JP2005348189A - Method of detecting defect in solid state image pick-up element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of detecting defect in solid state image pick-up element for preventing erroneous detection of white/black defect beforehand, by determining two or more areas as a night scene, of which the detection accuracy of white defect is a prescribed level or below, and the like and avoiding the detection of white detect if the areas spread to a certain largeness and the luminance information is a prescribed level of darkness or below and by determining two or more ares as a bubble of beer, of which the detection accuracy of white detect is a prescribed level or below, and the like and avoiding the detection of black defect if the areas spread to a certain largeness and the luminance information is a prescribed level of brightness or more. <P>SOLUTION: When a person with background of night view is picked up, the rear night view is dark and its luminance information becomes a prescribed level or below. In this case, if the detection of white defect is carried out for the rear night view, a light like a street light in the background is determined as a white detect, and detection of defect tends to become erroneous. Then, the night scene in the background is taken previously by a control circuit and is determined as a night scene from the luminance information, and the maximum detection number of white defect detection for the night view in the background is set as zero to prevent erroneous white detection beforehand. The luminance information for each area is calculated and the detection accuracy of white defect for each area is sought from the luminance information and the detection of white defect is not carried out for an area having detection accuracy of white defect of a prescribed level or below. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a defect detection method for a solid-state imaging device that detects a defect occurring in a solid-state imaging device during imaging in order to correct the defect.

  In a solid-state image sensor formed of a semiconductor such as a CCD, the pixel is defective due to a decrease in sensitivity due to local crystal defects in the semiconductor, or due to electrostatic breakdown of the solid-state image sensor or changes over time. May occur. In the latter case, the video camera is provided with a function for detecting a defect and a function for correcting a defect for correcting the detected defect.

As a conventional defect detection method for a solid-state imaging device, there is one described in Patent Document 1. . This is to detect a defect during photographing without using a light shielding means or a reference light source, and based on the outputs of three circuits of a level difference determination circuit, an edge determination circuit, and an edge defect determination circuit, a logical operation circuit Since the defect detection is performed by the above, even if the pixel defect detection is performed during the camera imaging operation, the defect detection can be accurately performed without mistaking the edge information and random noise included in the captured video information.
Japanese Patent Laid-Open No. 7-23297

  However, when black spots are included in white parts such as cake sponges or beer bubbles, or when white spots are included in dark parts such as night sky or night view, these are mistakenly detected as defects. Since the defective pixel is corrected in the erroneously detected portion, there is a problem that the image quality is deteriorated.

  Accordingly, an object of the present invention is to provide a defect detection method for a solid-state imaging device that solves the above-described problems.

  The invention according to claim 1 divides an image into a plurality of areas, calculates luminance information in each area, obtains white defect detection accuracy for each area based on the luminance information, and the white defect detection accuracy is predetermined. In the following areas, white defects are not detected.

  In such a defect detection method of a solid-state imaging device, for example, a night scene where the detection accuracy of a white defect is below a predetermined value for a plurality of areas where the luminance information is darker than a predetermined value and has a certain extent. It is determined that the white defect is not detected, thereby preventing the erroneous detection of the white defect.

  According to a second aspect of the present invention, in the defect detection method for a solid-state imaging device according to the first aspect, the maximum number of detected white defects is reduced in order not to detect the white defect.

  In such a defect detection method for a solid-state imaging device, white defects are not detected by setting the maximum number of detected white defects to be small, for example, zero.

  The invention according to claim 3 divides an image into a plurality of areas, calculates luminance information in each area, obtains black defect detection accuracy for each area based on the luminance information, and the black defect detection accuracy is predetermined. In the following areas, black defects are not detected.

  In such a defect detection method of a solid-state imaging device, for example, beer bubbles having a black defect detection accuracy of a predetermined value or less for a plurality of areas that are bright portions with luminance information of a predetermined value or more and have a certain extent. Therefore, the black defect is not detected, thereby preventing erroneous detection of the black defect.

  According to a fourth aspect of the present invention, in the defect detection method for a solid-state imaging device according to the second aspect, the maximum number of detected black defects is reduced in order not to detect the black defects.

  In such a defect detection method for a solid-state imaging device, the black defect is not detected by setting the maximum number of black defects detected to be small, for example, zero.

  The invention according to claim 5 divides the image into a plurality of areas, calculates luminance information in each area, and the shooting time is different from the current shooting time for each area where the luminance information is obtained. Read the defect information of the image of the area where the brightness information of each area stored is a value close to the brightness information of the area at the time of the current shooting, and the read defect information at the time of the current shooting Compared with black defect information or white defect information of the area, when the position of the defect in the corresponding area matches, it is determined that the defect exists at the position and the defect is detected. To do.

  In such a defect detection method for a solid-state imaging device, when there is an image in which brightness information is a value close to the current value at a different time from the current time and the position of a black defect or a white defect is the same in the corresponding area. Is detected as being defective.

  According to the defect detection method for a solid-state imaging device according to the present invention, the detection accuracy of a white defect is not more than a predetermined value for a plurality of areas that are dark portions whose luminance information is not more than a predetermined value and have a certain extent. For example, the white defect detection accuracy is not more than a predetermined value for a plurality of bright areas where brightness information is not less than a predetermined value and a certain extent is spread without detecting a white defect because it is a night scene. Since it is determined that it is a beer bubble and black defects are not detected, it is possible to prevent erroneous detection of white defects and black defects.

  Also, the black defect information and the white defect information at the time of the current shooting, and the luminance information of each area at a time different from the current value are close to the current value, and the position of the black defect or the defect of the white defect is within the corresponding area. If there is a matching image, it is determined as a defect, so that a more accurate defect detection can be performed with a smaller number of images than when a plurality of images are simply compared.

Hereinafter, embodiments of a defect detection method for a solid-state imaging device according to the present invention will be described.
(A) Embodiment 1
First, a first embodiment of the defect detection method for a solid-state imaging device according to the present invention will be described. FIG. 1 shows a part of a circuit diagram of a digital camera that uses a defect detection method for a solid-state imaging device. Data captured by the solid-state imaging device 1 is sent to an AFE (Analog Front End Processor) 2 as an analog signal, subjected to an analog front end process by the AFE 2, converted into a digital signal, and sent to the signal processing unit 3. Then, image signal processing is performed by the signal processing unit 3 and output as an image signal.

  The signal processing unit 3 performs luminance calculation for dividing the image into a plurality of areas and calculating luminance information for each area, and defect correction for detecting and correcting defects. The brightness information obtained by the brightness calculation is output to the control circuit 4 such as a microcomputer.

  Between the AFE 2 and the signal processing unit 3, a black defect detection unit 5 and a white defect detection unit 6 are provided. The black defect detection unit 5 and the white defect detection unit 6 buffer (temporarily store) the digital signal output from the AFE 2 by an amount necessary for black defect detection and white defect detection.

  Based on the luminance information, the control circuit 4 controls the black defect detection unit 5 and the white defect detection unit 6. That is, control is performed as follows. The control circuit 4 detects a defective part from each area of the image temporarily stored in the black defect detection unit 5 and the white defect detection unit 6 and counts the number of detections for each area. Here, a threshold value (s), which is a reference value for determining whether or not there is a defect, is set in advance, and if it exceeds the threshold value (s), it is determined that it is a defective portion. At that time, based on the luminance information, a maximum number (m) of defective portions is set in advance. Then, a defect detection operation is performed so that the detection number does not exceed the maximum detection number (m). Details will be described later.

  Next, calculation of luminance information and defect detection based on the circuit of FIG. 1 will be described.

The calculation of luminance information by the signal processing unit 3 is performed as follows. As shown in FIG. 2, for example, an image in which two people are shown side by side is divided into 48 areas of length (6) × width (8), and the signal level is integrated for each area to obtain brightness. Is output as luminance information. And
(1) When it is determined from the obtained luminance information that a condition such as a night view is present, and an area is dark and the signal level (numerical value of luminance information) is below a predetermined value, the area is detected as a white defect. Assuming that the accuracy is below a predetermined level, white defect detection is not performed but only black defect detection is performed. By performing such control, erroneous detection of a white defect in an area that is dark and has a signal level equal to or lower than a predetermined value can be prevented.
(2) On the other hand, if it is found that a certain area is bright and the signal level (numerical value of luminance information) is equal to or higher than a predetermined value, the black defect is not detected in the area because the black defect detection accuracy is lower than a predetermined value. Only white defect detection is performed. By performing such control, it is possible to prevent erroneous detection of black defects in an area that is bright and whose signal level is equal to or higher than a predetermined value.

  When detecting the defect as described above, the control circuit 4 controls the black defect detection unit 5 and the white defect detection unit 6 as follows. First, the maximum number of black defects detected (m) and the maximum number of white defects detected (m) are set for each area. And it is for judging whether it is a defect so that the detection number of the defect part which the black defect detection part 5 and the white defect detection part 6 detect does not exceed the maximum detection number (m) given in each area. The threshold value (s) that is the reference value is adjusted.

  An example of performing defect detection in the case (1) is shown in FIG. As shown in the figure, the upper and peripheral portions of the image are dark and the central portion and the lower portion are bright, and this is a pattern when a person is photographed against a night view. In such a case, the night view of the back is dark and has a signal level below a predetermined value. In such a case, if white defect detection is performed on the night view of the back, the light such as the back street light is misidentified as a white defect. In some cases, erroneous defects are detected. However, in the defect detection method of the present invention, even in such a case, the control circuit 4 previously receives the night scene of the back as luminance information, and is an area where the detection accuracy of the white defect is a predetermined value or less from the luminance information. Since the maximum number (m) of white defect detection for the back night scene is reduced or set to zero, erroneous white defect detection can be prevented in advance. As an example of this, for example, when the digital camera has a photographing mode such as a night view mode, the maximum number (m) of white defects detected for the back night view in FIG. 3 may be set to zero.

  FIG. 4 shows a case where defect detection is performed in the case (2). As shown in the figure, the center and bottom of the image are bright and the top and both sides are dark. An example is shown in which numerical values of the number of detected defects are compared in a plurality of areas that are bright and have a signal level equal to or higher than a predetermined value and that are close to the signal level obtained from luminance information. When comparing the number of detected defects, the maximum number of detected areas (m) for the corresponding area is sufficiently increased, and the threshold (s), which is a reference value for determining whether or not the defect is in the corresponding area, is the same. Compare. This example shows a situation in which the number of defects detected in some (two) areas out of a plurality of areas is prominent, and this is because some of the cake sponge and beer foam parts are black defects. This happens when it is detected by mistake.

  In such a case, the central part and the lower part of the image are bright and have a signal level higher than a predetermined value. When black defect detection is performed on a bright part, a part of the cake sponge part or beer foam part is blackened. It may be mistaken as a defect and erroneously detected. However, in the defect detection method of the present invention, even in such a case, the control circuit 4 receives the sponge portion of the cake and the foam portion of the beer as luminance information, and the sponge portion of the cake and the beer Because it is a bubble part and the black defect detection accuracy is determined to be an area below a predetermined value, the maximum number of black defect detection (m) for the sponge part of the cake and the beer foam part is set to be small or zero. Thus, erroneous black defect detection can be prevented in advance. As an example of this, for example, in a digital camera, the maximum number of black defects (m) detected for the sponge portion of the cake and the beer foam portion of FIG. 4 may be set to zero.

The defect detected in this way is corrected in the signal processing unit 3 controlled by the control circuit 4. Lights such as street lights on the back of the night view are mistakenly detected as white defects and corrected, or some of the sponge parts of misidentified cake and beer foam parts are mistakenly detected as black defects and corrected. Therefore, the problem that the image quality deteriorates due to the erroneous detection of the defect and the correction of the erroneous detection defect as in the prior art is solved.
(B) Embodiment 2
Next, a second embodiment of the defect detection method for a solid-state imaging device according to the present invention will be described. FIG. 5 shows an improvement of a part of the circuit diagram of FIG. Compared with FIG. 1, a black defect memory 7 and a white defect memory 8 are added. The black defect memory 7 and the white defect memory 8 store black defect information and white defect information detected by past defect detection, and black defect information and white defect information at the time of current photographing, respectively. Since other configurations are the same, description thereof is omitted.

  The stored defect information is a frame that is separated in time from the current shooting, and the stored luminance information has a value close to the luminance information of each area at the time of the current shooting. A frame including an area is read by the control circuit 4. Then, the black defect information and the white defect information are compared with respect to the defect information of the area at the time of current photographing and the defect information of the corresponding area stored. If the positions of the defects in the corresponding areas match between the two to be compared, it is determined that there is a defect at that position and is detected as having a defect.

  The defect detected in this way is corrected in the signal processing unit 3 controlled by the control circuit 4. Since the accuracy of defect detection is high, advanced image quality can be obtained by performing defect correction.

  FIG. 6 is an improvement of the circuit diagram of FIG. As can be seen from a comparison between FIG. 5 and FIG. 6, the defect correction is performed in the signal processing unit 3 in FIG. 5, but the defect correction is performed in the white defect detection unit 5 and the black defect detection unit 6 in FIG. 6. It is a thing. Other configurations are the same as those in FIG.

  In the case of FIG. 5, the part for detecting the defect and the part for correcting the defect are separated, but in FIG. 6, the part for detecting the defect and the part for correcting the defect are combined into one. Correction is performed simultaneously with detection.

FIG. 3 is a circuit diagram for detecting a defect in a solid-state image sensor (Embodiment 1). Explanatory drawing which shows the image as an example for calculating luminance information (Embodiment 1). Explanatory drawing which shows an example of the luminance information output from a signal processing part (Embodiment 1). Explanatory drawing which shows the other example which compares the number of defect detections in the some area where the signal level obtained from luminance information is near (Embodiment 1). FIG. 6 is a circuit diagram for detecting a defect in a solid-state imaging device (second embodiment). FIG. 6 is a circuit diagram for detecting a defect in a solid-state imaging device (second embodiment).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor 3 ... Signal processing part 4 ... Control circuit 5 ... Black defect detection part 6 ... White defect detection part 7 ... Memory for black defect 8 ... Memory for white defect

Claims (5)

The image is divided into a plurality of areas, luminance information in each area is calculated, white defect detection accuracy is obtained for each area based on the luminance information, and white defect detection is performed in areas where the white defect detection accuracy is a predetermined value or less. The defect detection method of the solid-state image sensor characterized by not performing. 2. The defect detection method for a solid-state imaging device according to claim 1, wherein the maximum number of detected white defects is reduced in order not to detect the white defect. The image is divided into a plurality of areas, luminance information in each area is calculated, black defect detection accuracy is obtained for each area based on the luminance information, and black defects are detected in areas where the black defect detection accuracy is a predetermined level or less. The defect detection method of the solid-state image sensor characterized by not performing. 3. The defect detection method for a solid-state image pickup device according to claim 2, wherein the maximum number of detected black defects is reduced in order not to detect the black defect. The image is divided into a plurality of areas, brightness information in each area is calculated, and each area where the brightness information is obtained is separated from the current shooting time and stored. The defect information of the image of the area where the luminance information of the area is a value close to the luminance information of the area at the time of the current shooting is read, and the read defect information is read as black defect information or white of the area at the time of the current shooting. A defect detection method for a solid-state imaging device, wherein a defect is detected by determining that a defect exists in the corresponding area when the position of the defect in the corresponding area matches with the defect information .

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