JP2006022360A - Partial plating device for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a partial plating device capable of efficiently applying partial plating with a thick film to an electronic component. <P>SOLUTION: This partial plating device is composed of: a plurality of cylindrical plating liquid retaining vessels opening at both of a tip face and a bottom face; a one-side electrode provided at the inside of each cylindrical plating liquid retaining vessel: a power source electrically connected to the electrode; a plating liquid feeding vessel connected to the bottom face of the opening in each cylindrical plating liquid retaining vessel; a plating liquid recovering vessel provided around the cylindrical plating liquid retaining vessel; and an electronic component temporary retaining tool electrically connected to the other pole in the above power source. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus for performing partial plating on an electronic component such as an airtight terminal and a partial plating method using the apparatus.

  The most commonly used method for plating electronic components is to accommodate a large number of electronic components in a mesh that is electrically connected to one pole of a power supply, and the mesh containing the electronic components. Is immersed in a plating bath, and the mesh cage is rotated while a potential difference is applied between the electrode prepared separately in the plating bath (electrically connected to the other electrode of the power source) and the mesh mesh. This is the “barrel plating method”.

  The barrel plating method is the simplest method capable of forming an electronic component with a stable plating layer, but has several problems. First, there is a case where only a specific region of an electronic component having a plurality of conductive parts cannot be plated, and a large amount of plating solution is required. The latter point is particularly problematic when it is necessary to perform precious metal plating such as gold plating.

  Patent Document 1 discloses an apparatus for plating while protecting a non-plated portion using a specially prepared jig in order to plate (partial plating) only a lead portion on one side of an airtight terminal by a barrel method. A method is described.

  On the other hand, instead of the barrel method, there is a method in which only the lead portion on one side of the hermetic terminal is plated, and only the lead portion to be plated is brought into contact with the plating bath. Along with this, the plating bath composition around the lead portion changes abruptly, so that it is difficult to form a uniform plating layer when it is necessary to form a thick plating layer.

As a method of uniformly plating only the lead part on one side of the hermetic terminal using the partial immersion method, a long plating bath is prepared, and the plating solution is placed in the long direction in this plating bath. There is also a method of moving the lead portion in contact with the plating solution along the longitudinal direction in the direction opposite to the moving direction of the plating solution. However, when an attempt is made to form a thick plating layer by this method, the length of the plating layer becomes long, which causes a problem that it is difficult to arrange the plating apparatus in the plating factory.
JP-A-10-130881

  An object of the present invention is to provide a partial plating apparatus that can efficiently perform partial plating of a thick film on an electronic component.

  The present invention includes a plurality of cylindrical plating solution holding containers opened on both the top surface and the bottom surface, one electrode provided in each cylindrical plating solution holding container, and a power source electrically connected to the electrodes A plating solution supply container connected to the bottom of each cylindrical plating solution holding device, a plating solution recovery container provided around the cylindrical plating holding device, and an electron electrically connected to the other electrode of the power source. It is in the partial plating apparatus of the electronic component which consists of a component temporary holder.

A preferred configuration of the partial plating apparatus of the present invention will be described below.
(1) A plurality of cylindrical plating solution holding containers are arranged in series via the plating solution recovery container.
(2) A plurality of cylindrical plating solution holding containers are arranged in series and arcuately via the plating solution recovery container.
(3) The power source is a power source capable of generating a pulse current.
(4) A plating solution supply container connected to the bottom of the opening is connected to each of the cylindrical plating solution holding containers.
(5) The respective plating solution recovery containers provided around each cylindrical plating holding device are connected to each other.

  The present invention is also a step of preparing the partial plating apparatus of the present invention described above; an electronic component temporary holder is connected to a conductive portion electrically connected to a planned plating portion of an electronic component to be partially plated. , A step of temporarily supporting electronic components; from a plating solution supply container to a plurality of cylindrical plating solution holding containers, and maintaining the plating solution from the bottom so that the plating solution rises due to surface tension at the top of the holding container opening Supplying the plating solution to the plating solution recovery container; bringing only the planned plating part of the electronic component into contact with the plating solution in the first cylindrical plating solution holding container, and temporarily holding the electronic component Applying a potential difference between the tool and an electrode provided inside the cylindrical plating solution holding tool to subject the plating component contact portion of the electronic component to a primary plating treatment; From liquid holding container Next, the electronic component subjected to the first plating process in the above step is brought into contact with the plating solution in the second cylindrical plating solution holding container, and the first plating process of the electronic component is performed. A step of performing a second plating process in the same manner on the formed portion; a step of repeating this plating step a desired number of times; a step of washing and drying a plating portion of an electronic component that has been subjected to a plurality of partial plating treatments There is also a method for partial plating of electronic parts comprising:

  By using the partial plating apparatus of the present invention, it is possible to efficiently perform partial plating of thick films on various electronic components with a relatively compact plating apparatus.

  The partial plating apparatus of this invention is demonstrated in detail, referring an accompanying drawing.

  FIG. 1 is a perspective view showing a configuration of a stem (stem portion) of an airtight terminal which is a representative electronic component to be plated using the partial plating apparatus of the present invention. In FIG. 1, a stem 1 is electrically connected to a pedestal portion 11, upper lead portions 12a and 12b, and upper lead portions 12a and 12b, which are fitted with an airtight container portion (not shown) to form an airtight container. Lower lead portions 13a and 13b and insulating material portions 14a and 14b. In addition, the electronic component which becomes the object of the partial plating of this invention is not restricted to a stem (part) as shown in FIG. 1, The electroconductive part for plating and the electroconductive part for non-plating are contained in one component. There is no particular limitation as long as the electronic components are present and their parts are electrically connected.

  FIG. 2 is a cross-sectional view showing an example of the configuration of a detonator for generating expansion of an automobile-mounted airbag using the airtight terminal of FIG. In FIG. 2, an energization heating element 15 such as a nichrome wire is placed between the upper lead portions 12a and 12b of the stem described in FIG. And the airtight container 17 is fitted to the base part 11 in the state where the upper part of the base part 11 was filled with the explosive 16. That is, when a current flows between the lower lead portions 13a and 13b, the energization heating element 15 generates heat, the explosive 16 ignites, blows up the hermetic container 17, and is mounted around the hermetic container. An airbag (not shown) can be inflated rapidly.

FIG. 3 is a schematic diagram for explaining a partial plating apparatus of the present invention and a partial plating operation using the plating apparatus.
The plating apparatus of the present invention includes a plurality of cylindrical plating solution holding containers 31a, 31b, 31c opened at both the top surface and the bottom surface, and one electrode 32a, 32b provided inside each cylindrical plating solution holding container. 32c, power supplies 33a, 33b, 33c electrically connected to the electrodes at the same pole, plating solution supply container 34 connected to the bottom of the opening of each cylindrical plating solution holding device, and surroundings of the cylindrical plating holding device And the electronic component temporary holders 36a, 36b, and 36c electrically connected to the other poles of the power supplies 33a, 33b, and 33c. It is not necessary to prepare a power source independently for each plating solution holding container, and a common power source may be used in a switching manner. One plating solution supply container and one plating solution recovery container may be prepared for each plating solution holding container. The plating solution supply container 34 is normally connected to a plating solution supply source (not shown), and the plating solution recovery container 35 is also usually connected to a separately prepared plating solution reservoir (not shown).

  Next, an operation for plating the lower leads 13a and 13b of the stem shown in FIG. 1 using the partial plating apparatus shown in FIG. 3 will be described.

  First, the partial plating apparatus shown in FIG. 3 is prepared, and electronic parts are temporarily held in a conductive portion (upper lead portion) electrically connected to a plating scheduled portion (lower lead portion) of the stem 1 to be partially plated. The tool 36a is connected to temporarily hold the electronic component. Simultaneously with or before or after the temporary holding, the plating solution is supplied from the plating solution supply container 34 to the cylindrical plating solution holding container 31a from the bottom thereof, and the plating solution is raised by the surface tension at the top of the holding container opening. Then, the plating solution is supplied to the plating solution recovery container 35. Since the plating solution supply container is normally connected to the bottom of each cylindrical plating solution holding container, the plating solution is supplied to each cylindrical plating solution holding container 31a, 31b, 31c at the same time. Then, the plating solution rises in the cylindrical plating solution holding container, overflows while maintaining a state where the top surface of the cylindrical container is raised by the surface tension, and is provided around the cylindrical container. Into the plating solution recovery container 35.

  At the stage where the plating solution in the cylindrical container is in the above state, the lower lead portion of the stem which is connected by the electronic component temporary holder 36a and temporarily held is inserted from the top of the plating solution, and is shown in FIG. As shown, the entire lower lead portion is brought into contact with the plating solution. Then, in this state, a potential difference is applied in a pulsed manner between the electronic component temporary holder 36a and the electrode 32a provided inside the cylindrical plating solution holding tool, so that the plating solution contact portion of the electronic component (lower The first lead treatment (usually 1 to 5 seconds) is performed on the side lead portion, and then the electronic component is taken out from the plating solution holding container. Next, the electronic component that has been subjected to the primary plating process in the above step is brought into contact with the plating solution in the second cylindrical plating solution holding container, and the part of the electronic component that has been subjected to the primary plating process Similarly, the second plating process is performed. Further, if necessary, this plating process is repeated a desired number of times, and thus a plurality of partial plating processes are performed. Thereafter, the plating part of the electronic component is washed and finally dried to complete the partial plating of the electronic component.

  In the partial plating apparatus of the present invention, two or more cylindrical plating solution holding containers (plating baths) are used. In order to form a thick plating layer, about 4 to 8 cylindrical plating solution holding containers are connected in series. Thus, as shown in FIG. 3, it is desirable to use them arranged in series via a plating solution recovery container.

  FIG. 4 is a plan view showing a configuration of a partial plating apparatus in which five cylindrical plating solution holding containers 31a, 31b, 31c, 31d, and 31e are arranged in series in an arc shape. In general, when performing plating treatment of electronic parts, first, pretreatment (cleaning, degreasing, acid treatment, etc.) is performed before the plating treatment, and after the plating treatment is finished, washing (water washing, pure treatment) is performed. Water washing) and drying. Therefore, in the plating apparatus of FIG. 4, pretreatment units 37 and 38 and a posttreatment unit 39 are provided. The arrows indicate the supply position and discharge position of the electronic components, respectively. The number of cylindrical plating solution holding containers arranged in series and in an arc shape in FIG. 4 is not particularly limited as long as it is two or more, and the number of pretreatment units and posttreatment units is not particularly limited.

It is a perspective view which shows the structure of the stem part of the airtight terminal which is a typical electronic component of the object plated using the partial plating apparatus of this invention. It is sectional drawing which shows the example of a structure of the detonator for generating the expansion | swelling of the airbag mounted on a motor vehicle using the airtight terminal of FIG. It is a schematic diagram explaining the plating operation using the partial plating apparatus of this invention and this plating apparatus. It is a schematic plan view which shows another type of structural example of the partial plating apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Stem 11 Base part 12a, 12b Upper lead part 13a, 13b Lower lead part 14a, 14b Insulation material part 15 Electric heating element (Nichrome wire)
16 Gunpowder 17 Airtight containers 31a, 31b, 31c Cylindrical plating solution holding containers 32a, 32b, 32c Electrodes 33a, 33b, 33c Power supply 34 Plating solution supply container 35 Plating solution recovery containers 36a, 36b, 36c Electronic parts temporary holder 37, 38 Pre-processing unit 39 Post-processing unit

Claims (6)

  A plurality of cylindrical plating solution holding containers opened on both the top surface and the bottom surface, one electrode provided in each cylindrical plating solution holding container, a power source electrically connected to the electrodes, and each cylindrical shape A plating solution supply container connected to the bottom of the opening of the plating solution holding device, a plating solution recovery container provided around the cylindrical plating holding device, and an electronic component temporary holder electrically connected to the other electrode of the power source A partial plating apparatus for electronic parts.   The partial plating apparatus for an electronic component according to claim 1, wherein the plurality of cylindrical plating solution holding containers are arranged in series via the plating solution recovery container.   The partial plating apparatus for electronic parts according to claim 1 or 2, wherein the power source is a power source capable of generating a pulse current.   The partial plating apparatus for electronic parts according to any one of claims 1 to 3, wherein a plating solution supply container connected to the bottom surface of the opening is connected to each of the cylindrical plating solution holding containers.   The partial plating apparatus of the electronic component according to any one of claims 1 to 4, wherein the plating solution recovery containers provided around the cylindrical plating holding devices are connected to each other. A step of preparing a partial plating apparatus for an electronic component according to any one of claims 1 to 5; an electron in a conductive portion electrically connected to a planned plating portion of an electronic component to be partially plated A step of temporarily holding an electronic component by connecting a component temporary holder; from a plating solution supply container to a plurality of cylindrical plating solution holding containers, and from the bottom of the plating solution, a plating solution at the top of the holding container opening The step of supplying the plating solution to the plating solution recovery container while maintaining the surface so as to rise due to the surface tension; the plating solution in the first cylindrical plating solution holding container is used only for the planned plating portion of the electronic component. Applying a potential difference between the electronic component temporary holding tool and the electrode provided inside the cylindrical plating solution holding tool to perform a first plating process on the plating solution contact portion of the electronic component Step; the electronic component Step of removing from the plating solution holding container; Next, the electronic component subjected to the first plating process in the above step is brought into contact with the plating solution in the second cylindrical plating solution holding container to A step of performing the second plating process in the same manner on the portion subjected to the plating treatment; a step of repeating this plating treatment step as many times as desired; and washing a plating treatment portion of an electronic component that has been subjected to a plurality of partial plating treatments And a method for partially plating electronic parts comprising a drying step.

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