of the present invention is a method of performing surface treatment by irradiating the surface of an object with an electron beam to melt and solidify a surface layer thereof. Area information that defines a processing target area for surface treatment of an object is registered in advance, and an electron beam is drawn based on this area information so as to draw a bent line-shaped locus in the processing target area of the object to be processed. It is characterized by dimension scanning.

  The electron beam surface treatment apparatus of the present invention has electron beam irradiation means for irradiating the surface of the workpiece with an electron beam. The electron beam irradiation means includes an electron gun for generating an electron beam and the electron gun. A beam converging unit for converging the electron beam from the beam and a beam deflecting unit for deflecting the electron beam, and a storage unit in which region information for defining a processing target region for performing the surface treatment of the workpiece is registered. Based on the region information stored in the storage unit, the beam deflecting unit is controlled so that the electron beam is two-dimensionally scanned in a bent line-like locus within the processing target region of the workpiece. And beam scanning control means.

  According to the present invention, when the surface layer is melted by two-dimensional scanning within the region to be processed of the object to be processed by the electron beam, the surface tension causes the surface to be flat from the original shape of the object to be processed. After being deformed into a simple surface shape, it is self-cooled and solidified, so that the surface of the object to be processed can be finished to a fine surface roughness of about 1 μm within a relatively short time. In addition, since the electron beam is two-dimensionally scanned so as to draw a curved trajectory at that time, heat does not concentrate locally and uneven melting does not occur, and a uniform surface is obtained over the entire surface treatment target region. It can be finished to roughness.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of an electron beam surface treatment apparatus according to Embodiment 1 of the present invention.

  The electron beam surface treatment apparatus 1 according to the first embodiment performs surface treatment of a workpiece W made of a ferrous metal such as steel or a non-ferrous metal such as an aluminum alloy. A beam irradiation means 3 and an XY table 4 are arranged. Further, outside the vacuum chamber 2, an evacuation device 5, a beam focusing device 6, a beam deflection device 7, a power supply device 8, and a control device 9 are provided.

  The electron beam irradiation means 3 irradiates the surface of the workpiece W with an electron beam. The electron gun 12 generates an electron beam, a converging lens 13 that converges the electron beam from the electron gun 12, and an electron. A deflection lens 14 for deflecting the beam is provided. The electron gun 12 includes a cathode 12a, an anode 12b, and a bias electrode 12c. When the power supply device 8 applies a negative voltage to the cathode 12a and the bias electrode 12c and a positive voltage to the anode 12b. An electron beam is generated, converged by the converging lens 13, then deflected by the deflecting lens 14 and irradiated onto the surface of the workpiece W.

  As shown in FIG. 2, the XY table 4 can move the workpiece W individually in the X-axis direction and the Y-axis direction orthogonal to each other. The evacuation device 5 performs evacuation so that the vacuum chamber 2 has a predetermined degree of vacuum.

  The beam converging device 6 adjusts the degree of convergence of the electron beam by the converging lens 13 based on a command from the control device 9, and the beam deflection device 7 is based on a command from the control device 9. 14 adjusts the degree of deflection of the electron beam. A beam converging unit 15 is configured by the converging lens 13 and the beam converging unit 6, and a beam deflecting unit 16 is configured by the deflecting lens 14 and the beam deflecting unit 7.

  The control device 9 is composed of a microcomputer or the like, and each operation of the electron beam irradiation means 3, the XY table 4, the vacuum exhaust device 5, and the power supply device 8 based on a preset control program. To control. Further, the control device 9 is provided with a workpiece information memory 19.

  The workpiece information memory 19 corresponds to the storage means in the claims, and includes region information that defines a processing target region for performing the surface treatment of the workpiece W, and a shape related to the surface shape of the workpiece W. Information is registered in advance.

  Based on the region information and the shape information stored in the workpiece information memory 19, the control device 9 causes the electron beam to be bent in the processing target region of the workpiece W as described later. The beam deflecting unit 16 is controlled so as to be scanned two-dimensionally, and the beam converging unit 15 is controlled so that the electron beam always focuses on the irradiation position of the surface of the workpiece W. Therefore, this control device 9 serves as beam scanning control means and focus control means in the claims.

  Next, a surface treatment method of the workpiece W using the electron beam surface treatment apparatus 1 having the above configuration will be described.

  When performing the surface treatment of the workpiece W, the region information for defining the processing target region of the workpiece W and the shape information related to the surface shape of the workpiece W are registered in advance in the workpiece information memory 19. . Then, after placing the workpiece W on the XY table 4, vacuuming is performed by the vacuum exhaust device 5 until the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum.

  When the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum, the control device 9 drives the XY table 4 and moves the workpiece W to a position where an electron beam can be irradiated to a processing target area where surface processing is required. Then, the power supply device 8 is activated to generate an electron beam from the electron gun 12.

  Then, the control device 9 performs two-dimensional scanning with the electron beam drawing a bent line-shaped locus in the processing target region of the workpiece W based on the region information stored in the workpiece information memory 19. Thus, the beam deflection means 16 is controlled.

  For example, as shown in FIG. 3A, when the processing target area that requires surface treatment of the workpiece W is set to a range indicated by the symbol Ra, the electron beam has a sawtooth wave locus in the processing target area Ra. Two-dimensional scanning is performed as shown. Alternatively, for example, as shown in FIG. 3B, when the processing target area that requires surface treatment of the workpiece W is set to the range indicated by the symbol Rb, the electron beam is in a multiple reflection state within the processing target area Rb. Two-dimensional scanning is performed so as to draw the trajectory.

  Here, in order to draw a sawtooth-like trajectory as shown in FIG. 3A, when the scanning speed component in the X-axis direction is Vx and the scanning speed component in the Y-axis direction is Vy, Vy >> It can be implemented by setting to Vx.

  In order to draw a multiple reflection trajectory as shown in FIG. 3B, when the scanning speed component Vx in the X-axis direction and the scanning speed component Vy in the Y-axis direction are used, the difference between the two speed components is obtained. This can be implemented by setting Δ (= Vx−Vy) to be a small difference. When Vx = Vy, the electron beam is reciprocated on the line indicated by the broken line in FIG. 3B (on the line having an angle of 45 °), so that a multiple reflection trajectory is not drawn.

  As described above, when the electron beam is two-dimensionally scanned so as to draw a sawtooth wave locus as shown in FIG. 3A or a multiple reflection locus as shown in FIG. It is convenient because heat does not concentrate locally.

  That is, as shown in FIG. 4 (a), when two-dimensional scanning is performed so that the electron beam draws a circular locus, the electron beam extends over a length La within a region having a certain width M (shaded portion). Since scanning is performed, the irradiation time of the electron beam is increased, and heat is concentrated on the tangential portion where the circular trajectory overlaps, and uneven melting is likely to occur between the other portions.

  On the other hand, as shown in FIG. 4B, when the electron beam is two-dimensionally scanned in a bent line shape, a slight length Lb (in a region (shaded portion) having the same constant width M is used. Since the electron beam is scanned only by <La), the irradiation time of the electron beam is shorter than that in the case of FIG. 4A, and the heat concentration in the tangential portion where the trajectories overlap is alleviated. For this reason, it is possible to achieve a uniform surface roughness over the entire region to be processed without causing uneven melting with other portions. In particular, when the electron beam is two-dimensionally scanned so as to draw a multiple reflection trajectory as shown in FIG. 3B, it is possible to reliably avoid the heat generated by the electron beam irradiation from being concentrated at a specific location. it can.

  Further, in the first embodiment, when the electron beam is two-dimensionally scanned in a bent line as described above, the control device 9 is configured to obtain the surface shape of the workpiece W stored in the workpiece information memory 19. The beam converging means 15 is controlled so that the electron beam is always focused on the irradiation position on the surface of the workpiece W based on the shape information regarding.

  For this reason, as shown in FIG. 5A, for example, even when the concave portion W1 exists on the surface of the workpiece W, the electron beam is always irradiated at any irradiation position on the surface inside the concave portion W1 and the surface outside the concave portion W1. Become focused. Further, for example, as shown in FIG. 5B, even when an arc-shaped step W2 exists on the surface of the workpiece W, the irradiation position of the electron beam is on the surface of the step W2 and on the surface before and after the step W2. But always focus. Therefore, even when the shape of the workpiece W varies, the surface is always irradiated with the electron beam with the same energy density.

  As described above, in the first embodiment, by scanning the electron beam within the region to be processed of the workpiece W, the surface layer is melted and then self-cooled and solidified immediately. Can be finished to a fine surface roughness of about 1 μm within a relatively short time. In addition, since the electron beam is scanned so as to form a bent line as shown in FIG. 3, the heat does not concentrate locally and uneven melting does not occur, and the entire region to be processed is uniform. It can be finished to a rough surface. Further, the focus of the electron beam is controlled so as to always converge to the irradiation position on the surface of the workpiece W as shown in FIG. The density is always constant. Therefore, the surface can be uniformly melted and solidified by irradiating the surface with an electron beam. For this reason, a more uniform surface treatment can be performed.

  In this way, when the surface treatment of a certain range of the workpiece W is completed by the two-dimensional scanning of the electron beam, the control device 9 moves the XY table 4 and moves the XY table 4 on the other range of the workpiece W. In the same manner as above, surface treatment is performed by electron beam irradiation. Finally, the surface treatment is performed over the entire area of the predetermined processing target area of the workpiece W. The two-dimensional scanning of the electron beam and the movement of the XY table 4 may be controlled synchronously.

  In the first embodiment described above, a sawtooth wave locus (FIG. 3A) or a multiple reflection locus (FIG. 3 (A)) in the rectangular processing target areas Ra and Rb that require surface treatment of the workpiece W. b)), the electron beam is scanned two-dimensionally, but the electron beam is digitally minute (for example, the beam diameter is about 1/10 of φ0.3 mm, 0.01 mm to 0.05 mm). If the preset position is moved according to the data, it is possible to irradiate not only the rectangular areas Ra and Rb but also any complicated area with an electron beam.

  In the first embodiment, focus control is performed so that the electron beam always focuses on the irradiation position on the surface of the workpiece W based on the shape information in the memory 19. It is also possible to perform focus control so as to be always set at a predetermined distance from the surface of the workpiece W.

  Furthermore, even if the focus control is performed so that the electron beam always focuses on the surface of the workpiece W, if the surface of the workpiece W is generally inclined, the surface of the workpiece W Since the heat input density of the electron beam (energy density of the electron beam) is different from that in the case of the horizontal plane, based on the shape information relating to the surface shape of the workpiece W stored in the workpiece information memory 19. The heat input density (electron beam energy density) of the electron beam to the object to be processed may be changed. In this case, the heat input density can be changed by changing the beam current, changing the number of scans, or changing the scan speed.

  Furthermore, in the first embodiment, the XY table 4 is provided as the workpiece moving mechanism. However, the present invention is not limited to this, and a workpiece moving mechanism having another configuration may be provided. For example, a mechanism 21 that tilts and holds the workpiece W as shown in FIG. 6A and a rotation holding mechanism 22 as shown in FIG. 6B can be disposed on the XY table 4.

  For example, as shown in FIG. 6A, when the workpiece W has a groove W3, the vertical wall in the groove W3 may not be sufficiently irradiated by simply deflecting the electron beam. When 21 is provided, surface treatment can be performed by reliably irradiating the vertical wall of the groove W3 with an electron beam by inclining the workpiece W by the tilt holding mechanism 21.

  Further, as shown in FIG. 6B, when the workpiece W has a cylindrical shape, the workpiece W is rotated by the rotation holding mechanism 22 so that the electron beam is perpendicular to the processing surface. Since it can be irradiated, a uniform surface treatment can be performed.

Embodiment 2. FIG.
FIG. 7 is a block diagram showing a main part of the electron beam surface treatment apparatus according to the second embodiment.

  A feature of the second embodiment is that deflection lenses 14a and 14b are provided over a plurality of stages (two stages in this example) along the radiation direction of the electron beam. For this reason, the electron beam deflected by the first stage deflection lens 14a is subsequently further deflected by the second stage deflection lens 14b.

  Thereby, the incident angle of the electron beam with which the surface of the workpiece W is irradiated can be reduced. That is, the electron beam can be irradiated as perpendicularly as possible to the surface of the workpiece W. For this reason, when the electron beam is scanned two-dimensionally, the energy density of the electron beam applied to the surface of the workpiece W is always constant, so that the surface layer of the workpiece W can be uniformly melted and solidified. And uniform surface treatment.

  Moreover, for example, as shown in FIG. 8, when the workpiece W has a concave portion W4, the single deflection lens cannot sufficiently deflect the electron beam, so that the shadow is formed in the concave portion W4 and the electron beam is sufficiently irradiated. There are things that cannot be done. On the other hand, when the electron beam is deflected a plurality of times by the plurality of stages of deflection lenses 14a and 14b as in the second embodiment, the surface treatment is performed by reliably irradiating the electron beam into the recess W4. It can be carried out.

  In the second embodiment, the two-stage deflection lenses 14a and 14b are provided along the electron beam radiation direction, but three or more stages may be provided. Other configurations and operational effects are the same as those in the first embodiment, and thus detailed description thereof is omitted here.

Embodiment 3 FIG.
FIG. 9 is a block diagram of the electron beam surface treatment apparatus according to the third embodiment. Components corresponding to those of the first embodiment shown in FIG.

  A feature of the third embodiment is that a vacuum chamber 2a in which the electron beam irradiation means 3 is arranged and a vacuum chamber 2b in which the XY table 4 is arranged are provided independently of each other. Between the two vacuum chambers 2a and 2b, for example, a bellows-like vacuum seal 23 is provided to communicate with each other, and the vacuum chamber 2a in which the electron beam irradiation means 3 is disposed is connected to the other vacuum chamber 2b. A sliding means 24 for displacing is provided. The sliding means 24 in this case is constituted by, for example, a roller 25 provided at the bottom of the vacuum chamber 2a, and a driving unit 26 having a motor and a gear for driving the roller 25.

  According to this configuration, even if the irradiation range of the electron beam to the workpiece W is limited only by moving the XY table 4, if the entire vacuum chamber 2a in which the electron beam irradiation means 3 is disposed is moved, the object to be processed is moved. An electron beam can be irradiated over a wide range of the workpiece W.

  In the third embodiment, the vacuum chamber 2a in which the electron beam irradiation means 3 is arranged is moved. Conversely, the vacuum chamber 2b in which the XY table 4 is accommodated may be moved. Is possible. Other configurations and operational effects are the same as those in the first embodiment, and thus detailed description thereof is omitted here.

  6A shows a configuration in which the mechanism 21 for tilting and holding the workpiece W is arranged on the XY table 4, the electron beam irradiation means 3 is tilted with respect to the XY table 4 in the vacuum chamber 2a. It can also be set as the structure which provided the tilt holding mechanism (not shown) to hold | maintain. With such a configuration, even when the shape of the workpiece W is large, the electron beam can be appropriately irradiated over a wide surface of the workpiece W by tilting the electron beam irradiation means 3.

Embodiment 4 FIG.
FIG. 10 is a block diagram showing a main part of the electron beam surface treatment apparatus according to the fourth embodiment.

  The feature of the fourth embodiment is that a temperature adjusting means 29 is provided for adjusting the temperature of the workpiece W placed on the XY table 4 so as to reach a required temperature. The temperature adjusting means 29 in this case is composed of, for example, a heating / cooling device 30 interposed between the XY table 4 and the workpiece W and a temperature control device 31 for controlling the temperature of the heating / cooling device 30. ing. As the heating / cooling device 30 in this case, for example, a device using a Peltier element, a heater alone or a cooler alone, or a combination of both can be applied.

  According to this configuration, for example, as shown in FIG. 11, when the melting temperature of the workpiece W by electron beam irradiation is Tq, the base material temperature before the processing of the workpiece W is changed to T1 and T2, The temperature distribution curve of the workpiece W at the time of electron beam irradiation changes as indicated by the solid line and the broken line, and the melting depth from the surface also changes by D1 and D2. Therefore, appropriate melting depths D1, D2, etc. can be set according to the material of the workpiece W.

  Other configurations and operational effects are the same as those in the first embodiment, and thus detailed description thereof is omitted here.

  Using the electron beam surface treatment apparatus having the configuration of the first embodiment, surface treatment was performed on an object to be evaluated. In this case, STAVAX steel (JIS G 4303 to 4309: martensitic stainless steel SUS420J2 equivalent) was used as the material of the workpiece. The surface roughness of the substrate before this surface treatment is 6 μm. Further, as processing conditions, under a vacuum degree of 6.7 Pa or less, an acceleration voltage of 30 kV, a beam current of 110 mA, a processing target area is set to a range of 30 mm × 30 mm, and within that range, as shown in FIG. The electron beam was scanned two-dimensionally so as to draw a sawtooth-like trajectory. Then, the surface roughness of the object to be processed after electron beam scanning was measured.

  As a result, the time required to two-dimensionally scan the entire 30 mm × 30 mm processing target region with the electron beam once is about 1.6 seconds, and the surface roughness of the processing object at this time is 0.96 μm (6 Average value of the measurement times). Therefore, it was confirmed that the surface roughness after the surface treatment sufficiently satisfies the required characteristics. Moreover, when the surface state after the process of the to-be-processed object was observed with the scanning electron microscope etc., it was confirmed that the uniform surface treatment is performed in the process target area | region.

  In addition, if only the beam current is changed to 90 mA among the processing conditions and the processing target area having the same area as above is subjected to two-dimensional scanning repeatedly, the total time required for processing is about 7.4 seconds. The surface roughness of the object to be processed was 1.13 μm (average value of six measurements). In this case, it was confirmed that the required surface roughness was obtained.

  Note that, as described in Patent Document 2, the time required to finish the surface roughness of about 1 μm in the same 30 mm × 30 mm area as described above by irradiating an electron beam over a wide area of the object to be processed. Is about 380 seconds. Therefore, it is understood that the time required for finishing the present invention with the same level of surface roughness is extremely short as compared with the prior art.

  The present invention is not limited to the case where the workpiece W to be surface-treated is a mold, and the present invention can be widely applied to workpieces that require fine surface treatment. .

It is a block diagram of the electron beam surface treatment apparatus in Embodiment 1 of this invention. In Embodiment 1 of this invention, it is a perspective view which shows the outline of the state which mounted the to-be-processed object on the XY table. In Embodiment 1 of this invention, it is explanatory drawing at the time of carrying out two-dimensional scanning with an electron beam with respect to a to-be-processed object. It is a figure for demonstrating the heat concentration degree which arises with the difference in the scanning method in the case of scanning an electron beam with respect to a to-be-processed object two-dimensionally. In Embodiment 1 of this invention, it is explanatory drawing in the case of carrying out focus control so that an electron beam always converges on the irradiation position of the to-be-processed object surface. It is a perspective view which shows the modification of a to-be-processed object movable mechanism. FIG. 5 is a configuration diagram showing a main part of an electron beam surface treatment apparatus in a second embodiment. In Embodiment 2, it is explanatory drawing in the case of deflecting an electron beam and irradiating the to-be-processed surface. 6 is a configuration diagram of an electron beam surface treatment apparatus in Embodiment 3. FIG. FIG. 10 is a configuration diagram showing a main part of an electron beam surface treatment apparatus in a fourth embodiment. In Embodiment 4, it is a characteristic view which shows the difference in the temperature distribution by electron beam irradiation at the time of adjusting the temperature of a to-be-processed object with a temperature control means.

Explanation of symbols

W workpiece, 1 electron beam surface treatment device, 2 vacuum chamber,
3 electron beam irradiation means, 4 XY table (workpiece moving mechanism),
9 Control device (beam scanning control means, focus control means), 12 electron gun,
13 converging lens, 14, 14a, 14b deflection lens, 15 beam converging means,
16 Beam deflection means, 19 Workpiece information memory (storage means), 21 Tilt holding mechanism, 22 Rotation holding mechanism, 24 Slide means, 29 Temperature adjusting means.

Claims (12)

In an electron beam surface treatment method in which a surface treatment is performed by irradiating the surface of an object with an electron beam to melt and solidify the surface layer,
Area information that defines a process target area for performing the surface treatment of the object to be processed is registered in advance, and an electron beam is drawn in a bent line locus in the process target area of the object to be processed based on the area information. An electron beam surface treatment method characterized by performing two-dimensional scanning as described above. 2. The electron beam surface treatment method according to claim 1, wherein the two-dimensional scanning for drawing a bent line-shaped locus is a two-dimensional scanning for drawing a sawtooth-shaped locus. 2. The electron beam surface treatment method according to claim 1, wherein the two-dimensional scanning that draws the bent line-shaped locus is a two-dimensional scanning that draws a multi-reflection locus. Focus control is performed so that shape information relating to the surface shape of the object to be processed is registered in advance, and the electron beam is always focused on the surface of the object to be processed or a certain distance from the surface based on the shape information. The electron beam surface treatment method according to any one of claims 1 to 3, wherein: 2. Shape information regarding the surface shape of the object to be processed is registered in advance, and control is performed to change the energy density of the electron beam with respect to the irradiation position of the object to be processed based on the shape information. The electron beam surface treatment method according to any one of claims 3 to 4. An electron beam irradiation means for irradiating the surface of the workpiece with an electron beam; the electron beam irradiation means; an electron gun for generating an electron beam; a beam focusing means for converging the electron beam from the electron gun; In an electron beam surface treatment apparatus comprising beam deflecting means for deflecting an electron beam,
Storage means in which area information for defining a process target area for surface treatment of the object to be processed is registered in advance, and an electron beam is processed on the object to be processed based on the area information stored in the storage means. An electron beam surface processing apparatus comprising: a beam scanning control unit that controls the beam deflecting unit so that a two-dimensional scanning is performed while drawing a bent line-shaped locus in a region. In the storage means, in addition to the area information, shape information relating to the surface shape of the object to be processed is registered in advance, and on the basis of the shape information, the electron beam is separated from the surface or surface of the object to be processed by a predetermined distance. 7. The electron beam surface treatment apparatus according to claim 6, further comprising a focus control means for controlling the beam converging means so as to always focus on the spot. 8. The electron according to claim 6 or 7, further comprising a workpiece moving mechanism that performs at least one of horizontal movement, rotation, and tilting of the workpiece with respect to an electron beam irradiation direction. Beam surface treatment equipment. The electron beam surface treatment apparatus according to any one of claims 6 to 8, wherein the beam deflecting means is provided in a plurality of stages along the electron beam radiation direction. 10. The electron beam surface treatment apparatus according to claim 6, further comprising slide means for displacing the position of the electron beam irradiation means with respect to the workpiece moving mechanism. 11. The electron beam surface treatment apparatus according to claim 6, further comprising tilting means for tilting the position of the electron beam irradiation means with respect to the workpiece moving mechanism. The electron beam surface treatment apparatus according to any one of claims 6 to 11, further comprising temperature adjusting means for adjusting the temperature of the object to be processed to a predetermined temperature.

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