JP2006013208A - Exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem in which an attracting force for holding an original plate is ceased and the original disk falls from a reticle chuck slider, when power supply to an electrostatic chuck electrode electrostatically attracting the original plate to the reticle chuck slider is stopped while the original plate is mounted perpendicuarlly on the reticle slider during the operation of an exposure device. <P>SOLUTION: A stopper is provided which receives the original disk nearby in a fall peeling direction when a device power source is turned off and the attracting force of the electrostatic chuck is ceased to cause the original plate to fall. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a projection exposure apparatus for projecting and transferring an original (reticle) pattern onto a silicon wafer, which is an exposure apparatus used in a semiconductor manufacturing process, and in particular, EUV light (Extreme Ultraviolet extreme ultraviolet light). The present invention relates to an EUV exposure apparatus that uses exposure light having a wavelength of about 13 to 14 nm as a light source.

  The prior art is shown in FIGS.

  The excitation laser 101 is an excitation laser for emitting light by irradiating a light source material that becomes a light emitting point of a light source toward a gasified, liquefied, or atomized gas point, and exciting light source material atoms by plasma excitation. A solid laser or the like is used. The source light emitting unit 102 has a structure maintained in a vacuum inside, and a light source A indicated by 102A indicates a light emission point of an actual exposure light source. The light source mirror Aa indicated by 102Aa is arranged as a hemispherical mirror at the center of the light source A indicated by 102A so as to align and reflect all spherical light from the light source A indicated by 102A in the light emitting direction. Xe (liquefied, sprayed, gas) denoted by 102Ab causes liquefied Xe or liquefied Xe sprayed or Xe gas as a light emitting element to protrude from the point of the light source A denoted by 102A by a 102Ae nozzle. The vacuum chamber 103 stores the entire exposure apparatus and allows the vacuum pump 104 to maintain a vacuum state. The exposure light introducing unit 105 introduces and molds exposure light from the light source light emitting unit 102, and includes mirrors A to D indicated by 105A to 105D, and homogenizes and shapes the exposure light. In reticle stage 106, a master 106A, which is a reflective master of an exposure pattern, is mounted on a movable part on the reticle stage. The reduction projection mirror optical system 107 sequentially projects and reflects the exposure pattern reflected from the original (reticle) 106A onto the mirrors A to E indicated by 107A to 107E, and finally reduces and projects the image at a specified reduction magnification ratio. The wafer stage 108 is designed to position a wafer 108A, which is an Si substrate that exposes a pattern reflected and reduced by the original (reticle) 105A, at a predetermined exposure position. The wafer stage 108 tilts about the XYZ and XY axes, and rotates about the Z axis. Positioning control is performed so that six axes can be driven in the rotational direction. The reticle stage support 109 supports the reticle stage 105 with respect to the apparatus installation floor. The projection system main body 110 supports the reduction projection mirror optical system 107 with respect to the apparatus installation floor. The wafer stage support 111 supports the wafer stage 108 with respect to the apparatus installation floor.

  Reticle stage 105 separately and independently supported by reticle stage support 109, projection system main body 110 and wafer stage support 111, reduction projection mirror optical system 107, reduction projection mirror optical system 107, and wafer stage 108 In the meantime, there is provided means (not shown) for measuring the relative position and maintaining and controlling the relative position continuously. The reticle stage support 109, the projection system main body 110, and the wafer stage support 111 are provided with mounts (not shown) that insulate vibrations from the apparatus installation floor. Reticle stocker 112 temporarily stores reticle 106A, which is a master disk, from the outside of the apparatus, and stores a reticle in a sealed state in accordance with different patterns and different exposure conditions. The reticle changer 113 selects a reticle to be used from the reticle stocker 112 and conveys it.

  The reticle alignment unit 114 is composed of a rotary hand that can rotate around the XYZ and Z axes, receives the master 106A from the reticle changer 113, and rotates and conveys it 180 degrees to the reticle alignment scope 115 provided at the end of the reticle stage 106. With respect to the alignment mark 115A provided on the basis of the reduction projection mirror optical system 107, the master 106A is finely moved in the XYZ axis rotation direction for alignment. The master 106A that has been aligned is chucked on the reticle stage 106.

  The wafer stocker 116 temporarily stores the wafer 108A inside the apparatus from the outside of the apparatus, and a plurality of wafers are stored in the storage container.

  The wafer transfer robot 117 selects the wafer 108A to be exposed from the wafer stocker 116, and carries it to the wafer mechanical pre-alignment temperature controller 118. Wafer mechanical pre-alignment temperature controller 118 performs a rough feed adjustment in the rotation direction of the wafer and simultaneously adjusts the wafer temperature to the temperature control temperature inside the exposure apparatus.

  Wafer feeding hand 119 feeds wafer 108 </ b> A aligned and temperature-controlled by wafer mechanical pre-alignment temperature controller 118 to wafer stage 108.

  The gate valves 120 and 121 are gate opening / closing mechanisms for inserting a reticle and wafer from the outside of the apparatus. Similarly, the gate valve 122 is opened and closed only when the wafer stocker 116 and the wafer mechanical pre-alignment temperature controller 118 space and the exposure space are separated by a partition in the apparatus, and the wafer 108A is transferred and carried out.

  In this manner, separation by the partition walls makes it possible to minimize the volume once released to the atmosphere and quickly bring it into a vacuum parallel state when the wafer 108A is transported out of the apparatus.

  When the original (reticle) 106A is positioned and clamped to the reticle chuck slider 106B provided on the reticle driving means 106C of the reticle stage 106 with such a conventional exposure apparatus, the reticle stocker 112 shown in FIG. The stored original plate (reticle) 106A is selectively conveyed by the reticle changer 113, and is further transferred to the reticle alignment hand 114A of the reticle alignment unit 114 to be rotated and conveyed at the same time as shown in FIG. As shown in FIG. 16A, the slider 106B is moved to the reticle alignment position which is the optical measurement position of the reticle alignment scope 115 and the reticle alignment mark 115A.

  Next, as shown in FIG. 16, the original (reticle) 105A sucked and conveyed by the reticle alignment hand 114A is measured while measuring the original (reticle) 105A with respect to the reticle alignment mark 115A by the reticle alignment scope 115. Align to XY (in-plane direction) and ωZ (Z-axis rotation direction).

After completion of the alignment operation of the original (reticle) 105A, as shown in FIG. 17 (1), the original (reticle) 106A is brought into close contact with the reticle chuck slider 106B by the reticle alignment hand 114A, and further as shown in FIG. 17 (2). Further, the original (reticle) 105A is electrostatically attracted by the potential applied to the electrostatic chuck 106E electrode provided on the reticle chuck slider 106B.
JP 2002-305138 A

  However, in such a conventional exposure apparatus, when it is necessary to turn off the apparatus power due to an emergency stop of the apparatus while the original (reticle) 105A is mounted on the reticle stage 106 during operation of the exposure apparatus, FIG. As shown in FIG. 6, since the power supply to the electrostatic chuck 106E electrode on which the original (reticle) 105A is electrostatically attracted to the reticle chuck slider 106B is cut off, the attracting force for holding the original (reticle) 106A is increased. As a result, as shown in FIG. 18, it may be peeled off from the reticle chuck slider 106 </ b> B, and may collide and fall on the mirror D indicated by 105 </ b> D constituting the reduction projection mirror optical system 107, causing mutual damage. .

  In order to solve the problems of the above conventional example, when the apparatus power is turned off due to an emergency stop of the exposure apparatus and the electrostatic chuck attracts and the original (reticle) falls, the vicinity of the drop peeling direction is very close By providing a stopper to catch the original (reticle), accidents that occurred in the conventional example are prevented.

As a means, the following method is taken.
(1) When the original (reticle) is mounted, a stopper is provided in the direction perpendicular to the original.
(2) The stopper is supported from the original (reticle) mounting member.
(3) The stopper is supported from the original (reticle) stage moving member.
(4) The stopper is moved to a position perpendicular to the original plate surface after the original plate (reticle) is mounted.
(5) A convex stopper receiving member is provided around the original (reticle) so that when the original (reticle) is mounted, the convex portion and the stopper are in a position in which they interfere with the original surface in the vertical direction. .
(6) By making the stopper movable in the vertical direction with respect to the original plate surface, it is possible to drop the original plate (reticle) placed on the stopper and return it to the original plate mounting surface.
(7) A measuring means for detecting the dropping and movement of the original plate is provided, and the original dropping is determined based on the detection signal.

By providing an original (reticle) drop stopper on the original (reticle) stage and the original (reticle) mounting member, the exposure apparatus can be stopped urgently without damage to the original (reticle) and the apparatus, and more reliable exposure is possible. Realize the device.
In addition, the original (reticle) can be returned to the original (reticle) mounting surface by moving the original (reticle) once dropped on the original (reticle) drop stopper to the original (reticle) mounting surface by an emergency stop. This makes it possible to quickly recover the device after an emergency stop.

  Examples of the present invention will be described below.

  1 to 9 show this embodiment. The excitation laser 1 is an excitation laser for emitting light by irradiating a light source material serving as a light emitting point of a light source toward a gasified, liquefied or atomized gas point, and exciting light source material atoms with plasma. A YAG solid laser or the like is used. The light source light emitting unit 2 has a structure in which the inside is maintained in vacuum, and the light source A indicated by 2A is a light emission point of an actual exposure light source. The vacuum chamber 3 stores the entire exposure apparatus and allows the vacuum pump 4 to maintain a vacuum state. The exposure light introducing unit 5 is constituted by mirrors A to D indicated by 5A to 5D, and introduces and molds the exposure light from the light source light emitting unit 2, and homogenizes and shapes the exposure light. An original plate 6A, which is a reflection original plate of an exposure pattern, is mounted on the movable part on the reticle stage 6. The reticle chuck slider 6B clamps and holds the original 6A with respect to the reticle driving means 6C. The electrostatic chuck electrodes 6D, 6E, 6F, 6G, 6H, 6J, 6K, and 6L are built in the reticle chuck slider 6B, and the potentials are between 6D and 6E, between 6F and 6G, between 6J and 6H, and between 6K and 6L. By applying in between, the electrostatic potential is polarized between the respective electrodes and the original 6A, and the original 6A is adsorbed and fixed to the reticle chuck slider 6B by Coulomb force or Johnson Rabeck force. The gap sensors 6N, 6M, 6P, and 6Q measure the gap between the original 6A and the reticle chuck slider 6B. In general, the sensor principle is a capacitance sensor (detects changes in capacitance with displacement of the gap between electrodes) and eddy current sensor (detects changes in eddy current in the target with displacement of gap between electrodes as eddy current loss). ) And an optical microsensor such as a laser light oblique incidence reflection detection type.

  The reduction projection mirror optical system 7 reduces and projects the exposure pattern reflected from the original 6A. Projected and reflected sequentially on mirrors A to E indicated by 7A to 7E, and finally reduced and projected at a specified reduction ratio.

  The wafer stage 8 is positioned in a predetermined exposure position for a wafer 8A, which is an Si substrate for exposing a pattern projected by reflection reduction by the original 5A, at a predetermined exposure position. Positioning is controlled so that the shaft can be driven. The reticle stage support 9 supports the reticle stage 5 with respect to the apparatus installation floor. The projection system main body 10 supports the reduction projection mirror optical system 7 with respect to the apparatus installation floor. The wafer stage support 11 supports the wafer stage 8 against the apparatus installation floor.

  Between the reticle stage support 9, the projection system main body 10 and the wafer stage support 11 that are separately and independently supported by the reticle stage support 9, the reduction projection mirror optical system 7, and the reduction projection mirror optical system 7 and the wafer stage 8. Is provided with means (not shown) for measuring the relative position and continuously maintaining and controlling the relative position.

  The reticle stage support 9, the projection system main body 10, and the wafer stage support 11 are provided with mounts (not shown) that insulate vibrations from the apparatus installation floor.

  The reticle stocker 12 temporarily stores a reticle 6A, which is an original plate, from the outside of the apparatus, and stores a reticle in a sealed state in accordance with different patterns and different exposure conditions. The reticle changer 13 selects and transports a reticle to be used from the reticle stocker 12.

  The reticle alignment unit 14 is composed of a rotating hand that can rotate around the XYZ and Z axes, receives the original 6A from the reticle changer 13, and rotates it 180 degrees to the reticle alignment scope 15 provided at the end of the reticle stage 6 for reduction. Alignment is performed by finely moving the original plate 6A in the XYZ axis rotation direction with respect to the alignment mark 15A provided on the basis of the projection mirror optical system 7.

  The reticle alignment hand 14A functions as a rotary hand that can rotate around the XYZ and Z axes of the reticle alignment unit 14. In addition, an electrostatic chuck electrode (not shown) for holding the original 6A is incorporated.

  The wafer stocker 16 temporarily stores the wafer 8A inside the apparatus from the outside of the apparatus, and a plurality of wafers are stored in a storage container. The wafer transfer robot 17 selects the wafer 8A to be exposed from the wear stocker 16, and carries it to the wafer mechanical pre-alignment temperature controller 18. The wafer mechanical pre-alignment temperature controller 18 adjusts the wafer feed in the rotational direction and simultaneously adjusts the wafer temperature to the exposure apparatus internal temperature adjustment temperature. The wafer feeding hand 19 feeds the wafer 8 </ b> A aligned and temperature-controlled by the wafer mechanical pre-alignment temperature controller 18 to the wafer stage 8.

  The gate valves 20 and 21 are gate opening / closing mechanisms for inserting a reticle and wafer from the outside of the apparatus. Similarly, the gate valve 22 is opened and closed only when the wafer stocker 16, the wafer mechanical pre-alignment temperature controller 18 space and the exposure space are separated by a partition in the apparatus and the wafer 8A is transferred and carried out.

  As described above, the separation by the partition wall makes it possible to minimize the volume once released to the atmosphere when the wafer 8A is transferred to and from the outside of the apparatus and to quickly bring it into a vacuum parallel state.

  The reticle alignment control circuit 23 controls the reticle alignment unit 14 based on information from the measurement data of the alignment scope 15.

  The original (reticle) drop stopper 24 prevents the original (reticle) 6A, 6D from dropping.

In the exposure apparatus having the above configuration, when the original plate (reticle) 6A is positioned and clamped to the reticle chuck slider 6B provided on the reticle driving means 6C of the reticle stage 6,
A reticle (reticle) 6A stored in the reticle stocker 12 is selected and conveyed by the reticle changer 13, and is further transferred to the reticle alignment hand 14A of the reticle alignment unit 14 and rotated and conveyed at the same time as shown in FIG. 6C, the reticle chuck slider 6B is moved to the reticle alignment position which is the optical measurement position of the reticle alignment scope 15 and the reticle alignment mark 15A as shown in FIG.

  Next, as shown in FIG. 3A, an alignment operation of the original (reticle) 5A sucked and conveyed by a reticle alignment electrostatic chuck (not shown) provided in the reticle alignment hand 14A is performed.

  As shown in FIG. 3B, the position error of the original (reticle) 6A is measured and detected by the reticle alignment scope 15 from the relative alignment error with the reticle alignment mark 15A, and the reticle alignment unit 14 is detected by the original alignment control circuit 24. Is driven and the reticle alignment hand 14A performs alignment operations in XY (in-plane direction) and ωZ (Z-axis rotation direction), thereby aligning the original 6A.

  When the alignment of the original (reticle) 6A is completed, as shown in FIG. 4 (2), the back surface of the original 6A is subjected to Coulomb force or Johnson Rabeck by the potential applied to the electrostatic chuck electrode 6E of the reticle chuck slider 6B. Adsorption clamp by force.

  After the clamping is completed, as shown in FIG. 3 (3), an electrostatic chuck (not shown) provided on the reticle alignment hand 14B releases the original (reticle) 6D, and the reticle alignment hand 14A is retracted downward. . The exposure operation is started after the above reticle alignment operation is completed.

  Here, in the embodiment, as shown in FIG. 4 (2), the original (reticle) drop stopper 24 provided on the reticle chuck slider 6B is rotated from the state (1) to the state (2) in FIG. By doing so, it is positioned with a minute gap immediately below the original plate surface of the original plate (reticle) 6D.

  Further, as shown in FIG. 6 (2), the original (reticle) dropping stopper 24 is provided with an original (reticle) drop detection / horizontal position sensor 24 A on the original (reticle) receiving surface portion, thereby dropping the original (reticle) 24. Detection can be performed.

  FIG. 7 shows an apparatus operation flow when an original (reticle) drop detection occurs. Here, when the original (reticle) fall detection sensor 24A detects the original (reticle) fall, an apparatus operation state determination 24B is performed. Here, if the apparatus is in scan exposure, calibration or wafer transfer (24C), the stage is quickly stopped (24E), and at the same time, an original (reticle) clamp error is shown and the apparatus is stopped.

  In the apparatus operation state determination (24B), when the original (reticle) alignment or the original (reticle) is being transferred (24D), the original (reticle) alignment operation is immediately stopped, the original (reticle) transfer operation is stopped, or the original ( Reticle) Indicates a clamp error (24F) and stops the device.

  Next, in a state where the apparatus is stopped due to an original (reticle) clamp error, the operator temporarily turns off the apparatus power, and checks and measures against the original (reticle) clamp error and the cause of the drop (24H).

Next, the apparatus power is turned on (24J), and the process proceeds to an original (reticle) collection operation (24K). The original (reticle) collection operation (24K) is performed in the following order 24L.
(1) Original plate (reticle) horizontal position confirmation: The horizontal position of the original plate (reticle) that has dropped is confirmed, and it is confirmed that the original plate (reticle) is within a horizontal position that can be returned relative to the electrostatic chuck.
(2) Master (reticle) lift-up: The master (reticle) 6A and 6D dropped by the master (reticle) drop stopper 24 shown in FIG. 9 (1) is replaced with the reticle chuck slider 6B as shown in FIG. 9 (2). Lift up toward the mounting surface.
(3) Original (reticle) electrostatic chuck holding: In this state, an electric potential is again applied to the electrostatic chuck electrode 6E to electrostatically chuck the original (reticle). Next, as shown in FIG. 9 (3), the original (reticle) drop stopper 28 is retracted downward.
(4) Recovery operation by reticle alignment unit: The electrostatic chucked original plate (reticle) is recovered by the reticle alignment unit 14.
(5) Drop original (reticle) maintenance and inspection: The recovered original drop (reticle) is maintained and inspected to confirm that there is no problem, and the original (reticle) is returned to the apparatus.

  FIG. 8 shows an apparatus operation flow when the apparatus power supply is turned off or the apparatus emergency stop (24M) is executed during the operation of the apparatus.

  First, device operation state determination (24N) is performed. If the apparatus is in scan exposure, calibration, or wafer transfer (24P), the stage is quickly stopped (24R), and at the same time, an original (reticle) clamp error is shown and the apparatus is stopped.

  In the apparatus operation state determination (24N), when the original (reticle) alignment is being performed or the original (reticle) is being transferred (24Q), the original (reticle) alignment operation is immediately stopped or the original (reticle) transfer operation is canceled or the original ( Reticle) Indicates a clamp error and stops the device (24S).

  Next, in the state where the apparatus is stopped due to an original (reticle) clamp error, in the case of an emergency stop, the operator turns the apparatus power ON (24T) after the apparatus is stopped and turned off again, and the original (reticle) recovery operation (24U) is performed. Transition.

The original (reticle) collection operation (24U) is performed in the following order 24V.
(1) Original plate (reticle) horizontal position confirmation: The horizontal position of the original plate (reticle) that has dropped is confirmed, and it is confirmed that the original plate (reticle) is within a horizontal position that can be returned relative to the electrostatic chuck.
(2) Original (reticle) lift-up: The original (reticle) drop stopper 24 shown in FIG. 9 (1) causes the originals (reticles) 6A and 6D dropped to a reticle chuck slider as shown in FIG. 9 (2). Lift up toward 6B mounting surface.
(3) Original (reticle) electrostatic chuck holding: In this state, an electric potential is again applied to the electrostatic chuck electrode 6E to electrostatically chuck the original (reticle). Next, as shown in FIG. 9 (3), the original (reticle) drop stopper 28 is retracted downward.
(4) Recovery operation by reticle alignment unit: The electrostatic chucked original plate (reticle) is recovered by the reticle alignment unit 14.
(5) Drop original (reticle) maintenance and inspection: The recovered original drop (reticle) is maintained and inspected to confirm that there is no problem, and the original (reticle) is returned to the apparatus.

  In this way, by providing the original (reticle) drop stopper 24 in the vicinity of the original (reticle) 6D dropping direction, the original (reticle) 6D interferes with other parts in the exposure apparatus even during an emergency stop of the exposure apparatus. The apparatus and the original plate (reticle) can be prevented from being damaged without falling to the position where they are moved.

  Further, by providing an original plate (reticle) drop detection and a horizontal position sensor, it is possible to perform a quicker and safer recovery operation of the original plate (reticle).

(Other Example 1)
Another embodiment 1 is shown in FIG. In the previous embodiment, the original (reticle) fall prevention stopper is supported by the reticle chuck slider 6B. However, as another embodiment, it is also possible to support the reticle driving means 6C as shown in FIG. It is.

  At that time, the original (reticle) dropping stopper 25 supported by the reticle driving means 6C is positioned by the rotating operation from the state (1) to the state (2) in FIG.

(Other Example 2)
Another embodiment 2 is shown in FIG. In the embodiment and the other embodiment 1, the original (reticle) dropping stopper is configured to directly receive the original (reticle). However, as another embodiment, as shown in FIG. 11, the original (reticle) 6A, 6D An original plate ear 6E, which is a convex member, is joined to the outer peripheral portion, and the original (reticle) drop stopper 26 supported and provided on the reticle chuck slider 6B is changed from the state (1) to the state (2) in FIG. By moving by the rotational operation, when the original (reticle) 6A, 6D is dropped, the original ear 6E is received by the original (reticle) drop stopper 26, and the original (reticle) 6A, 6D can be prevented from falling.

(Other Example 3)
Another embodiment 3 is shown in FIG. In the embodiment, the original plate (reticle) drop stopper is configured to be mounted at a predetermined position by a rotation operation after the original plate (reticle) is mounted. However, as shown in FIG. 12, an original plate (reticle) drop stopper 27 is provided. The reticle chuck slider 6B is provided in a fixed shape, and when the original plates (reticles) 6A and 6D are mounted, the original plate ear 6F and the original plate (reticle) drop stopper 27 move in the vertical direction with respect to the original plate (reticle) at a non-interference position. Next, it is moved horizontally to the mounting position of the reticle chuck slider 6B by horizontal movement, and in this state, the original (reticle) alignment operation is performed and the reticle chuck slider 6 is mounted.

  In this state, since the original plate ear 6F and the original plate (reticle) drop stopper 27 are positioned substantially in the same plane in the vertical direction with respect to the original plate surface, the original plate (reticle) is dropped when the original plates (reticles) 6A and 6D are dropped. The stopper 27 receives the original ear 6F and makes it possible to prevent falling.

  In this way, a configuration in which the original (reticle) drop stopper itself does not move and operate is also possible.

(Other Example 4)
Another embodiment 4 is shown in FIG. In another configuration of the third embodiment, a configuration in which the dropped original (reticle) is once returned to the mounting position of the reticle chuck slider 6B and automatically recovered outside the apparatus can be considered. FIG. 13 shows the configuration.

  The original (reticle) drop stopper 27 provided on the reticle chuck slider 6B is in the position shown in FIG. 13 (1) when the original (reticle) 6A, 6D is dropped. In this state, when the exposure apparatus is restarted, it is necessary to temporarily return the reticle (reticle) to the reticle chuck slider 6B on the reticle stage 6 when taking the original (reticle) out of the apparatus.

  Therefore, as shown in FIG. 13B, the reticle chuck slider is moved by moving the original (reticle) drop stopper 27 upward in the figure while the original (reticle) 6A and 6D are placed on the original (reticle) drop stopper 27. The original plates (reticles) 6A and 6D are brought into close contact with 6B. By supplying the electrostatic chuck in this state, the original plates (reticles) 6A and 06D are held. Here, as shown in FIG. 13 (3), the original (reticle) drop stopper 27 can be moved downward to return it to its original position.

(Other Example 5)
Another embodiment 5 is shown in FIG. In the embodiment, the drop detection and the horizontal position sensor are provided on the fall prevention stopper side, but, as shown in FIG. 15B, an original (reticle) drop detection sensor 29 is provided on the reticle chuck slider 6B side. This makes it possible to detect when the original plates (reticles) 6A and 6D have moved or dropped from the mounting surface of the reticle chuck slider 6. As the original (reticle) drop detection sensor 29, a method of detecting the distance from the back of the original (reticle) by a light reflection method, or a change in electrostatic capacitance with the dielectric film for electrostatic chuck on the back of the original (reticle) is used. (Reticle) Capacitance sensor that measures the distance from the back surface.

1 is an overall view of an exposure apparatus shown in the present embodiment. The alignment means detail drawing shown in a present Example. The alignment means detail drawing shown in a present Example. FIG. 3 is a detailed view of a fall prevention means shown in the present embodiment. FIG. 3 is a detailed view of a fall prevention means shown in the present embodiment. FIG. 3 is a detailed view of a fall prevention means shown in the present embodiment. The exposure apparatus functional flow shown in the present embodiment. The exposure apparatus functional flow shown in the present embodiment. FIG. 3 is a detailed view of a fall prevention means shown in the present embodiment. FIG. 5 is a detailed view of a fall prevention means shown in another embodiment 1; The fall prevention means detail drawing shown in other Example 2. FIG. FIG. 6 is a detailed view of a fall prevention means shown in another embodiment 3; The fall prevention means detail drawing shown in the other Example 4. FIG. FIG. 10 is a detail view of a fall prevention means shown in another embodiment 5. The whole exposure apparatus shown in a prior art example. Alignment means detail drawing shown in a prior art example. Alignment means detail drawing shown in a prior art example. The fall state explanatory drawing shown in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Excitation laser 2 Light source light emission part 2A Light source A
3 Vacuum chamber 4 Vacuum pump 5 Exposure light introduction part 5A Mirror A
5B Mirror B
5C Mirror C
5D Mirror D
6 Reticle stage 6A Original (reticle)
6B Reticle chuck slider 6C Reticle driving means 6D Original (reticle)
6E Electrostatic chuck electrode 6F Original plate ear 7 Reduction projection mirror optical system 7A Mirror A
7B Mirror B
7C Mirror C
7D Mirror D
7E Mirror E
DESCRIPTION OF SYMBOLS 8 Wafer stage 8A Wafer 9 Reticle stage support body 10 Exposure apparatus main body 11 Wafer stage support body 12 Reticle stocker 13 Reticle changer 14 Reticle alignment unit 14A Reticle alignment hand 15 Reticle alignment scope 15A Reticle alignment mark 16 Wafer stocker 17 Wafer transfer robot 18 Wafer Hameka pre-alignment temperature controller 19 Wafer feeding hand 20 Gate valve 21 Gate valve 22 Gate valve 23 Master alignment control circuit 24 Master (reticle) drop stopper 24A Master (reticle) drop detection sensor 24B Device operation state determination 24C to V Device operation state Description 25 Master (reticle) drop stopper 26 Master (reticle) drop stopper 2 Original (reticle) fall stopper 28 original (reticle) fall stopper 29 original (reticle) fall sensor 101 excitation laser 102 source emitting portion 102A light source A
102Aa Light source mirror Aa
102Ab Xe (liquefaction, spray, gas)
102Ae Nozzle 103 Vacuum chamber 104 Vacuum pump 105 Exposure light introduction part 105A Mirror A
105B Mirror B
105C Mirror C
105D Mirror D
106 reticle stage 106A original (reticle)
106B Reticle chuck slider 106C Reticle driving means 106D Master (reticle)
106E Electrostatic chuck electrode 107 Reduction projection mirror optical system 107A Mirror A
107B Mirror B
107C Mirror C
107D Mirror D
107E Mirror E
DESCRIPTION OF SYMBOLS 108 Wafer stage 108A Wafer 109 Reticle stage support body 110 Exposure apparatus main body 111 Wafer stage support body 112 Reticle stocker 113 Reticle changer 114 Reticle alignment unit 114A Reticle alignment hand 115 Reticle alignment scope 115A Reticle alignment mark 116 Wafer stocker 117 Wafer transfer robot 118 Wafer Hameka pre-alignment temperature controller 119 Wafer feeding hand 120 Gate valve 121 Gate valve 122 Gate valve 123 Original plate alignment control circuit

Claims (4)

  The pattern drawn on the original surface is projected onto the substrate via the projection optical system, and both the original plate and the substrate, or only the substrate is moved relative to the projection optical system by the stage device, so that the original pattern is changed. In the exposure apparatus that repeatedly exposes the substrate, the member that prevents the movement of the original in the direction perpendicular to the original surface is moved to a position facing the original surface through a gap after the original is mounted on the original stage device. Exposure equipment to do.   2. The exposure apparatus according to claim 1, wherein the blocking member is supported by an original plate mounting member or the original stage apparatus moving member.   2. The blocking member moves to a position facing a concave and convex portion provided on the original plate through a gap in a state where the original plate is mounted on the original stage device. Exposure device.   An original plate position measuring unit that measures an original plate position with respect to the original plate mounting surface is provided, and the original mounting state, movement from the original plate mounting surface, or original plate dropping is determined based on a signal from the original plate position measuring unit. The exposure apparatus according to any one of 1 to 4.

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