JP2006023166A - Socket for inspection and method of manufacturing semiconductor device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attain a higher precision of alignment of a semiconductor device regarding the manufacturing technology of the semiconductor device. <P>SOLUTION: The socket 1 for inspection in which a small camera 1b is embedded is prepared. After arranging the semiconductor device 4 on the socket 1, the rear face of the semiconductor 4 is photographed by the small camera 1b, and the position of the external terminals of the semiconductor device 4 is recognized by the image. The position of the socket 1 is corrected by the XY table 6 on the basis of the recognition results. After the correction, the semiconductor device 4 is mounted on the socket 1 so as to bring the external terminals of the semiconductor device 4 into contact with the contact pins 1d of the socket 1, then the characteristic inspection for the semiconductor device 4 is performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a manufacturing technique of a semiconductor device, and more particularly to a technique that is effective when applied to high accuracy of alignment of a semiconductor device.

In a conventional handling device with a lead detection function, a measurement unit includes lead detection means for detecting a lead of a semiconductor device, and the lead detection means has an optical fiber for obtaining an image of the lead of the semiconductor device, and a camera for capturing the obtained lead image. An image recognition unit for recognizing the captured lead image, and a display for displaying the obtained lead image. Then, it is detected by the lead detection means that the position of the lead of the semiconductor device is shifted, and an indentation of the contact pin of the IC socket attached to the lead of the semiconductor device is displayed (for example, Patent Document) 1).
Japanese Patent Laying-Open No. 2001-4696 (FIG. 2)

  The technique shown below is a position recognition / positioning technique investigated by the present inventors.

  The first technique is to install a small camera near the contact and move the mirror, prism, or camera body between the object to be inspected and the socket for inspection each time the object to be inspected is changed, and confirm the position of each. This is a recognition mechanism moving system that performs adjustment.

  In the second technique, a camera is installed between the movement paths of the inspected object, and the position of the inspected object is recognized while moving the inspected object or once stopped on the camera. In this method, the position of the inspection socket is recognized in advance by another camera, and the positions of the inspection object and the inspection socket are adjusted.

  In the first technique, the mirror, prism, or camera body is moved each time the object to be inspected is changed, so that the handling time is increased and the productivity is lowered.

  Further, there is a problem that the frequency of occurrence of failures such as a decrease in position accuracy corresponding to mechanical accuracy and cable disconnection increases.

  Further, in the second technique, since the recognition is performed between the movement paths of the inspection object, there is a problem that the position accuracy corresponding to the addition of the mechanical accuracy after the recognition is lowered. If the object to be inspected is recognized while moving, the handling time can be improved, but the recognition accuracy is lowered, and once stopped on the camera, the recognition accuracy can be improved, but the handling time is delayed. .

  An object of the present invention is to provide an inspection socket capable of increasing the accuracy of alignment of a semiconductor device and a method of manufacturing a semiconductor device using the same.

  Another object of the present invention is to provide an inspection socket capable of saving space and a method of manufacturing a semiconductor device using the same.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  That is, the present invention provides a socket body having a main surface on which a plurality of terminals are arranged corresponding to the arrangement of external terminals of a semiconductor device that is an object to be inspected, and embedded in the socket body. And a camera that images the back surface of the semiconductor device when the semiconductor device is disposed at a position facing the main surface and away from the main surface.

  According to another aspect of the present invention, there is provided a step of disposing the semiconductor device so as to face a small camera disposed at a central portion of an inspection socket on which the semiconductor device can be mounted, and the position of the semiconductor device disposed at a position facing the inspection socket. The step of imaging the back side of the semiconductor device with the small camera, recognizing the position of the external terminal of the semiconductor device, correcting the position of the inspection socket based on the recognition result, and after the correction, the semiconductor Attaching the semiconductor device to the inspection socket so that an external terminal of the device and a terminal of the inspection socket are in contact with each other, and inspecting the characteristics of the semiconductor device with the semiconductor device being attached to the inspection socket The process of performing.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  The back side of the semiconductor device disposed at a position facing the inspection socket is imaged by a camera in the inspection socket, and the position of the external terminal of the semiconductor device is recognized, whereby the semiconductor device is placed in the inspection socket. When mounting, the position of the external terminal of the semiconductor device can be recognized on the inspection socket. As a result, the semiconductor device can be mounted on the inspection socket in a state in which the position of the external terminal of the semiconductor device is recognized and the position of the inspection socket is corrected, so that the semiconductor device and the inspection socket are aligned with high accuracy. be able to. As a result, it is possible to increase the accuracy of alignment of the semiconductor device.

  In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

  Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment)
FIG. 1 is a perspective view showing an example of the structure of an inspection socket used in the method for manufacturing a semiconductor device according to an embodiment of the present invention. FIG. 2 is a perspective view showing an example of an assembly method of the inspection socket shown in FIG. 3 is a perspective view showing an example of a position recognition state in the manufacturing method of the semiconductor device using the inspection socket shown in FIG. 1, and FIG. 4 is a characteristic inspection in the manufacturing method of the semiconductor device using the inspection socket shown in FIG. FIG. 5 is a side view showing an example of the state, FIG. 5 is a side view showing an example of the structure of a semiconductor device whose characteristics are inspected by the method of manufacturing a semiconductor device using the inspection socket shown in FIG. 1, and FIG. FIG. 7 and FIG. 8 are cross-sectional views each showing a structure of a semiconductor device of a modification example in which characteristics are inspected by a method of manufacturing a semiconductor device using the inspection socket shown in FIG.

  The semiconductor device manufacturing method of the present embodiment is a characteristic inspection process after assembling a semiconductor device, in which the semiconductor device is mounted on an inspection socket and the semiconductor device is inspected.

  First, an inspection socket used in the method for manufacturing a semiconductor device of the present embodiment will be described.

  An inspection socket 1 shown in FIG. 1 includes a main surface 1c on which a plurality of contact pins (terminals) 1d are arranged corresponding to the arrangement of external terminals 12 (see FIG. 6) of a semiconductor device 4 that is an object to be inspected. The socket body 1a and the back surface of the semiconductor device 4 when the semiconductor device 4 is disposed at a position that is embedded in the central portion of the socket body 1a and that faces the main surface 1c of the socket body 1a and is separated from the main surface 1c. And a small camera (camera) 1b.

  That is, the small camera 1b is embedded in the center of the socket main body 1a of the inspection socket 1 so that the upper part of the socket main body 1a can be imaged, and the socket main body 1a and the small camera 1b are integrated. is there.

  A through hole 1e is formed at the center of the socket body 1a of the inspection socket 1 as shown in FIG. 2, and the small camera 1b is embedded in the through hole 1e so that they are integrated. Can do.

  Further, when the inspection socket 1 is manufactured, the inspection socket 1 and the small camera 1b may be integrally molded with resin.

  Next, a method for manufacturing a semiconductor device using the inspection socket 1 of the present embodiment will be described. The manufacturing method of the semiconductor device is an inspection method of the semiconductor device 4 after assembly.

  First, an inspection socket 1 in which a small camera 1b is embedded in the central portion in advance and an inspection board 3 on which the inspection socket 1 is mounted are prepared. As shown in FIG. Place on top.

  Thereafter, the semiconductor device 4 is arranged at a position facing the small camera 1 b embedded in the inspection socket 1.

  That is, as shown in FIG. 3, the semiconductor device 4 is sucked and conveyed by the collet 2 and is disposed above the main surface 1 c of the inspection socket 1.

  Thereafter, the back side of the semiconductor device 4 arranged at a position facing the inspection socket 1 is imaged by the small camera 1b, and the position of the external terminal 12 of the semiconductor device 4 is recognized. For example, when the semiconductor device 4 is an LGA (Land Grid Array) type semiconductor device 4 as shown in FIGS. 5 and 6, the external terminal 12 on the back surface of the semiconductor device 4 shown in FIG. 12 positions are recognized.

  Here, the semiconductor device 4 shown in FIGS. 5 and 6 has a semiconductor chip 8 and a chip component 9 mounted on a ceramic substrate 11, and the semiconductor chip 8 is electrically connected to the ceramic substrate 11 by wires 10. The chip component 9 is connected to the ceramic substrate 11 by solder connection or the like. Further, the semiconductor chip 8 and the chip component 9 are resin-sealed by a sealing body 13. A plurality of external terminals 12 are arranged on the back surface of the ceramic substrate 11.

  With respect to such a semiconductor device 4, as shown in FIG. 3, the entire back surface is imaged by the small camera 1 b in the inspection socket 1, and the image is displayed on the output unit 7, and is also displayed on the image recognition unit 5. Capture and recognize images. Thereby, the position of each external terminal 12 is determined.

  Thereafter, the position of the inspection socket 1 is corrected based on the recognition result. That is, the displacement of the position of the inspection socket 1 is corrected so that the position of the external terminal 12 of the semiconductor device 4 and the position of the contact pin 1d of the inspection socket 1 corresponding to this position match.

  At that time, the XY table 6 is moved and corrected.

  After the correction, the semiconductor device 4 is mounted on the inspection socket 1 so that the external terminal 12 of the semiconductor device 4 and the contact pin 1d of the inspection socket 1 are in contact with each other. Here, as shown in FIG. 4, the collet 2 is lowered while the semiconductor device 4 is sucked and held by the collet 2, the semiconductor device 4 is pressed against the inspection socket 1, and the external terminal 12 of the semiconductor device 4 and the inspection socket 1 contact pin 1d is brought into contact.

  Thereafter, the semiconductor device 4 is inspected for characteristics while the semiconductor device 4 is pressed against the inspection socket 1 by the collet 2.

  When the inspection socket 1 becomes unusable due to dirt on the contact pins 1d, the inspection socket 1 in which the small camera 1b is embedded is replaced.

  Further, the semiconductor device 4 which is an object to be inspected may be of the LGA type shown in FIGS. 5 and 6, or the QFN (Quad Flat Non-leaded Package) type semiconductor device 4 shown in FIG. Alternatively, it may be a QFP (Quad Flat Package) type semiconductor device 4 shown in FIG. In the QFN type semiconductor device 4 shown in FIG. 7, a semiconductor chip 8 is mounted on a tab 14 via a die bonding material 18, and a plurality of leads 15 electrically connected to the semiconductor chip 8 by wires 10. Is arranged at the peripheral edge of the back surface of the sealing body 13. Further, the QFP type semiconductor device 4 shown in FIG. 8 has a plurality of inner leads 16 electrically connected to the semiconductor chip 8 by wires 10, and a plurality of outer leads 17 integrally connected thereto. Further, a plurality of outer leads 17 protrude from the side surface of the sealing body 13 and are bent into a gull wing shape.

  That is, the semiconductor device 4 applied to the method for manufacturing the semiconductor device of the present embodiment can be any semiconductor device 4 as long as the arrangement of the external terminals 12 (including the leads 15 and the outer leads 17) can be imaged from the back side. The type of is not particularly limited.

  However, when the small camera 1b is embedded in the central portion of the inspection socket 1, the external terminal 12 is not disposed near the central portion of the main body of the semiconductor device 4 as the semiconductor device 4 imaged by the small camera 1b. A semiconductor device 4 having a structure is preferable. That is, when the external terminal 12 is arranged near the center of the back surface of the semiconductor device 4 main body, the contact pin 1d must be provided in the center of the inspection socket 1 corresponding to the external terminal 12. However, even if the external terminal 12 is arranged near the central portion of the main body of the semiconductor device 4, it is not necessary to provide the contact pin 1 d, for example, for GND that is electrically connected to another external terminal If it is the external terminal 12 for power supplies, there will be no problem in particular.

  It is also possible to inspect the appearance of the back surface of the semiconductor device 4 by imaging the back surface of the semiconductor device 4 with the small camera 1b in a state where the semiconductor device 4 is arranged on the inspection socket 1 shown in FIG. . That is, the appearance inspection of the back surface of the semiconductor device 4 can be performed in the characteristic inspection process. In this case, the appearance inspection may be performed before the characteristic inspection, or may be performed after the characteristic inspection.

  According to the inspection socket and the semiconductor device manufacturing method using the same according to the present embodiment, the rear surface side of the semiconductor device 4 disposed above the inspection socket 1 is moved by the small camera 1 b in the inspection socket 1. By imaging and recognizing the position of the external terminal 12 of the semiconductor device 4, the position of the external terminal 12 of the semiconductor device 4 is recognized on the inspection socket 1 when the semiconductor device 4 is mounted on the inspection socket 1. can do.

  That is, since the small camera 1b is attached to the socket portion where accuracy is most easily obtained, the recognition positioning accuracy can be improved.

  Accordingly, the semiconductor device 4 can be mounted on the inspection socket 1 in a state where the position of the external terminal 12 of the semiconductor device 4 is recognized and the position of the inspection socket 1 is corrected. Positioning can be performed with high accuracy.

  As a result, it is possible to improve the alignment accuracy of the semiconductor device 4.

  Further, by embedding the small camera 1b in the inspection socket 1, it is possible to save space and reduce the size as compared with the case where the inspection socket 1 and the small camera 1b are separately arranged.

  Further, by integrating the inspection socket 1 and the small camera 1b, the positional accuracy of the inspection socket 1 and the small camera 1b can be improved.

  Further, by manufacturing the inspection socket 1 and the small camera 1b by integral molding, it is possible to easily obtain positional accuracy even if the inspection socket 1 is replaced.

  Further, since the small camera 1b is arranged at the center of the inspection socket 1, it is arranged at the best position for recognizing and aligning the semiconductor device 4, so that the operation of recognizing and aligning can be simplified. Thus, the speed of the position recognition / positioning operation can be improved (index up), and variations in mechanical accuracy can be eliminated, so that the positioning of the semiconductor device 4 and the inspection socket 1 can be made highly accurate.

  Further, since the small camera 1b is embedded in the inspection socket 1 instead of attaching the small camera 1b to a device such as a handler, the inspection socket 1 is taken out and the small camera 1b is replaced on the inspection socket when the camera is replaced. Therefore, replacement of the small camera 1b can be facilitated.

  Although the invention made by the present inventor has been specifically described based on the embodiments of the invention, the present invention is not limited to the embodiments of the invention, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

  For example, in the above-described embodiment, the case where the inspection socket 1 and the small camera 1b are integrally formed has been described. However, the inspection socket 1 and the small camera 1b do not necessarily have to be integrally formed. May be separate.

  That is, for example, a small camera 1b is mounted on an inspection board 3 and an inspection socket 1 having a through hole 1e formed in the center is prepared. The inspection socket 1 is arranged on the inspection substrate 3 so as to be accommodated in the hole 1e. As a result, when the back side of the semiconductor device is imaged and the position of the external terminal 12 is recognized, the image can be recognized under the same conditions as in the case where the inspection socket 1 and the small camera 1b are integrated. . Further, when the inspection socket 1 and the small camera 1b are separate, when the contact pin 1d of the inspection socket 1 becomes dirty and cannot be used, only the inspection socket 1 can be removed from the inspection board 3 and replaced. The inspection socket 1 can be easily replaced.

  Moreover, although the said embodiment demonstrated the case where the small camera 1b was arrange | positioned in the center part of the socket main body 1a of the socket 1 for inspection, even if it is other than a center part about the arrangement position of the small camera 1b. Good. That is, when one small camera 1b is arranged, it is preferably arranged at the center of the main surface 1c. However, when a plurality of small cameras 1b can be arranged on the socket body 1a, it is not limited to the center. The small cameras 1b may be arranged in a distributed manner with respect to the main surface 1c of the socket body 1a, and if the entire back surface of the semiconductor device 4 can be imaged, the number and arrangement positions of the small cameras 1b are particularly limited. It is not something.

  The present invention is suitable for an inspection socket and a method for manufacturing a semiconductor device.

It is a perspective view which shows an example of the structure of the socket for a test | inspection used with the manufacturing method of the semiconductor device of embodiment of this invention. It is a perspective view which shows an example of the assembly method of the socket for an inspection shown in FIG. It is a perspective view which shows an example of the position recognition state in the manufacturing method of the semiconductor device using the socket for an inspection shown in FIG. It is a side view which shows an example of the characteristic test | inspection state in the manufacturing method of the semiconductor device using the socket for an inspection shown in FIG. It is a side view which shows an example of the structure of the semiconductor device in which a characteristic test | inspection is carried out by the manufacturing method of the semiconductor device using the socket for an inspection shown in FIG. FIG. 6 is a back view illustrating an example of the structure of the semiconductor device illustrated in FIG. 5. It is sectional drawing which shows the structure of the semiconductor device of the modification in which the characteristic test | inspection is carried out by the manufacturing method of the semiconductor device using the socket for an inspection shown in FIG. It is sectional drawing which shows the structure of the semiconductor device of the modification in which the characteristic test | inspection is carried out by the manufacturing method of the semiconductor device using the socket for an inspection shown in FIG.

Explanation of symbols

1 Inspection socket 1a Socket body 1b Small camera (camera)
1c Main surface 1d Contact pin (terminal)
1e Through hole 2 Collet 3 Inspection substrate 4 Semiconductor device (inspection object)
DESCRIPTION OF SYMBOLS 5 Image recognition part 6 XY table 7 Output part 8 Semiconductor chip 9 Chip component 10 Wire 11 Ceramic substrate 12 External terminal 13 Sealing body 14 Tab 15 Lead 16 Inner lead 17 Outer lead 18 Die bonding material

Claims (5)

A socket body having a main surface on which a plurality of terminals are arranged corresponding to the arrangement of external terminals of a semiconductor device to be inspected;
A camera that is embedded in the socket body, and that images the back surface of the semiconductor device when the semiconductor device is disposed at a position facing the main surface of the socket body and away from the main surface. Special inspection socket. A socket body having a main surface on which a plurality of terminals are arranged corresponding to the arrangement of external terminals of a semiconductor device to be inspected;
A camera that is embedded in a central portion of the socket body, and that images the back surface of the semiconductor device when the semiconductor device is disposed at a position facing the main surface of the socket body and away from the main surface. A socket for inspection characterized by having. A step of arranging the semiconductor device so as to face a camera arranged in a central portion of an inspection socket on which the semiconductor device can be mounted;
Imaging the back side of the semiconductor device disposed at a position facing the inspection socket with the camera and recognizing the position of the external terminal of the semiconductor device;
Correcting the position of the inspection socket based on the recognition result, and mounting the semiconductor device to the inspection socket so that the external terminal of the semiconductor device and the terminal of the inspection socket are in contact with each other after the correction; When,
And a step of inspecting characteristics of the semiconductor device in a state in which the semiconductor device is mounted in the inspection socket. Preparing an inspection socket in which a camera is embedded in advance;
Disposing a semiconductor device at a position facing the camera embedded in the inspection socket;
Imaging the back side of the semiconductor device disposed at a position facing the inspection socket with the camera and recognizing the position of the external terminal of the semiconductor device;
Correcting the position of the inspection socket based on the recognition result, and mounting the semiconductor device to the inspection socket so that the external terminal of the semiconductor device and the terminal of the inspection socket are in contact with each other after the correction; When,
And a step of inspecting characteristics of the semiconductor device in a state in which the semiconductor device is mounted in the inspection socket. A step of arranging the semiconductor device so as to face a camera arranged in a central portion of an inspection socket on which the semiconductor device can be mounted;
Imaging the back side of the semiconductor device disposed at a position facing the inspection socket with the camera and recognizing the position of the external terminal of the semiconductor device;
Correcting the position of the inspection socket based on the recognition result, and mounting the semiconductor device to the inspection socket so that the external terminal of the semiconductor device and the terminal of the inspection socket are in contact with each other after the correction; When,
A step of performing a characteristic inspection of the semiconductor device with the semiconductor device mounted in the inspection socket;
Before or after the characteristic inspection, the back surface side of the semiconductor device disposed at a position facing the inspection socket is imaged by the camera, and the back surface of the semiconductor device is visually inspected. Manufacturing method.

Images