JP2005349448A - Ultrasonic joining method and ultrasonic joining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic joining method and an ultrasonic joining device for realizing the ultrasonic joining with high reliability and omitting strict inspection. <P>SOLUTION: In the ultrasonic joining method for performing the ultrasonic joining of a plurality of members between different members for each spot, information on physical characteristics and information on ultrasonic joining of materials to constitute each member are acquired (S1), the ultrasonic joining at the first spot is performed on the basis of information on ultrasonic joining (S2), the optimum position of the second spot not to provide the stress over the reference value of the joining strength predetermined for the first spot during the ultrasonic joining is calculated (S3), and the ultrasonic joining at the second spot is performed at the optimum position on the basis of information on ultrasonic welding (S4). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  An object of the present invention is to provide an ultrasonic bonding method and apparatus capable of calculating a second hit point position where stress is hardly applied to the first hit point.

  In recent years, in response to growing environmental awareness, there is a movement to shift the power source of automobiles from an engine using fossil fuel to a motor using electric energy. For this reason, the technology of the battery that serves as a power source for the motor is also rapidly developing.

  An automobile is desired to be mounted with a battery that is small and light and can be charged and discharged with a large amount of electric power and has excellent vibration resistance and heat dissipation. In response to this demand, in recent years, an assembled battery in which a number of flat unit cells are connected in series has been developed.

When manufacturing an assembled battery, in order to improve productivity, it is desirable to perform joining of single cells by welding as shown, for example, in Patent Document 1 below. However, in the case of a flat unit cell, the heat capacity of the unit cell is small, and the unit cell structure itself does not have sufficient heat resistance. As shown in FIG. 1, the cells are joined together using ultrasonic joining that can be welded without increasing the temperature.
JP 2002-141051 A JP 2002-96180 A

  However, in order to join a plurality of members, when ultrasonic joining is performed between different members for each striking point, even if the joining strength of the first striking point satisfies the joining strength reference value, When the vibration at the time of sonic bonding is applied to the first hit point, a stress is applied to the first hit point, and this stress may reduce the bonding strength of the first hit point.

  For batteries mounted on vehicles that are subject to large vibrations during traveling, such as automobiles, poor bonding strength can cause subsequent failures, so a strict inspection (100% inspection) is performed during the inspection process. Such a battery is not installed.

  The present invention calculates the second hit point position where stress is difficult to be applied to the first hit point, and ultrasonically joins the position so that highly reliable ultrasonic bonding can be performed, and strict inspection is omitted. It is an object of the present invention to provide an ultrasonic bonding method and apparatus capable of performing the same.

  In order to achieve the above object, an ultrasonic bonding method according to the present invention is an ultrasonic bonding method for ultrasonically bonding a plurality of members with different members for each hit point. Obtaining the characteristic information and the ultrasonic bonding information; performing the ultrasonic bonding of the first hitting point based on the ultrasonic bonding information; and the first hitting point during the ultrasonic bonding based on the physical property information of the material. Calculating an optimal position of the second hit point that does not give a stress greater than a predetermined bond strength reference value, and performing ultrasonic bonding of the second hit point at the optimal position based on the ultrasonic bonding information It is characterized by including these.

  According to the above procedure, the position of the second hit point is a position that does not apply a stress greater than the bonding strength reference value to the first hit point. Therefore, it is possible to join the second hit point while suppressing adverse effects on the first hit point. it can.

  In addition, an ultrasonic bonding apparatus according to the present invention for achieving the above object is an ultrasonic bonding apparatus that ultrasonically bonds a plurality of members with different members for each hitting point, and the physical properties of the materials constituting each member A database for storing characteristic information and ultrasonic bonding information; a first hit point position is calculated based on the ultrasonic bond information; and the first hit point is determined in advance during ultrasonic bonding based on physical property information of the material. A striking point position calculating means for calculating an optimal second striking point position that does not give a stress equal to or greater than the bond strength reference value, a positioning means for positioning the member at the calculated first striking point position and the second striking point position, And ultrasonic bonding means for ultrasonically bonding the first hit point position and the second hit point position based on ultrasonic bonding information.

  From the above configuration, the hit point position calculating means calculates a position that does not apply a stress higher than the bonding strength reference value to the first hit point as the position of the second hit point, so that the ultrasonic bonding means adversely affects the first hit point. The second spot can be joined while suppressing the above.

  In the present invention having the above-described configuration, the position where no stress greater than the bonding strength reference value is applied to the first hitting point can be set as the second hitting point, which enables highly reliable ultrasonic bonding. Strict inspection can be omitted and production efficiency is improved.

  The details of the operation of the ultrasonic bonding method and apparatus according to the present invention will be described below with reference to the drawings.

  The ultrasonic bonding apparatus according to the present invention ultrasonically bonds a plurality of members with different members for each hit point. In the present embodiment, the plurality of members are all made of A, B, and C having different materials. As the three flat plates, the first hit point to be ultrasonically bonded is performed to join the A and B members, and the second hit point is used to join the B and C members. It will be explained as

  FIG. 1 is a block diagram showing a schematic configuration of an ultrasonic bonding apparatus according to the present invention.

  The ultrasonic bonding apparatus includes a database 10, an input device 15, a control device 20, a workpiece positioning device 30, and an ultrasonic bonding machine 40.

  The database 10 includes physical property information including materials, Young's modulus E, wavelength constant k, and vibration propagation characteristics, which are necessary for the control device 20 to perform various calculations. The ultrasonic bonding information including the position information of the first hit point, the vibration frequency, the applied pressure, and the bonding time when ultrasonic bonding is performed is stored.

  The input device 15 is provided for manually inputting physical property information and ultrasonic bonding information of the material.

  The control device 20 calculates the first hit point position based on the ultrasonic bonding information stored in the database 10 or input from the input device 15, while being stored in the database 10 or input from the input device 15. Based on the physical property information, an optimal second hit point position that does not apply stress higher than the bond strength reference value (predetermined) to the first hit point during ultrasonic bonding is calculated. The control device 20 functions as a hit point position calculating means.

  The workpiece positioning device 30 functions as positioning means, and integrally positions the three flat plates A, B, and C at the first hit point position and the second hit point position calculated by the control device 20.

  The ultrasonic bonding machine 40 functions as an ultrasonic bonding means, and ultrasonically bonds the first hit point position and the second hit point position based on the ultrasonic bonding information output from the control device 20.

  The ultrasonic bonding machine 40 has a structure as schematically shown in FIG. The ultrasonic bonding machine 40 includes an anvil 41 that is set in a state where a metal flat plate A and a flat plate B that are to be joined are overlapped, an amplifying horn 43 that is ultrasonically vibrated by a vibrating means 42, and an amplifying horn. And a chip 44 detachably attached to the lower end of 43.

  The anvil 41 is firmly attached on a base (not shown). The vibration means 42 applies ultrasonic vibration in the illustrated horizontal direction to the amplification horn 43, and includes a vibrator 46 that vibrates with a high frequency power supply 45. The amplifying horn 43 applies a pressing force in the vertical direction in the drawing to the chip 44 by a pressing means (not shown).

  At the time of ultrasonic bonding, the flat plates A and B to be ultrasonically bonded are pressed by the tip 44 on the anvil 41 as illustrated. When the amplifying horn 43 causes ultrasonic vibration in this state, the chip 44 vibrates in the horizontal direction while receiving pressure. By this vibration, the metal atoms of the flat plates A and B are diffused and further recrystallized to mechanically join the portion located between the chips 44.

  FIG. 3 is a diagram illustrating a schematic configuration of a flat battery in which ultrasonic bonding is performed in the present embodiment. The flat batteries 50A and 50B shown in the figure are the same type of flat battery, in which battery elements (not shown) are accommodated and the outer sides thereof are covered with laminate films 51A and 51B. Positive terminal 52A, 52B and negative terminal 53A, 53B are pulled out from the battery element. The periphery of the battery element is sealed by heat fusion to prevent intrusion of moisture and the like from the outside.

  In the present embodiment, as shown in FIG. 3 and FIGS. 4A and 4B, a plurality of members are ultrasonically bonded with different members for each hit point. Specifically, first, the negative electrode terminal 53B and the voltage detection faston terminal 55 are joined at the first hit point position 54, and then the negative electrode terminal 53B and the positive electrode terminal 52A are joined at the second hit point position 57. The faston terminal 55 is a flat plate A made of brass, the negative electrode terminal 53B is a flat plate B made of copper, and the positive electrode terminal 52A is a flat plate C made of aluminum.

  Therefore, when performing ultrasonic bonding at the second hit point position 57, the ultrasonic vibration applied to the second hit point position 57 is applied to the bonded first hit point position 54 via the negative electrode terminal 53B and the positive electrode terminal 52A. In other words, this ultrasonic vibration may cause a decrease in the bonding strength at the first hit point position 54 in some cases. In the present invention, the distance from the first hit point position 54 to the second hit point position 57 is calculated so that the ultrasonic vibration at the second hit point position 57 does not adversely affect the bonding strength of the first hit point position 54. The ultrasonic welding of the second hit point is performed at a distance. For example, in the case of the present embodiment, as shown in FIGS. 3 and 4B, the positive and negative terminals 52A, 52B, 53A, 53B of the flat batteries 50A, 50B have a width of 90 mm. The second hit point position 57 is set at a position 71 mm away from the first hit point position 54.

  Next, the grounds for setting the second hit point position 57 at a position 71 mm away from the first hit point position 54 in the present embodiment will be described.

In general, when an elastic body of a rod-like long plate having a uniform cross section is given a vibration from one end thereof to be in a half-wave resonance state of longitudinal vibration in the longitudinal direction, the length direction of the elastic body is taken as the X axis. And the longitudinal vibration amplitude ξ (x) at the x position is
ξ (x) = ξ ₀ sin ωt · coskx
ξ ₀ : Maximum vibration amplitude, ω: angular frequency, k: wavelength constant (ω / c), and sound velocity of elastic body.
Further, since the vibration strain δ (x) is a positional function of the vibration amplitude, ξ (x) is calculated by differentiating it with x, and the vibration strain δ (x) is
δ (x) = δ ₀ sinωt · sinkx
δ ₀ = −ξ ₀ k: Expressed by the equation of maximum vibration strain.
The vibration stress T (x) at the x position is obtained by multiplying the vibration strain by the Young's modulus E when the Young's modulus of the elastic body is E.
T (x) = Eδ ₀ sinωt · sinkx
It is expressed by the following formula.

  The vibration stress T (x) finally obtained by these equations is a stress applied to the first hit point by vibration directly transmitted through the long plate. Actually, in addition to this direct vibration, a stress of vibration transmitted indirectly by being reflected from the end face of the long plate is also applied to the first hit point. However, the indirect stress of the vibration due to reflection is a very small stress compared to the direct stress because the transmission distance becomes long.

  When ultrasonically joining the second hit point of the long plate, the stress applied to the first hit point by the vibration directly transmitted through the long plate and the stress applied to the first hit point by the vibration reflected by the end face of the long plate and indirectly transmitted Is required to be smaller than the set joint strength reference value. This is because if the stress applied to the first point by ultrasonic bonding at the second point greatly exceeds the bonding strength reference value, the bonding strength at the first point is lowered, and the bonding quality is deteriorated.

  FIG. 5 is a diagram showing how vibration is propagated and stress is applied on the long plate from the striking point position. When the point of hitting is ultrasonically bonded, the wave of wavelength λ as shown by the solid line in the figure corresponding to the frequency of vibration applied by ultrasonic bonding on the long plate and the vibration propagation characteristics of the material of the long plate is a sine wave. Vibration propagates. At the same time, stress distributed in a sine wave shape as shown by a dotted line in the figure is applied at each position on the long plate. From these waveforms, it can be seen that the stress waveform is shifted in phase by λ / 4 from the vibration waveform. It can also be seen that the stress at the position away from the hit point position by λ / 4 is the largest.

  The maximum stress having the magnitude of the vibration stress T (λ / 4) calculated by the above formula is applied to a position away from the hit point position by λ / 4. For this reason, it is understood that the ultrasonic bonding of the second hit point at a position away from the first hit point position by λ / 4 should be avoided.

  In the present embodiment, for the sake of safety, the second hit point position 57 is set to a position away from the first hit point position (n / 2 + 1/4) λ: [n is a positive number], as shown in FIG. / 4 ± λ / 16 is set to a region excluding a region (shaded area in the drawing) in a range apart. As shown in FIG. 4, the length of the negative electrode terminal 53B is 90 mm, the vibration frequency f of ultrasonic bonding is 19.15 KHz, and the sound velocity c of the longitudinal wave of copper that is the metal constituting the negative electrode terminal 53B is Since it is 3960 m / sec, when the wavelength λ of the vibration waveform is first obtained, λ = 2π / k = 2π · c / w = c / f = 206 mm. Therefore, the range of λ / 4 ± λ / 16 is a range excluding the range of 39 mm to 64 mm from the first hit point position. For this reason, in the present embodiment, the second hit point position 57 is set to a position 71 mm away from the first hit point position 54 as an optimum position that is out of this range. The control device 20 performs the above calculation, and the workpiece positioning device 30 performs positioning of the flat battery 50 at the calculated hitting point position.

  If the second hit point position 57 is set at such a position, it is possible to suppress the stress applied to the first hit point at the time of ultrasonic bonding of the second hit point, and it is possible to avoid poor bonding at the first hit point. In order to reduce the stress applied to the first striking point, a region in the range of λ / 4 ± λ / 12 away from the first striking point position 54 or a region in the range of λ / 4 ± λ / 8 is defined as the bonding prohibited region. The second spot position may be provided in a region excluding these bonding prohibited regions.

  FIG. 7 is a flowchart showing the procedure of the ultrasonic bonding method according to the present invention. This method is performed by the ultrasonic bonding apparatus shown in FIG.

  First, the control device 20 acquires physical characteristic information of the negative electrode terminal 53 </ b> B that is a copper flat plate B and the positive electrode terminal 52 </ b> A that is an aluminum flat plate C from the database 10. At the same time, ultrasonic bonding information necessary for performing ultrasonic bonding at the first hit point and ultrasonic bonding at the second hit point is acquired. The physical characteristic information is information necessary for calculating the optimum position of the second hit point, and is the material, Young's modulus E, wavelength constant k, and vibration propagation characteristic. That is, the Young's modulus E, the wavelength constant k, and the vibration propagation characteristics (longitudinal wave propagation speed) according to the material of the flat plate and the dimensions such as shape, thickness, width, and depth. The ultrasonic bonding information is the position information of the first hit point, the vibration frequency, the applied pressure, and the bonding time.

  Normally, all of these pieces of information are stored in the database 20, but there are also cases where the operator manually inputs from the input device 15 or from an external device such as a production management device. In this case, the control device 20 acquires physical characteristic information from the input device 15 or an external device (S1).

  The workpiece positioning device 30 acquires the position information of the first hit point position from the control device 20, and positions the negative terminal 53B and the voltage detection faston terminal 55 (see FIG. 3) on the anvil 41 (see FIG. 2). Position to. When the amplifying horn 43 of the ultrasonic bonding machine 40 is lowered and the tip 44 sandwiches the negative terminal 53B and the voltage detecting faston terminal 55 between the anvil 41 with a desired pressure, the vibrator 46 is activated. The amplifying horn 43 causes ultrasonic vibration at a desired vibration frequency, and joining of the first hitting point is started. When the ultrasonic vibration is continued for the joining time, the ultrasonic joining at the first spot is finished (S2).

  Next, the control device 20 performs the above calculation based on the physical characteristic information of the negative electrode terminal 53B, which is the copper flat plate B obtained from the database 10, that is, the material, Young's modulus E, wavelength constant k, and vibration propagation characteristic. And an optimum position of the second hitting point that does not give a stress greater than a predetermined bonding strength reference value to the first hitting point is calculated during ultrasonic bonding. Specifically, the position where the second hit point position 57 is away from the first hit point position 54 by λ / 4 of the wavelength of the vibration waveform, or the first hit point position 54 is λ / 4 ± λ / 16, λ / A region in the range of 4 ± λ / 12 or λ / 4 ± λ / 8 is set as a bonding prohibited region, and the second spot position is set in a region excluding these bonding prohibited regions (S3).

  The control device 20 outputs the calculated second hit point position to the work positioning device 30, and the work positioning device 30 acquires the position information of the second hit point position from the control device 20, and the negative terminal 53B and the positive terminal 52A. (See FIG. 3) is positioned at that position on the anvil 41 (see FIG. 2). When the amplifying horn 43 of the ultrasonic bonding machine 40 is lowered and the tip 44 sandwiches the negative terminal 53B and the positive terminal 52A between the anvil 41 with a desired pressure, the vibrator 46 operates to amplify the horn 43. Causes ultrasonic vibration at a desired vibration frequency, and the joining of the second spot is started. When the ultrasonic vibration is continued for the joining time, the ultrasonic joining at the second spot is finished (S4).

  As described above, according to the present invention, a position where no stress greater than the bonding strength reference value is applied to the first hit point can be set as the second hit point, so that highly reliable ultrasonic bonding can be performed. Strict inspection can be omitted and production efficiency is improved.

FIG. 8 is a diagram showing a specific configuration in the case where the actual stress applied to the first hit point position is obtained by experiment when the present invention is applied. As shown in the figure, the flat plate A is assumed to be a Faston terminal, and is a very thin brass thin film having a thickness t of 0.5 mm. The flat plate B or C is a very thin copper or aluminum thin film having a width of 90 mm, a depth of 40 mm, and a thickness t of 0.2 mm. In the ultrasonic bonding, a forced vibration having a frequency of 19.15 KHz is applied to a region having an area of 12 mm × 6 mm with an amplitude of 20 μm at each of the first spot position 54 and the second spot position 57. The part directly under the part where the forced vibration is applied is completely fixed. The direction in which the forced vibration is applied is the depth direction of the flat plate B as shown in the figure. The first spot joins the flat plates A and B, and the second spot joins the flat plate B or C with another member.
[Example 1]
Under the conditions as described above, the distance between the first striking point position and the second striking point position (hereinafter referred to as excitation distance) was set to 72 mm with respect to the flat plate B (copper), and ultrasonic bonding was performed at the second striking point. . When the excitation distance is 72 mm, the wavelength of the vibration waveform is 206 mm, and therefore, a position λ / 4 away from the wavelength of the vibration waveform (52 mm) is avoided, and λ / 4 ± λ / 16 (38 mm to 64 mm). In addition, the second spot position is set in a region that avoids the range of λ / 4 ± λ / 12 (35 mm to 69 mm).

As a result, it was found by CAE analysis that the maximum stress generated at the Faston terminal of the flat plate A was 0.336 × 10 ⁹ Pa. That is, it was found that the stress applied to the first hit point is considerably reduced when the second hit point is 72 mm away from the first hit point.
[Example 2]
The excitation distance was set to 52 mm for the flat plate B (copper), and ultrasonic bonding was performed at the second spot. When the excitation distance is 52 mm, the second hit point position is set at a position (52 mm) that is exactly λ / 4 of the wavelength of the vibration waveform.

As a result, it was found that the maximum stress generated at the Faston terminal of the flat plate A was 0.534 × 10 ¹¹ Pa. That is, it was found that the stress applied to the first hit point becomes very large when the second hit point is 52 mm away from the first hit point.
[Example 3]
The excitation distance was set to 26 mm for the flat plate B (copper), and ultrasonic bonding was performed at the second spot. The excitation distance of 26 mm avoids a position (52 mm) away from the wavelength of the vibration waveform by λ / 4, λ / 4 ± λ / 16 (38 mm to 64 mm), and further λ / 4 ± λ / 12. The second hit point position is set in a region that avoids the range of (35 mm to 69 mm).

As a result, it was found that the maximum stress generated at the Faston terminal of the flat plate A was 0.156 × 10 ¹⁰ Pa. That is, it was found that the stress applied to the first hit point is not as large as that of Example 1 when the second hit point is separated from the first hit point by 26 mm.
[Example 4]
Next, the excitation distance was set to 70 mm for the flat plate C (aluminum), and ultrasonic bonding was performed at the second spot. The excitation distance of 70 mm avoids a position (52 mm) away from the wavelength of the vibration waveform by λ / 4, λ / 4 ± λ / 16 (38 mm to 64 mm), and further λ / 4 ± λ / 12. The second hit point position is set in a region that avoids the range of (35 mm to 69 mm).

As a result, it was found that the maximum stress generated at the Faston terminal of the flat plate A was 0.337 × 10 ⁹ Pa. That is, it was found that the stress applied to the first hit point is considerably reduced when the second hit point is separated from the first hit point by 70 mm.
[Example 5]
The excitation distance was set to 52 mm for the flat plate C (aluminum), and ultrasonic bonding was performed at the second spot. When the excitation distance is 52 mm, the second hit point position is set at a position (52 mm) that is exactly λ / 4 of the wavelength of the vibration waveform.

As a result, it was found that the maximum stress generated at the faston terminal of the flat plate A was 0.779 × 10 ⁹ Pa. That is, it was found that the stress applied to the first hit point increases when the second hit point is 52 mm away from the first hit point.
[Example 6]
The excitation distance was set to 26 mm for the flat plate C (aluminum), and ultrasonic bonding was performed at the second spot. The excitation distance of 26 mm avoids a position (52 mm) away from the wavelength of the vibration waveform by λ / 4, λ / 4 ± λ / 16 (38 mm to 64 mm), and further λ / 4 ± λ / 12. The second hit point position is set in a region that avoids the range of (35 mm to 69 mm).

As a result, it was found that the maximum stress generated at the Faston terminal of the flat plate A was 0.447 × 10 ¹⁰ Pa. That is, it was found that the stress applied to the first hit point is not as large as that of Example 1 when the second hit point is separated from the first hit point by 26 mm. In addition, it turned out that the stress of the vibration part in the 2nd hit point position 57 has applied big stress only to the part currently vibrated.

  The results of Examples 1 to 6 are summarized as shown in Table 1 below.

  As is apparent from the results of this table, the second hit point position 57 is a position that avoids the position where the wavelength of the vibration waveform is λ / 4 away from the first hit point position 54, or the first hit point position 54 is λ / 4. It is possible to set a second striking position in a region excluding these joint prohibition regions, with a region in the range separated by ± λ / 16, λ / 4 ± λ / 12, or λ / 4 ± λ / 8 as a joint prohibition region, You can see how effective it is to improve the bonding quality.

  If the present invention is used, a highly reliable battery having excellent earthquake resistance can be manufactured. Therefore, the present invention can be applied particularly in the field of batteries mounted on automobiles.

1 is a block diagram showing a schematic configuration of an ultrasonic bonding apparatus according to the present invention. It is a figure which shows schematic structure of an ultrasonic bonding machine. It is a figure which shows schematic structure of the flat battery in which ultrasonic bonding is performed in this Embodiment. (A), (b) is a figure where it uses for description of a hit point position. It is a figure where it uses for description of the principle for setting a 2nd hit point position. It is a figure where it uses for description of the principle for setting a 2nd hit point position. It is a flowchart which shows the procedure of the ultrasonic bonding method concerning this invention. It is a figure which shows the specific structure in the case of calculating | requiring the actual stress concerning a 1st hit point position by experiment when this invention is applied.

Explanation of symbols

10 database,
15 input devices,
20 control device,
30 Work positioning device,
40 ultrasonic bonding machine,
41 Anvil,
42 vibration means,
43 Amplifying horn,
44 chips,
45 high frequency power supply,
46 vibrator,
50, 50A, 50B flat battery,
51A Laminate film,
52A, 52B positive terminal,
53A, 53B negative terminal,
54 RBI position,
55 Faston terminals,
A, B, C Flat plate.

Claims (10)

An ultrasonic bonding method for ultrasonically bonding a plurality of members with different members for each hit point,
Acquiring physical property information and ultrasonic bonding information of the material constituting each member;
Performing ultrasonic bonding of the first spot based on the ultrasonic bonding information;
A step of calculating an optimum position of a second hit point that does not give a stress higher than a predetermined bond strength reference value to the first hit point at the time of ultrasonic bonding based on physical property information of the material;
Performing ultrasonic bonding of a second hit point at the optimum position based on the ultrasonic bonding information;
An ultrasonic bonding method comprising:   The plurality of members are all three flat plates of A, B, and C of different materials, and the first hit point joins the A and B members, so the second hit point is between the B and C members. The ultrasonic bonding method according to claim 1, wherein the ultrasonic bonding is performed in order to bond the two.   The physical property information of the material includes the material of each member, Young's modulus E, wavelength constant k, and vibration propagation property. These physical property information is stored in a storage means as a database, or an external device. The ultrasonic bonding method according to claim 1, wherein a signal input from is used.   The ultrasonic bonding information includes position information, vibration frequency, applied pressure, and bonding time of the first hit point. The ultrasonic bonding information is stored in the storage means as a database, or from an external device. 2. The ultrasonic bonding method according to claim 1, wherein an input one is used. The optimum position of the second hit point is
When ultrasonic bonding is performed at the second hit point, the first hit point is caused by the stress applied to the first hit point by the vibration directly transmitted through the member and the vibration indirectly reflected by the end face of the member. 2. The ultrasonic bonding method according to claim 1, wherein the ultrasonic bonding method is a position where a total value of stress applied to the hitting point is smaller than the bonding strength reference value. The optimum position of the second hit point is
When the wavelength obtained from the vibration frequency at the time of ultrasonic bonding and the vibration propagation characteristic of the member is λ, a position of (n / 2 + 1/4) λ: [n is a positive number] from the first hit point position is avoided. The ultrasonic bonding method according to claim 1, wherein the ultrasonic bonding method is set to a position. An ultrasonic bonding apparatus that ultrasonically bonds a plurality of members with different members for each hit point,
A database for storing physical property information and ultrasonic bonding information of materials constituting each member;
Optimum that calculates a first hit point position based on the ultrasonic bonding information and does not give a stress exceeding a predetermined bonding strength reference value to the first hit point during ultrasonic bonding based on physical property information of the material A hit point position calculating means for calculating the second hit point position;
Positioning means for positioning the member at the calculated first hit point position and second hit point position;
Ultrasonic bonding means for ultrasonic bonding the first hit point position and the second hit point position based on the ultrasonic bonding information;
An ultrasonic bonding apparatus comprising:   The ultrasonic bonding apparatus according to claim 7, wherein the physical property information of the material includes a material of each member, a Young's modulus E, a wavelength constant k, and a vibration propagation property.   The ultrasonic bonding apparatus according to claim 7, wherein the ultrasonic bonding information includes position information of a first hit point, a vibration frequency, a pressing force, and a bonding time. The optimal second hit point position is
When the wavelength obtained from the vibration frequency at the time of ultrasonic bonding and the vibration propagation characteristic of the member is λ, a position of (n / 2 + 1/4) λ: [n is a positive number] from the first hit point position is avoided. The ultrasonic bonding apparatus according to claim 7, wherein the ultrasonic bonding apparatus is set to a position.

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