JP2006024703A5 - - Google Patents

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JP2006024703A5
JP2006024703A5 JP2004200887A JP2004200887A JP2006024703A5 JP 2006024703 A5 JP2006024703 A5 JP 2006024703A5 JP 2004200887 A JP2004200887 A JP 2004200887A JP 2004200887 A JP2004200887 A JP 2004200887A JP 2006024703 A5 JP2006024703 A5 JP 2006024703A5
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Prior art keywords
nitride semiconductor
semiconductor layer
buried film
semiconductor laser
laser element
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JP2004200887A
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Japanese (ja)
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JP2006024703A (en
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Priority to JP2004200887A priority Critical patent/JP2006024703A/en
Priority claimed from JP2004200887A external-priority patent/JP2006024703A/en
Publication of JP2006024703A publication Critical patent/JP2006024703A/en
Publication of JP2006024703A5 publication Critical patent/JP2006024703A5/ja
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Claims (15)

第1窒化物半導体層、活性層及び第2窒化物半導体層がこの順に積層され、該第2窒化物半導体層上に埋め込み膜を一部に介して電極が形成されて構成される窒化物半導体レーザ素子であって、
前記埋め込み膜が、少なくとも酸素を含有し、かつ膜厚方向において酸素以外に同一の構成元素を含み、前記第2窒化物半導体層側から表面側にかけて酸素比率が変化してなることを特徴とする窒化物半導体レーザ素子。
A nitride semiconductor in which a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer are stacked in this order, and an electrode is formed on the second nitride semiconductor layer through a part of a buried film. A laser element,
The buried film contains at least oxygen, contains the same constituent element in addition to oxygen in the film thickness direction, and has an oxygen ratio that varies from the second nitride semiconductor layer side to the surface side. Nitride semiconductor laser device.
埋め込み膜の酸素比率は、第2窒化物半導体層側に対して表面側が小さい請求項1に記載の窒化物半導体レーザ素子。   2. The nitride semiconductor laser device according to claim 1, wherein an oxygen ratio of the buried film is smaller on a surface side than on a second nitride semiconductor layer side. 第1窒化物半導体層、活性層及び第2窒化物半導体層がこの順に積層され、該第2窒化物半導体層上に埋め込み膜を一部に介して電極が形成されて構成される窒化物半導体レーザ素子であって、
埋め込み膜は、膜厚方向に同一の構成元素を含み、前記第2窒化物半導体層側から表面側にかけて密度が変化してなることを特徴とする窒化物半導体レーザ素子。
A nitride semiconductor in which a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer are stacked in this order, and an electrode is formed on the second nitride semiconductor layer through a part of a buried film. A laser element,
The nitride semiconductor laser element, wherein the buried film includes the same constituent element in the film thickness direction, and the density changes from the second nitride semiconductor layer side to the surface side.
埋め込み膜の密度は、第2窒化物半導体層側に対して表面側が大きい請求項3に記載の窒化物半導体レーザ素子。   The nitride semiconductor laser device according to claim 3, wherein the density of the buried film is larger on the surface side than on the second nitride semiconductor layer side. 埋め込み膜は、前記第2窒化物半導体層側から表面側にかけて屈折率が変化してなる請求項1〜4のいずれか1つに記載の窒化物半導体レーザ素子。   5. The nitride semiconductor laser element according to claim 1, wherein the buried film has a refractive index that changes from the second nitride semiconductor layer side to the surface side. 6. 埋め込み膜の屈折率は、第2窒化物半導体層側に対して表面側が大きい請求項5に記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 5, wherein a refractive index of the buried film is larger on a surface side than on a second nitride semiconductor layer side. 第2窒化物半導体層側の埋め込み膜の屈折率が2.20以下、表面側の埋め込み膜の屈折率が2.20より大きい請求項5又は6に記載の窒化物半導体レーザ素子。   The nitride semiconductor laser device according to claim 5 or 6, wherein the refractive index of the buried film on the second nitride semiconductor layer side is 2.20 or less and the refractive index of the buried film on the surface side is larger than 2.20. 埋め込み膜は、単層で構成されてなる請求項1〜7のいずれか1つに記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film is formed of a single layer. 埋め込み膜は、2層以上の積層構造の膜で構成されてなる請求項1〜7のいずれか1つに記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film is formed of a film having a laminated structure of two or more layers. 埋め込み膜は、少なくとも2層で形成され、前記第2窒化物半導体層側の層と表面側の層との表面粗さが異なる請求項1〜7のいずれか1つに窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film is formed of at least two layers, and the surface roughness of the layer on the second nitride semiconductor layer side and the layer on the surface side are different. 埋め込み膜の最表面側の層の表面が、埋め込み層の中で最も平坦である請求項10に記載の窒化物半導体レーザ素子。   The nitride semiconductor laser device according to claim 10, wherein the surface of the layer on the outermost surface side of the buried film is flattest among the buried layers. 埋め込み膜は、少なくとも第2窒化物半導体層側において酸素を含む請求項1〜11のいずれか1つに記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film contains oxygen at least on the second nitride semiconductor layer side. 埋め込み膜は、少なくとも第2窒化物半導体層側において酸化物からなる請求項1〜11のいずれか1つに記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film is made of an oxide at least on the second nitride semiconductor layer side. 埋め込み膜は、酸素とジルコニウムとからなる請求項1〜13のいずれか1つに記載の窒化物半導体レーザ素子。   The nitride semiconductor laser element according to claim 1, wherein the buried film is made of oxygen and zirconium. 第2窒化物半導体層の表面にリッジが形成されてなる請求項1〜14のいずれか1つに記載の窒化物半導体レーザ素子。
The nitride semiconductor laser element according to claim 1, wherein a ridge is formed on a surface of the second nitride semiconductor layer.
JP2004200887A 2004-07-07 2004-07-07 Nitride semiconductor laser device Pending JP2006024703A (en)

Priority Applications (1)

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JP2004200887A JP2006024703A (en) 2004-07-07 2004-07-07 Nitride semiconductor laser device

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Application Number Priority Date Filing Date Title
JP2004200887A JP2006024703A (en) 2004-07-07 2004-07-07 Nitride semiconductor laser device

Publications (2)

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JP2006024703A JP2006024703A (en) 2006-01-26
JP2006024703A5 true JP2006024703A5 (en) 2007-08-16

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4601391B2 (en) * 2004-10-28 2010-12-22 シャープ株式会社 Nitride semiconductor device and manufacturing method thereof
US7646798B2 (en) 2006-12-28 2010-01-12 Nichia Corporation Nitride semiconductor laser element
US7773650B2 (en) 2006-12-28 2010-08-10 Nichia Corporation Nitride semiconductor laser element
US7764722B2 (en) 2007-02-26 2010-07-27 Nichia Corporation Nitride semiconductor laser element
US7804872B2 (en) 2007-06-07 2010-09-28 Nichia Corporation Nitride semiconductor laser element
US7701995B2 (en) 2007-07-06 2010-04-20 Nichia Corporation Nitride semiconductor laser element
JP5223552B2 (en) 2008-05-02 2013-06-26 日亜化学工業株式会社 Manufacturing method of nitride semiconductor laser device
KR101628233B1 (en) * 2010-07-08 2016-06-08 엘지이노텍 주식회사 Light emitting diode and Light emitting device comprising the same
JP5510212B2 (en) 2010-09-08 2014-06-04 日亜化学工業株式会社 Nitride semiconductor laser device and manufacturing method thereof

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