JP2006012873A - Electronic controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reinforcing device whose cost is reduced and productivity is improved, as compared to the conventional cases, and in which the bonding strength of a lead component can be fully secured. <P>SOLUTION: A jumper wires 15 are mounted around the lead component insertion hole 13 of a printed circuit 11 as reinforcement measures. Stress on the printed circuit 11 is dispersed by the jumper wires 15, and concentration of stress to the local part of the printed circuit 11 can be suppressed. Since the jumper wires 15 can be mounted on an automatic mounting machine which are the same as those of the other electronic component that is necessary, in terms of circuit structure in the electronic controller, dedicated equipment, a jig, and man-hour work can be eliminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In the electronic control device for joining a lead component to a printed wiring board by using a flow soldering method, the present invention provides a reinforcing measure for a lead component that requires particularly strong joint strength, such as a heavy component or a connection component. The present invention relates to an electronic control device.

  2. Description of the Related Art Conventionally, this type of electronic control device uses a soldering iron as a reinforcing measure to solder a lead part and then solder the lead fillet (see, for example, Patent Document 1). In some cases, a fit is inserted in advance into a lead component insertion hole of a printed wiring board (see, for example, Patent Document 2).

  FIG. 4 shows a conventional electronic control device. In FIG. 4 (a), the solder fillet 17 generated by flow soldering is placed on the solder fillet using a soldering iron.

FIG. 4B shows a case in which a lead component 12 is mounted after inserting a clasp 19 into the printed wiring board 11, and flow soldering is performed.
Japanese Utility Model Publication No. 5-93029 JP-A-55-21171

  However, in the conventional configuration, when soldering is performed, when stress is applied to the lead component, the copper foil portion of the printed wiring board may be peeled off from the base material, and it is necessary to improve the bonding strength of the lead component. was there. Furthermore, since production systems based on human tactics are mainstream, it was necessary to reduce costs and improve productivity.

  In addition, when inserting an eyelet, it is possible to ensure sufficient strength of the lead parts, but in general, production methods based on human naval tactics using dedicated equipment or jigs are the mainstream, reducing costs and increasing productivity. There was a need to improve.

  The present invention solves the above-described conventional problems, and an object thereof is to provide a reinforcing measure capable of reducing cost, improving productivity, and sufficiently securing the bonding strength of lead components.

  In order to solve the above-described conventional problems, the electronic control device of the present invention has a jumper wire mounted around the lead component insertion hole of the printed wiring board as a reinforcing measure.

  As a result, when stress is applied to the lead component after flow soldering, the jumper wire is joined with the same solder fillet as the terminal of the lead component, and is also fixed to the opposite side of the surface to be soldered of the printed wiring board Therefore, it plays a role of dispersing the stress applied to the printed wiring board.

  In addition, the jumper wire should be mounted in the same process as other electronic components required for circuit configuration in the electronic control device using a general-purpose automatic mounting machine that is generally widely used in the electronic component mounting field. Can do.

  The reinforcing measure in the electronic control device of the present invention can disperse the stress applied to the printed wiring board by the jumper wire and suppress the concentration of the stress locally on the printed wiring board. Moreover, since the jumper wire can be mounted by the same automatic mounting machine as other electronic components required for the circuit configuration in the electronic control device, it is possible to eliminate dedicated equipment, jigs and man-hour work.

  In a first aspect of the present invention, an electronic control device for joining a lead component to a printed wiring board by using a flow soldering method, the jumper wire is mounted around the lead component insertion hole of the printed wiring board, thereby performing flow soldering. When stress is applied to the lead component later, the jumper wire is joined with the same solder fillet as the lead component terminal, and is also fixed to the opposite side of the printed circuit board soldering surface. It plays a role of dispersing the stress applied to the wiring board and can improve the bonding strength of the lead parts.

  Even if the lead component and the jumper wire are joined by separate lands and solder fillets, the same effect can be obtained if both are mounted close to each other. It is not a thing.

  Moreover, since the jumper wire can be mounted by the same automatic mounting machine as other electronic components required for the circuit configuration in the electronic control device, it is possible to simultaneously reduce costs and improve productivity.

  In the second invention, in particular, the jumper wire of the first invention is mounted from the opposite side of the surface to be soldered on the printed wiring board, so that most of the jumper wire is opposite to the surface to be soldered. It will be placed on the face side. Therefore, the flow soldered jumper wire can effectively disperse the stress applied to the printed wiring board and improve the bonding strength of the lead component. In this case, since the mounting direction is usually from the same side as other electronic components, the highest productivity can be obtained.

  In the third invention, in particular, by mounting the jumper wire of the first invention from the surface side to be soldered on the printed wiring board, most of the jumper wire is placed on the surface side to be soldered. become. Therefore, when performing flow soldering, this jumper wire exhibits the effect of collecting more solder on the land, and the solder fillet of the lead component becomes high, especially for heavy lead components. Strength can be improved.

  In the fourth invention, in particular, the jumper wire is placed between the land of the printed wiring board and the terminal of the lead component by mounting the jumper wire of the third invention on the lead component insertion hole. It will be. Therefore, during flow soldering, the jumper wire plays a role of connecting solder to both sides, and in addition to the effects of the third invention, it is possible to effectively suppress soldering defects such as blow holes.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 shows an electronic control unit according to Embodiment 1 of the present invention.

In FIG. 1, a printed wiring board 11 has a lead component insertion hole 13 for mounting a lead component 12 and a land 14 to be joined by normal flow soldering. Further, a jumper wire insertion hole 16 for mounting the jumper wire 15 is provided in the vicinity of the lead component insertion hole 13, and the jumper wire insertion hole 16 is provided inside the land 14. In the printed wiring board 11, the jumper wire 15 and the lead component 12 are mounted from the surface opposite to the land 14, and the land 14 is flow soldered. At this time, the jumper wire 15 is joined by the same solder fillet 17 as the lead component 12.

  The operation and action of the electronic control device configured as described above will be described below.

  First, at the time of flow soldering, in addition to the terminals of the lead component 13 in the land 14, there are also terminals of the jumper wire 15, so that more solder is collected on the land 14 to form a good solder fillet 17. can do.

  Further, most of the jumper wires 15 are placed on the surface of the printed wiring board 11 opposite to the lands 14. Accordingly, the flow soldered jumper wire 15 can effectively disperse the stress applied to the printed wiring board and improve the bonding strength of the lead component.

(Embodiment 2)
FIG. 2 shows an electronic control unit according to Embodiment 2 of the present invention.

  In FIG. 2, the printed wiring board 11 has a lead component insertion hole 13 for mounting the lead component 12 and a land 14 that is usually joined by flow soldering. Further, a jumper wire insertion hole 16 for mounting the jumper wire 15 is provided in the vicinity of the lead component insertion hole 13, and the jumper wire insertion hole 16 is provided inside the land 14. In the printed wiring board 11, the jumper wire 15 is mounted from the surface of the land 14, the lead component 12 is mounted from the surface opposite to the land 14, and the land 14 is flow soldered. At this time, the jumper wire 15 is joined by the same solder fillet 17 as the lead component 12.

  The operation and action of the electronic control device configured as described above are the same as those in the first embodiment, but most of the jumper wire 15 is placed on the land 14 of the printed wiring board 11. Accordingly, the flow soldered jumper wire 15 exhibits the effect of collecting more solder on the land 14 and the solder fillet 17 becomes higher, and the joint strength can be effectively improved particularly for heavy components. .

  In particular, as shown in FIG. 3, the jumper wire 15 of the present embodiment is mounted on the lead component insertion hole 13 so that the jumper wire 15 is connected to the land 14 of the printed wiring board 11 and the lead component 12. It will be placed between the terminals. Therefore, during flow soldering, the jumper wire 15 plays a role of connecting solder to both sides, and can suppress soldering defects such as blow holes in addition to the above effects.

  As described above, since the electronic control device according to the present invention can improve the bonding strength with respect to the printed wiring board, the electronic control apparatus can also be applied to reinforcement applications such as a heat sink that can be fixed to the printed wiring board by soldering.

Explanatory drawing of the electronic control apparatus in Embodiment 1 of this invention Explanatory drawing of the electronic control unit in Embodiment 2 of the present invention Explanatory drawing of the other electronic control unit in Embodiment 2 of this invention (A) An explanatory diagram of a conventional electronic control device (b) An explanatory diagram of another conventional electronic control device

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Printed wiring board 12 Lead component 13 Lead component insertion hole 14 Land 15 Jumper wire 16 Jumper wire insertion hole 17 Solder fillet 18 Soldered solder 19 Fitting

Claims (4)

In an electronic control device that joins lead components (electronic components with lead terminals) to a printed wiring board using flow soldering, jumper wires are used as lead parts for printed wiring boards in order to improve the durability of joining the lead parts. An electronic control device that is mounted around the insertion hole. The electronic control device according to claim 1, wherein the jumper wire is mounted from the side opposite to the surface to be flow soldered of the printed wiring board. The electronic control device according to claim 1, wherein the jumper wire is mounted from a surface side of the printed wiring board on which flow soldering is performed. The electronic control device according to claim 3, wherein the jumper wire is mounted on the lead component insertion hole.

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