JP2005347337A - Solid-state imaging device storage package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device storage package which can be manufactured at a low cost while improving the reliability in image quality, and also to provide its manufacturing method. <P>SOLUTION: A frame 2 is formed of a thermoplastic resin having a water absorption property such as polyamide and polyphthalamide, and consists of a nearly rectangular frame 20 and a nearly rectangular opening 2b formed in a top face 2a extended from the outer edge of the frame 20 as an integral body thereof. The lower surface side of the frame 20 is airtightly joined to a printed board 1 by a thermosetting adhesive such an epoxy resin. On the upper surface side of the opening 2b, a lid 3 consisting of a transparent glass plate, etc. is airtightly joined to the top face 2a by a thermosetting adhesive such as an epoxy resin, with the lid 3 covering the opening 2b. The opening 2b is formed in a direction of the field of view of the solid-state imaging device 5 in order not to interrupt the field of view. An electrode of the solid-state imaging device 5 is electrically connected to a terminal 1b via bonding wires 6 such as gold wires. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solid-state image sensor housing package and a method for manufacturing the solid-state image sensor housing package.

  Conventionally, a solid-state image pickup device storage package for storing a solid-state image pickup device, in particular, an inexpensive solid-state image pickup device storage package generally includes a pre-molded package structure using a lead frame and an epoxy resin, as shown in FIG. An insulating base 101 having a recess 101 a for accommodating the solid-state imaging element 103 on the upper surface, a plurality of lead terminals 105 made of lead frames extending from the inner side to the outer side of the concave part 101 a of the insulating base 101, and an upper surface of the insulating base 101 The lid 102 is attached via a sealing material and closes the recess 101a of the insulating base 101. The solid-state image sensor 103 is attached to the bottom surface of the recess 101a of the insulating base 101 via a resin adhesive. At the same time, each electrode of the solid-state image sensor 103 is bonded to one end of the external lead terminal 105 with a bonding wire 106. After that, the lid 102 is joined to the upper surface of the insulating base 101 via a resin sealing material, and the solid-state imaging device 103 is placed inside the container 104 composed of the insulating base 101 and the lid 102. By sealing hermetically, a solid-state imaging device as a final product is obtained.

  In this conventional solid-state image pickup device storage package, the insulating base 101 is made of an epoxy resin, and the epoxy resin is inferior in moisture resistance, so that the solid-state image pickup device 103 is hermetically sealed inside the container 104 composed of the insulating base 101 and the lid 102. After the housing, moisture contained in the atmosphere easily enters the recess 101a in which the solid-state image sensor 103 is housed through the insulating substrate 101. Oxidation corrosion occurs, and the electrode and the bonding wire 106 are disconnected, resulting in a loss of function as a solid-state imaging device.

  In addition, since the lid body 102 is made of a transparent member such as glass, when moisture enters and stays inside the container 104, the lid body 102 is clouded due to condensation, resulting in a defect in the captured image.

Therefore, conventionally, in order to solve the above problem, moisture is prevented from entering the inside of the container 104 by incorporating a hygroscopic material into the insulating substrate 101 of the pre-mold package structure. (For example, refer to Patent Document 1).
Japanese Patent No. 2750254

  However, in the above-described conventional example, the joint portion between the insulating base 101 and the lid body 102 is formed over the side surface of the container 104, and moisture easily enters from the joint portion. Furthermore, when the temperature changes, the air in the recess 101a expands, and the pressure due to the expanded air is applied to the lid 102, airtightness is reduced, and moisture and dust have entered the package. Further, the airtightness was also lowered by the undulation generated at the joint between the insulating base 101 and the lid 102.

  Furthermore, when a thermosetting resin such as an epoxy resin is used as the material of the insulating substrate 101, if a moisture absorbing material is included in the thermosetting resin, burrs are often generated, and when these burrs adhere to the surface of the solid-state imaging element 103, There was a problem that black spots or the like were included in the captured image.

  Then, the intrusion of moisture into the package from the joint between the insulating base 101 and the lid 102, the penetration of moisture, dust, and burr of the thermosetting resin due to the deterioration of the airtightness, Reliability was reduced.

  Also, the solid-state image sensor housing package with the above pre-mold package structure requires simultaneous molding of the lead frame and the resin, so that the cost of the mold is high, and the mold is manufactured for each solid-state image sensor of various specifications. It was necessary to do so, and the cost was high. Furthermore, a deburring process is required, and the manufacturing cost is increased due to an increase in the number of processes. Furthermore, since the mold for molding the thermosetting resin wears quickly, the cost required for maintenance is high.

  The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide a solid-state imaging device storage package that can be manufactured at low cost by improving the reliability of video quality, and a method for manufacturing the solid-state imaging device storage package. It is to provide.

  According to a first aspect of the present invention, there is provided a printed circuit board on which a solid-state image sensor is mounted and a terminal electrically connected to an electrode of the solid-state image sensor is formed; A surface made of a thermoplastic resin having an opening in the viewing direction, and a transparent lid that covers the opening, and the opening extends from the outer edge of the frame into the frame. The lid body is hermetically bonded to the surface.

  According to the present invention, since the area of the opening covered by the lid is reduced, it is difficult for moisture to enter from the joint between the frame and the lid, and the pressure due to the expanded air in the package that occurs when the temperature changes In addition, the undulation generated at the joint between the frame and the lid is also reduced, the airtightness of the package is improved, and the reliability of the video quality can be improved. In addition, it does not require an expensive metal mold for simultaneous molding of the lead frame and resin as in the past, and can be manufactured at low cost, and by changing the pattern of the printed circuit board, it can be used for solid-state imaging devices of various specifications. Also, it can be flexible and low cost. Furthermore, by using a thermoplastic resin, the deburring process is unnecessary, the wear rate of the mold is also slowed down, and when glass is used for the lid, the opening area is small, so expensive glass should be used. The cost can be reduced and further cost reduction can be achieved.

  A second aspect of the present invention is characterized in that, in the first aspect, the frame body is formed with a wall portion projecting outward so as to surround the lid body covering the opening portion.

  According to the present invention, the cover is surrounded by the wall and the surface thereof is protected, and the surface of the cover is damaged by contact with other objects during manufacturing, and the captured image may be defective. Therefore, the reliability of video quality can be improved. In addition, defects during manufacturing are reduced, handling is facilitated, inspection time can be reduced, and manufacturing at low cost is possible.

  According to a third aspect of the present invention, in the first or second aspect, the opening is formed in a tapered shape that expands toward the side in which the solid-state imaging device is accommodated.

  According to the present invention, by providing the tapered portion, the area of the opening can be made as small as possible while preventing defects such as noise caused by reflection from occurring in the captured image of the solid-state imaging device, and the frame and lid The reliability of the airtightness between the image quality and the image quality can be greatly improved, and the reliability of the video quality can be improved. Moreover, when using glass for a cover body, use of expensive glass can be reduced and cost reduction can be achieved.

  According to a fourth aspect of the present invention, in the method for manufacturing a solid-state image pickup device storage package according to any one of the first to third aspects, the printed circuit board has a through-hole formed in a portion inside the joint portion with the frame body. The through hole is hermetically sealed with solder after the body, the frame body, and the lid body are hermetically joined.

  According to the present invention, the expansion air generated when the printed circuit board and the frame body and the frame body and the lid body are each hermetically joined is released from the through hole provided in the printed circuit board, and finally the through hole is sealed. Further, it is possible to prevent the occurrence of defects in the joint portion due to the expanded air at the time of airtight joining, and stable airtight joining is possible, so that the reliability of video quality can be improved.

  According to a fifth aspect of the present invention, in the method for manufacturing a solid-state image pickup device storage package according to any one of the first to third aspects, the frame is formed with a through-hole that continues the space containing the solid-state image pickup device to the outside. And the frame body and the frame body and the lid body are hermetically joined, and then the through hole is hermetically sealed by heat sealing.

  According to the present invention, the expansion air generated when the printed circuit board and the frame body and the frame body and the lid body are each hermetically joined is released from the through hole provided in the frame body, and finally the through hole is sealed. Further, it is possible to prevent the occurrence of defects in the joint portion due to the expanded air at the time of airtight joining, and stable airtight joining is possible, so that the reliability of video quality can be improved.

  A sixth aspect of the present invention is the method for manufacturing a solid-state imaging device storage package according to any one of the first to third aspects, wherein the frame is a B-stage thermoset on the joint surface with the printed circuit board and the joint surface with the lid. Each of the adhesive layers is formed, and airtight joining between the frame and the printed circuit board and airtight joining between the frame and the lid are performed simultaneously.

  According to the present invention, the flow path of the expansion air generated when the printed circuit board and the frame and the frame and the lid are hermetically bonded is controlled by designing and adjusting the shape of the B-stage adhesive layer. This makes it possible to efficiently prevent defects in the adhesive layer due to the expanded air during hermetic joining and to achieve stable hermetic joining, thereby improving the reliability of video quality. In addition, sagging that occurs when a liquid adhesive is used, variation in the amount of adhesive, area variation, and the like can be suppressed, and stable production becomes possible. Furthermore, since the printed circuit board and the frame body and the frame body and the lid body are air-tightly joined at the same time, the manufacturing time can be shortened and the cost can be reduced accordingly.

  According to a seventh aspect of the present invention, in the method of manufacturing a solid-state imaging device storage package according to any one of the first to third aspects, the side edge of the printed circuit board is covered with a substance that does not generate dust at least in the assembly process.

  According to the present invention, since generation of dust such as glass fiber and molding powder from the cut surface of the side edge of the printed circuit board is suppressed, the dust generated from the printed circuit board at the time of assembly adheres to the surface of the solid-state image sensor and is solid-state imaged. It is possible to prevent defects such as black spots in the captured image of the element and improve the reliability of the video quality.

  The invention of claim 8 is characterized in that, in at least the assembly step, the side edge of the printed board is covered with a jig that is detachable from the side edge of the printed board and formed of a material that does not generate dust. .

  According to the present invention, since generation of dust such as glass fiber and molding powder from the cut surface of the side edge of the printed circuit board is suppressed, the dust generated from the printed circuit board at the time of assembly adheres to the surface of the solid-state image sensor and is solid-state imaged. It is possible to prevent defects such as black spots in the captured image of the element and improve the reliability of the video quality. Furthermore, the jig can be reused, and the generation of dust can be suppressed at low cost.

  According to a ninth aspect of the present invention, in the method of manufacturing a solid-state image pickup device storage package according to any one of the first to third aspects, a plated through hole is formed in a printed circuit board, and a frame is fitted into the through hole. Protrusion to be formed is formed, and positioning of the printed board and the frame is performed by fitting the protrusion into the through hole.

  According to the present invention, since the positioning accuracy between the printed circuit board and the frame is improved, the positional accuracy between the solid-state imaging device and the lid is improved, the reliability of the image quality can be improved, and the assembling work can be performed. It can be performed with high accuracy in a short time. In addition, the plating applied to the through hole can suppress the generation of dust such as glass fiber and molding powder from the through hole, so that the reliability of video quality can be improved and the occurrence of product defects can be prevented. ing.

  The invention of claim 10 is the method of manufacturing a solid-state image pickup device storage package according to any one of claims 1 to 3, wherein a plurality of solid-state image pickup devices are mounted on a printed board portion integrally formed with a plurality of print boards. A frame part that electrically connects the electrodes of each solid-state imaging device to each terminal, and then integrally forms a printed circuit board part and a plurality of frames, and a cover part that covers the frame part and the entire frame part; Each solid-state image pickup element is housed in each frame, and the lid portion is covered with the opening of each frame, and then the printed circuit board portion, the frame portion, and the lid portion are It cut | disconnects simultaneously and isolate | separates into each solid-state image sensor storage package.

  According to this invention, parts cost and assembly cost can be significantly reduced.

  As described above, in the present invention, the area of the opening covered by the lid is reduced, so that moisture is less likely to enter from the joint between the frame and the lid, and the inside of the package that occurs when the temperature changes The pressure caused by the expanded air is also reduced, and the undulation generated at the joint between the frame and lid is reduced, improving the airtightness of the package and improving the reliability of the video quality. is there. In addition, it does not require an expensive metal mold for simultaneous molding of the lead frame and resin as in the past, and can be manufactured at low cost, and by changing the pattern of the printed circuit board, it can be used for solid-state imaging devices of various specifications. Also, it can be flexible and low cost. Furthermore, by using a thermoplastic resin, the deburring process is unnecessary, the wear rate of the mold is also slowed down, and when glass is used for the lid, the opening area is small, so expensive glass should be used. There is also an effect that the cost can be reduced and further cost reduction can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1, 2 (a) and 2 (b) show an embodiment of a solid-state image pickup device storage package according to the present invention. The package 4 includes a printed circuit board 1, a frame body 2, and a lid body 3. FIG. The solid-state image sensor 5 is accommodated inside. FIG. 3 shows a top view when the lid 3 is removed.

  A solid-state imaging device 5 is mounted on the printed circuit board 1 and bonded by die bonding. The printed circuit board 1 is electrically connected to electrodes of the solid-state imaging device 5 via bonding wires 6 such as gold wires. A pattern 1a is formed corresponding to the electrode shape of the solid-state imaging device 5, and a terminal 1b for outputting a signal to the outside is formed on the side edge of the printed circuit board 1 continuously with each pattern 1a. The terminal 1b is formed by plating a through hole formed in the printed circuit board 1 and cutting the through hole into a substantially semicircular shape in the middle.

  The frame body 2 is made of a thermoplastic resin having water absorption characteristics such as polyamide and polyphthalamide, and extends integrally from the outer edge of the frame portion 20 so as to cover the substantially rectangular frame portion 20 and the upper surface side of the frame portion 20. The top surface 2a is provided and a substantially rectangular opening 2b formed substantially at the center of the top surface 2a. The lower surface side of the frame portion 20 is formed by a thermosetting adhesive such as an epoxy resin. Airtightly joined to the printed circuit board 1 and surrounded by the frame 20 and the top surface 2a, the solid-state imaging device 5 is accommodated. On the upper surface side of the opening 2b, the lid 3 is hermetically bonded to the top surface 2a by a thermosetting adhesive such as an epoxy resin, and the lid 3 covers the opening 2b. Here, the opening 2 b is formed in the visual field direction so as not to block the visual field of the solid-state imaging device 5.

  Thus, since the air inside the package 4 is hermetically sealed, when the temperature of the package 4 fluctuates, a force F is generated in the lid 3 according to the temperature fluctuation. Since the force F is a value obtained by multiplying the pressure change due to the temperature change by the area of the opening 2b, the force F becomes smaller as the area of the opening 2b is smaller. However, in the present embodiment, since the opening 2b is provided on the top surface 2a, the area of the opening 2b can be reduced regardless of the size of the frame 20. Therefore, when the top surface 2a of the frame body 2 and the lid body 3 are joined, it is difficult to be affected by the surface state such as the undulation of the bonding portion between the top surface 2a and the lid body 3, and the frame body 2 and the lid body 3 The reliability of airtightness can be greatly improved. In addition, since the area of the opening 2b covered by the lid 3 is reduced, it is difficult for moisture to enter from the joint between the frame 2 and the lid 3.

  Further, since the frame body 2 is made of a thermoplastic resin having a water absorption rate of 0.5 to 5%, the printed circuit board 1, the frame body 2, and the lid body 3 are mounted after the solid-state imaging device 5 is mounted on the printed circuit board 1. Even if moisture contained in the atmosphere tries to enter through the frame body 2 into the package 4 configured by hermetically bonding the two, the moisture is blocked by the water absorption characteristics of the resin material, and as a result, enters the package 4. The amount of moisture is suppressed, and moisture that has entered the package 4 is also absorbed into the frame 2 by the water absorption characteristics of the resin material. In this embodiment, since the top surface 2a is provided, the surface area of the thermoplastic resin in the package 4 is increased, and the water absorption is further improved. Therefore, the solid-state imaging device 5 can be operated normally and stably over a long period of time without causing oxidative corrosion on the electrodes of the solid-state imaging device 5 accommodated in the package 4.

  As described above, in this embodiment, since the area of the opening 2b covered by the lid 3 is reduced, it is difficult for moisture to enter from the joint between the frame 2 and the lid 3, and a package generated when the temperature changes. 4 also reduces the pressure due to the expanded air, reduces the undulation generated at the joint between the frame 2 and the lid 3, improves the airtightness of the package 4, and improves the reliability of the video quality. ing.

  The lid 3 is made of a transparent plate material such as glass, and is configured not to block the visual field of the solid-state imaging device 5 while maintaining airtightness. And in this embodiment, by having comprised as mentioned above, the water | moisture content in the package 4 dew condensation by the rapid temperature change, the inner surface of the cover body 3 becomes cloudy, and a defect arises in the picked-up image of the solid-state image sensor 5. Disappear. Further, when glass is used for the lid 3, since the area of the opening 2 b is small, the use of expensive glass can be reduced, and the cost can be reduced.

  Furthermore, by constituting the frame body 2 with a thermoplastic resin having water absorption characteristics, it is possible to achieve the effect of preventing moisture from entering and staying in the package 4 without adding a moisture absorbent or the like at a low cost. In addition, the moldability is also good.

  And since the package 4 is comprised by the printed circuit board 1, the frame body 2, and the cover body 3, it does not require the expensive metal mold | die for simultaneous shaping | molding of a lead frame and resin like the past, and can manufacture at low cost. . In addition, by changing the pattern 1a of the printed circuit board 1, it is possible to deal with the solid-state imaging device 5 of various specifications flexibly and at low cost.

(Embodiment 2)
FIG. 4 shows an embodiment of the solid-state image pickup device storage package of the present invention. The frame 2 is made of a thermoplastic resin having water absorption characteristics such as polyamide and polyphthalamide, and the upper surface of the frame 2 is shown. A cylindrical recess 2c formed on the lower surface of the frame 2 and a partition that is integrally extended from the outer edge of the frame 2 and separates the bottom surfaces of the recesses 2c and 2d. The plate 2e is provided, and the cross section is substantially H-shaped. The lower surface side of the frame 2 is hermetically bonded to the printed circuit board 1 with a thermosetting adhesive such as an epoxy resin, and the solid-state imaging device 5 is accommodated in the recess 2d. The partition plate 2e has an opening 2f formed substantially at the center, and the lid 3 is hermetically bonded to the upper surface side of the opening 2f by a thermosetting adhesive such as an epoxy resin. 2f is covered. Here, the opening 2 f is formed in the visual field direction so as not to block the visual field of the solid-state imaging device 5.

  The side wall 2g of the recess 2c protrudes upward from the peripheral edge of the partition plate 2e, and the lid 3 is surrounded by the side wall 2g to protect the surface thereof. The possibility that the surface of the body 3 is damaged and a captured image is defective is reduced. Therefore, the reliability of the video quality is improved, and it is possible to manufacture at a low cost by reducing defects during manufacturing.

  In this embodiment, the cylindrical lens block 7 is disposed in the recess 2c. At this time, the thread block 2h is threaded on the inner surface of the side wall 2g, so that the thread block 7a is threaded on the outer periphery. Can be screwed into the recess 2c to position the lens block 7 so that the lens block 7 can be adjusted, and the number of positioning parts for the lens block 7 can be reduced, and the cost can be reduced.

  Further, as shown in FIGS. 5A and 5B, if a tapered portion 2 i that spreads toward the solid-state imaging device 5 is formed in the lower portion of the opening 2 f, the light is condensed by the tapered portion 2 i through the lid 3. The emitted light enters the solid-state imaging device 5 while spreading along the tapered portion 2i. By providing the tapered portion 2 i in this manner, the area of the opening 2 f can be made as small as possible while preventing defects such as noise caused by reflection from occurring in the captured image of the solid-state imaging device 5. Therefore, if the area of the opening 2f is small, it is difficult to be affected by the surface state such as the undulation of the bonding portion between the frame 2 and the lid 3 when the frame 2 and the lid 3 are joined. The reliability of the airtightness between the cover 3 and the lid 3 is further improved from that of the first embodiment, and the reliability of the video quality is further improved.

  In addition, the same code | symbol is attached | subjected to the structure similar to Embodiment 1, and description is abbreviate | omitted.

(Embodiment 3)
FIG. 6 shows one embodiment of the solid-state image pickup device storage package of the present invention, which basically has the same configuration as that of the second embodiment, but has a through hole 1c formed in the printed circuit board 1. At the time of joining the printed circuit board 1 and the frame body 2, the through hole 1c is located in the recess 2d. The through hole 1c is gold-plated on the inner surface and the land portion.

  Hereinafter, a method for manufacturing the solid-state imaging device storage package of the present embodiment will be described. First, the solid-state imaging device 5 is die-bonded to the printed circuit board 1, and the electrodes of the solid-state imaging device 5 and the pattern 1 a on the printed circuit board 1 are electrically connected via the bonding wires 6. The frame 2 is hermetically joined with a thermosetting adhesive such as an epoxy resin, and then the frame 2 and the lid 3 are hermetically joined with a thermosetting adhesive such as an epoxy resin. In the first and second embodiments, in such an airtight joining process, the air in the package 4 expands due to heat at the time of curing the adhesive, and this expanded air is between the printed circuit board 1 and the frame body 2 and the frame body. In some cases, an air flow path is formed in the adhesive layer 8 formed between the cover 2 and the lid 3, and it is difficult to stably carry out airtight joining of the package 4. However, in this embodiment, by forming the through hole 1c in the printed circuit board 1, the expanded air in the hermetic bonding process passes through the through hole 1c and is discharged to the outside. Never formed.

  The final hermetic sealing is performed by closing the through hole 1 c with the solder 9. At this time, the area of the through hole 1c is small, the amount of solder heat is small, and the sealing is completed in a short time. Therefore, the expansion amount of air is small, and the hermetic joining of the package 4 can be stably performed. Quality reliability is improved.

  In the next process, when the solid-state image pickup device storage package is carried into the reflow furnace, the solder 9 may be melted during reflow and the airtightness may be deteriorated. In such a case, the temperature is higher than the reflow temperature. By using the solder 9 that melts in this way, it is possible to prevent the deterioration of the airtight characteristics.

  In addition, the same code | symbol is attached | subjected to the structure similar to Embodiment 2, and description is abbreviate | omitted.

(Embodiment 4)
FIG. 7 shows an embodiment of the solid-state image pickup device storage package according to the present invention, which basically has the same configuration as that of the second embodiment, but the partition plate 2e of the frame 2 has a recess 2c and a recess. A through hole 2j that connects 2d is formed so as to deviate from the covering position of the lid 3.

  Hereinafter, a method for manufacturing the solid-state imaging device storage package of the present embodiment will be described. First, the solid-state imaging device 5 is die-bonded to the printed circuit board 1, and the electrodes of the solid-state imaging device 5 and the pattern 1 a on the printed circuit board 1 are electrically connected via the bonding wires 6. The frame 2 is hermetically joined with a thermosetting adhesive such as an epoxy resin, and then the frame 2 and the lid 3 are hermetically joined with a thermosetting adhesive such as an epoxy resin. In the first and second embodiments, in such an airtight joining process, the air in the package 4 expands due to heat at the time of curing the adhesive, and this expanded air is between the printed circuit board 1 and the frame body 2 and the frame body. In some cases, an air flow path is formed in the adhesive layer 8 formed between the cover 2 and the lid 3, and it is difficult to stably carry out airtight joining of the package 4. However, in the present embodiment, by forming the through hole 2j in the frame body 2, the expanded air in the hermetic joining process passes through the through hole 2j and is discharged to the outside. Never formed.

  Then, the final hermetic sealing is performed by forming the heat-sealed portion 10 in which the through-hole 2j is fused by heat and closing the through-hole 2j with the heat-fused portion 10. At this time, since the area of the through-hole 2j is small, the heat of fusion is small, and the sealing is completed in a short time, the amount of expansion of air is small, and the package 4 can be stably sealed. Reliability of video quality has been improved.

  In addition, the same code | symbol is attached | subjected to the structure similar to Embodiment 2, and description is abbreviate | omitted.

(Embodiment 5)
FIG. 8 shows an embodiment of the solid-state image pickup device storage package of the present invention, which basically has the same configuration as that of the second embodiment, but the frame body 2 is formed on the printed circuit board 1 before the airtight joining. The B-stage adhesive layer 11 is formed on the airtight joint surface with the lid 3 and the airtight joint surface with the lid 3.

  Hereinafter, a method for manufacturing the solid-state imaging device storage package of the present embodiment will be described. First, the solid-state imaging device 5 is die-bonded to the printed circuit board 1, and the electrodes of the solid-state imaging device 5 and the pattern 1 a on the printed circuit board 1 are electrically connected via bonding wires 6. Next, after forming the B-stage adhesive layer 11 on the joint surface of the frame body 2 to the printed circuit board 1 and the joint surface of the frame body 2 to the lid body 3, the printed circuit board 1 and the lid are attached to the frame body 2. The body 3 is hermetically joined at the same time.

  Here, the B-stage adhesive layer 11 is a semi-cured adhesive layer, and by designing and adjusting the shape of the B-stage adhesive layer 11, the printed circuit board 1 and the frame body 2 and the frame body 2 and the lid body. It is possible to control the flow path of the expanded air generated when the 3 is hermetically bonded, and it is possible to efficiently prevent defects in the adhesive layer due to the expanded air during the hermetic bonding, thereby stabilizing the hermetic bonding of the package 4. The reliability of video quality is improved. In addition, sagging that occurs when a liquid adhesive is used, variation in the amount of adhesive, area variation, and the like can be suppressed, and stable production becomes possible. Furthermore, since the printed circuit board 1 and the frame body 2 and the frame body 2 and the lid body 3 can be hermetically bonded at the same time, the manufacturing time can be shortened and the cost can be reduced accordingly.

  In addition, the same code | symbol is attached | subjected to the structure similar to Embodiment 2, and description is abbreviate | omitted.

(Embodiment 6)
FIG. 9 shows one state in the assembly process of the solid-state image pickup device storage package of the present invention. The solid-state image pickup device storage package has the same configuration as that of the first embodiment. In the present embodiment, as shown in FIG. 9, in the assembly process, a plurality of frames 2 and lids 3 are joined on one printed circuit board portion 1 ′ integrally formed with a plurality of printed circuit boards 1. Finally, the printed circuit board portion 1 ′ is cut and separated for each solid-state image pickup device storage package.

  In general, the through-hole and the cut surface in the surface of the printed circuit board portion 1 ′ are covered with gold plating or the like, but the side edge (outermost peripheral surface) of the printed circuit board portion 1 ′ is a cut surface with the substrate member exposed as it is. ing. From the cut surface of the printed circuit board part 1 'side edge, dust such as glass fiber and molding powder contained in the printed circuit board part 1' is generated, and dust is generated at the time of assembly even if cleaning is performed carefully. When the dust adheres to the surface of the solid-state image sensor 5, there is a defect that black spots or the like appear in the captured image of the solid-state image sensor 5.

  Therefore, in the present embodiment, by covering the side edge of the printed circuit board portion 1 ′ with a material 12 that does not generate dust such as plating or adhesive, glass fiber or molding powder from the cut surface of the side edge of the printed circuit board portion 1 ′ is used. The generation of dust is suppressed. Therefore, it is possible to prevent defects such as black spots in the captured image of the solid-state imaging device 5 generated by dust adhering to the surface of the solid-state imaging device 5, and the reliability of video quality is improved.

  In this embodiment, the solid-state image sensor housing package having the same configuration as that of the first embodiment has been described. However, any of the solid-state image sensor housing packages of the second to fifth embodiments may be configured in the same manner as described above. Similar effects can be achieved.

(Embodiment 7)
10 (a) and 10 (b) show one state in the assembly process of the solid-state image pickup device storage package of the present invention. In the sixth embodiment, the glass fiber from the cut surface of the printed circuit board portion 1 'side edge is shown. In order to suppress the generation of dust such as molding powder or the like, the side edge of the printed circuit board 1 'is covered with a material 12 that does not generate dust such as plating or adhesive. By placing the printed circuit board portion 1 ′ on the bottom surface 13 a of the jig 13 and placing the side edge 1 d of the printed circuit board portion 1 ′ against the inner surface of the jig 13, dust such as glass fiber and molding powder To improve the reliability of video quality. Since the jig 13 is made of a material that does not generate dust and is configured to be detachable from the jig 12, it can be reused and dust can be suppressed at low cost.

  Note that the jig 13 may be formed in a frame shape, and the printed board portion 1 ′ may be fitted into the frame so that the side edge 1 d of the printed board portion 1 ′ is brought into contact with the inner side surface of the jig 13.

(Embodiment 8)
FIG. 11 shows an example of a solid-state image pickup device storage package according to the present invention. The package basically has the same configuration as that of the second embodiment, but a positioning through-hole 14 is formed in the printed circuit board 1. A positioning pin 15 is formed on the lower surface of the frame 2. When the printed circuit board 1 and the frame body 2 are joined, the positioning pins 15 are fitted into the positioning through holes 14 so that the printed circuit board 1 and the frame body 2 can be positioned with high accuracy. Work can be performed with high accuracy in a short time.

  In addition, the inner surface of the through hole 14 is gold-plated, so that generation of dust such as glass fiber and molding powder from the inner surface of the through hole 14 can be suppressed, and the reliability of the video quality is improved and the product is defective. Is prevented.

(Embodiment 9)
FIG. 12 shows one state in the manufacturing process of the solid-state image sensor housing package of the present invention. The solid-state image sensor housing package has the same configuration as that of the first embodiment. In the present embodiment, as shown in FIG. 12, a pattern on which a plurality of solid-state imaging devices 5 can be mounted is formed on a single printed circuit board portion 1 ′ in which a plurality of printed circuit boards 1 are integrally formed. The solid-state imaging device 5 is die-bonded to the printed board portion 1 ′, and the electrodes of each solid-state imaging device 5 and the patterns 1 a on the printed board portion 1 ′ are electrically connected via bonding wires 6. Then, a printed circuit board portion 1 ′, a frame portion 2 ′ in which a plurality of frames 2 corresponding to the respective solid-state imaging elements 5 are integrally formed, and a lid that collectively covers the opening 2 b of each frame 2. After airtightly bonding the body part 3 with a thermosetting adhesive such as an epoxy resin, the printed circuit board part 1 ′, the frame part 2 ′, and the lid part along the cutting portion X in FIG. By cutting 3 ′ at the same time, each solid-state image pickup device storage package is separated. By adopting such a manufacturing method, the part cost and the assembly cost can be significantly reduced.

It is side surface sectional drawing which shows the solid-state image sensor accommodation package of Embodiment 1 of this invention. The external appearance is shown (a) side view and (b) is a bottom view. It is a top view in the state where the same lid was removed. It is the disassembled perspective view partly fractured | ruptured which shows the solid-state image sensor accommodation package of Embodiment 2 of this invention. The other solid-state image sensor accommodation package in the state which removed the lens block same as the above is shown, (a) is a top view, (b) is side sectional drawing. It is side surface sectional drawing which shows the package for solid-state image sensor accommodation of Embodiment 3 of this invention. It is side surface sectional drawing which shows the package for solid-state image sensor accommodation of Embodiment 4 of this invention. It is side surface sectional drawing which shows the package for solid-state image sensor accommodation of Embodiment 5 of this invention. It is a perspective view which shows the manufacturing method of the package for solid-state image sensor accommodation of Embodiment 6 of this invention. FIGS. 8A and 8B show a method for manufacturing a solid-state image pickup device storage package according to a seventh embodiment of the present invention, where FIG. 9A shows a state before mounting a jig, and FIG. It is side surface sectional drawing which shows the package for solid-state image sensor accommodation of Embodiment 8 of this invention. It is a perspective view which shows the manufacturing method of the package for solid-state image sensor accommodation of Embodiment 9 of this invention. It is side surface sectional drawing which shows the conventional package for solid-state image sensor accommodation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 1b Terminal 2 Frame body 20 Frame part 2a Top surface 2b Opening part 3 Cover body 4 Package 5 Solid-state image sensor 6 Bonding wire

Claims (10)

A printed circuit board on which a solid-state image sensor is mounted and terminals that are electrically connected to the electrodes of the solid-state image sensor are formed, and the solid-state image sensor is accommodated in an airtight connection to the printed circuit board to form an opening in the visual field direction of the solid-state image sensor A frame made of thermoplastic resin and a transparent lid that covers the opening, the opening being formed in a plane extending from the outer edge of the frame into the frame, and the lid A solid-state image pickup device storage package, wherein the body is hermetically bonded to the surface. The solid-state image pickup device storage package according to claim 1, wherein the frame body forms a wall portion protruding outward so as to surround a lid body that covers the opening portion. 3. The solid-state image sensor housing package according to claim 1, wherein the opening is formed in a tapered shape that widens toward a side housing the solid-state image sensor. 4. The method of manufacturing a solid-state image pickup device storage package according to claim 1, wherein the printed circuit board is formed with a through hole in a portion inside a joint portion with the frame body, and the printed circuit board, the frame body, the frame body, and the lid body. And a through hole is hermetically sealed with solder, and then a method for manufacturing a solid-state image pickup device storage package. 4. The method for manufacturing a solid-state image pickup device storage package according to claim 1, wherein the frame is formed with a through hole that continues a space containing the solid-state image pickup device to the outside, and the printed circuit board, the frame, and the frame A method for manufacturing a solid-state imaging device storage package, wherein after sealing each of the lids, the through holes are hermetically sealed by heat sealing. 4. The method of manufacturing a solid-state image pickup device storage package according to claim 1, wherein the frame includes a B-stage thermosetting adhesive layer on the bonding surface with the printed circuit board and the bonding surface with the lid. A method of manufacturing a solid-state imaging device storage package, wherein the solid-state image pickup device package is formed and airtight joining between the frame body and the printed circuit board and airtight joining between the frame body and the lid body are simultaneously performed. 4. The method for manufacturing a solid-state image pickup device storage package according to claim 1, wherein the side edge of the printed circuit board is covered with a substance that does not generate dust at least in an assembly process. 8. The solid-state imaging device storage package according to claim 7, wherein the side edge of the printed circuit board is covered with a jig formed of a material that is detachable from the side edge of the printed circuit board and does not generate dust at least in an assembly process. Method. 4. The method of manufacturing a solid-state image pickup device storage package according to claim 1, wherein a plated through hole is formed on the printed circuit board, and a projection that fits into the through hole is formed on the frame body, The method of manufacturing a solid-state imaging device storage package, wherein the positioning of the substrate and the frame is performed by fitting the protrusion into the through hole. 4. The method of manufacturing a solid-state image pickup device storage package according to claim 1, wherein a plurality of solid-state image pickup devices are mounted on a printed circuit board portion integrally formed with a plurality of print boards, and the electrodes of the respective solid-state image pickup devices are provided. By electrically connecting to each terminal, and then airtightly joining the frame body part integrally formed with the printed circuit board part and the plurality of frame bodies, and the frame body part and the lid body part covering the whole frame body part, respectively. Each solid-state imaging device is accommodated in each frame, and the lid is covered with the opening of each frame, and then the printed circuit board, the frame, and the lid are cut at the same time. A method for manufacturing a solid-state image pickup device storage package, wherein the solid-state image pickup device storage package is separated into an image pickup device storage package.

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