JP2006032529A - Conveyance equipment and method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To deliver smoothly an object to be conveyed between mechanisms even if the mechanism is subject to thermal deformation. <P>SOLUTION: This conveyance equipment is used for conveying an object to be delivered between a plurality of mechanisms by the movement of traverse, rise/fall or rotation in a high temperature environment. It comprises position detectors 8c and 8d for detecting the position of a delivering mechanism or the position of a delivered mechanism; and a displacement detector 100 for detecting the position displacement with respect to the prescribed range of the delivering mechanism or the delivered mechanism based on detection results of the position detectors 8c and 8d. In the case that the position of the delivering mechanism or the position of the delivered mechanism is displaced in comparison with the prescribed range, the position of the delivered mechanism is moved relatively to the position of the delivering mechanism according to the detection result of the displacement detector 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a transport apparatus and method.

The transport device is for transporting a transport object to a predetermined position. In such a transport device, the transport object is transported in an airtight container (in atmospheric gas or vacuum) or in a high temperature environment. (See Patent Document 1).
In addition, some transport apparatuses include a plurality of mechanism units that transport a transport target object. In such a transport apparatus, the transport target object is transported while delivering the transport target object between the plurality of mechanism units. is doing. In such a transport device having a plurality of mechanism units, for example, a servo motor is installed in one of the mechanism units, and the mechanism unit is positioned at a predetermined position by the servo motor when the object to be transported is transferred between the mechanism units. The transfer object is delivered by moving and performing the operation.
Japanese Patent Laid-Open No. 2003-332404

However, in a transport apparatus that transports an object to be transported in a hermetic container using a plurality of mechanism units in a high-temperature environment, the members constituting the mechanism units themselves may be deformed by thermal expansion. In such a case, the object to be transported is displaced as a result, making it difficult to cope with the servo motor. For this reason, the case where it is delivered between several mechanism parts in the state which the conveyance target object shifted | deviated arises.
As described above, when the transfer object is transferred between the plurality of mechanism units in a shifted state, the transfer object falls from the mechanism unit or the transfer object collides with a member constituting the mechanism unit. As a result, there arises a problem that the conveying device that the conveyance object or the member of the mechanism portion is damaged must be stopped.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to smoothly transfer an object to be conveyed between mechanism units even when the mechanism units are thermally deformed.

  In order to achieve the above object, the invention according to claim 1 is configured to convey the object to be conveyed by traversing, moving up and down or rotating in a high temperature environment, and delivering the object to be conveyed between a plurality of mechanism units. A position detection unit that detects a position of the mechanism unit on the delivery side or a position of the mechanism unit on the delivery side, and the mechanism unit on the delivery side based on the detection result of the position detection unit or the above A displacement detecting unit that detects a displacement of a mechanism unit on the delivery side with respect to a predetermined range, and the position of the mechanism unit on the delivery side or the position of the mechanism unit on the delivery side is relative to the predetermined range. The mechanism unit on the delivery side is moved relative to the mechanism unit on the delivery side according to the detection result of the deviation detection unit.

  According to a second aspect of the present invention, in the first aspect of the invention, the position detection unit is an imaging apparatus and an image processing device that capture an image of the position of the delivery-side mechanism unit or the delivery-side mechanism unit. It is characterized by being.

  The invention according to claim 3 is characterized in that, in the invention according to claim 1 or 2, the mechanism portion is arranged in an airtight container.

  The invention according to claim 4 is a transport method for transporting the transport object in a high temperature environment by traversing, moving up and down or rotating, and delivering the transport object between a plurality of mechanism units, Detecting the position of the mechanism part or the position of the mechanism part on the delivery side, detecting a positional shift of the delivery side mechanism part or the delivery side mechanism part with respect to a predetermined range based on the detection result; When the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side is deviated from the predetermined range, the mechanism part on the delivery side according to the detection result of the positional deviation. Is moved relative to the mechanism on the delivery side.

  According to a fifth aspect of the present invention, in the invention according to the fourth aspect, the position of the delivery-side mechanism section or the receiving position is obtained by imaging the delivery-side mechanism section or the delivery-side mechanism section. The position of the mechanism unit on the delivery side is detected, and image processing data of the mechanism unit on the delivery side or the mechanism unit on the delivery side is subjected to image processing, whereby the mechanism unit on the delivery side or the delivery unit is delivered. It is characterized in that a positional shift of a side mechanism portion with respect to a predetermined range is detected.

  The invention according to claim 6 is the invention according to claim 4 or 5, wherein the delivery-side mechanism portion is based on an edge position of the delivery-side mechanism portion or an edge position of the delivery-side mechanism portion. Alternatively, it is characterized in that a positional deviation with respect to a predetermined range of the mechanism part on the delivery side is detected.

  According to the transport apparatus and method of the present invention, the position of the mechanism unit on the delivery side or the position of the mechanism unit on the delivery side is detected, and further, a positional deviation is detected. Then, when the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side is shifted, the mechanism part on the delivery side according to the detection result of the displacement is the mechanism part on the delivery side. Is moved relative to. For this reason, even when the member of the mechanism section is deformed by thermal expansion, the positional relationship between the mechanism section on the delivery side and the mechanism section on the delivery side is corrected to an optimum state for delivery of the conveyance object. Can be made. Therefore, according to the transporting apparatus and method of the present invention, it is possible to smoothly transfer the transport object between the mechanical parts even when the mechanical parts are thermally deformed.

  Further, according to the transport device and method of the present invention, when an imaging device is used as the position detection unit, the delivery side mechanism is obtained by imaging the delivery side mechanism unit or the delivery side mechanism unit. The position of the mechanism part or the position of the mechanism part on the delivery side is detected, and the position shift of the mechanism part on the delivery side or the mechanism part on the delivery side is detected by image processing the detection result. Therefore, according to the conveying apparatus and method of the present invention, it is possible to easily detect the positional deviation of the mechanism unit on the delivery side or the mechanism unit on the delivery side.

  Further, according to the transport method of the present invention, the positional deviation of the delivery-side mechanism unit or the delivery-side mechanism unit with respect to the predetermined range is the edge position of the delivery-side mechanism unit or the delivery-side mechanism unit. Is detected based on the edge position. Therefore, according to the transport method of the present invention, it is possible to easily detect the positional deviation of the mechanism unit on the delivery side or the mechanism unit on the delivery side.

  Hereinafter, an embodiment of a transfer apparatus and method according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.

The transport apparatus of this embodiment is used in a semiconductor substrate manufacturing apparatus that is a deposition plate manufacturing apparatus. FIG. 1 is a schematic configuration diagram when a semiconductor substrate manufacturing apparatus is viewed in plan. FIG. 2 is a schematic configuration diagram when the semiconductor manufacturing apparatus is viewed from the front. FIG. 3 is a schematic configuration diagram when the semiconductor substrate manufacturing apparatus is viewed from the side.
In the semiconductor substrate manufacturing apparatus 1, the transfer apparatus according to the present embodiment includes the substrate carry-in / out mechanism 60 and the deposition mechanism 10. The substrate 14 (conveyance target) is transported by the substrate carry-in / out mechanism 60 and the deposition mechanism 10 by traversing, raising / lowering or rotating, and is transferred between the substrate carry-in / out mechanism 60 and the deposition mechanism 10. And the semiconductor substrate manufacturing apparatus 1 manufactures the sheet-like precipitation board 2, carrying out the deposition board | substrate 14 using the conveying apparatus of this embodiment. Hereinafter, the detailed configuration of the semiconductor substrate manufacturing apparatus 1 will be described.

  As shown in FIG. 1, the semiconductor substrate manufacturing apparatus 1 reciprocates the deposition substrate 14 on the molten metal 15 so that the conveyance paths do not cross, thereby making a sheet mainly composed of Si as shown in FIG. 2. The shaped precipitation plate 2 is manufactured. The semiconductor substrate manufacturing apparatus 1 is a kind of deposition plate manufacturing apparatus. Further, the precipitation plate manufacturing apparatus is an apparatus that heats and melts the melting target object 101 such as a semiconductor material or a metal material to form the molten metal 15 and manufactures the melting target object 101 so as to be the sheet-shaped deposition plate 2. Further, as the melting object 101, a metal material such as iron or titanium can be used in addition to a semiconductor material such as Si.

  The semiconductor manufacturing apparatus 1 includes a vacuum vessel 4 having a double wall structure that can isolate the inside from an external environment in a sealed state. The vacuum vessel 4 forms a sealed processing chamber 3. The processing chamber 3 includes a deposition mechanism accommodation space 3a, a substrate movement space 3b, and a molten metal accommodation space 3c in the vertical direction. The deposition mechanism accommodation space 3a is located at the uppermost part and is formed so as to accommodate a deposition mechanism 10 (mechanism part) described later. The substrate activation space 3b is located between the deposition mechanism accommodation space 3a and the molten metal accommodation space 3c, and is an intermediate mechanism of a later-described substrate carry-in / out mechanism 60 (mechanism part) provided in two sets in the vertical direction in FIG. It is formed so as to accommodate the portion 60b. The molten metal accommodation space 3c is located at the lowermost part and is formed to accommodate a crucible device 75 described later.

  A gas supply device (not shown) that supplies an inert gas of Ar gas and a vacuum exhaust device (not shown) that exhausts the air in the processing chamber 3 are connected to the vacuum container 4. These apparatuses form a processing environment filled with, for example, an inert gas in the processing chamber 3 different from the external environment by supplying the inert gas while reducing the processing chamber 3 to a predetermined pressure.

  Further, as shown in FIG. 1, a carry-in mechanism portion 60 a of the substrate carry-in / out mechanism 60 is arranged on the upstream side (left side in the drawing) in the transport direction with respect to the vacuum container 4. On the other hand, an unloading mechanism 60c of the substrate unloading / unloading mechanism 60 is disposed on the downstream side (right side in the drawing) in the transport direction with respect to the vacuum container 4. The carry-in mechanism unit 60a, the carry-out mechanism unit 60c, and the intermediate mechanism unit 60b are horizontally arranged substantially linearly. The carry-in mechanism section 60a includes partition walls 62a, 62b, and 62c having a rectangular longitudinal section, a viewing window 67, and a transport roller 59 shown in FIG. Note that a plurality of viewing windows 67 are provided for the operator to monitor the inside of the space surrounded by the partition wall 62a. Moreover, the conveyance roller 59 is arrange | positioned in the space enclosed by the partition 62a, and moves to the conveyance direction, mounting the depositing board | substrate 14. FIG.

  The spaces surrounded by the partition walls 62a, 62b, and 62c are configured as a pressure adjustment chamber 61a, a preheating chamber 61b, and a standby chamber 61c, respectively. These pressure adjustment chamber 61a, preheating chamber 61b, and standby chamber 61c are arranged in this order from the upstream side in the transport direction. The pressure adjusting chamber 61a is set to a size that can be accommodated in series in the six deposition substrates 14 in this embodiment. Further, the pressure adjusting chamber 61a has one end communicated with an apparatus having atmospheric pressure, and the other end communicated with the preheating chamber 61b.

  A first shielding plate 63 and a second shielding plate 64 are provided at one end and the other end of the pressure adjusting chamber 61a, respectively. Each of these shielding plates 63 and 64 can be raised and lowered by a cylinder device (not shown), and the raising and lowering operation is controlled by a control device (not shown). Specifically, the first shielding plate 63 is raised when the deposition substrate 14 is carried into the pressure adjustment chamber 61a, and is lowered so as to seal one end of the pressure adjustment chamber 61a in an airtight state after carrying in. On the other hand, the second shielding plate 64 is raised so as to open the other end of the second shielding plate 64 when the deposition substrate 14 is transported from the pressure adjustment chamber 61a to the preheating chamber 61b. An exhaust system 66 is connected to the pressure adjustment chamber 61a through an electromagnetic valve 65. The exhaust system 66 can depressurize the pressure adjustment chamber 61a to a vacuum state. The electromagnetic valve 65 is closed when the deposition substrate 14 is carried into the pressure adjustment chamber 61a, and is opened so that the pressure regulation chamber 61a is decompressed after the deposition substrate 14 is loaded.

  The preheating chamber 61b communicated with the pressure adjusting chamber 61a through the second shielding plate 64 is set to a size that can accommodate the six deposition substrates 14 in series, similarly to the pressure adjusting chamber 61a. ing. Similar to the vacuum vessel 4, the preheating chamber 61 b is surrounded by a partition wall 62 b having a double wall structure. One end of the preheating chamber 61 b can be opened and closed by the above-described second shielding plate 64, and the other end is partitioned by a first partition member 68. As shown in FIG. 2, the first partition member 68 is disposed so as to form a gap that allows the deposition substrate 14 transported by the transport roller 59 to pass therethrough.

  A first preheating heater 82 is provided in the preheating chamber 61b. The first preheating heater 82 is disposed so as to face the deposition substrate 14 located at the upstream end in the transport direction. Then, when the deposition substrate 14 is opposed to the first preheating heater 82, the deposition substrate 14 is heated to raise the temperature to a predetermined temperature, whereby the temperature difference between the molten metal 15 and the deposition substrate 14 is increased. It is set to be constant. The first preheating heater 82 may be a system that heats a heating wire by generating heat by energization, or may be a system that heats using a magnetic induction. Further, as shown in FIG. 1, an exhaust system 66 is connected to the preheating chamber 61b so as to suck in impurity gas diffused from the deposition substrate 14 during preheating. The suction port of the exhaust system 66 is close to the first preheater heater 82 so as to efficiently suck the impurity gas.

  The preheating chamber 61 b communicates with the standby chamber 61 c through the first partition member 68. The standby chamber 61 c is surrounded by a partition wall 62 c having a double wall structure, as in the vacuum vessel 4. Further, one end and the other end of the standby chamber 61c are partitioned by a first partition member 68 and a second partition member 69, respectively. The second partition member 69 is formed and arranged so as to pass the deposition substrate 14 and a substrate feed mechanism 70 described later. The standby chamber 61c is provided with a second preheating heater 83 similar to the first preheating heater 82 described above.

  The second preheating heater 83 is arranged so as to face the deposition substrate 14 in the standby state. The second preheating heater 83 heats and raises the temperature of the deposition substrate 14 preheated by the first preheating heater 82 when the deposition substrate 14 is opposed to the deposition substrate 14. And the temperature difference between the two is made constant in a further reduced state. The second preheating heater 83 may be used for fine adjustment of the preheating temperature of the deposition substrate 14. Further, an exhaust system 66 is connected to the standby chamber 61c so as to suck in impurity gas diffused from the deposition substrate 14 during preheating. The suction port of the exhaust system 66 is close to the second preheater 83 so as to suck the impurity gas efficiently.

  The standby chamber 61 c communicates with the processing chamber 3 through the second partition member 69. The processing chamber 3 accommodates the intermediate mechanism portion 60 b of the substrate carry-in / out mechanism 60. As shown in FIG. 2, the intermediate mechanism portion 60 b includes a first transport table 84 and a second transport table 85 on which the deposition substrate 14 is movably mounted. One end of the first transfer table 84 is advanced into the standby chamber 61 c so as to be close to the end of the transfer roller 59. The first transfer table 84 and the second transfer table 85 are arranged in series at a predetermined interval on the upstream side (left side in the drawing) and the downstream side (right side in the drawing) of the processing chamber 3. The gaps between the transfer tables 84 and 85 are set as an attachment / detachment position A for delivering the deposition substrate 14 between the substrate carry-in / out mechanism 60 and the deposition mechanism 10.

  As shown in FIG. 1, a substrate feed mechanism 70 is disposed on the side of the first transfer table 84. The substrate feed mechanism 70 includes a plurality of claw members 71, a claw support member 72 that cantilles these claw members 71 on the free end side, and a claw turning mechanism that rotatably supports a base end portion of the claw support member 72. 73 and a claw turning mechanism 73 and a claw advance / retreat mechanism 74 that moves the claw support member 72 and the claw member 71 forward and backward in the transport direction. Each of the claw members 71 has an arrangement interval so as to sandwich both side surfaces of the deposition substrate 14 and has a predetermined width so that the gap between the adjacent deposition substrates 14 and 14 is expanded to a predetermined width. The thickness is set. Further, the claw turning mechanism 73 is composed of a motor with a clutch or the like, and the claw member 71 is turned so as to be positioned above and to the side of the deposition substrate 14 by turning in the forward and reverse directions. Yes. The claw advance / retreat mechanism 74 is composed of an air cylinder or the like, and the moving distance per time is set to the length of the deposition substrate 14.

  The substrate feeding mechanism 70 configured as described above includes an operation of gripping the deposition substrate 14 with a claw member 71 at a predetermined interval, an operation of moving the claw member 71 in the transport direction, and a deposition substrate 14. By repeating the operation of opening the claw member 71 and the operation of moving the claw member in a direction substantially in the transport direction, the deposition substrate 14 carried into the standby chamber 61c from the preheating chamber 61b is moved by the second preheating heater 83. The feed is sequentially sent to the preheating position and the attachment / detachment position A, and is sent from the attachment / detachment position A to the carry-out mechanism 60c.

  The substrate carry-in / out mechanism 60 composed of each of the mechanism portions 60a to 60c is arranged in parallel symmetrically about the crucible device 75. As a result, the attachment / detachment position A existing in the path of the substrate carry-in / out mechanism 60 is in a state of being located away from the upper side of the molten metal 15 in the crucible device 75. As shown in FIG. 2, the crucible device 75 includes a crucible 76 that accommodates the molten metal 15, an induction heating coil 77 disposed around the side wall of the crucible 76, the crucible 76 and the induction heating coil 77, The crucible 76 and the crucible support 78 for supporting the induction heating coil 77 are provided. A high frequency power source is connected to the induction heating coil 77 via a power cable (not shown). Thereby, the induction heating coil 77 generates an alternating magnetic field around the crucible 76 when high-frequency AC power is supplied from the high-frequency power source, and induction heating is mainly performed on the surface side of the crucible 76. Yes.

  The crucible 76 is formed in a circular shape in plan view as shown in FIG. The crucible 76 may be formed in a rectangular shape or an elliptical shape in plan view so that the traveling direction of the deposition substrate 14 is long. In this case, it is possible to prevent the side wall of the crucible 76 from becoming an obstacle during the immersion of the deposition substrate 14 while suppressing the amount of the molten metal 15 accommodated to a minimum. The crucible 76 has a bottom wall with a sufficiently large thickness so that a large amount of heat is transmitted from the two directions of the side surface and the bottom surface. On the other hand, the side wall of the crucible 76 is set to a thickness that is less than the penetration depth of electromagnetic induction, and when the molten metal 15 is convected, the fall center such as dust becomes a nucleus and the surface center of the molten metal 15 solidifies. Is preventing.

  A supply mechanism 90 that supplies the object to be melted 101 is provided obliquely above the crucible device 75. The supply mechanism 90 is provided on the side surface of the vacuum container 4 on the downstream side in the transport direction. The supply mechanism 90 includes a storage partition wall 91 having one end opened in the processing chamber 3, and a shield capable of airtightly separating the storage partition wall 91 into a supply chamber 93 on the processing chamber 3 side and a preparation chamber 94 on the atmosphere side. A mechanism 92, a lid member 95 that can open and close the preparation chamber 94 to the atmosphere side, and a raw material conveyance mechanism 96 that conveys the object to be melted 101 from the preparation chamber 94 to above the crucible 76.

  In addition, a first viewing window portion 4 a of the vacuum vessel 4 is disposed on the side of the supply mechanism 90. The first viewing window 4a is provided with a first imaging device 8a such as a CCD camera. The first imaging device 8a can detect the molten metal surface height of the molten metal 15 together with the crucible 76. A second viewing window portion 4b is disposed on the side wall surface of the vacuum container 4 on the downstream side in the transport direction. The second viewing window 4b is provided with a second imaging device 8b such as a CCD camera. The second imaging device 8b is set to capture an area viewed from the reverse direction that cannot be captured by the first imaging device 8a.

  A third viewing window 4c is arranged on one side (lower side in the figure) of the vacuum container 4 in the direction orthogonal to the transport direction. The third viewing window 4c is provided with a third imaging device 8c (imaging device) such as a CCD camera. As shown in FIG. 2, a fourth viewing window 4 d is disposed above the second transfer table 85 in the vacuum container 4. The fourth viewing window 4d is provided with a fourth imaging device 8d (imaging device) such as a CCD camera. The third image pickup device 8c and the fourth image pickup device 8d can detect the position of the first transport base 84 (the mechanism on the delivery side).

  FIG. 4 is a block diagram showing a part of a signal processing system included in the semiconductor substrate manufacturing apparatus 1. As shown in this figure, the third imaging device 8c and the fourth imaging device 8d are connected to the control device 100 (deviation detection unit). The control device 100 includes a calculation unit and a storage unit, and performs image processing on the imaging data of the second conveyance table 85 input from the third imaging device 8c and the fourth imaging device 8d, thereby performing the second conveyance table 85. The positional deviation with respect to the existence range (predetermined range) at the time of non-thermal deformation can be detected. In addition, when detecting a positional deviation, the control device 100 generates a control signal based on the detected positional deviation and outputs this control signal. The control signal is a signal for moving a deposition mechanism 10 (delivery side mechanism) described later so that the detected positional deviation is corrected so that the deposition substrate 14 can be smoothly delivered. is there. The amplifier 200 amplifies and outputs the control signal. The amplifier 200 and the deposition mechanism 10 are connected. Specifically, the amplifier 200 is connected to each of a horizontal driving device 23, a vertical driving device 35, and a turning driving device 40 which are a part of the deposition mechanism 10 described later.

  Further, the control device 100 has various functions for controlling each mechanism of the semiconductor substrate manufacturing apparatus 1 individually or in conjunction with each other. Specifically, the function of detecting the molten metal level of the molten metal 15 based on the brightness of the imaging signal from the first imaging device 8a and the supply so that the detected molten metal level becomes a predetermined reference height. The mechanism 90 has a function of controlling the supply timing and supply amount of the dissolution object 101.

  Further, as shown in FIG. 2, a deposition mechanism 10 is provided above the crucible device 75. The deposition mechanism 10 moves a later-described substrate gripping mechanism 51 (delivery side mechanism) between the attachment / detachment position A and the molten metal 15 of the crucible device 75 in a direction perpendicular to the loading / unloading direction (conveying direction). Thus, the deposition substrate 14 mounted on the substrate gripping mechanism 51 is soaked in the molten metal 14 and pulled up. Specifically, in the attachment / detachment position A, the deposition mechanism 10 holds the other surface (the surface opposite to the substrate surface 14a) of the deposition substrate 14 through the substrate gripping mechanism 51 so as to be attachable / detachable from the lower side. By swiveling the tip end portion holding the deposition substrate 14 in a posture inclined with respect to the swivel radial direction so that the other surface of the deposition substrate 14 is positioned on the upper side at the immersion position, The deposition substrate 14 is moved in the intersecting direction together with the substrate gripping mechanism 51. The turning radius direction is the longitudinal direction of the turning member 50 that turns around the turning shaft 49 of FIG.

  FIG. 3 is a schematic configuration diagram when the semiconductor substrate manufacturing apparatus is viewed from the side. The deposition mechanism 10 includes a horizontal movement mechanism 13, a vertical movement mechanism 11 that can be moved horizontally by the horizontal movement mechanism 13, a turning mechanism 12 that can be moved up and down by the vertical movement mechanism 11, a substrate gripping mechanism 51, and the like. have. The horizontal movement mechanism 13 is provided on the upper surface of the partition wall 62c surrounding the standby chamber 61c. As shown in FIG. 3, the horizontal movement mechanism 13 includes a horizontal conveyance unit 16 that is orthogonal to the conveyance direction, and a horizontal drive unit 17 that drives the horizontal conveyance unit 16. The horizontal transfer unit 16 is arranged in the horizontal direction, one end side is arranged on the vacuum vessel 4 side, and the other end side is arranged in the processing chamber 3 in the vacuum vessel 4.

  As shown in FIG. 2, the horizontal conveying unit 16 includes a screw shaft member 18 having a screw groove formed on the entire peripheral surface, a block member 19 screwed into the screw shaft member 18, and a lower surface of the block member 19. And a connecting member 21 provided on the upper surface of the block member 19 and connected to the vertical moving mechanism 11. Furthermore, the horizontal conveyance part 16 has the connection shaft member 24 connected with the end of the screw shaft member 18, and extended outside the vacuum vessel 4, as shown in FIG. A horizontal drive unit 17 is coupled to one end of the coupling shaft member 24. The horizontal drive unit 17 includes a horizontal drive device 23 such as a servo motor that can be rotated forward and backward at an arbitrary rotation speed and can be stopped with a predetermined holding force. The horizontal drive device 23 makes the vertical movement mechanism 11 movable to an arbitrary position in the horizontal direction by rotating the screw shaft member 18 forward and backward via the connecting shaft member 24.

  As shown in FIG. 2, the vertical movement mechanism 11 horizontally moved by the horizontal movement mechanism 13 includes a vertical conveyance unit 30 arranged in the vertical direction and a vertical drive unit provided at the upper end of the vertical conveyance unit 30. 31. The vertical conveyance unit 30 includes a screw shaft member (not shown) in which a screw groove is formed on the entire circumferential surface, and a block member 33 screwed into the screw shaft member and connected to the turning mechanism 12 on the entire surface (right side in the drawing). The rail member 34 supports the back surface (left surface in the figure) of the block member 33 so as to be movable up and down.

  A vertical drive unit 31 is connected to the upper end of the vertical transport unit 30. The vertical drive unit 31 can rotate forward and backward at an arbitrary rotation speed and can be stopped with a predetermined holding force. A vertical drive unit 35 such as a servo motor is connected to the upper end portion of the screw shaft member, and the screw shaft By rotating the member forward and backward, the turning mechanism 12 can be moved to a recognized height position in the vertical direction via the block member 33 and the like.

  Further, the cooling device 36 stores the vertical drive device 35 so as to be isolated from the processing environment of the processing chamber 3, a storage container 25 in which a cooling gas such as an inert gas of nitrogen gas or air is sealed, and the storage container 25. And a cooling pipe (not shown) for flowing a cooling medium such as cooling water along the wall surface of the storage container 25. And the cooling device 36 maintains the accommodation environment in the storage container 25 below predetermined temperature by heat-exchanging cooling gas with cooling media, such as the cooling water which distribute | circulates cooling piping. The cooling device 36 may be configured to supply and discharge cooling gas from outside the vacuum container 3 into the storage container 25 and circulate it.

  The vertical movement mechanism 11 supports the turning mechanism 12 so as to be movable up and down. The turning mechanism 12 includes a connecting support body 38 having one end face connected to the block member 33, a turning drive part 39 connected to the upper surface of the connection support body 38, and an immersion mechanism part that is turned by the previous drive part 39. 37. The turning drive unit 39 includes a turning drive device 40 such as a servo motor that can be rotated at an arbitrary rotation speed and can be stopped with a predetermined holding force, and a cooling device 41 that cools the turning drive device 40. .

  Similar to the vertical drive unit 31, the cooling device 41 is configured to exhibit the same cooling function by the same member as the cooling device 36 having the storage container 25 and the like. The swivel drive device 40 in the cooling device 41 is disposed such that the swivel drive shaft 40 a is horizontally disposed and the tip of the swivel drive shaft 40 a faces the block member 33. Below the drive sprocket 42a, an intermediate sprocket 42b and a turning sprocket 42b are arranged in this order. The drive sprocket 42a is connected to the intermediate sprocket 42b via the first chain 43a, and the intermediate sprocket 42b is connected to the turning sprocket 42c via the second chain 43b.

  The turning sprocket 42 c is provided on the rotating shaft member 44. The rotary shaft member 44 is supported by the first support member 45 so as to be rotatable in the horizontal direction. As shown also in FIG. 3, the first support member 45 is suspended from the connection support 38 and is provided so as to protect the intermediate sprocket 42 b and the chains 43 a and 43 b from the radiant heat of the molten metal 15.

One end of the rotary shaft member 44 supported by the first support member 45 is connected to a rotary encoder 46. The rotary encoder 46 can detect the turning angle of the immersion mechanism unit 37 by detecting the rotation angle of the rotating shaft member 44. A cover member 47 is provided around the rotary encoder 46. The cover member 47 has a function as a heat shielding plate that blocks radiant heat from the molten metal 15 and a function as a dust-proof cover that prevents dust floating from the molten metal 15 and the like from adhering to the rotary encoder 46.

  On the other hand, the other end portion of the rotating shaft member 44 is connected to the immersion mechanism portion 37. As shown in FIG. 5, the immersion mechanism unit 37 includes second support members 48 and 48 suspended from the lower surface of the connection support 38, and a swivel that is rotatably supported in the horizontal direction by the second support members 48 and 48. The shaft 49 has a pair of turning members 50, 50 provided on the turning shaft 49. The rotary shaft member 44 and the second support members 48 and 48 are rotatably connected via a bearing mechanism 97 made of carbon. The bearing mechanism 97 includes a housing 98 that is fitted into the lower end portion of each second support member 48 and a cylindrical member 99 that is extrapolated to the rotary shaft member 44. The cylindrical member 99 is slidably inserted in the housing 98. The bearing mechanism 97 smoothly rotates the rotating shaft member 44 by sliding the outer peripheral surface of the cylindrical member 99 against the inner wall surface of the housing 98.

  A substrate gripping mechanism 51, which will be described later, is provided at the tip of the swiveling members 50 and 50 that are swung via the bearing mechanism 97. The substrate gripping mechanism 51 holds the deposition substrate 14 in a posture inclined with respect to the turning radius direction, thereby detachably holding the deposition substrate 14 in a horizontal state from the lower side at the attachment / detachment position A. In B, the surface holding the deposition substrate 14 is positioned on the upper side. Each turning member 50 may be formed of a metal material such as stainless steel having excellent mechanical strength, or may be formed of carbon having excellent heat resistance.

  As described above, the deposition mechanism 10 including the mechanisms 11 to 13 includes a horizontal movement by the horizontal movement mechanism 13, a vertical movement by the vertical movement mechanism 11, and a turning movement by the turning mechanism 12, as shown in FIG. In combination, the substrate gripping mechanism 51 can be positioned at the attachment / detachment position A and the deposition position B, and the deposition substrate 14 is immersed in the molten metal 15 along a predetermined immersion locus. The immersion trajectory is a precipitate which is a solidified and grown precipitate of the molten metal 15 in the immersed part by lowering the deposition substrate 14 obliquely from the upstream side in the swirling direction (arrow direction) and pulling it up from the molten metal 15. It is set to generate the plate 2.

  As shown in FIGS. 6A, 6B, and 7, the deposition substrate 14 is formed of carbon in a rectangular shape in plan view. Note that the deposition substrate 14 may be formed in a circular shape, an elliptical shape, a triangular shape, a trapezoidal shape, or a polygonal shape that is a pentagon or more. The deposition substrate 14 includes a substrate surface 14a (lower surface) on which the deposition plate 2 is deposited, an inverted trapezoidal gripping portion 14b formed on the upper surface (anti-deposition surface) of the deposition substrate 14, and both side surfaces in the transport direction. And a protruding portion 14c formed on the surface. The protrusions 14c are arranged in a pair on the left and right ends of each side so as to reduce blurring between the protrusions 14c and 14c when the deposition substrates 14 and 14 come into contact with each other.

  Further, the protrusions 14c and 14c are arranged on the side surface of the gripping part 14b away from the substrate surface 14a so as not to be immersed in the molten metal 15. Further, the length of each protrusion 14 c in the transport direction is set to a value larger than the protruding length of the lateral precipitate 5 deposited on the side surface of the deposition substrate 14. These protrusions 14c and 14c prevent a corner portion of the deposition substrate 14 from being damaged by creating a gap between the adjacent deposition substrates 14 and 14, and the deposition by the substrate feed mechanism 70 in FIG. The separation work of the deposition substrate 14 is facilitated, and contact between the lateral precipitates 5 deposited on the side surfaces of the deposition substrate 14 is prevented.

  In addition, the gripping portion 14b having the projections 14c and 14c formed on the side surfaces thereof is attached to and detached from an engagement portion 52a and 52a of a substrate gripping mechanism 51 described later by movement in the transport direction. Are formed in parallel. In addition, the gripping portion 14b is set to have such a width that the width in the region from the center portion to the front of both end portions is in contact with the engaging portions 52a and 52a. And in the area | region from both ends of the holding | grip part 14b to both ends, it sets so that a width | variety may be decreased gradually from both ends front to both ends. As a result, when the deposition substrate 14 is transported, the grip portion 14b can be reliably inserted between the engaging portions 52a and 52a even if there is some error in the width direction relative to the transport direction. It is possible.

  In addition, the protrusion 14c of the deposition substrate 14 may be formed on at least one side surface in the transport direction. The deposition substrate 14 may be inclined from the substrate surface 14a to the upper surface side so that both end portions of the substrate surface 14a are located inside both end portions of the upper surface.

  The deposition substrate 14 is detachably held by a substrate gripping mechanism 51 provided in the immersion mechanism 37 of FIG. As shown in FIG. 7, the substrate gripping mechanism 51 is integrally provided with chuck portions 52 and 52 symmetrically. Each chuck portion 52, 52 is surrounded by an engagement portion 52a formed on the lower surface so as to engage with the gripping portion 14b and an annular groove portion 52b formed so as to receive a fallen object such as dust. And a hanging portion 52c. The engaging portions 52a are arranged symmetrically so as to insert the holding portions 14b of the deposition substrate 14. Thus, the substrate gripping mechanism 51 inserts the gripping portion 14b of the deposition substrate 14 between the engaging portions 52a and 52a when the deposition substrate 14 is moved in the transport direction (carrying in / out direction). The deposition substrate 14 can be held in the vertical direction.

  On the other hand, two projecting portions 52d and 52d are arranged to face each other on the upper surface of the suspension portion 52c. Pin insertion holes 52e and 52e are formed at the center of both protruding portions 52d and 52d. Between the projecting portions 52d and 52d, the turning members 50 and 50 of the above-described immersion mechanism portion 37 are fitted. A carbon pin member 53 is detachably inserted into the pin insertion holes 52e and 52e, and the pin member 53 connects the swiveling members 50 and 50 to the chuck portions 52 and 52, respectively. It is supposed to let you.

  The pin member 53 is formed to be shorter than the projected area on the deposition side of the chuck portion 52 so as to avoid direct radiation of radiant heat from the molten metal 15. In addition, a hardened layer 54 is formed on the surface of the pin member 53, and the pin member 53 has a mechanical strength of the surface that is increased by the hardened layer 54, so that the pin member 53 has a pin insertion hole 52 e in the chuck portion 52. Wear when attaching and detaching is reduced. On the other hand, in the chuck portion 52, a pin insertion hole 52e that contacts the pin member 53, an engaging portion 52a that contacts the deposition substrate 14, a lower surface, and a hardened layer 54 are formed. Further, the mechanical strength of the contact surface of the chuck portion 52 is increased by the hardened layer 54, so that wear when the pin member 53 is attached and detached and when the deposition substrate 14 is gripped is reduced.

  In addition, as a formation method of the hardened layer 54, the hardening process which coats a SiC film with surface treatment methods, such as plasma CVD and ion plating, can be mentioned. Further, the hardened layer 54 may be formed on the entire surface of the substrate gripping mechanism 51. In this case, the overall mechanical strength of the substrate holding mechanism 51 can be increased. Can be difficult to be damaged even if an impact is applied during transportation.

  Next, the operation of the semiconductor substrate manufacturing apparatus 1 configured as described above will be described.

(Preparation and maintenance process)
The preparation / maintenance process is performed when the semiconductor manufacturing apparatus 1 is in a state suitable for production before and after the production of the deposition plate 2 is started. That is, as shown in FIG. 2, the crucible device 75 is inspected, the crucible 76 is replaced, and the mechanisms in the vacuum vessel 4 are inspected. Further, during the inspection of the crucible device 75, the remaining amount of the object to be melted 101 stored in the storage box 72 of the supply mechanism 71 is confirmed and replenished so as to be an appropriate amount. When the inspection or replacement of each device is completed, the vacuum vessel 4 is sealed. Then, after an evacuation apparatus (not shown) is operated and air is exhausted, an inert gas of Ar gas is supplied, so that a processing environment different from the external environment is formed in the processing chamber 3.

  Thereafter, high frequency AC power is supplied to the induction heating coil 77, and a high frequency magnetic field is generated around the crucible 76. As a result, when a strong magnetic field is applied to the surface side of the side wall of the crucible 76, the surface side of the side wall is mainly heated by induction heating, and the amount of heat on the surface side is conducted inward. It will be. Then, a large amount of heat is transmitted from the two directions of the side surface and the bottom surface of the crucible 76, and as a result, the object to be melted 101 is evenly heated by this amount of heat. Further, after the molten metal 15 is reached, the side surface and the lower surface of the molten metal 15 are continuously heated with a large amount of heat, so that the entire molten metal 15 is maintained at a uniform temperature.

  Further, when the molten metal 15 is formed, high-temperature radiant heat is released from the molten metal 15. At this time, part of the radiant heat travels toward the deposition mechanism 10, but the radiant heat that travels to the turning drive unit 39 of the deposition mechanism 10 exhibits the function of the connection support 38 as a heat shielding plate. Therefore, the turning drive unit 39 is not directly irradiated. In addition, the radiant heat that travels to the driving force transmission mechanism such as the first chain 43a of the deposition mechanism 10 does not directly radiate the driving direct transmission mechanism because the first support member 45 functions as a heat shielding plate. Further, the radiant heat that travels to the rotary encoder 46 of the deposition mechanism 10 does not directly radiate the rotary encoder 46 because the cover member 47 functions as a heat shielding plate. As a result, the internal equipment of the deposition mechanism 10 is prevented from being thermally deteriorated due to direct radiation heat.

  Further, the vertical drive unit 31 and the swivel drive unit 39 accommodate the vertical drive device 35 and the swivel drive device 40 in the storage containers 25 and 25 of the cooling devices 36 and 41, respectively. Driving is avoided. Therefore, the drive units 31 and 39 are sufficiently prevented from being damaged due to heat. The cooling devices 36 and 41 maintain the storage environment in the storage container 25 at a predetermined temperature or less by exchanging heat with a cooling medium such as cooling water through which the cooling gas flows through the cooling pipe. Therefore, even when the cooling gas leaks due to breakage of the storage container 25 or the like when the object to be melted is heated and melted, the cooling water does not contact the molten metal 15 to cause a serious failure.

(Substrate transport process)
When the preparation of production is completed by forming the molten metal 15 under the desired processing environment as described above, the substrate carry-in / out mechanism arranged vertically symmetrically about the crucible device 75 as shown in FIG. In 60 and 60, the transfer operation of the deposition substrate 14 is performed. In the following description, for the sake of convenience of explanation, the transport operation in one substrate carry-in / out mechanism 60 will be described.

  Specifically, first, at a substrate setting position (not shown) arranged upstream of the substrate carry-in / out mechanism 60, a plurality of deposition substrates 14 such as six are set in series with the substrate surface 14a facing upward. The Thereafter, the exhaust operation of the pressure adjusting chamber 61a is stopped by opening the electromagnetic valve 65, and one end of the pressure adjusting chamber 61a is opened by raising the first shielding plate 63. Then, the deposition substrate 14 is carried into the pressure adjusting chamber 61a in a serial state by a conveyance device such as a conveyance roller (not shown).

  When the above deposition substrates 14 are set or carried in, impact may be applied to each deposition substrate 14 due to contact or collision between adjacent deposition substrates 14, 14. At this time, since the pair of protrusions 14c and 14c are formed on the front and rear side surfaces of the deposition substrate 14 in the transport direction, contact and collision at the time of setting and transport will impact the corner portion of the deposition substrate 14. It is possible to prevent breakage such as chipping of the corner portion due to the addition. As a result, since the substrate surface 14a of the deposition substrate 14 maintains its original shape, a deposition plate having a predetermined shape can be obtained with certainty.

  When all the deposition substrates 14 are loaded into the pressure regulation chamber 61a, the first shielding plate 63 is lowered, and both ends of the pressure regulation chamber 61a are closed. Thereafter, the electromagnetic valve 65 is opened, and the pressure adjusting chamber 61a is evacuated by the exhaust system 66. Thereby, dust adhering to the deposition substrate 14 is removed. Then, the other end of the pressure adjusting chamber 61a is opened by the rising of the second shielding plate 64, whereby the pressure quantity property 61a and the preheating chamber 61b are communicated.

  Thereafter, when the deposition substrate 14 in the pressure adjusting chamber 61a is transferred to the pressure adjusting chamber 61a and all the substrates are transferred into the pressure adjusting chamber 61a, the pressure adjusting chamber 61a and the preheating chamber 61b are moved by the lowering of the second shielding plate 64. Is isolated. In the pressure adjusting chamber 61a, the operation of loading the deposition substrate 14 from the above-described substrate setting position is performed.

  In the preheating chamber 61 b, the deposition substrate 14 positioned at the head (uppermost stream side) in the transport direction is opposed to the first preheating heater 82. Thus, when preheating power is supplied to the preheating heater 82, the leading deposition substrate 14 is heated to a predetermined preheating temperature by the preheating heater 82. Further, when the deposition substrate 14 is heated, dust may be scattered from the deposition substrate 14 or the gas in the deposition substrate 14 may be released, and these dust and gas flow into the processing chamber 3. Then, it acts as a contaminant in the processing environment of the processing chamber 3. However, most of these dusts and gases are sucked into the exhaust system 66 and discharged to the outside of the apparatus, and the remaining portion flows into the processing chamber 3 while flowing into the first partition member 68 and the second partition of the standby chamber 61c. It is blocked by the member 69. As a result, the processing environment of the processing chamber 3 is hardly contaminated with dust or gas on the deposition substrate 14.

  Thereafter, the substrate feeding mechanism 70 is operated, and the preheated leading deposition substrate 14 is held by the claw members 71 and 71 while being conveyed by a distance corresponding to the length of the deposition substrate 14. It is carried into the waiting room 61c. The deposition substrate 14 transferred to the standby chamber 61 c is further preheated by the second preheater 83. Then, fine adjustment is performed to achieve a desired preheating temperature, or a temperature drop is prevented. Thereafter, the transport operation by the substrate feeding mechanism 70 is repeatedly performed, so that the deposition substrate 14 in the standby chamber 61c is sequentially transported to the attachment / detachment position A while the leading deposition substrate 14 in the preheating chamber 61b is sequentially standby. It is conveyed to the chamber 61c.

  While the deposition substrate 14 is being transported by the substrate feeding mechanism 70 as described above, at the attachment / detachment position A, as shown in FIG. 3, the substrate gripping mechanism 51 has the engaging portions 52a and 52a positioned on the upper side. Waiting in posture. Therefore, when the deposition substrate 14 is transported to the attachment / detachment position A, the holding portion 14b of the deposition substrate 14 becomes narrower than the width between the engagement portions 52a and 52a of the substrate holding mechanism 51, as shown in FIG. Therefore, the grip portion 14b is reliably inserted between the engagement portions 52a and 52a.

  Here, as shown in FIG. 2, when the deposition substrate 14 is transported to the attachment / detachment position A, the control device 100 detects the position of the first transport base 84, and based on the detection result, the first transport base 84. , And the deposition mechanism 10 is driven in accordance with the detected position shift, thereby moving the substrate gripping mechanism 51 relative to the first transport table 84.

  Specifically, as shown in FIG. 8A, the control device 100 compares the substrate gripping mechanism 51 and the first transport base 84 from the imaging data (shown solid line) acquired from the third imaging device 8 c ( By performing image processing, a positional shift in the height direction relative to the substrate gripping mechanism 51 of the first transport table 84 is detected. Here, as shown in FIG. 8A, the upper edge position A in the length direction of the first transport base 84 in the acquired imaging data is compared with the upper edge position A ′ of the substrate holding mechanism 51. The position shift in the height direction is detected by. Further, as shown in FIG. 8B, the control device 100 compares the substrate gripping mechanism 51 and the first transport table 84 (image processing) based on the imaging data (illustrated solid line) acquired from the fourth imaging device 8d. As a result, a relative angular shift and a lateral shift of the first transport table 84 with respect to the substrate gripping mechanism 51 are detected. Here, as shown in FIG. 8B, the angle of the angle is obtained by comparing the upper edge C in the width direction of the first transport table 84 and the upper edge C ′ of the substrate gripping mechanism 51 in the acquired imaging data. Misalignment is detected. Further, the lateral shift is detected by comparing the side edge B of the first transfer table 84 with the side edge B ′ of the substrate gripping mechanism 51. Subsequently, the control device 100 drives the deposition mechanism 10 by generating a control signal based on the positional deviation detected in this way and inputting the control signal to the deposition mechanism 10. As a result, the substrate gripping mechanism 51 of the deposition mechanism 10 is moved to a position where the deposition substrate 14 can be delivered smoothly. Note that the control device 100 does not detect the positional deviation of the first transfer table 84 or if the positional deviation is within the allowable range, the position where the substrate gripping mechanism 51 can smoothly transfer the deposition substrate 14 already. Therefore, the substrate holding mechanism 51 is not moved with respect to the first transport table 84.

  According to such a substrate transfer process (transfer method), even when the member of the mechanism portion is thermally deformed due to thermal expansion, the positional relationship between the substrate holding mechanism 51 and the first transfer table 84 is determined as the deposition substrate 14. It can be in an optimal state for delivery. Accordingly, even when the first transfer table 84 is thermally deformed, the deposition substrate 14 can be smoothly transferred between the substrate holding mechanism 51 and the first transfer table 84.

  Moreover, according to such a board | substrate conveyance process, by image-processing in the control apparatus 100 the imaging data of the 1st conveyance stand 84 imaged by the 3rd imaging device 8c and the 4th imaging device 8d, a 1st conveyance stand 84 is detected as a relative displacement with respect to the substrate gripping mechanism 51. For this reason, since the position shift of the 1st conveyance stand 84 can be detected, without installing a new sensor etc. in a high temperature atmosphere, the position shift of the 1st conveyance stand 84 can be detected easily.

  Moreover, according to such a board | substrate conveyance process, the position shift of the 1st conveyance stand 84 is detected based on edge position AC. Therefore, the amount of image data to be compared in the control device 100 can be minimized. For this reason, the position shift of the 1st conveyance stand 84 can be detected easily.

  Thereafter, the deposition substrate 14 for which the deposition process to be described later has been completed is pushed out in the transport direction from the substrate gripping mechanism 51 and transferred to the second transport table 85. Then, the previous deposition substrate 14 that has been pushed out is separated from the vacuum vessel 4 via the second transfer table 85.

  When the deposition substrate 14 is attached or detached, the deposition substrate 14 is transported and attached in a horizontal posture by positioning the substrate surface 14a of the deposition substrate 14 immersed in the molten metal 15 on the upper side. Thereby, the deposition substrate 14 is attached and detached in a stable state. Further, as shown in FIG. 1, since the attachment / detachment A exists at a place off the molten metal 15, for example, when the attachment / detachment occurs and drops due to dust or chipping, or when the deposition substrate 14 falls due to attachment / detachment failure However, it is difficult for these dusts to enter the molten metal.

  Further, when the deposition substrate 14 after deposition is removed from the substrate gripping mechanism 51, or when the deposition substrate 14 is carried out of the apparatus, as shown in FIG. The parts 14c and 14c come into contact with each other. Therefore, even when the lateral precipitate 5 is generated on the side surface of the deposition substrate 14 during the immersion, the lateral precipitates 5 and 5 do not come into contact with each other. As a result, even if an external force due to vibration or impact is generated between the deposition substrates 14 and 14 during removal or removal, the external force does not directly act on the protrusion 14c. As a result, it is possible to prevent the side precipitate 5 from being peeled off from the deposition substrate 14 together with the side precipitate 5 by peeling off the side precipitate 5 by an external force.

(Precipitation process)
When the attachment of the deposition substrate 14 to the substrate gripping mechanism 51 is completed in both the substrate carry-in / out mechanisms 60, 60 as described above, the attachment / detachment position A of one of the substrate carry-in / out mechanisms 60 as shown in FIG. The substrate holding mechanism 51 is moved in a direction orthogonal to the transport direction in a state where the direction is constant, and the deposition substrate 14 held by the substrate holding mechanism 51 is immersed in the molten metal 15.

  Specifically, the substrate gripping mechanism 51 is raised by the vertical movement mechanism 11 while being horizontally moved toward the deposition position B by the horizontal movement mechanism 13. Then, when the substrate gripping mechanism 51 is positioned above the molten metal 15, the turning mechanism 12 is operated, so that the substrate gripping mechanism 51 and the deposition substrate 14 are moved along an immersion locus with the turning center of the turning member 50 as a radius. It is turned. The immersion trajectory can draw an arbitrary curve by a combination of the operations of the mechanisms 11, 12, and 13.

  When the deposition substrate 14 is immersed in the molten metal 15 as described above, since the immersion mechanism portion 37 is positioned above the molten metal 15 as shown in FIG. 5, the swiveling members 50 and 50 can be rotated freely. The supporting bearing mechanism 97 is heated to a high temperature by the radiant heat from the molten metal 15.

  As shown in FIG. 3, at the time of turning, the substrate gripping mechanism 51 turns in a state where the directions of the engaging portions 52a and 52a are aligned with the transport direction. Therefore, the protrusion 14c of the deposition substrate 14 does not move in the transport direction within the engaging portions 52a and 52a, so that the deposition substrate 14 does not fall off the substrate gripping mechanism 51. Then, the deposition substrate 14 thus held by the substrate gripping mechanism 51 is immersed in the molten metal 15 at the deposition position B while being positioned below the substrate gripping mechanism 51 as shown by a two-dot chain line in the figure. The melting object 101 of the molten metal 15 is deposited on the substrate surface 14 a of the working substrate 14. Then, after a predetermined time has elapsed, the deposition substrate 14 is pulled up from the molten metal 15, whereby the deposition plate 2 having a predetermined thickness is formed on the substrate surface 14 a of the deposition substrate 14.

  The turning operation of the turning member 50 is continued until the substrate gripping mechanism 51 returns to the position before the turning. At this time, since the turning angle is detected by the rotary encoder 46 of FIG. 2, the substrate gripping mechanism 51 is positioned with high accuracy. Thereafter, the turning mechanism 12 is stopped, and the vertical movement mechanism 11 and the horizontal movement mechanism 13 are operated, whereby the substrate gripping mechanism 51 is returned to the attachment / detachment position A. Thereafter, when the next deposition substrate 14 is conveyed to the attachment / detachment position A by the substrate feeding mechanism 70 in the above-described substrate conveyance step, the next deposition substrate 14 is fed out by the next deposition substrate 14.

  In addition, the deposition operation in the other substrate loading / unloading mechanism 60 is performed until the deposition process is completed in one substrate loading / unloading mechanism 60 as described above and the next deposition substrate 14 is mounted on the substrate gripping mechanism 51. Is similarly implemented. As a result, the deposition plates 2 are sequentially manufactured by one crucible device 75 while the deposition substrates 14 transported by the both substrate carry-in / out mechanisms 60 and 60 are alternately used.

  As mentioned above, although preferred embodiment of the conveying apparatus and the conveying method which concern on this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the displacement of the first transfer table 84 is accommodated by moving the substrate gripping mechanism 51 of the deposition mechanism 10. However, the present invention is not limited to this, and by installing a moving mechanism for rotating the first transport table 84 up and down, left and right, and moving the first transport table 84 itself using this moving mechanism, You may respond | correspond to the position shift of the 1st conveyance stand 84. FIG.

  Moreover, in the said embodiment, it demonstrated targeting the delivery of the deposition substrate 14 between the deposition mechanism 10 and the 1st conveyance stand 84. FIG. However, the present invention is not intended only for the transfer of the deposition substrate 14 between the deposition mechanism 10 and the first transport table 84, for example, between the second transport table 85 and the substrate gripping mechanism 51. The delivery of the deposition substrate 14 may be targeted. In this case, an image pickup device that detects a positional deviation due to thermal deformation of the second conveyance table 85 is installed, and the second conveyance table 85 or the substrate gripping mechanism 51 is moved according to the positional deviation of the second conveyance table 85. Thus, it is possible to smoothly transfer the deposition substrate 14 between the second transfer table 85 and the substrate gripping mechanism 51. In such a case, the mechanism on the delivery side of the present invention is the substrate gripping mechanism 51, and the mechanism on the delivery side of the present invention is the second transport table 85.

  Further, in the present embodiment, the first transfer table is obtained by performing image processing on the imaging data obtained by imaging the first transfer table 84 by the image pickup devices (the third image pickup device 8c and the fourth image pickup device 8d). 84 misalignment was detected. However, the present invention is not limited to this, and a predetermined reference position (for example, the side surface on the second transport table side 85 side of the substrate gripping mechanism 51 and the side surface of the second transport table on the substrate gripping mechanism 51 side). It is also possible to install a light emitting element and a light receiving element connected to each other via an optical fiber or the like, and to detect a positional deviation between the substrate gripping mechanism 51 and the first transport table 84 using the light emitting element and the light receiving element.

  Moreover, in the said embodiment, the conveying apparatus was demonstrated as what is provided in a semiconductor substrate manufacturing apparatus. However, the transport apparatus and method of the present invention are not applied only to the semiconductor substrate manufacturing apparatus, but are applied to all transport apparatuses that transport a transport target object between a plurality of mechanisms in a hermetic container in a high temperature environment. Can be applied.

  Moreover, in this embodiment, although the immersion mechanism part 37 is formed with carbon, it is not limited to this, You may be formed with ceramics.

  Further, the bearing mechanism 97 of the present embodiment is configured to be pivotally supported by the cylindrical member 99 and the housing 98, but is not limited to this, and a ceramic bearing can also be used.

It is a schematic block diagram in the case of planar view of a semiconductor substrate manufacturing apparatus provided with the conveying apparatus which is one Embodiment of this invention. It is a schematic block diagram in the case where a semiconductor substrate manufacturing apparatus provided with a transfer apparatus according to an embodiment of the present invention is viewed from the front. It is a schematic block diagram at the time of carrying out the side view of the semiconductor substrate manufacturing apparatus provided with the conveying apparatus which is one Embodiment of this invention. It is the block diagram which showed a part of signal processing system of the semiconductor substrate manufacturing apparatus. It is explanatory drawing which showed schematic structure of the bearing mechanism. It is explanatory drawing which shows the state of the board | substrate for precipitation after precipitation. It is a perspective view of the board | substrate holding | grip mechanism holding the board | substrate for precipitation. It is explanatory drawing for demonstrating the method to detect the position shift of a 1st conveyance stand.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor substrate manufacturing apparatus 2 Deposition plate 3 Processing chamber 3a Deposition mechanism accommodation space 3b Substrate movement space 3c Molten metal accommodation space 4 Vacuum container 8c 3rd imaging device (imaging device) 8d 4th imaging device (imaging device) 10 Deposition mechanism (mechanism) 11) Vertical movement mechanism 12 Swivel mechanism 13 Horizontal movement mechanism 14 Deposition substrate (conveyance target) 15 Molten metal 16 Horizontal conveyance unit 17 Horizontal drive unit 23 Horizontal drive unit 35 Vertical drive unit 40 Pivot drive unit 51 Substrate gripping mechanism 60 Substrate Loading / unloading mechanism (mechanism part) 84 1st conveyance stand 85 2nd conveyance stand 100 Control apparatus (deviation detection part)

Claims (6)

A conveying device that conveys the object to be conveyed in a high temperature environment by traversing, moving up and down or rotating, and delivering the object to be conveyed between a plurality of mechanism parts,
A position detection unit for detecting a position of the mechanism unit on the delivery side or a position of the mechanism unit on the delivery side, and the mechanism unit on the delivery side or the delivery side based on the detection result of the position detection unit A displacement detection unit that detects a displacement of the mechanism unit with respect to a predetermined range;
When the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side is deviated from the predetermined range, the mechanism on the delivery side according to the detection result of the deviation detection part A conveying device characterized in that a part is moved relative to the mechanism part on the delivery side. The transport apparatus according to claim 1, wherein the position detection unit is an imaging device and an image processing device that capture an image of a position of the delivery-side mechanism unit or the delivery-side mechanism unit. The transport apparatus according to claim 1, wherein the mechanism is disposed in an airtight container. A transport method for transporting a transport object in a high temperature environment by traversing, moving up and down or rotating, and delivering the transport object between a plurality of mechanism parts,
Detect the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side,
Based on the detection result, a positional shift of the delivery side mechanism part or the delivery side mechanism part with respect to a predetermined range is detected,
When the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side is deviated from the predetermined range, the mechanism part on the delivery side according to the detection result of the positional deviation. Is moved relative to the mechanism on the delivery side. Detecting the position of the mechanism part on the delivery side or the position of the mechanism part on the delivery side by imaging the mechanism part on the delivery side or the mechanism part on the delivery side;
Image processing is performed on imaging data of the delivery-side mechanism unit or the delivery-side mechanism unit, thereby detecting a positional shift of the delivery-side mechanism unit or the delivery-side mechanism unit with respect to a predetermined range. The transport method according to claim 4, wherein: Based on an edge position of the delivery-side mechanism section or an edge position of the delivery-side mechanism section, a positional shift of the delivery-side mechanism section or the delivery-side mechanism section with respect to a predetermined range is detected. The conveyance method according to claim 4 or 5, characterized by the above-mentioned.

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