JP2005529767A5 - - Google Patents

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Publication number
JP2005529767A5
JP2005529767A5 JP2004510966A JP2004510966A JP2005529767A5 JP 2005529767 A5 JP2005529767 A5 JP 2005529767A5 JP 2004510966 A JP2004510966 A JP 2004510966A JP 2004510966 A JP2004510966 A JP 2004510966A JP 2005529767 A5 JP2005529767 A5 JP 2005529767A5
Authority
JP
Japan
Prior art keywords
film
backing
substrate
adhesive layer
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004510966A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005529767A (ja
Filing date
Publication date
Priority claimed from US10/167,347 external-priority patent/US6872268B2/en
Application filed filed Critical
Publication of JP2005529767A publication Critical patent/JP2005529767A/ja
Publication of JP2005529767A5 publication Critical patent/JP2005529767A5/ja
Pending legal-status Critical Current

Links

JP2004510966A 2002-06-11 2003-05-09 真空を利用することによって接着フィルムを基材に形態適合させる方法 Pending JP2005529767A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/167,347 US6872268B2 (en) 2002-06-11 2002-06-11 Method of conforming an adherent film to a substrate by application of vacuum
PCT/US2003/015794 WO2003103853A1 (en) 2002-06-11 2003-05-09 Method of conforming an adherent film to a substrate by application of vacuum

Publications (2)

Publication Number Publication Date
JP2005529767A JP2005529767A (ja) 2005-10-06
JP2005529767A5 true JP2005529767A5 (https=) 2006-05-25

Family

ID=29710872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004510966A Pending JP2005529767A (ja) 2002-06-11 2003-05-09 真空を利用することによって接着フィルムを基材に形態適合させる方法

Country Status (11)

Country Link
US (1) US6872268B2 (https=)
EP (1) EP1511578B1 (https=)
JP (1) JP2005529767A (https=)
KR (1) KR20050012267A (https=)
CN (1) CN100384542C (https=)
AT (1) ATE414571T1 (https=)
AU (1) AU2003231793A1 (https=)
CA (1) CA2488732A1 (https=)
DE (1) DE60324791D1 (https=)
TW (1) TWI277515B (https=)
WO (1) WO2003103853A1 (https=)

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CN103862668A (zh) * 2014-03-20 2014-06-18 山东齐鲁武峰塑料制品有限公司 复合pvc-0管的制备工艺
CN104486906B (zh) * 2014-12-10 2018-01-12 昆山峰实电子科技有限公司 一种模外电子贴膜及其制作方法
CN104845540A (zh) * 2015-05-15 2015-08-19 湖北三江航天江河化工科技有限公司 一种提高碳纤维/酚醛-丁腈橡胶材料粘接强度的方法
CN105670522A (zh) * 2016-04-22 2016-06-15 山西平阳重工机械有限责任公司 复杂薄壁隔仓密封粘结方法
CN107305832A (zh) * 2016-04-25 2017-10-31 中微半导体设备(上海)有限公司 一种半导体处理装置及处理基片的方法
US10967605B2 (en) * 2017-03-17 2021-04-06 The Boeing Company Decorative laminates having an open-cell foam layer
DE102018000754A1 (de) 2018-01-31 2019-08-01 Lohmann Gmbh & Co. Kg Klebebandlaminiereinrichtung zur blasenfreien Verbindung starrer Materialien
ES3042248T3 (en) * 2018-11-01 2025-11-19 Ppg Advanced Surface Tech Llc Method and apparatus for application of polymeric film and laminates to surfaces of articles
JP7425213B2 (ja) 2020-02-18 2024-01-30 エーエスエムエル ネザーランズ ビー．ブイ． 荷電粒子システムにおける流体移送システム
CN114536736B (zh) * 2022-02-19 2024-03-08 福建盈浩文化创意股份有限公司 一种可持久保持装饰画色彩度的装饰画用覆膜设备
KR102757681B1 (ko) * 2022-07-19 2025-01-21 박서준 진공을 활용한 방수시트의 부착장치
CN115946941B (zh) * 2023-02-03 2024-07-16 中国工程物理研究院材料研究所 一种胶带黏贴工具
US12564996B2 (en) * 2023-06-23 2026-03-03 Wtl Technology Shenzhen Co., Ltd. Integrated film application device
CN116533537B (zh) * 2023-07-06 2023-08-29 微网优联科技(成都)有限公司 一种用于摄像头模组的镜头的高精密连续贴膜装置及方法
CN116779524B (zh) * 2023-08-18 2023-11-14 天通控股股份有限公司 一种真空吸附贴蜡装置及方法
TWI879100B (zh) * 2023-09-19 2025-04-01 輝能科技股份有限公司 用於貼合複數膜的系統及使用其製備複合膜的方法
CN121510976A (zh) * 2026-01-08 2026-02-10 浙江创豪半导体有限公司 封装基板加工设备及封装基板

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