JP2006013502A5 - - Google Patents

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Publication number
JP2006013502A5
JP2006013502A5 JP2005181472A JP2005181472A JP2006013502A5 JP 2006013502 A5 JP2006013502 A5 JP 2006013502A5 JP 2005181472 A JP2005181472 A JP 2005181472A JP 2005181472 A JP2005181472 A JP 2005181472A JP 2006013502 A5 JP2006013502 A5 JP 2006013502A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005181472A
Other languages
Japanese (ja)
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JP2006013502A (ja
Filing date
Publication date
Priority claimed from US10/873,650 external-priority patent/US7057702B2/en
Application filed filed Critical
Publication of JP2006013502A publication Critical patent/JP2006013502A/ja
Publication of JP2006013502A5 publication Critical patent/JP2006013502A5/ja
Pending legal-status Critical Current

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JP2005181472A 2004-06-23 2005-06-22 リソグラフィ装置およびデバイス製造方法 Pending JP2006013502A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/873,650 US7057702B2 (en) 2004-06-23 2004-06-23 Lithographic apparatus and device manufacturing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007300911A Division JP5064979B2 (ja) 2004-06-23 2007-11-20 リソグラフィ装置およびデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2006013502A JP2006013502A (ja) 2006-01-12
JP2006013502A5 true JP2006013502A5 (enExample) 2007-08-09

Family

ID=34938361

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005181472A Pending JP2006013502A (ja) 2004-06-23 2005-06-22 リソグラフィ装置およびデバイス製造方法
JP2007300911A Expired - Fee Related JP5064979B2 (ja) 2004-06-23 2007-11-20 リソグラフィ装置およびデバイス製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007300911A Expired - Fee Related JP5064979B2 (ja) 2004-06-23 2007-11-20 リソグラフィ装置およびデバイス製造方法

Country Status (7)

Country Link
US (1) US7057702B2 (enExample)
EP (1) EP1610183A3 (enExample)
JP (2) JP2006013502A (enExample)
KR (1) KR100695553B1 (enExample)
CN (2) CN1713075B (enExample)
SG (2) SG138618A1 (enExample)
TW (1) TWI277837B (enExample)

Families Citing this family (45)

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KR100585476B1 (ko) 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101369016B1 (ko) 2003-04-10 2014-02-28 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
EP3352015A1 (en) * 2003-04-10 2018-07-25 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
KR20180054929A (ko) 2003-04-11 2018-05-24 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
TWI347741B (en) * 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI482200B (zh) 2003-06-19 2015-04-21 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
KR101561727B1 (ko) * 2004-01-05 2015-10-20 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR101504445B1 (ko) 2004-03-25 2015-03-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) * 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119876B2 (en) * 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) * 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7411654B2 (en) * 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7170583B2 (en) * 2005-06-29 2007-01-30 Asml Netherlands B.V. Lithographic apparatus immersion damage control
US7432513B2 (en) * 2005-10-21 2008-10-07 Asml Netherlands B.V. Gas shower, lithographic apparatus and use of a gas shower
US8125610B2 (en) * 2005-12-02 2012-02-28 ASML Metherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US7728952B2 (en) * 2007-01-25 2010-06-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for closing plate take-over in immersion lithography
US8817226B2 (en) * 2007-02-15 2014-08-26 Asml Holding N.V. Systems and methods for insitu lens cleaning using ozone in immersion lithography
US8654305B2 (en) * 2007-02-15 2014-02-18 Asml Holding N.V. Systems and methods for insitu lens cleaning in immersion lithography
NL1035908A1 (nl) * 2007-09-25 2009-03-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2009094145A (ja) * 2007-10-04 2009-04-30 Canon Inc 露光装置、露光方法およびデバイス製造方法
NL2005586A (en) * 2009-12-02 2011-06-06 Asml Netherlands Bv Lithographic apparatus and sealing device for a lithographic apparatus.
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
US9341942B2 (en) * 2010-08-24 2016-05-17 Nikon Research Corporation Of America Vacuum chamber assembly for supporting a workpiece
NL2008199A (en) * 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008695A (en) * 2011-05-25 2012-11-27 Asml Netherlands Bv Lithographic apparatus comprising substrate table.
KR101616762B1 (ko) * 2011-11-22 2016-04-29 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
JP6025976B2 (ja) * 2012-07-06 2016-11-16 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置
US9568828B2 (en) * 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US10095129B2 (en) 2014-07-04 2018-10-09 Asml Netherlands B.V. Lithographic apparatus and a method of manufacturing a device using a lithographic apparatus
US11397385B2 (en) 2016-06-17 2022-07-26 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and a method of forming a particle shield
CN107783283B (zh) * 2016-08-30 2020-01-24 上海微电子装备(集团)股份有限公司 镜片防污染装置及方法
CN109283797B (zh) 2017-07-21 2021-04-30 上海微电子装备(集团)股份有限公司 物镜保护装置、物镜系统以及光刻设备
EP3620858B1 (en) * 2018-09-10 2023-11-01 Canon Kabushiki Kaisha Exposure apparatus and method of manufacturing article
US11656555B2 (en) * 2019-04-26 2023-05-23 Asml Holding N.V. Lithographic apparatus and illumination uniformity correction system
WO2021032356A1 (en) 2019-08-20 2021-02-25 Asml Netherlands B.V. Substrate holder, lithographic apparatus and method
EP3918421B1 (en) * 2019-12-26 2024-05-15 Nanjing ZongAn Semiconductor Equipment Ltd Tool architecture for wafer geometry measurement in semiconductor industry
EP3919978A1 (en) * 2020-06-05 2021-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and a method of forming a particle shield
US11740564B2 (en) * 2020-06-18 2023-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus and method using the same
CN113262956B (zh) * 2021-07-21 2021-10-15 四川洪芯微科技有限公司 一种半导体晶圆表面处理装置
DE102023204744A1 (de) * 2023-05-22 2024-05-16 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage

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JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
AU8749798A (en) * 1997-08-29 1999-03-22 Nikon Corporation Temperature adjusting method and aligner to which this method is applied
WO2001006548A1 (en) * 1999-07-16 2001-01-25 Nikon Corporation Exposure method and system
US6559922B2 (en) * 2000-05-03 2003-05-06 Eric C. Hansell Method and apparatus for a non-contact scavenging seal
JP2001358056A (ja) * 2000-06-15 2001-12-26 Canon Inc 露光装置
TWI222668B (en) * 2001-12-21 2004-10-21 Nikon Corp Gas purging method and exposure system, and device production method
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1429188B1 (en) * 2002-11-12 2013-06-19 ASML Netherlands B.V. Lithographic projection apparatus
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
EP1571697A4 (en) * 2002-12-10 2007-07-04 Nikon Corp EXPOSURE SYSTEM AND COMPONENT MANUFACTURING METHOD
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method

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