JP2005353641A - Method for mounting semiconductor part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor part for relocating each semiconductor chip at a prescribed position to a desired base without taking out of a substrate, or the like, and to provide a method for manufacturing the semiconductor part. <P>SOLUTION: The semiconductor part 20 in which at least one portion of a semiconductor chip 12 is in contact with a base 11 made of a first synthetic resin is injected toward a body 40 to be deposited in the state of a solid. The semiconductor part 20 flying in space to the body 40 to be deposited after injection is heated, the base 11 is liquefied partially or entirely, and the semiconductor part 20 in which the base 11 is liquefied partially or entirely is passed through the atmosphere of adhesive vapor. A method for mounting the semiconductor part 20 for depositing the semiconductor part 20 to the body 40 to be deposited is provided by using one portion or entirety of the liquefied base 11 in which adhesive vapor is deposited. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for mounting a semiconductor component.

  In general, a minute part such as a semiconductor chip is very difficult to handle because its size is as small as several tens of μm to several hundreds of μm. In recent years, semiconductor chips and the like tend to be further downsized, and it has been difficult to directly hold the semiconductor chips individually and align and arrange them on the substrate. So far, for example, Patent Document 1 has proposed a method of arranging minute semiconductor chips in a predetermined direction on a substrate without directly holding them individually.

  Further, Patent Document 2 proposes a supply device that supplies minute parts such as semiconductor chips to a predetermined position such as a substrate by aligning them in a predetermined direction.

  However, Patent Literature 1 and Patent Literature 2 do not disclose a method of rearranging individual semiconductor chips so as to be in a predetermined position with respect to a desired base material.

In order to rearrange the individual semiconductor chips on a desired base material, the operation of taking out the semiconductor chip from the substrate or the like and aligning and placing it on the base material again has to rely on human hands or robot arms. When the semiconductor chip is manually rearranged, the semiconductor chip may fall off and be damaged, so that the semiconductor chip must be handled with great care. In addition, when the robot arm is used, the arrangement speed becomes slow. As described above, when the conventional semiconductor chip is rearranged manually or by a robot arm, the productivity is lowered.
JP 2004-22846 A JP-A-11-186790

  The present invention has been made in view of the above circumstances, and enables semiconductor components to be rearranged so that individual semiconductor chips are located at predetermined positions with respect to a desired base material without being taken out from a substrate or the like. It aims at providing the attachment method of.

  In order to solve the above problems, the present invention injects a semiconductor component in which at least a part of a semiconductor chip is in contact with a base material made of a first synthetic resin toward the adherend in a solid state. Heat is applied to the semiconductor component that is in flight through the space to the adherend to liquefy part or all of the base material, and then part or all of the base material is liquefied. A semiconductor in which the semiconductor component is attached to the adherend using a part or the whole of the base material to which the semiconductor component is passed through the atmosphere of adhesive vapor to be liquefied and to which adhesive vapor is attached. Provide a method for mounting components.

  In this semiconductor component mounting method, a semiconductor component in which at least a part of a semiconductor chip is in contact with a base material made of a first synthetic resin is injected toward an adherend in a solid state, and after the injection, A semiconductor component in which a part or all of the base material is liquefied by applying heat to the semiconductor component in flight through the space leading to the body, and then liquefying part or all of the base material. Since the semiconductor component is attached to the adherend by using part or all of the base material that is passed through the atmosphere of adhesive vapor and liquefied and adhered to the adhesive vapor, a small semiconductor The operation | work which rearranges a chip | tip individually so that it may become a predetermined position with respect to a desired base material can be performed easily.

  In the semiconductor component mounting method, at least a part of the exposed portion of the semiconductor chip is coated with a coating material made of a second synthetic resin having a melting point lower than that of the first synthetic resin forming the base material. It is preferable.

  In this semiconductor component mounting method, at least a part of the exposed portion of the semiconductor chip is covered with a covering material made of a second synthetic resin having a melting point lower than that of the first synthetic resin forming the base material. Therefore, it is possible to prevent the semiconductor chip from falling off from the base material and being damaged in handling the semiconductor component.

  In the semiconductor component mounting method, the first synthetic resin and / or the second synthetic resin is preferably not liquefied in a storage temperature atmosphere.

  The storage temperature atmosphere in the present invention is an atmosphere in a temperature range in which the semiconductor component of the present invention is used, specifically, an atmosphere in a temperature range of 0 ° C to 60 ° C. If the first synthetic resin and / or the second synthetic resin are not liquefied in this storage temperature atmosphere, the semiconductor chip can be prevented from falling off the base material in handling the semiconductor component, and the semiconductor component It is possible to prevent the semiconductor component from moving after being rearranged at a predetermined position.

In the method for mounting a semiconductor component of the present invention, a semiconductor component in which at least a part of the semiconductor chip is in contact with the base material made of the first synthetic resin is injected toward the adherend in a solid state, and then injected. A semiconductor in which a part or all of the base material is liquefied after applying heat to the semiconductor component in flight in the space to the adherend to liquefy part or all of the base material The semiconductor component is attached to the adherend by using a part or all of the base material to which the component is passed through the atmosphere of the adhesive vapor and liquefied, and the adhesive vapor is adhered. It is possible to easily perform an operation of rearranging individual semiconductor chips individually so as to be in a predetermined position with respect to a desired substrate.
In addition, since at least a part of the exposed portion of the semiconductor chip is coated with a coating material made of a second synthetic resin having a lower melting point than the first synthetic resin that forms the base material, In this case, it is possible to prevent the semiconductor chip from dropping from the base material and being damaged. Furthermore, since the first synthetic resin and / or the second synthetic resin is not liquefied in the storage temperature atmosphere, it is possible to prevent the semiconductor chip from dropping from the base material during the handling of the semiconductor component, and to fix the semiconductor component to a predetermined level. It is possible to prevent the semiconductor component from moving after being rearranged at the position.

  Hereinafter, a semiconductor component mounting method embodying the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor component used in the semiconductor component mounting method according to the present invention.
The semiconductor component 10 is generally configured by a base material 11 and a semiconductor chip 12 disposed so that one surface 12 a thereof is in contact with the one surface 11 a of the base material 11.

  In the semiconductor component 10, the base material 11 is formed larger than the semiconductor chip 12 and has a shape like an edge of the semiconductor chip 12.

  Examples of the base material 11 include a synthetic resin substrate made of a first synthetic resin, a synthetic resin film, and a synthetic resin sheet. Examples of the first synthetic resin include a thermoplastic resin that does not liquefy in the storage temperature atmosphere (0 ° C. to 60 ° C.) of the semiconductor component 10. Furthermore, the thickness and width of the base material 11 are appropriately set according to the use of the semiconductor component 10 and the like.

 Examples of the semiconductor chip 12 include those having a size of several tens of μm to several hundreds of μm × several tens of μm to several hundreds of μm. Specifically, a micro RFID (Radio Frequency IDentification) chip capable of supporting all frequency bands from 13.56 MHz to 2.45 GHz having a size of 0.5 mm × 0.5 mm can be used.

FIG. 2 is a schematic cross-sectional view showing another example of a semiconductor component used in the semiconductor component mounting method according to the present invention.
In FIG. 2, the same components as those of the semiconductor component 10 shown in FIG.
The semiconductor component 20 of this embodiment differs from the semiconductor component 10 of the first embodiment in that the exposed portion of the semiconductor chip 12 (the side surface 12b and the other surface 12c in FIG. It is different in that it is covered.

 In addition, in the semiconductor component 30, although the whole surface of the one surface 11a of the base material 11 is covered with the coating | covering material 13, the semiconductor component of this invention is not limited to this. In the semiconductor component of the present invention, it is only necessary that at least a part of the exposed part of the semiconductor chip, that is, a part not in contact with the base material is covered with the coating material.

 Examples of the covering material 13 include a synthetic resin substrate made of a second synthetic resin, a synthetic resin film, and a synthetic resin sheet. Examples of the second synthetic resin include a thermoplastic resin having a melting point lower than that of the substrate 11. Furthermore, the second synthetic resin is preferably a thermoplastic resin that does not liquefy in the storage temperature atmosphere (0 ° C. to 60 ° C.) of the semiconductor component 10. In addition, the thickness and width of the base material 13 are appropriately set according to the size of the semiconductor chip 12 and the like.

 In the present invention, either the first synthetic resin constituting the base material or the second synthetic resin constituting the covering material, or the first synthetic resin or covering material constituting the base material. It is sufficient that both the two synthetic resins are not liquefied in the storage temperature atmosphere.

Next, with reference to FIG. 3, a method for mounting a semiconductor component according to the present invention will be described.
FIG. 3 is a schematic view showing an embodiment of a semiconductor component mounting method according to the present invention.
In this embodiment, a method for attaching the semiconductor component 20 shown in FIG. 2 will be described.

  In the semiconductor component mounting method of this embodiment, first, as shown in FIG. 3A, the semiconductor component 20 is placed in a semiconductor component injection nozzle 30 provided in a semiconductor component mounting apparatus (not shown). Load it. The method of loading the semiconductor component 20 into the injection nozzle 30 is not particularly limited. For example, the method of loading the individually diced semiconductor component 20 into the injection nozzle 30 and the semiconductor component 20 are long in length. For example, a method of individually dicing a long tape-like material connected in a number of directions in the injection nozzle 30 may be used. In the method of individually dicing a long tape-shaped object in the injection nozzle 30, the semiconductor component 20 is injected from the injection nozzle 30 each time the semiconductor component 20 is individually diced.

  Here, before injecting the semiconductor component 20, the injection port 30 a of the injection nozzle 30 is arranged at a distance from the surface (attachment surface) 40 a of the adherend 40.

  Subsequently, as shown in FIG. 3B, air is introduced into the injection nozzle 30 from the rear side of the semiconductor component 20 and from the side opposite to the injection direction (the side opposite to the injection port 30 a of the injection nozzle 30). Compressed gas such as inert gas is fed to inject the semiconductor component 20 toward the adherend surface 40a of the adherend 40 in a solid state.

  Then, while flying through the space that is injected from the injection port 30 a and reaches the adherend surface 40 a of the adherend 40, heat is indirectly applied to the semiconductor component 20, and a part or all of the base material 11 of the semiconductor component 20. Liquefy. Here, liquefying a part or the whole of the base material 11 of the semiconductor component 20 applies heat at a temperature equal to or higher than the melting point of the first synthetic resin forming the base material 11 so that the semiconductor chip 12 is not destroyed. Refers to softening or melting. Since the covering material 13 is made of a material having a lower melting point than the material forming the base material 11, the covering material 13 is also liquefied when the base material 11 is liquefied.

  In addition, as a method of indirectly applying heat to the semiconductor component 20 while flying through the space to the adherend surface 40a of the adherend 40, a method of blowing hot air to the semiconductor component 20, or bringing the semiconductor component 20 to a predetermined temperature. Examples thereof include a method of passing through a set atmosphere and a method of irradiating the semiconductor component 20 with infrared rays.

  Subsequently, the semiconductor component 20 in which a part or all of the substrate 11 is liquefied is passed through the atmosphere 35 of the adhesive vapor, and the adhesive vapor is applied to a part or all of the substrate of the semiconductor component 20. Adhere.

  Here, as the adhesive vapor, a solvent that is compatible with any one of vaporized adhesive, a synthetic resin that forms the base material 11 of the semiconductor component 20, or a synthetic resin that forms the covering material 13, or a semiconductor. What vaporized the solvent compatible with both the synthetic resin which comprises the base material 11 of the components 20, and the synthetic resin which comprises the coating | covering material 13 is used.

Subsequently, as shown in FIG. 3C, when the semiconductor component 20 reaches the adherend surface 40a of the adherend 40, it is liquefied and partly or entirely of the base material 11 to which adhesive vapor is attached. The semiconductor component 20 is attached to the adherend surface 40a of the adherend 40.
In this state, when the adhesive is cured or the surface 11 is dissolved by the solvent to solidify the substrate 11 exhibiting tackiness, the semiconductor component 20 is fixed to the adherend surface 40a of the adherend 40. .

  In this embodiment, the semiconductor component 20 in which the semiconductor chip 12 is surrounded by the base material 11 and the covering material 13 made of synthetic resin is injected toward the adherend 40 in a solid state, and after being injected, the adherend 40 is injected. After heat is applied to the semiconductor component 20 in flight in the space up to liquefy part or all of the substrate 11, the semiconductor component 20 liquefied part or all of the substrate 11 is bonded. Since the semiconductor component 20 is attached to the adherend 40 using a part or the whole of the base material 11 which is passed through the atmosphere 35 of the characteristic vapor and liquefied and adhered with the adhesive vapor, the minute amount is small. The operation | work which rearranges a semiconductor chip separately so that it may become a predetermined position with respect to a desired base material can be performed easily.

  The semiconductor component mounting method of the present invention is also applicable to minute components other than semiconductor chips. That is, by applying the present invention to a minute part having a size equivalent to that of a semiconductor chip, handling by a human can be facilitated. Further, the semiconductor component mounting method of the present invention can also be applied to an ink jet printing method.

It is a schematic sectional drawing which shows an example of the semiconductor component used with the attachment method of the semiconductor component which concerns on this invention. It is a schematic sectional drawing which shows the other example of the semiconductor component used with the attachment method of the semiconductor component which concerns on this invention. It is a schematic diagram which shows one Embodiment of the attachment method of the semiconductor component which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,20 ... Semiconductor component, 11 ... Base material, 12 ... Semiconductor chip, 13 ... Covering material, 30 ... Injection nozzle, 30a ... Injection port, 35 ... Adhesion Sexual vapor atmosphere, 40 ... adherend.

Claims (3)

  A semiconductor component in which at least a part of the semiconductor chip is in contact with the base material made of the first synthetic resin is injected toward the adherend in a solid state, and is flying in the space from the injection to the adherend After heat is applied to the semiconductor component in part to liquefy part or all of the base material, the semiconductor part in which part or all of the base material is liquefied is passed through an adhesive vapor atmosphere. And attaching the semiconductor component to the adherend using a part or all of the base material to which the liquefied and adhesive vapor is adhered.   The at least part of the exposed portion of the semiconductor chip is covered with a covering material made of a second synthetic resin having a melting point lower than that of the first synthetic resin forming the base material. Item 2. A method for mounting a semiconductor component according to Item 1. 3. The method of mounting a semiconductor component according to claim 1, wherein the first synthetic resin and / or the second synthetic resin is not liquefied in a storage temperature atmosphere.

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