JP2006010429A - Mounted board inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounted board inspection device capable of inspecting with high precision a joined state of a mounted component joined with solder on a printed board. <P>SOLUTION: The inspection device is equipped with a laser instrumentation portion for finding data on the height of an object to be inspected on an inspection board by laser triangulation, an X-ray instrumentation portion for finding height data by calculating a cross-sectional shape of the object to be inspected from an X-ray transmission image obtained by irradiating the board with X-rays and photographing, and an instrumentation inspection unit for calculating an angle of inclination of the external shape of the object to be inspected from the height data acquired by measurement in the laser instrumentation portion, and selectively changing the height data acquired in the laser instrumentation portion and the height data acquired in the X-ray instrumentation portion on the basis of the calculated angle of inclination. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting board inspection apparatus, and particularly can be suitably used for inspection of a solder joint state by measuring the shape of a solder joint portion of a mounted component on a mounted printed board with high accuracy.

  Conventionally, there are a triangulation method using laser light and a laminography method using X-ray as a mounting board inspection device for measuring the outer shape of a solder joint portion of a component mounted on a printed circuit board and inspecting the joining state. In the following, a conventional inspection apparatus will be described.

  For example, Japanese Patent No. 3064517 discloses a conventional triangulation method using laser light in a conventional mounting board inspection apparatus. As shown in FIG. 10, the inspection apparatus includes a laser unit, a polygon mirror, and an fθ lens. Group, condensing lens group, PSD (Position Sensitive Detector), XY stage that moves printed circuit board in XY direction, and measurement / inspection unit. Laser beam output from laser unit is polygon The light is deflected by the mirror, passes through the fθ lens group, and is irradiated vertically onto the printed circuit board. The irradiated laser light is reflected at the irradiation position of the inspection object on the printed board, and a part of the reflected light passes through the condenser lens group and is condensed on the PSD light receiving surface.

  At this time, based on the principle of triangulation, the reflected light is condensed at an arbitrary position on the PSD light receiving surface corresponding to the height of the laser light irradiation position on the inspection object, and corresponds to the light collecting position output from the PSD. By calculating the output signal to be performed in the measurement / inspection unit, the height of the laser light irradiation position of the inspection object is calculated. Since the laser beam is scanned in the X-axis direction by rotating the polygon mirror, the printed circuit board area can be measured by moving the printed circuit board in the Y-axis direction in synchronization with the scanning. By reconstructing the height data of the inspection object, the outer shape of the inspection object on the printed circuit board is measured. In addition, after the area measurement, the printed circuit board is moved in the X-axis direction by the scanning length and the area measurement is repeatedly performed, thereby enabling measurement of the entire surface of the printed circuit board, and determining the quality of the outer shape of the measured inspection object. By doing so, inspection of the solder joint state of the mounted component on the printed circuit board is performed.

  Next, as a conventional technique of a laminography method using X-rays, for example, it is disclosed in Japanese Patent Laid-Open No. 5-157708, and will be described with reference to FIGS. As shown in FIG. 12, the inspection apparatus includes an X-ray source, an X-ray II (Image Intensifier) camera that converts X-rays into visible light and forms an image, a θ stage that rotates the X-ray II camera along the Z-axis, It comprises an XYZ stage that moves the printed circuit board in the XYZ directions, a θ stage that rotates along the Z axis, and a measurement / inspection unit. Here, the rotation center of the X-ray II camera coincides with the center of the light receiving surface.

  X-rays emitted from the X-ray source are incident on the printed circuit board and the light-receiving surface of the X-ray II camera from an oblique direction (45 degrees), and the light emitting point of the X-ray source and the light-receiving surface of the X-ray II camera. The printed circuit board and the XYZθ stage are arranged so that the line connecting the centers of the two and the rotation axis of the printed circuit board intersect at an angle of 45 degrees. Is transmitted in an oblique direction, and the transmitted X-ray is detected by an X-ray II camera, whereby an X-ray transmission image of the printed circuit board is taken. At that time, the printed circuit board and the X-ray II camera are synchronized and rotated with the same rotation direction and rotation angle, so that the line connecting the light emitting point of the X-ray source and the center of the light receiving surface of the X-ray II camera, The tomographic information on the XY plane that intersects the intersection with the rotation axis of the substrate always forms an image at the same position of the X-ray II camera, as shown in FIG.

Therefore, since the tomographic information of the Z-axis coordinate different from the XY plane always forms an image at a different position during one rotation, the X-ray transmission image is accumulated during the rotation, so that the intersection position, that is, The tomographic information on the XY plane at the intersection of the line connecting the light emitting point of the X-ray source and the center of the light receiving surface of the X-ray II camera and the rotation axis of the printed circuit board is emphasized, and the tomographic information on the other planes is blurred. Using the tomographic shape extracted by image processing of the image, the mounting state of the mounted components on the printed circuit board is inspected, and the printed circuit board is moved in the Z direction. Further, the tomographic inspection at different heights can be performed in the XY directions, and the entire surface of the printed circuit board can be inspected.
JP-A-5-149733

  However, in the triangulation method using laser light, which is a conventional measurement method, the inclination of the solder part from the mounting component to the printed board, such as the solder joint on the printed board, is inspected with respect to the printed board. When the surface has a steep inclination from 45 degrees to 90 degrees and the surface is a metallic glossy surface, as shown in FIG. 11, most of the laser light irradiated to the position of a that is a steep inclined surface. , Reflected in the direction of b on the printed circuit board, not in the direction of PSD. Therefore, the amount of laser reflected light incident on the PSD from the position b to the position (2) on the PSD is larger than the amount of laser reflected light at the position (1) incident on the PSD from the position a. Therefore, when the height of the inspection object is calculated from the output signal of the PSD, the reflected laser beam is incident on the PSD from a position c lower than the position a where the laser light is irradiated and lower than the printed circuit board surface. The measured height data has the same value, and causes a measurement error corresponding to | c−a |, which is the absolute value of the difference between the heights a and c.

  Therefore, it is difficult to measure the outer shape with high accuracy in a region having a particularly steep inclination angle of the solder joint, that is, the angle between the tangent at the solder joint of the incident beam in the vertical direction of the laser beam and the horizontal plane. When the angle becomes steep from 45 degrees to 90 degrees, it has been difficult to calculate the height using a laser beam.

  In the laminography method, which is a measurement technique using X-rays, as shown in FIG. 14, for example, when tomographic measurement is performed near the lower end or upper end of an inspection object having a low X-ray transmittance such as a solder ball. As shown in FIG. 15, when a tomographic image is generated by accumulating X-ray transmission images, a shadow-like virtual image called an artifact is generated around the original tomographic shape. That is, X-ray transmission images (a), (b), (c), and (d) are accumulated to generate tomographic images, and these generated tomographic images are reconstructed into three-dimensional images to obtain YZ. A cross-sectional image that is a cut surface in a plane is obtained. Then, as shown in FIG. 16, the artifact is a cross-sectional image that is a cut surface in the YZ plane of the inspection target (the cross-sectional image is obtained from a reconstructed image of the tomographic image). In a tomographic image that is generated in a hatched area surrounded by X-rays passing through the boundary of the inspection object and is a cut surface in the XY plane of the inspection object, it is an area that originally has no inspection object. Since it occurs or occurs in the periphery of the original shape of the inspection object, there is a problem that the tomographic outline of the detected inspection object is blurred and it is difficult to measure a highly accurate outer shape .

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a mounting board inspection apparatus capable of inspecting a solder joint state of a mounting component on a printed board with high accuracy.

  In order to solve the above-described conventional problems, the mounting board inspection apparatus of the present invention includes a laser measurement unit that obtains height data of an inspection object on an inspection board by laser triangulation, and irradiates the board with X-rays. An X-ray measurement unit that calculates a cross-sectional shape of the inspection object from a photographed X-ray transmission image and measures height data, and an outer shape of the inspection object from the height data measured by the laser measurement unit An inclination angle of the shape is calculated, and the inspection object is selectively switched between height data measured by the laser measurement unit and height data measured by the X-ray measurement unit based on the calculated inclination angle. It is characterized by measuring objects.

  The mounting board inspection apparatus of the present invention also inspects the laser light by irradiating laser light while scanning in the X-axis direction from the Z-axis direction that is perpendicular to the inspection board on which the inspection object is mounted. Laser measurement unit based on the principle of triangulation that collects the reflected light from the object on the light receiving surface of the position detection element and measures the height data of the inspection object on the inspection board by the output signal from the position detection element X-rays having a predetermined divergence angle penetrating the inspection object on the inspection substrate in the Z-axis direction are photographed when the inspection substrate linearly moves in the Y-axis direction in the X-ray optical path. An X-ray measurement unit that calculates the cross-sectional shape of the inspection object using a line transmission image and measures height data, and an inclination angle of the outer shape of the inspection object from the height data measured in the laser measurement unit And an inclination angle extracting means for calculating Based on the tilt angle calculated by the tilt angle extracting means, the height measurement data measured by the laser measurement unit and the height data measured by the X-ray measurement unit are selectively switched to select the inspection object. It is characterized by inspection.

  According to the mounting board inspection apparatus of the present invention, in the outer shape data in the laser measurement unit, the measurement accuracy deteriorates, for example, an inspection region having a steep inclination angle such as a solder joint is measured in the X-ray measurement unit. By replacing the outer shape data, it is possible to measure the outer shape with high accuracy for inspection objects having various shapes, and there is a solder joint on the back side of the component such as BGA / CSP. For solder joints that are difficult to be visually inspected after mounting, it is possible to inspect the presence / absence of solder, a short circuit, an insufficient amount of solder, and the like from an X-ray transmission image taken by the X-ray measurement unit. Accordingly, it is possible to provide a mounting board inspection apparatus with high inspection accuracy for the solder joint state of all the mounting components on the printed board.

Embodiments of a mounting board inspection apparatus according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 shows a configuration of a mounting board inspection apparatus that combines a triangulation method using laser light and a CT method X-ray measurement method using X-rays in the first embodiment of the present invention.

  In FIG. 1, the laser light emitted from the laser unit 1 is deflected by the polygon mirror 2, passes through the fθ lens group 3, is deflected by the mirror 4, and then the printed circuit board 6 on which the inspection object 5 is mounted. Irradiate from vertically above to focus on the top. The irradiated laser light is reflected by the inspection object 5 on the printed circuit board 6, deflected again by the mirror 4, then enters the condenser lens group 7, and the print of the inspection object 5 irradiated with the laser light is printed. Corresponding to the height from the substrate 6, the light is condensed on the light receiving surface of the PSD 8, and a signal corresponding to the light condensing position is output to the measurement / inspection unit 9. By using the height calculation using the printed circuit board 6, the height of the laser light irradiation position of the inspection object 5 from the printed circuit board 6 is measured using the printed circuit board 6 as a reference height.

  Further, by rotating the polygon mirror 2, the laser light is scanned about 30 mm per line in the X-axis direction, and during that time, the number of data of 1500 points, that is, image data is acquired with a resolution of 20 μm. Next, after scanning 30 mm per line in the X-axis direction, the printed circuit board is sequentially moved in the Y-axis direction by a resolution of 20 μm, scanning for the next line is performed, and printing is performed by repeating this. By measuring the area of 30 mm width on the substrate and reconstructing the measured height data of the inspection object, the outer shape of the inspection object on the printed circuit board is measured. Further, after the area measurement, the entire surface of the printed board can be measured by moving the printed board in the X-axis direction by a distance corresponding to a scanning length of 30 mm and repeating the area measurement.

  In addition, by calculating a difference in height data between adjacent measurement pixels and performing calculation using the inter-pixel distance d corresponding to the above-described resolution, an inclination angle that is an inclination of the inspection target can be obtained. However, under the measurement conditions described above, the inter-pixel distance d is calculated using a value with a resolution of 20 μm. However, the number of measurement data during scanning with laser light is variable. For example, when measuring 3000 points, the resolution is It is assumed that the calculation is performed with the inter-pixel distance d being 10 μm.

  Regarding X-ray measurement, an X-ray source 10 is arranged on one side of the printed circuit board 6, and the inspection object 5 on the printed circuit board 6 is irradiated with X-rays to transmit an X-ray transmission image to the X-ray detector 11 and the measurement / inspection unit. 9 through.

Next, a method of calculating the tilt angle will be described with reference to FIG. The arithmetic processing is performed by the measurement / inspection unit 9. In FIG. 2, using the laser measurement unit, the height data P (x, y) measured at the pixel position (x, y) on the printed circuit board and the pixel position adjacent in the Y-axis direction were measured. The height difference data S (x, y) is calculated using the height data with the height data P (x, y-1). That is, S (x, y) = P (x, y) −P (x, y−1) is calculated. Then, the inclination angle α (x, y) is calculated from α (x, y) = tan ⁻¹ (S (x, y) / d) using the calculated height difference data S (x, y). Can do.

As described above, as shown in FIG. 2, from the height data P (x, y) measured by the laser measurement unit, the height difference data S (x, y) of pixels adjacent in the Y-axis direction at the interval d. ) Is calculated. Next, the inclination angle α (x, y) can be calculated using the calculated height difference data S (x, y). From the outer shape data (height data) of FIG. By calculating the height difference data of 2 (b), the inclination angle data of FIG. 2 (c) can be obtained. Triangulation method using laser light for the outer shape data at the coordinate position where the calculated inclination angle α (x, y) satisfies the condition of 45 ° ≦ α (x, y) ≦ 90 ° Then, since measurement accuracy deteriorates, high-accuracy outer shape measurement can be performed by replacing with outer shape data measured by an X-ray measurement method described later.
Note that the inclination angle is calculated by obtaining an average of a plurality of inclination angles of about 2 to 10 for each pixel, thereby eliminating the influence of noise components.

  That is, the inclination angle of the solder portion of the mounted component on the printed circuit board 6 that is the inspection object 5 is calculated by the measurement / inspection unit 9, and when the inclination is a steep inclination of 45 degrees or more, the outer shape measured by the X-ray measurement method The shape data is selected by a selection means (not shown) in the measurement / inspection unit 9.

Next, an X-ray measurement method will be described with reference to FIGS.
When measuring the height of the printed board using the laser beam, as shown in FIG. 4, the printed board is a cone beam-shaped X-ray optical path emitted from the X-ray source with a divergence angle of, for example, 120 degrees in the Z-axis direction. The X-ray transmission image of the printed circuit board is taken at a plurality of arbitrary Y coordinate positions. That is, the height data is obtained by obtaining the transmission image data of the mounted component by X-rays irradiated from any angle direction from 30 degrees to 150 degrees on the printed circuit board on which the measurement object is mounted from the Y axis to the Z axis direction. Can be extracted.

  Next, the luminance distribution of the emitted light of the X-ray source detected by the X-ray detector in the absence of the printed circuit board usually has a luminance distribution that is high at the center of the detector and low at the periphery. When CT reconstruction is performed using X-ray transmission image data including the luminance distribution information, the cross-sectional image is calculated as if there is an object in the peripheral portion where the luminance decreases, and the cross-section is different from the actual cross-sectional shape. Since the image is calculated, it is necessary to perform correction so that the luminance level of the photographed X-ray transmission image becomes uniform within the screen. Therefore, an X-ray transmission image is captured in advance without a printed circuit board, and the luminance distribution in the screen of the captured X-ray transmission image is made uniform by performing offset correction and coefficient calculation. A correction table is created for each pixel, and brightness correction is performed by calculating using the correction table for each pixel of the X-ray transmission image of the printed circuit board to be photographed.

Next, as shown in FIG. 4, for example, X-ray light transmitted at an angle of 30 degrees with respect to the printed circuit board is irradiated on the coordinate Y (30 °) of the X-ray detector. The data of each pixel in the Y direction of the line transmissive image is an image formed by irradiating the X-ray light transmitted through the printed board in the range of 30 to 150 degrees onto the X-ray detector. as shown, printed circuit board extracts the Y-axis only same Y coordinate data of the X-ray image to be taken when moving from Y _-m to Y _m, as shown in FIG. 5b, the horizontal axis By arranging image data in the X-axis direction of the X-ray transmission image so as to correspond to the position of the Y-axis when the X-ray transmission image of the printed board is taken, parallel X-ray light is printed as shown in FIG. X-ray transmission image obtained by irradiating the substrate and rotating it within the angle range of 30 to 150 degrees A corresponding image is obtained. In the actual X-ray measurement method, the measurement is performed by moving the inspection object in the Y-axis direction. For convenience of explanation, as shown in FIG. The description will be given on the assumption that the line detector is moved and measured.

  The X-ray source irradiates the object to be inspected at an angle range of 30 to 150 degrees by rotating the X-ray source every 0.5 degrees or every other degree, and the X-ray detector detects X from each direction of the object to be inspected. A line-transmission image was taken, and the CT reconstruction algorithm (written by Saito Tsuneo, Algorithm Series 2 “Image Processing Algorithm”, Item 6, Item 8, Modern Science, 1993, using the imaged X-ray transmission image. ), A cross-sectional image of the printed circuit board is calculated, and the calculated cross-sectional image is subjected to image processing such as binarization and edge extraction, so that the outer shape of the inspection object on the printed circuit board is obtained. Desired.

  However, when X-ray measurement is performed in the angle range, X-rays from the X-ray source are not detected in the angle range of 0 to 30 degrees and 150 to 180 degrees with respect to the Y axis of the inspection object. Since the X-ray transmission image is not captured and the X-ray transmission image is not taken, image data for performing the CT reconstruction calculation is lost, and as shown in FIG. Artifacts in the area of the upper and lower boundaries of the cross-sectional image in the Z-axis direction and the hatched area surrounded by the angles of 0 to 30 degrees and 150 degrees to 180 degrees where data is missing, which is the cut surface in the Z plane As shown in the tomographic image which is the cut surface in the XY plane of the inspection object, the outline of the original cross-sectional shape of the inspection object is blurred, so that it is difficult to measure the cross-sectional shape with high accuracy. X-ray transmission image is taken from 30 degrees to 150 degrees In time range, the artifact does not occur, the contour of the cross section is clearly detected, thereby enabling highly accurate sectional shape measurement.

  Next, a method for removing a region where measurement accuracy deteriorates that occurs in the laser measurement method will be described with reference to FIG. For example, when the inspection target is a solder joint of a mounting component, the outer shape of the solder joint changes abruptly at the boundary between the electrode portion of the mounting component and the solder joint, which is generally parallel to the horizontal plane. As described above, when the inclination angle data obtained from the height data described above in the laser measurement method is 45 degrees or more, the height of the mounted component cannot be accurately measured (see FIG. 11).

  If the inclination of the laser beam irradiation position of the solder joint becomes 45 degrees or more with respect to the flat XY plane as the zero degree reference, the height data of the mounted component cannot be accurately measured as described with reference to FIG. Therefore, when the tilt angle data is 45 degrees or more, it is possible to select the outer shape data measured by the X-ray measurement method and replace it with the height data measured by the laser measurement method to obtain a highly accurate outer shape. Shape measurement is possible.

  Next, the configuration of the mounting board inspection apparatus will be described with reference to FIGS.

  In the laser measurement unit, after performing laser measurement using the principle of the triangulation method, the output signal from the PSD 8 as the position detection element is calculated in the measurement inspection unit 9 to calculate the height data of the inspection object, The height data is stored in a storage means (not shown), and the stored height data is subjected to data processing such as data correction and coordinate conversion by the measurement / inspection unit 9 to be inspected by the laser measuring unit. The external shape data of the object is obtained. Further, from the obtained outer shape data, the measurement / inspection unit 9 performs angle calculation using the adjacent coordinate height data and the inter-coordinate distance, and extracts the inclination angle for each coordinate. The calculation of the height data and the inclination angle are performed in the measurement / inspection unit 9.

  Next, in the X-ray measurement unit, the inspection object 5 is irradiated with cone beam X-rays, and the X-ray transmission image captured by the X-ray detector 11 is corrected for luminance distribution by the measurement / inspection unit 9, and After performing coordinate correction, etc., it is stored in a storage means (not shown). Then, in the measurement / inspection unit 9, a tomographic image of the inspection object 5 is reconstructed using a known CT reconstruction algorithm, and the calculated reconstructed image is subjected to image processing such as edge extraction. After calculating the outer shape data of the object 5, the outer shape data is stored in a storage means (not shown), and the stored outer shape data is subjected to data processing such as data correction and coordinate conversion. External shape data of the inspection object 5 by the X-ray measurement unit is obtained.

  Next, as described above with reference to FIG. 8, in the outer shape data obtained by the laser measurement unit using the tilt angle data calculated by the laser measurement unit, 45 degrees to 90 degrees with respect to the Y axis. Since the measurement accuracy is deteriorated for the data having the inclination angle, the external shape data obtained by the X-ray measuring unit is selected by the data selecting means for the coordinate data having the angle range, and the external shape data is selected. By synthesizing the shape data, it is possible to measure the outer shape data with high accuracy even for a measurement object having various inclination angles.

  The storage means for storing the height data, the storage means for storing the external shape data, and the data read from these storage means are selected by the data selection means according to the inclination angle extracted by the inclination angle extraction means. Then, the data is selectively selected, and the composite data is obtained and stored in the composite data storage means. Then, the measurement data is inspected and the result is displayed to realize a mounting board measuring apparatus having a high inspection system. The storage means, selection means, other processing means, and the like are built in the measurement / inspection unit 9, but may be configured separately. Moreover, although these means are comprised with a semiconductor element, processes, such as selection and a synthesis | combination, can be processed by software.

  As described above, the mounted component image is measured using the laser measurement unit and the X-ray measurement unit, and the mounted state is measured with high accuracy using the image data. The state of the solder and the state such as the mounting position are inspected by comparing with reference data stored in the measurement / inspection unit 9. In other words, by comparing the measurement data measured with high precision with the reference external shape data and parts information, etc., and performing the inspection, and displaying the result, it is possible to supply a mounting board inspection apparatus with high inspection accuracy. Become.

  Here, in selecting the external shape data in the mounting board inspection apparatus of the present invention, the use of the inclination angle data calculated by the laser measurement unit is not limited, and an arbitrary region of the inspection object is previously determined. By setting the external shape data of the X-ray measurement unit to be selected, the external shape data can be synthesized at high speed without performing the tilt angle calculation process.

1 is a configuration diagram of a mounting board inspection apparatus according to a first embodiment of the present invention. The figure which shows the height data and inclination-angle data by the laser measurement method of the mounting board inspection apparatus in Example 1 of this invention. The figure for demonstrating the inclination angle data calculation method by the laser measurement method of the mounting board inspection apparatus in Example 1 of this invention The figure for demonstrating the X-ray irradiation angle to the printed circuit board in the X-ray measurement part of the mounting board inspection apparatus in Example 1 of this invention. The figure for demonstrating the image extraction of the X-ray transmission image in the X-ray measurement part of the mounting board inspection apparatus in Example 1 of this invention. The figure for demonstrating typically the measurement in the X-ray-measurement part of the mounting board inspection apparatus in Example 1 of this invention. The figure for demonstrating the artifact generation | occurrence | production in the X-ray measurement part of the mounting board inspection apparatus in Example 1 of this invention. The figure for demonstrating selection of the external shape data of the mounting board inspection apparatus in Example 1 of this invention The block diagram of the mounting board inspection apparatus in Example 1 of this invention Configuration of conventional triangulation system mounting board inspection equipment using laser light The figure for demonstrating the measurement precision deterioration of the mounting board inspection apparatus by the triangulation method using the conventional laser beam Configuration diagram of a mounting board inspection device using a conventional laminography method using X-rays The figure for demonstrating the calculation method of the tomographic image in the mounting board inspection apparatus of the laminography system using the conventional X-ray The figure for demonstrating the measurement conditions which the artifact generate | occur | produces in the mounting board inspection apparatus of the laminography system using the conventional X-ray The figure for demonstrating generation | occurrence | production of the artifact in the mounting board inspection apparatus of the laminography system using the conventional X-ray. The figure for demonstrating the artifact which generate | occur | produces in the vicinity of the test object in the mounting board inspection apparatus of the laminography system using the conventional X-ray.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser unit 2 Polygon mirror 3 f (theta) lens group 4 Mirror 5 Inspection object 6 Printed circuit board 7 Condensing lens group 8 PSD (position detection element)
9 Measurement and inspection unit 10 X-ray source 11 X-ray detector

Claims (9)

A mounting board inspection apparatus comprising: a laser measurement unit that obtains height data of an inspection object on an inspection board by laser triangulation; and the inspection object from an X-ray transmission image photographed by irradiating the substrate with X-rays An X-ray measuring unit that calculates the height data by calculating the cross-sectional shape of the object,
The inclination angle of the outer shape of the inspection object is calculated from the height data measured in the laser measurement unit, and the height data measured in the laser measurement unit based on the calculated inclination angle and the X-ray measurement unit A mounting board inspection apparatus, wherein the inspection object is measured by selectively switching the height data measured in step (1).   The X-ray measurement unit uses an X-ray transmission image captured by irradiating X-rays in an irradiation angle range of 30 degrees to 150 degrees with respect to the Y axis that is the moving direction of the inspection object. The mounting board inspection apparatus according to claim 1, wherein a cross-sectional shape is calculated. A mounting board inspection apparatus, wherein a laser beam is irradiated while scanning in the X-axis direction from a Z-axis direction that is perpendicular to an inspection board on which an inspection object is mounted. A laser measurement unit based on the principle of triangulation that collects the reflected light on the light-receiving surface of the position detection element and measures the height data of the inspection object on the inspection substrate from the output signal from the position detection element; An X-ray transmission image taken when X-rays having a predetermined divergence angle penetrating the inspection object on the inspection substrate in the Z-axis direction are taken and the inspection substrate linearly moves in the Y-axis direction in the X-ray optical path. The X-ray measurement unit that calculates the cross-sectional shape of the inspection object using the sensor and measures height data, and the inclination angle of the outer shape of the inspection object is calculated from the height data measured by the laser measurement unit An inclination angle extracting means,
Based on the tilt angle calculated by the tilt angle extracting means, the height measurement data measured by the laser measurement unit and the height data measured by the X-ray measurement unit are selectively switched to select the inspection object. A mounting board inspection apparatus characterized by inspecting. X-rays having a predetermined divergence angle penetrating the inspection object in the Z-axis direction of the X-ray measuring unit are irradiated in an irradiation angle range of 30 to 150 degrees with respect to the Y-axis that is the moving direction of the inspection object. The mounting board inspection apparatus according to claim 3, wherein a cross-sectional shape of the inspection object is calculated using an X-ray transmission image photographed in this manner. 5. The mounting board inspection apparatus according to claim 4, wherein the predetermined spread angle of the X-ray from the X-ray source is a cone beam shape of 120 degrees in the Z-axis direction from the X-ray source. The mounting board inspection apparatus according to claim 3, wherein when the inclination angle of the inclined portion of the inspection object is 45 degrees to 90 degrees, the height data from the X-ray measurement section is selected. The mounting substrate apparatus according to claim 3, wherein the inclination angle extraction unit of the inclined portion of the inspection object by the laser measurement unit calculates using a difference in height data between adjacent measurement pixels. The tilt angle extraction means sets the distance between the measurement pixels adjacent in the Y-axis direction as d, the measured pixel height data as P (x, y−1), P (x, y), and Y When the inclination angle between pixels adjacent in the axial direction is α (x, y),
α (x, y) = tan ⁻¹ (P (x, y) −P (x, y−1)) / d
The mounting board inspection apparatus according to claim 7, wherein the extraction is performed by the following. The mounting substrate inspection apparatus according to claim 8, wherein a distance d between the adjacent measurement pixels is 10 μm or 20 μm.

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