JP2005342561A - Slit coating type coater - Google Patents

Slit coating type coater Download PDF

Info

Publication number
JP2005342561A
JP2005342561A JP2004162045A JP2004162045A JP2005342561A JP 2005342561 A JP2005342561 A JP 2005342561A JP 2004162045 A JP2004162045 A JP 2004162045A JP 2004162045 A JP2004162045 A JP 2004162045A JP 2005342561 A JP2005342561 A JP 2005342561A
Authority
JP
Japan
Prior art keywords
substrate
coating
solution
holding member
coating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004162045A
Other languages
Japanese (ja)
Other versions
JP4424482B2 (en
JP2005342561A5 (en
Inventor
Shinya Momose
信也 百瀬
Takayuki Suzuki
崇之 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2004162045A priority Critical patent/JP4424482B2/en
Publication of JP2005342561A publication Critical patent/JP2005342561A/en
Publication of JP2005342561A5 publication Critical patent/JP2005342561A5/ja
Application granted granted Critical
Publication of JP4424482B2 publication Critical patent/JP4424482B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Coating Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a slit coating type coater permitting formation of a coating film of a uniform film thickness without adverse effects on surroundings. <P>SOLUTION: The coater has a holding table 20 holding a substrate 1 on the vertically lower plane and a coating head 30 arranged so as to oppose the surface of the substrate 1 held on the table 20 and having a slit-shaped nozzle opening 31 allowing a specified coating solution 2 to flow toward the surface of the substrate 1. The coater applies the solution 2 onto the surface of the substrate 1 by moving the table 20 and the head 30 relatively in the horizontal direction. A liquid-retaining member 50 which retains a liquid 3 containing at least the same solvent as the principal solvent of the solution 2 in the recessed part 51 opening on the side of the substrate 1 is arranged so as to lie in the vicinity of the head 30 and oppose the substrate 1 applied with the solution 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ノズルの先端から所定の溶液を流出して基板の表面に溶液を均一に塗布するスリットコート式塗布装置に関する。   The present invention relates to a slit coat type coating apparatus that causes a predetermined solution to flow out from the tip of a nozzle and uniformly coat the solution on the surface of a substrate.

半導体ウェハやガラス基板等の基板にレジスト材料や絶縁材料などの所定の溶液(溶剤)を塗布する塗布装置としては、例えば、毛細管現象によりノズルの先端から溶液を流出させて、基板の表面に溶液を塗布するスリットコート式塗布装置がある(例えば、特許文献1参照)。また、その他に、例えば、ゴムロールからなる塗布ロール部に溶液を付着させ、塗布ロール部に付着した溶液を基板上に塗布するロール塗布装置等もある(例えば、特許文献2参照)。   As a coating apparatus for applying a predetermined solution (solvent) such as a resist material or an insulating material to a substrate such as a semiconductor wafer or a glass substrate, for example, the solution is caused to flow out from the tip of a nozzle by capillary action, and the solution is applied to the surface of the substrate. There is a slit coat type coating apparatus for coating (see, for example, Patent Document 1). In addition, for example, there is a roll coating apparatus that attaches a solution to a coating roll unit made of a rubber roll and coats the solution adhered to the coating roll unit on a substrate (for example, see Patent Document 2).

なお、このような塗布装置によって基板の表面に全面に亘って溶液を塗布した後は、一般的に、例えば、ホットプレート上にこの基板を配置して塗布した溶液を乾燥させることによって基板表面に塗布膜を形成している。   After applying the solution over the entire surface of the substrate with such a coating apparatus, generally, for example, by placing the substrate on a hot plate and drying the applied solution, the substrate surface is dried. A coating film is formed.

そして、このような塗布装置においては、基板に塗布された溶液が塗布直後から乾燥し始めてしまうため、乾燥ムラやひけ等が発生してしまうという問題がある。特に、使用する溶液の粘度が比較的低い材料を用いて薄い膜厚の塗布膜を形成する場合、このような問題が顕著に表れる。   And in such a coating device, since the solution apply | coated to the board | substrate begins to dry immediately after application | coating, there exists a problem that a drying nonuniformity, a sink, etc. generate | occur | produce. In particular, when a thin coating film is formed using a material having a relatively low viscosity of the solution to be used, such a problem appears remarkably.

このような問題を解決するための構成として、例えば、特許文献2には、塗布ロール部の周囲を溶剤揮散防止カバーで覆い、この溶剤揮散防止カバー内に溶剤を噴霧する溶剤噴霧ノズルを設けた構造、あるいは溶剤揮散防止カバー内に溶剤が入った溶剤揮発皿を配置し溶剤揮発皿を加熱するようにした構造が開示されている。   As a configuration for solving such a problem, for example, Patent Document 2 includes a solvent spray nozzle that covers the periphery of the coating roll portion with a solvent volatilization prevention cover and sprays the solvent in the solvent volatilization prevention cover. There is disclosed a structure or a structure in which a solvent volatilization dish containing a solvent is disposed in a solvent volatilization prevention cover and the solvent volatilization dish is heated.

このような構造を採用することで、基板に塗布される溶液(溶剤)の乾燥は抑えられるかもしれない。しかしながら、溶剤揮散防止カバー内全体に揮発した溶剤が充満するため、例えば、まだ溶液が塗布されていない基板等に悪影響を及ぼし、塗布膜にピンホールが形成される等の製造不良が生じる虞がある。また、このような構造では、溶剤揮散防止カバー内という比較的広い空間内に揮発した溶剤を充満させるため、周囲の環境や、作業者等に悪影響を及ぼす虞があるという問題もある。   By adopting such a structure, drying of the solution (solvent) applied to the substrate may be suppressed. However, the solvent volatilization prevention cover is filled with the volatilized solvent, which may adversely affect the substrate on which the solution has not yet been applied, and may cause manufacturing defects such as the formation of pinholes in the coating film. is there. Moreover, in such a structure, since the solvent which volatilized in the comparatively wide space called the inside of a solvent volatilization prevention cover is filled, there also exists a problem that there exists a possibility of having a bad influence on the surrounding environment, an operator, etc.

特開平6−343908号公報(第1〜2図、第2〜4頁)JP-A-6-343908 (FIGS. 1-2 and 2-4) 特開平7−47315号公報(第1〜2図、第3〜4頁)Japanese Patent Laid-Open No. 7-47315 (FIGS. 1-2 and 3-4)

本発明はこのような事情に鑑み、周囲の環境に悪影響を与えることなく、均一な膜厚の塗布膜を形成することができるスリットコート式塗布装置を提供することを課題とする。   In view of such circumstances, an object of the present invention is to provide a slit coat type coating apparatus capable of forming a coating film having a uniform film thickness without adversely affecting the surrounding environment.

上記課題を解決する本発明の第1の態様は、基板を保持する保持テーブルと該保持テーブルに保持された前記基板の表面に相対向するように配置されると共に当該基板の表面に向かって所定の塗布溶液を流出するスリット状のノズル開口を有する塗布ヘッドとを具備して前記保持テーブルと前記塗布ヘッドとが水平方向で相対的に移動することで前記基板の表面に前記塗布溶液が塗布され、且つ前記塗布ヘッドに近接すると共に前記塗布溶液が塗布された前記基板に対向するように配置され、前記基板側に開口する凹部に少なくとも前記塗布溶液の主溶剤と同一の主溶剤を含む液体が保持される液体保持部材を有することを特徴とするスリットコート式塗布装置にある。
かかる第1の態様では、塗布溶液が塗布された基板が液体保持部材上に移動し、液体保持部材内の液体から溶剤が揮発することで、基板に塗布された塗布溶液の乾燥が抑えられる。
According to a first aspect of the present invention for solving the above-mentioned problems, a holding table for holding a substrate and a surface of the substrate held by the holding table are arranged so as to face each other and predetermined toward the surface of the substrate. A coating head having a slit-like nozzle opening for discharging the coating solution, and the holding table and the coating head are relatively moved in the horizontal direction so that the coating solution is coated on the surface of the substrate. And a liquid containing at least the same main solvent as the main solvent of the coating solution is disposed in the concave portion that is disposed close to the coating head and faces the substrate on which the coating solution has been coated, and opens to the substrate side. A slit coat type coating apparatus having a liquid holding member to be held.
In the first aspect, the substrate coated with the coating solution moves onto the liquid holding member, and the solvent is volatilized from the liquid in the liquid holding member, so that drying of the coating solution applied to the substrate is suppressed.

本発明の第2の態様は、第1の態様において、前記液体保持部材が鉛直方向に移動可能に設けられていることを特徴とするスリットコート式塗布装置にある。
かかる第2の態様では、液体保持部材を上下方向に移動させることで、基板の近傍雰囲気を、所望の溶剤濃度に調整することができる。
According to a second aspect of the present invention, there is provided the slit coat type coating apparatus according to the first aspect, wherein the liquid holding member is provided so as to be movable in a vertical direction.
In the second aspect, the atmosphere near the substrate can be adjusted to a desired solvent concentration by moving the liquid holding member in the vertical direction.

本発明の第3の態様は、第2の態様において、前記基板の表面近傍雰囲気の少なくとも前記主溶剤の濃度を検出する検出手段と、該検出手段の検出結果に応じて前記液体保持部材の上下方向の移動を制御する移動手段とをさらに具備することを特徴とするスリットコート式塗布装置にある。
かかる第3の態様では、基板の表面近傍雰囲気の主溶剤等の溶剤濃度を、自動的に、常に一定に維持することができる。
According to a third aspect of the present invention, in the second aspect, the detection means for detecting at least the concentration of the main solvent in the atmosphere near the surface of the substrate, and the upper and lower sides of the liquid holding member according to the detection result of the detection means. The slit coat type coating apparatus further comprises a moving means for controlling the movement of the direction.
In the third aspect, the concentration of the solvent such as the main solvent in the atmosphere near the surface of the substrate can be automatically maintained constantly.

本発明の第4の態様は、第1〜3の何れかの態様において、前記液体保持部材が、前記凹部の開口を開閉可能に設けられた開閉部材を具備することを特徴とするスリットコート式塗布装置にある。
かかる第4の態様では、所定のタイミングで開閉部材を開閉させることで、基板近傍雰囲気を、所望の溶剤濃度に調整することができる。
According to a fourth aspect of the present invention, in any one of the first to third aspects, the liquid holding member includes an opening / closing member provided to open and close the opening of the recess. In the applicator.
In the fourth aspect, the atmosphere in the vicinity of the substrate can be adjusted to a desired solvent concentration by opening and closing the opening / closing member at a predetermined timing.

本発明の第5の態様は、第4の態様において、前記基板の表面近傍雰囲気の少なくとも前記主溶剤の濃度を検出する検出手段と、該検出手段の検出結果に応じて前記液体保持部材の前記開閉部材の駆動を制御する駆動手段とをさらに具備することを特徴とするスリットコート式塗布装置にある。
かかる第5の態様では、基板の表面近傍雰囲気の溶剤濃度を、自動的に、常に一定に維持することができる。
According to a fifth aspect of the present invention, in the fourth aspect, the detection means for detecting at least the concentration of the main solvent in the atmosphere near the surface of the substrate, and the liquid holding member according to the detection result of the detection means. The slit coat type coating apparatus further comprises driving means for controlling driving of the opening / closing member.
In the fifth aspect, the solvent concentration in the atmosphere in the vicinity of the surface of the substrate can be automatically and always maintained constant.

以下に本発明を実施形態に基づいて詳細に説明する。
(実施形態1)
図1は、本発明の実施形態1に係るスリットコート式塗布装置の概略構成を示す斜視図であり、図2は、スリットコート式塗布装置の要部断面図である。図1に示すように、スリットコート式塗布装置10は、シリコンウェハ、半導体基板等の基板1が保持される保持テーブル20と、保持テーブル20の基板1側に設けられる塗布ヘッド30と、基板1に塗布する塗布溶液2を塗布ヘッド30に供給する貯留手段40と、凹部51に所定の液体3が保持される液体保持部材50とを具備する。なお、図示しないが、これら保持テーブル20、塗布ヘッド30、貯留手段40及び液体保持部材50等は、所定の封止空間内に配置されている。
Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is a perspective view showing a schematic configuration of a slit coat type coating apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of a main part of the slit coat type coating apparatus. As shown in FIG. 1, a slit coat type coating apparatus 10 includes a holding table 20 that holds a substrate 1 such as a silicon wafer or a semiconductor substrate, a coating head 30 provided on the substrate 1 side of the holding table 20, and a substrate 1. A storage means 40 for supplying the coating solution 2 to be applied to the coating head 30, and a liquid holding member 50 for holding the predetermined liquid 3 in the recess 51. Although not shown, the holding table 20, the coating head 30, the storage unit 40, the liquid holding member 50, and the like are arranged in a predetermined sealing space.

保持テーブル20は、鉛直方向下側の面に、基板1をその表面が鉛直方向下向きとなるように保持する。この保持テーブル20による基板1の保持方法は、特に限定されず、例えば、真空ポンプ等の吸引による方法が挙げられる。なお、保持テーブル20は、例えば、図示しない駆動モータ等のテーブル駆動手段によって基板1の面方向に沿って直線移動自在に設けられている。   The holding table 20 holds the substrate 1 on the lower surface in the vertical direction so that the surface thereof faces downward in the vertical direction. The method for holding the substrate 1 by the holding table 20 is not particularly limited, and examples thereof include a method using suction such as a vacuum pump. The holding table 20 is provided so as to be linearly movable along the surface direction of the substrate 1 by a table driving means such as a driving motor (not shown).

塗布ヘッド30は、鉛直方向上側に向かって開口し貯留手段40から供給された塗布溶液2を流出するスリット状のノズル開口31と、このノズル開口31に連通する溶液溜まり部32とを有する。また、塗布ヘッド30は、図示しない装置本体に鉛直方向に移動自在に保持されており、塗布ヘッド30の先端と基板1の表面との間隔が、例えば、塗布溶液2の動粘度、塗布溶液2の基板1に対する濡れ性、基板1に塗布する塗布溶液2の厚さ等を考慮して適宜調整されるようになっている。   The coating head 30 has a slit-like nozzle opening 31 that opens upward in the vertical direction and flows out the coating solution 2 supplied from the storage means 40, and a solution reservoir 32 that communicates with the nozzle opening 31. Further, the coating head 30 is held by a device body (not shown) so as to be movable in the vertical direction, and the distance between the tip of the coating head 30 and the surface of the substrate 1 is, for example, the kinematic viscosity of the coating solution 2 or the coating solution 2. In consideration of the wettability with respect to the substrate 1, the thickness of the coating solution 2 applied to the substrate 1, and the like are adjusted as appropriate.

貯留手段40は、塗布溶液2を保持する貯留タンク41と、一端が塗布ヘッド30に接続され、他端が貯留タンク41に接続される供給管42とで構成され、貯留タンク41の内部に貯留されている塗布溶液2を、供給管42を介して塗布ヘッド30に供給する。   The storage unit 40 includes a storage tank 41 that holds the coating solution 2, and a supply pipe 42 that has one end connected to the coating head 30 and the other end connected to the storage tank 41. The applied coating solution 2 is supplied to the coating head 30 via the supply pipe 42.

この貯留手段40の貯留タンク41から供給管42を介して塗布ヘッド30に塗布溶液2が供給され、塗布ヘッド30の溶液溜まり部32内に塗布溶液2が充填されると、溶液溜まり部32内の塗布溶液2が毛細管現象によってノズル開口31の先端まで上昇する。これにより、スリット状のノズル開口31には、塗布溶液2が全体に均一に充填されるようになっている。そして、この状態から塗布ヘッド30を上昇させてノズル開口31から突出した塗布溶液2を基板1の表面に接触させ、この状態で、保持テーブル20と塗布ヘッド30とを基板1の面方向において相対的に移動させる。例えば、本実施形態では、塗布ヘッド30を固定して保持テーブル20を基板1の面方向に直線移動させることで、これら塗布ヘッド30と保持テーブル20とを相対的に移動させている。これにより、ノズル開口31から塗布溶液2が連続的に流出し、基板1の表面には塗布溶液2が均一な厚さで塗布される。   When the coating solution 2 is supplied from the storage tank 41 of the storage means 40 to the coating head 30 via the supply pipe 42 and the coating solution 2 is filled into the solution pool 32 of the coating head 30, the inside of the solution pool 32 The coating solution 2 rises to the tip of the nozzle opening 31 by capillary action. As a result, the coating solution 2 is uniformly filled in the slit-shaped nozzle openings 31. Then, the coating head 30 is raised from this state and the coating solution 2 protruding from the nozzle opening 31 is brought into contact with the surface of the substrate 1. In this state, the holding table 20 and the coating head 30 are relative to each other in the surface direction of the substrate 1. Move. For example, in the present embodiment, the coating head 30 is fixed and the holding table 20 is linearly moved in the surface direction of the substrate 1, so that the coating head 30 and the holding table 20 are relatively moved. As a result, the coating solution 2 continuously flows out from the nozzle opening 31, and the coating solution 2 is applied to the surface of the substrate 1 with a uniform thickness.

また、保持テーブル20の基板1側には、塗布ヘッド30及び貯留手段40と共に、この塗布ヘッド30に近接して液体保持部材50が設けられている。この液体保持部材50は、基板1に対向する面側、すなわち、鉛直方向上側が開口する凹部51を有し、この凹部51内には、少なくとも塗布溶液2の主溶剤と同一の主溶剤を含む液体3が保持されている。例えば、本実施形態では、液体保持部材50の凹部51に、塗布溶液2そのものである液体3を溜めておくようにしている。なお、液体保持部材50の凹部51に溜めておく液体3としては、勿論、塗布溶液2の主溶剤のみからなるものであってもよい。   In addition, a liquid holding member 50 is provided on the substrate 1 side of the holding table 20 together with the application head 30 and the storage unit 40 in the vicinity of the application head 30. The liquid holding member 50 has a concave portion 51 that opens on the surface facing the substrate 1, that is, on the upper side in the vertical direction, and the concave portion 51 contains at least the same main solvent as the main solvent of the coating solution 2. Liquid 3 is retained. For example, in this embodiment, the liquid 3 that is the coating solution 2 itself is stored in the recess 51 of the liquid holding member 50. Of course, the liquid 3 stored in the recess 51 of the liquid holding member 50 may be composed only of the main solvent of the coating solution 2.

そして、このような液体保持部材50は、塗布ヘッド30に近接して設けられ、基板1に塗布溶液2を塗布する際に、塗布溶液2が塗布された基板1に対向するように配置されている。なお、このような液体保持部材50は、上下方向(鉛直方向)に移動可能に図示しない装置本体に固定されており、この液体保持部材50を上下方向に移動させることで、液体保持部材50と基板1の表面との間隔を調整できるようになっている。   Such a liquid holding member 50 is provided close to the coating head 30 and is disposed so as to face the substrate 1 to which the coating solution 2 is applied when the coating solution 2 is applied to the substrate 1. Yes. Such a liquid holding member 50 is fixed to an apparatus main body (not shown) so as to be movable in the vertical direction (vertical direction). By moving the liquid holding member 50 in the vertical direction, the liquid holding member 50 and The distance from the surface of the substrate 1 can be adjusted.

このような液体保持部材50を具備する本発明に係るスリットコート式塗布装置では、液体保持部材50の凹部51に保持された液体3の溶剤が揮発することで、塗布溶液2が塗布された基板1の近傍雰囲気に含まれる溶剤濃度、例えば、塗布溶液2の主溶剤の濃度を、所望の濃度に維持する。なお、基板1の近傍雰囲気の溶剤濃度は、本実施形態では、液体保持部材50を上下方向に移動させることで調整している。これにより、基板1に塗布された塗布溶液2の乾燥を防止することができ、塗布溶液2の乾きムラや塗布ムラ、ひけ等の発生を防止することができる。さらに、塗布ヘッド30のノズル開口31先端の乾き、すなわち、ノズル開口31から突出している塗布溶液2の乾燥も防止できるため、より良好に塗布溶液2を基板1に塗布することができる。   In the slit coat type coating apparatus according to the present invention having such a liquid holding member 50, the substrate on which the coating solution 2 is applied by volatilization of the solvent of the liquid 3 held in the recess 51 of the liquid holding member 50. The concentration of the solvent contained in the atmosphere near 1, for example, the concentration of the main solvent of the coating solution 2 is maintained at a desired concentration. In the present embodiment, the solvent concentration in the atmosphere near the substrate 1 is adjusted by moving the liquid holding member 50 in the vertical direction. Thereby, it is possible to prevent the coating solution 2 applied to the substrate 1 from being dried, and it is possible to prevent the coating solution 2 from being dried, uneven coating, sink marks, and the like. Furthermore, the tip of the nozzle opening 31 of the coating head 30 can be prevented from being dried, that is, the coating solution 2 protruding from the nozzle opening 31 can be prevented from being dried, so that the coating solution 2 can be applied to the substrate 1 more favorably.

なお、このような液体保持部材50の凹部51は、特に限定されないが、例えば、塗布溶液2を塗布する基板1と同程度の面積を有していることが好ましい。また、凹部51は、所定量の液体3を保持できる程度に比較的浅く形成されていることが好ましい。これにより、基板1の近傍雰囲気の溶剤濃度を比較的容易に所定の濃度に調整できる。   In addition, although the recessed part 51 of such a liquid holding member 50 is not specifically limited, For example, it is preferable that it has an area comparable as the board | substrate 1 which apply | coats the coating solution 2. FIG. Moreover, it is preferable that the recessed part 51 is comparatively shallowly formed so that predetermined amount of the liquid 3 can be hold | maintained. Thereby, the solvent concentration in the atmosphere in the vicinity of the substrate 1 can be adjusted to a predetermined concentration relatively easily.

また、本実施形態では、凹部51内の液体3の溶剤を自然揮発させているが、これに限定されず、例えば、凹部51の下部からエアーを送ったり、液体保持部材50を加熱したりすることで、液体3の溶剤を強制的に揮発させるようにしてもよい。   In the present embodiment, the solvent of the liquid 3 in the recess 51 is volatilized naturally. However, the present invention is not limited to this. For example, air is sent from the lower portion of the recess 51 or the liquid holding member 50 is heated. Thus, the solvent of the liquid 3 may be forcibly volatilized.

また、このような液体保持部材50と塗布ヘッド30との間には、本実施形態では、基板1の表面に接触することなく基板1の表面の一部を覆うように遮蔽板60が設けられている。すなわち、この遮蔽板60により、基板1の下側の空間を塗布ヘッド30と液体保持部材50の間で遮るようにしている。これにより、基板1が保持された保持テーブル20を移動させる際、この移動に伴う空気の流れによって塗布ヘッド30のノズル開口31先端部が乾いてしまうのを防止することができる。   In this embodiment, a shielding plate 60 is provided between the liquid holding member 50 and the coating head 30 so as to cover a part of the surface of the substrate 1 without contacting the surface of the substrate 1. ing. That is, the shielding plate 60 shields the lower space of the substrate 1 between the coating head 30 and the liquid holding member 50. Thereby, when the holding table 20 holding the substrate 1 is moved, it is possible to prevent the tip of the nozzle opening 31 of the coating head 30 from being dried by the air flow accompanying the movement.

以下、このようなスリットコート式塗布装置10を用いたスリットコート式塗布方法について詳しく説明する。なお、図3は、スリットコート式塗布装置の動作を示す概略図である。まず、図3(a)に示すように、保持テーブル20の下面に基板1を固定し、塗布ヘッド30を上昇させて基板1の表面と塗布ヘッド30のノズル開口31の先端面との間隔が所定の間隔となるように調整する。具体的には、ノズル開口31から突出する塗布溶液2の先端部が、基板1の表面の位置よりも若干高い位置となるように塗布ヘッド30を上昇させる。なお、本実施形態では、塗布ヘッド30を移動させることで、塗布ヘッド30と基板1との間隔を調整しているが、勿論、塗布ヘッド30を固定して、保持テーブル20を移動するようにしてもよい。   Hereinafter, the slit coat type coating method using such a slit coat type coating apparatus 10 will be described in detail. FIG. 3 is a schematic view showing the operation of the slit coat type coating apparatus. First, as shown in FIG. 3A, the substrate 1 is fixed to the lower surface of the holding table 20, the coating head 30 is raised, and the distance between the surface of the substrate 1 and the tip surface of the nozzle opening 31 of the coating head 30 is set. Adjust so that it is at a predetermined interval. Specifically, the coating head 30 is raised so that the tip of the coating solution 2 protruding from the nozzle opening 31 is slightly higher than the position of the surface of the substrate 1. In this embodiment, the distance between the coating head 30 and the substrate 1 is adjusted by moving the coating head 30. Of course, the coating head 30 is fixed and the holding table 20 is moved. May be.

次に、図3(b)に示すように、図示しないテーブル駆動手段によって保持テーブル20を基板1の面方向、すなわち水平方向に直線移動させることで、塗布ヘッド30のノズル開口31から突出している塗布溶液2が基板1の表面に接触することで、塗布溶液2の塗布が開始される。ここで、上述したように、保持テーブル20の移動に伴う基板1の下側の空気の流れが、遮蔽板60によって遮断されている。すなわち、遮蔽板60によって、ノズル開口31の先端から突出している塗布溶液2の乾燥が抑えられているため、保持テーブル20の移動により塗布溶液2が基板1に確実に接触して、基板1への塗布溶液2の塗布が開始される。   Next, as shown in FIG. 3B, the holding table 20 protrudes from the nozzle opening 31 of the coating head 30 by linearly moving the holding table 20 in the surface direction of the substrate 1, that is, in the horizontal direction by a table driving unit (not shown). When the coating solution 2 comes into contact with the surface of the substrate 1, coating of the coating solution 2 is started. Here, as described above, the air flow on the lower side of the substrate 1 accompanying the movement of the holding table 20 is blocked by the shielding plate 60. That is, the drying of the coating solution 2 protruding from the tip of the nozzle opening 31 is suppressed by the shielding plate 60, so that the coating solution 2 reliably contacts the substrate 1 by the movement of the holding table 20, and the substrate 1 is moved to. Application of the coating solution 2 is started.

このように基板1への塗布溶液2の塗布が開始された後、図3(c)に示すように、保持テーブル20をさらに移動させることで、塗布溶液2がノズル開口31から連続的に流出し、基板1の全面に塗布溶液2が塗布されていく。そして、基板1の塗布溶液2が塗布された部分は、順次、液体保持部材50に対向する領域に移動することになる。   After the application of the coating solution 2 to the substrate 1 is started in this way, the coating solution 2 continuously flows out from the nozzle opening 31 by further moving the holding table 20 as shown in FIG. Then, the coating solution 2 is applied to the entire surface of the substrate 1. Then, the portion of the substrate 1 to which the coating solution 2 is applied sequentially moves to a region facing the liquid holding member 50.

ここで、塗布溶液2は、通常、基板1に塗布された直後から自然乾燥し始める。しかしながら本実施形態では、塗布ヘッド30に近接して液体保持部材50が設けられており、基板1に塗布された塗布溶液2は、液体保持部材50に保持されている液体3の溶剤が揮発した雰囲気中に配置されることになり、基板1に塗布された塗布溶液2が塗布直後から乾燥し始めることはない。すなわち、塗布溶液2は、基板1の全面に塗布された後でも、基板1の各領域において、ほぼ一定の粘度に維持される。   Here, the coating solution 2 usually starts to dry naturally immediately after being applied to the substrate 1. However, in this embodiment, the liquid holding member 50 is provided in the vicinity of the coating head 30, and the solvent of the liquid 3 held on the liquid holding member 50 is volatilized in the coating solution 2 applied to the substrate 1. It will be arrange | positioned in atmosphere, and the coating solution 2 apply | coated to the board | substrate 1 does not begin to dry immediately after application | coating. That is, the coating solution 2 is maintained at a substantially constant viscosity in each region of the substrate 1 even after being applied to the entire surface of the substrate 1.

そして、このように基板1の全面に塗布溶液2を塗布した後は、図示しないが、例えば、ホットプレート等によって基板1を加熱して塗布溶液2を乾燥させ、さらに、例えば、クールプレート等によって基板1を冷却して塗布溶液2を常温に戻す。これにより、基板1の表面には所望の厚さの塗布膜が形成される。   Then, after coating the coating solution 2 over the entire surface of the substrate 1 in this way, although not shown, for example, the substrate 1 is heated by a hot plate or the like to dry the coating solution 2, and further, for example, by a cool plate or the like The substrate 1 is cooled and the coating solution 2 is returned to room temperature. As a result, a coating film having a desired thickness is formed on the surface of the substrate 1.

上述したように本発明に係るスリットコート式塗布装置によれば、このように塗布溶液2を乾燥させる際、基板1に塗布された塗布溶液2は、基板1の全面に亘ってほぼ一定の粘度に維持される。したがって、乾燥ムラや、ひけ等が発生することがなく、均一な膜厚の塗布膜を基板1の表面に良好に形成することができる。   As described above, according to the slit coat type coating apparatus according to the present invention, when the coating solution 2 is dried in this way, the coating solution 2 applied to the substrate 1 has a substantially constant viscosity over the entire surface of the substrate 1. Maintained. Accordingly, the coating film having a uniform film thickness can be satisfactorily formed on the surface of the substrate 1 without causing uneven drying and sink marks.

また、基板1に塗布された塗布溶液2が乾燥し易くなるため、基板1への塗布溶液2の塗布スピードを上げることはできなかったが、本発明に係るスリットコート式塗布装置であれば、塗布溶液2の乾燥が抑えられるため、基板1への塗布溶液2の塗布スピードを著しく向上することができる。   In addition, since the coating solution 2 applied to the substrate 1 is easy to dry, the coating speed of the coating solution 2 on the substrate 1 could not be increased. However, if the slit coating type coating apparatus according to the present invention is used, Since the drying of the coating solution 2 is suppressed, the coating speed of the coating solution 2 onto the substrate 1 can be remarkably improved.

さらに、本発明のスリットコート式塗布装置であれば、基板1の近傍雰囲気のみ、すなわち、比較的狭い領域の溶剤濃度を管理しているため条件が安定する。また、周囲の環境、あるいは作業者等への悪影響も防止することができる。   Furthermore, with the slit coat type coating apparatus of the present invention, the conditions are stabilized because only the atmosphere in the vicinity of the substrate 1, that is, the solvent concentration in a relatively narrow region is managed. Further, adverse effects on the surrounding environment or workers can be prevented.

(実施形態2)
図4は、実施形態2に係るスリットコート式塗布装置の概略図である。本実施形態は、図4に示すように、塗布溶液2が塗布された基板1の近傍、すなわち、液体保持部材50の近傍に、雰囲気中の溶剤濃度を検出する濃度センサ等の検出手段70と、この検出手段70の検出結果に応じて、液体保持部材50の上下方向の移動を制御する移動手段80とをさらに有する以外は、実施形態1と同様である。
(Embodiment 2)
FIG. 4 is a schematic view of a slit coat type coating apparatus according to the second embodiment. In the present embodiment, as shown in FIG. 4, in the vicinity of the substrate 1 to which the coating solution 2 is applied, that is, in the vicinity of the liquid holding member 50, a detection means 70 such as a concentration sensor that detects the solvent concentration in the atmosphere, The second embodiment is the same as the first embodiment except that it further includes a moving unit 80 that controls the vertical movement of the liquid holding member 50 according to the detection result of the detecting unit 70.

このような本実施形態のスリットコート式塗布装置10では、検出手段70が検出した検出結果である溶剤濃度が、予め設定された濃度よりも低い場合には、移動手段80が液体保持部材50を上昇させ、溶剤濃度が予め設定された濃度よりも高い場合には、移動手段80が液体保持部材50を下降させる。そして、このように基板1の近傍雰囲気の溶剤濃度に応じて液体保持部材50と基板1との距離を調整させることで、基板1の近傍雰囲気の溶剤濃度を常に一定に維持するようにしている。これにより、基板1に塗布された塗布溶液2の乾燥をより確実に防止することができ、乾燥ムラ等のない良好な塗布膜を形成することができる。   In the slit coat type coating apparatus 10 of this embodiment, when the solvent concentration, which is the detection result detected by the detection means 70, is lower than a preset concentration, the moving means 80 causes the liquid holding member 50 to be removed. When the solvent concentration is higher than the preset concentration, the moving means 80 lowers the liquid holding member 50. Then, by adjusting the distance between the liquid holding member 50 and the substrate 1 in accordance with the solvent concentration in the atmosphere in the vicinity of the substrate 1 as described above, the solvent concentration in the atmosphere in the vicinity of the substrate 1 is always maintained constant. . Thereby, drying of the coating solution 2 applied to the substrate 1 can be more reliably prevented, and a good coating film without unevenness in drying can be formed.

(実施形態3)
図5は、実施形態3に係るスリットコート式塗布装置の概略図である。図5に示すように、本実施形態は、液体保持部材50に、凹部51の開口を開閉可能な、例えば、シャッタ等の開閉部材52が設けられていると共に、移動手段80の代わりに、検出手段70の検出結果に応じてこの開閉手段52の開閉動作を制御する駆動手段90を有する以外は、実施形態2と同様である。すなわち、このような構成では、検出手段70が検出した検出結果である溶剤濃度に応じて、駆動手段90が開閉部材52を開閉させて凹部51の液体3の溶剤揮発量を調整することで、基板1の近傍雰囲気の溶剤濃度を常に一定に維持するようにしている。そして、このような構成においても、勿論、上述した実施形態と同様の効果が得られることは言うまでもない。
(Embodiment 3)
FIG. 5 is a schematic view of a slit coat type coating apparatus according to the third embodiment. As shown in FIG. 5, in the present embodiment, the liquid holding member 50 is provided with an opening / closing member 52 such as a shutter that can open and close the opening of the recess 51, and the detection is performed instead of the moving unit 80. The second embodiment is the same as the second embodiment except that it includes a driving unit 90 that controls the opening / closing operation of the opening / closing unit 52 according to the detection result of the unit 70. That is, in such a configuration, the drive means 90 opens and closes the opening / closing member 52 and adjusts the solvent volatilization amount of the liquid 3 in the recess 51 in accordance with the solvent concentration that is the detection result detected by the detection means 70. The solvent concentration in the atmosphere in the vicinity of the substrate 1 is always kept constant. Of course, in such a configuration, it is needless to say that the same effects as those of the above-described embodiment can be obtained.

(他の実施形態)
以上、本発明の実施形態について説明したが、本発明は上述したものに限定されるものではない。例えば、上述した実施形態では、保持テーブル20を基板1の面方向に移動させることで、保持テーブル20と塗布ヘッド30とを相対的に移動させるようにしたが、これに限定されず、例えば、保持テーブル20を固定して、塗布ヘッド30を基板1の面方向に移動させるようにしてもよい。なお、この場合には、塗布ヘッド30と共に液体保持部材50も同時に移動させるようにする。
(Other embodiments)
As mentioned above, although embodiment of this invention was described, this invention is not limited to what was mentioned above. For example, in the above-described embodiment, the holding table 20 and the coating head 30 are relatively moved by moving the holding table 20 in the surface direction of the substrate 1. However, the present invention is not limited to this. The holding table 20 may be fixed and the coating head 30 may be moved in the surface direction of the substrate 1. In this case, the liquid holding member 50 is also moved together with the coating head 30.

また、上述した実施形態では、液体保持部材50と塗布ヘッド30との間の領域に、遮蔽板60を設けるようにしたが、勿論、この遮蔽板60は設けなくてもよい。さらに、上述した実施形態では、表面が略平坦な面である基板を例示したが、これに限定されず、例えば、レンズ等の表面が曲面である基板を用いることができることは言うまでもない。   In the above-described embodiment, the shielding plate 60 is provided in the region between the liquid holding member 50 and the coating head 30. Of course, the shielding plate 60 may not be provided. Furthermore, although the board | substrate whose surface is a substantially flat surface was illustrated in embodiment mentioned above, it is not limited to this, For example, it cannot be overemphasized that the board | substrate whose surface, such as a lens, is a curved surface can be used.

本発明の実施形態1に係る塗布装置の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the coating device which concerns on Embodiment 1 of this invention. 本発明の実施形態1に係る塗布装置の要部断面図である。It is principal part sectional drawing of the coating device which concerns on Embodiment 1 of this invention. 本発明の実施形態1に係る塗布方法を示す概略図である。It is the schematic which shows the coating method which concerns on Embodiment 1 of this invention. 本発明の実施形態2に係る塗布装置の概略構成を示す図である。It is a figure which shows schematic structure of the coating device which concerns on Embodiment 2 of this invention. 本発明の実施形態3に係る塗布装置の概略構成を示す図である。It is a figure which shows schematic structure of the coating device which concerns on Embodiment 3 of this invention.

符号の説明Explanation of symbols

1 基板、 2 塗布溶液、 3 液体、 10 スリットコート式塗布装置、 20 保持テーブル、 30 塗布ヘッド、 31 ノズル開口、 40 貯留手段、 50 液体保持部材、 60 遮蔽板

DESCRIPTION OF SYMBOLS 1 Substrate, 2 Coating solution, 3 Liquid, 10 Slit coat type coating device, 20 Holding table, 30 Coating head, 31 Nozzle opening, 40 Storage means, 50 Liquid holding member, 60 Shielding plate

Claims (5)

基板を保持する保持テーブルと該保持テーブルに保持された前記基板の表面に相対向するように配置されると共に当該基板の表面に向かって所定の塗布溶液を流出するスリット状のノズル開口を有する塗布ヘッドとを具備して前記保持テーブルと前記塗布ヘッドとが水平方向で相対的に移動することで前記基板の表面に前記塗布溶液が塗布され、且つ前記塗布ヘッドに近接すると共に前記塗布溶液が塗布された前記基板に対向するように配置され、前記基板側に開口する凹部に少なくとも前記塗布溶液の主溶剤と同一の主溶剤を含む液体が保持される液体保持部材を有することを特徴とするスリットコート式塗布装置。 An application having a holding table for holding a substrate and a slit-like nozzle opening that is arranged so as to face the surface of the substrate held on the holding table and flows a predetermined application solution toward the surface of the substrate The coating solution is applied to the surface of the substrate by the relative movement of the holding table and the coating head in the horizontal direction, and the coating solution is applied in proximity to the coating head. A slit having a liquid holding member that is disposed so as to face the substrate and that holds a liquid containing at least the same main solvent as the main solvent of the coating solution in a recess that opens to the substrate side. Coat type coating device. 請求項1において、前記液体保持部材が鉛直方向に移動可能に設けられていることを特徴とするスリットコート式塗布装置。 2. The slit coat type coating apparatus according to claim 1, wherein the liquid holding member is provided so as to be movable in a vertical direction. 請求項2において、前記基板の表面近傍雰囲気の少なくとも前記主溶剤の濃度を検出する検出手段と、該検出手段の検出結果に応じて前記液体保持部材の上下方向の移動を制御する移動手段とをさらに具備することを特徴とするスリットコート式塗布装置。 The detection means for detecting at least the concentration of the main solvent in the atmosphere near the surface of the substrate according to claim 2, and the moving means for controlling the vertical movement of the liquid holding member according to the detection result of the detection means. A slit coat type coating apparatus, further comprising: 請求項1〜3の何れかにおいて、前記液体保持部材が、前記凹部の開口を開閉可能に設けられた開閉部材を具備することを特徴とするスリットコート式塗布装置。 The slit coat type coating apparatus according to claim 1, wherein the liquid holding member includes an opening / closing member provided to open and close the opening of the recess. 請求項4において、前記基板の表面近傍雰囲気の少なくとも前記主溶剤の濃度を検出する検出手段と、該検出手段の検出結果に応じて前記液体保持部材の前記開閉部材の駆動を制御する駆動手段とをさらに具備することを特徴とするスリットコート式塗布装置。
The detection means for detecting at least the concentration of the main solvent in the atmosphere near the surface of the substrate according to claim 4, and the drive means for controlling the drive of the opening / closing member of the liquid holding member according to the detection result of the detection means. A slit coat type coating apparatus, further comprising:
JP2004162045A 2004-05-31 2004-05-31 Slit coat type coating device Expired - Fee Related JP4424482B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004162045A JP4424482B2 (en) 2004-05-31 2004-05-31 Slit coat type coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004162045A JP4424482B2 (en) 2004-05-31 2004-05-31 Slit coat type coating device

Publications (3)

Publication Number Publication Date
JP2005342561A true JP2005342561A (en) 2005-12-15
JP2005342561A5 JP2005342561A5 (en) 2007-06-14
JP4424482B2 JP4424482B2 (en) 2010-03-03

Family

ID=35495416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004162045A Expired - Fee Related JP4424482B2 (en) 2004-05-31 2004-05-31 Slit coat type coating device

Country Status (1)

Country Link
JP (1) JP4424482B2 (en)

Also Published As

Publication number Publication date
JP4424482B2 (en) 2010-03-03

Similar Documents

Publication Publication Date Title
TWI565525B (en) Coating film forming device
JP2798503B2 (en) Liquid coating method and coating device
TW201741036A (en) Coating apparatus and coating method
KR20150055568A (en) Coating apparatus
JP2005152716A (en) Slit-nozzle coating type coating device and slit-nozzle coating type coating method
JPH08213308A (en) Coating method
TW201529182A (en) Coating device
JP4424482B2 (en) Slit coat type coating device
US20070098901A1 (en) Method for forming thin film and film-forming device
JP2003071363A (en) Coating liquid supply apparatus and coating equipment using the same
JP4034280B2 (en) Development processing equipment
JP5329837B2 (en) Coating apparatus and coating method
JP3811740B2 (en) Coating equipment
JP2009039624A (en) Slit-coat type coating method
JPH09293659A (en) Prevention of drying of coating liquid and device thereof
JP3267822B2 (en) Applicator for coating liquid on substrate
JP3638302B2 (en) Coating liquid coating apparatus and coating method for substrate
JP2003088791A (en) Method and apparatus for coating
JP2005218969A (en) Slit coating type applicator
JP3182815U (en) Coating nozzle cleaning device
JP3742822B2 (en) Coating device and coating system using the same
TWI471682B (en) Method for manufacturing a mask blank and coating apparatus
JP3823049B2 (en) Paste applicator
JP3383093B2 (en) Applicator for coating liquid on substrate
JPH07112151A (en) Coating liquid applying device to substrate

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070426

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070426

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091007

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091118

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

R150 Certificate of patent or registration of utility model

Ref document number: 4424482

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091201

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121218

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121218

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131218

Year of fee payment: 4

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees