JP2006005053A5 - - Google Patents
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- Publication number
- JP2006005053A5 JP2006005053A5 JP2004178089A JP2004178089A JP2006005053A5 JP 2006005053 A5 JP2006005053 A5 JP 2006005053A5 JP 2004178089 A JP2004178089 A JP 2004178089A JP 2004178089 A JP2004178089 A JP 2004178089A JP 2006005053 A5 JP2006005053 A5 JP 2006005053A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004178089A JP4343777B2 (ja) | 2004-06-16 | 2004-06-16 | 電子部品内蔵ウエハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004178089A JP4343777B2 (ja) | 2004-06-16 | 2004-06-16 | 電子部品内蔵ウエハ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006005053A JP2006005053A (ja) | 2006-01-05 |
| JP2006005053A5 true JP2006005053A5 (ja) | 2007-05-24 |
| JP4343777B2 JP4343777B2 (ja) | 2009-10-14 |
Family
ID=35773185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004178089A Expired - Fee Related JP4343777B2 (ja) | 2004-06-16 | 2004-06-16 | 電子部品内蔵ウエハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4343777B2 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4512545B2 (ja) * | 2005-10-27 | 2010-07-28 | パナソニック株式会社 | 積層型半導体モジュール |
| JP5245209B2 (ja) * | 2006-04-24 | 2013-07-24 | ソニー株式会社 | 半導体装置及びその製造方法 |
| KR101086972B1 (ko) | 2009-10-01 | 2011-11-29 | 앰코 테크놀로지 코리아 주식회사 | 관통전극을 갖는 웨이퍼 레벨 패키지 및 그 제조 방법 |
| KR101341619B1 (ko) | 2011-12-27 | 2014-01-13 | 전자부품연구원 | 반도체 패키지 및 그의 제조 방법 |
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2004
- 2004-06-16 JP JP2004178089A patent/JP4343777B2/ja not_active Expired - Fee Related