JP2005342299A - Endoscope apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To compatibly attain the miniaturization of an insertion part and securing of a sufficient light quantity by disposing a sufficient number of LEDs in a limited space on a mount base. <P>SOLUTION: The plurality of types of LED bare chips 19a and 19b having different shapes or sizes are mounted on the mount base 16 integrally provided at the insertion part and the front faces of the LED bare chips 19a and 19b are covered with a transparent sealing member such as a phosphor 21 or the like. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an endoscope apparatus in which an LED is disposed as an illuminating means in an insertion portion that is inserted into a lumen of an endoscopic object.

  An endoscope apparatus used for industrial use or medical use is provided with an optical system for observation or imaging at the distal end side of an insertion portion to be inserted into a lumen, and for an endoscopic object in the lumen. Illumination means for illuminating the surroundings are provided. As this illumination means, what irradiates the light of an external light source to an object through an optical fiber is often used, but in recent years, a light emitting diode (referred to as “LED” in this specification). Has been developed that directly attaches to the insertion portion and irradiates the periphery of the endoscopic object with the light of the LED (see, for example, Patent Documents 1 and 2).

In the conventional endoscope apparatus using this LED, wiring is provided on the front surface of the mounting base provided in the housing of the insertion portion, and a plurality of LED package chips (LED bare chips are used as electrodes or phosphor layers) in the wiring. And packaged together with a sealing layer, etc.) are connected and fixed, and the electrode portion of the wiring on the mounting base is connected to an external power supply unit.
Japanese Patent Laid-Open No. 10-216085 JP-A-11-76151

  However, in this conventional endoscope apparatus, since a plurality of LED package chips are arranged side by side on the front surface of the mounting base, the installation area of the mounting base is limited due to the size of the insertion portion and the like. If the number of LEDs cannot be increased, a sufficient number of LEDs cannot be arranged. On the other hand, if a sufficient amount of light is irradiated on the endoscopic object, an increase in the size of the insertion portion where the LEDs are arranged cannot be avoided. .

  Accordingly, the present invention is to provide an endoscope apparatus capable of arranging a sufficient number of LEDs in a limited space on the mounting base and achieving both a reduction in the size of the insertion portion and a sufficient amount of light. It is what.

  In order to achieve the above object, the present invention provides an attachment base provided integrally with an insertion portion in an endoscope apparatus in which an illumination LED is provided in an insertion portion that is inserted into a lumen of an endoscopic object. A plurality of types of LED bare chips having different shapes or sizes were attached, and the front surfaces of a plurality of these LED bare chips were covered with a common transparent sealing member.

  In the case of this invention, the LED is installed on the mounting base as a bare chip, and bare chips of different shapes and sizes are efficiently combined and arranged on the mounting base, so that the limited installation space on the mounting base is limited. The LEDs will be more dense.

  Specifically, for example, if different types of LED bare chips are arranged between adjacent LED bare chips of the same type, the LED bare chips are efficiently arranged on the mounting base.

  In particular, when a plurality of LED bare chips of the same type are arranged in a ring on a circular mounting base, and a plurality of different types of LED bare chips are arranged in a ring by offsetting the same kind of LED bare chips in the circumferential direction, It is possible to efficiently arrange LEDs on a circular mounting base that is difficult to densely arrange.

  The transmissive sealing member may be a phosphor or a cover lens. When the transmissive sealing member is made of a phosphor, the transmissive sealing member is partially thick depending on the type of LED bare chip that covers the front surface. The material characteristics may be changed. In this case, the wavelength of light to be irradiated can be set according to the shape and size of the LED bare chip. Further, when the transparent sealing member is constituted by a cover lens, the optical characteristics of the cover lens may be partially changed according to the type of the LED bare chip that covers the front surface. In this case, it is possible to obtain appropriate light distribution characteristics according to the shape and size of the LED.

  Further, the mounting base may be configured by superposing a plurality of base plates, and different types of LED bare chips may be mounted on the respective base plates. With such a configuration, it is possible to superimpose the base plates after attaching the LED bare chip to each base plate. In this case, it is easy to assemble the components.

  The mounting base may be formed of an insulative soft plate member, and in this case, the mounting base can be flexibly deformed, so that the mounting base can be easily assembled. In addition, design freedom increases.

  Further, the mounting base support surface of the insertion portion may be formed in a frustoconical shape, and a mounting base made of a soft plate member may be mounted on the mounting base support surface. In this case, it is possible to realize light irradiation having a spread on the outer periphery on the front side of the insertion portion.

  Alternatively, the attachment base support surface of the insertion portion may be formed in a columnar shape, and an attachment base made of a soft plate member may be attached to the attachment base support surface. When it does in this way, irradiation of the reliable light to the outer peripheral side of an insertion part is attained. Further, at this time, if a reflecting surface is provided on the rear side of the soft plate-like member, the light emitted from the LED bare chip is reflected to the front side by the reflecting surface, and the irradiation amount to the front side of the insertion portion increases. .

  A plurality of sets of LED wires connecting the same type of LED bare chips may be provided according to the type of the LED bare chip, and each LED wire may be connected to an individual current control circuit. In this case, an optimum current can be supplied to each LED wiring by a corresponding individual control circuit.

  Also, multiple sets of LED wirings connecting the same type of LED bare chips are provided according to the type of LED bare chips, and these LED wirings are connected in parallel to a common current control circuit, and any LED wiring is used for current correction. A resistor may be provided. In this case, as long as a current correction resistor is provided in any LED wiring, a single current control circuit can be shared by each LED wiring, so that the manufacturing cost can be reduced.

  Further, in this case, an adapter having an attachment base to which the LED bare chip is attached and a permeable sealing member covering the front surface thereof is detachably provided at the distal end of the insertion portion main body, and the plurality of sets of LEDs are attached to the adapter. It is desirable to provide wiring and a resistance for current correction. When the current correction resistor is provided in the adapter as described above, it is possible to replace the adapter with a different specification of the LED bare chip without adjusting the circuit on the insertion portion main body or the apparatus main body side.

  In the present invention, LED bare chips of different shapes and sizes are combined and arranged on the mounting base, and the front surfaces of the plurality of LED bare chips are covered with a common transparent sealing member, so that the space within the limited space on the mounting base is sufficient. A large number of LEDs can be densely arranged. Therefore, according to the present invention, it is possible to reduce the size of the insertion portion while securing a sufficient amount of light by the LED.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of each embodiment, the same portions are denoted by the same reference numerals, and redundant descriptions are omitted.

First, the first embodiment shown in FIGS. 1 to 5 will be described.
FIG. 2 shows an overall schematic configuration of the endoscope apparatus according to the present invention. As shown in the figure, this endoscope apparatus includes an insertion portion 3 in which a lens adapter 2 is detachably connected to the distal end side of a long flexible tube 1, and a box-like shape from which the insertion portion 3 is pulled out. An apparatus main body 5. The flexible tube 1 of the insertion portion 3 is wound around a drum 4, and the drum 4 is rotatably accommodated in the apparatus main body portion 5. Further, the apparatus main body 5 storing the drum 4 is accommodated in a carrying storage case 6 as shown in FIGS. 2 (A) and 2 (B).

  This endoscope apparatus is provided with a CCD (not shown) as an imaging means at the distal end of the insertion section 3, and an image signal captured by the CCD is passed through a signal line inside the flexible tube 1 to the apparatus main body section 5. Is output to a signal processing circuit (not shown) built in the signal processing circuit, and the signal processed by the signal processing circuit is displayed as an image on an image display means such as a liquid crystal panel. The apparatus main body 5 incorporates a main power circuit (not shown) connected to a battery power source in addition to the signal processing circuit.

  The insertion portion 3 to be inserted into the lumen is provided with the lens adapter 2 on the distal end side of the flexible tube 1 as described above. More specifically, the distal end side of the flexible tube 1 is made of a hard material such as metal. The connecting plug 9 is provided, and the lens adapter 2 is detachably provided at the tip of the connecting plug 9. The above-mentioned CCD is provided at the tip of the connection plug 9 and electrodes 10A to 10D (see FIG. 3) for supplying a current to the lens adapter 2 side. In FIG. 2A, 2A denotes a replacement lens adapter, and 7 denotes a storage pocket for storing the lens adapter 2A. Further, the insertion portion main body of the insertion portion 3 is configured by a portion excluding the lens adapter 2, that is, the flexible tube 1, the connection plug 9, and the like.

  The lens adapter 2 is of a so-called direct-view type, and as shown in FIG. 3, an objective lens group 11 that faces an object to be viewed and connects the image on the CCD of the connecting plug 9 is arranged in series along the axial direction. ing. The objective lens group 11 is accommodated in a substantially cylindrical lens holder 12 and is accommodated and fixed in a cylindrical adapter housing 13 together with an LED illumination unit 14 and a spacer block 15 described later.

  The LED lighting unit 14 is bonded and fixed to a perforated disk-shaped mounting base 16 made of a metal material having good thermal conductivity such as aluminum and the front inner periphery of the mounting base 16 as shown in FIG. The electrode sheets 18, 18 and a plurality of LED bare chips 19a ..., 19b ... which are bonded and fixed together with the electrode sheets 18, 18 to the front surface of the mounting base 16, and the transparency covering the front surfaces of these LED bare chips 19a ..., 19b ... And a phosphor 21 which is a sealing member. Each electrode sheet 18 has two electrodes 17A, 17B on the upper surface of an insulating soft plate-like member, and a plurality of LED bare chips 19a, 19b,. Wires 20 are connected to the electrodes 17A and 17B.

  In the case of this embodiment, two types of LED bare chips 19a,..., 19b... Are used, as shown in FIG. 4, and there are eight large LED bare chips 19a and small LED bare chips. Six 19b are used. Here, the pair of electrode sheets 18 and 18 are arranged at symmetrical positions across the center of the front surface of the mounting base 16, but the two types of LED bare chips 19 a, 19 b, etc. sandwich the electrode sheets 18, 18. Are arranged in an annular shape and offset from each other in the circumferential direction.

  Specifically, the small-sized LED bare chip 19b is disposed between the adjacent large-sized LED bare chips 19a and 19a and at a position slightly offset radially outward from the center of each LED bare chip 19a. . The large size LED bare chip 19a is connected in series to the electrode metals 17A and 17A by wire wiring 20 on each of the four sides sandwiching the electrode sheets 18, 18, and the small size LED bare chip 19b is similarly connected to the electrode sheet 18, Three on each side of 18 are connected in series to electrode metals 17B and 17B by wire wiring 20 (wire bonding).

  In this embodiment, each LED bare chip 19a, 19b is a blue LED or a purple LED, and the phosphor 21 covering the front of these LED bare chips 19a, 19b is YAG (yttrium, aluminum, garnet). It is comprised by the fluorescent resin which can obtain white lights, such as a system. The phosphor 21 is attached to the front surface of the mounting base 16 with the electrode sheet 18 and the LED bare chips 19a... 19b. It is applied to a predetermined thickness.

  On the other hand, an annular recess 22 is formed on the back surface of the lens holder 12 as shown in FIG. 3, and a perforated disk-shaped electrode substrate 23 and conductive rubber 24 are accommodated in the annular recess 22. A wiring 25 is drawn forward from the electrode substrate 23, and the wiring 25 is connected to the electrodes 17 </ b> A and 17 </ b> B of the respective electrode sheets 18 on the front surface of the mounting base 16. The electrode substrate 23 is provided with an electrode (not shown) to which the wirings 25 are connected, and the electrode is pressed against the conductive rubber 24 on the rear side. The conductive rubber 24 is obtained by embedding a conductive member such as nickel particles or gold-plated metal particles in an insulating rubber material such as silicon rubber in a dot shape. Usually, a dot type anisotropic conductive rubber or the like It is what is called. Since the conductive rubber 24 is configured as described above, when the rubber material, which is an elastic body, is pressed in the thickness direction, the conductivity between the conductive members densified by the compression deformation increases, thereby increasing the thickness direction. Energization is allowed. However, since the rubber material is an insulating member at this time, the insulating state is maintained in directions other than the thickness direction of the rubber material (for example, the circumferential direction).

  The conductive rubber 24 is pressed by the four electrodes 10A to 10D of the connecting plug 9 from the rear side when the lens adapter 2 is connected, as will be described later. For this reason, only the part press-contacted by each of these electrodes 10A to 10D is partially conducted, and at this time, only the electrodes at the opposing positions of the electrode substrate 23 and the connecting plug 9 are electrically connected to each other. Become.

  Further, a connecting wall 26 that protrudes rearward from the adapter housing 13 protrudes from the rear end portion of the lens holder 12, and a guide tube 27 that has a stepped diameter is integrally formed at the protruding end of the connecting wall 26. Has been. A cylindrical connection ring 28 is externally fitted to the guide cylinder 27 so as to be displaceable in the axial direction and the rotation direction, and an inner end of the connection ring 28 that can contact the stepped portion of the guide cylinder 27 is provided. A facing stopper flange 29 is integrally formed. A first female screw 30 and a second female screw 31 are provided on the inner peripheral surface of the connection ring 28 at a predetermined distance in the axial direction.

  On the other hand, a fixing male screw 32 is provided on the outer peripheral surface of the connecting plug 9, and the first female screw 30 and the second female screw 31 of the connection ring 28 are sequentially screwed into the male screw 32, thereby the lens adapter. 2 can be connected to the connecting plug 9. That is, when the connection ring 28 of the lens adapter 2 is fitted to the front end portion of the connection plug 9 and the connection ring 28 is rotated in a predetermined direction in this state, the axial displacement of the connection ring 28 causes the stopper flange 29 and the guide cylinder to move. 27, the male screw 32 of the connecting plug 9 is sequentially tightened into the first female screw 30 and then the second female screw 31, and as a result, the connecting plug 9 The electrodes 10 </ b> A to 10 </ b> D protruding from the front end surface press the conductive rubber 24 and are electrically connected to the electrodes on the electrode substrate 23 through the conductive rubber 24. The first female screw 30 is disengaged from the male screw 32 after the male screw 32 of the connecting plug 9 is closed by the second female screw 31. When the female screw 31 of the second screw is loosened, it functions as a stopper for preventing the drop.

  3, positioning projections 33 and receiving grooves 34 are provided on the inner peripheral surface of the guide tube 27 on the lens adapter 2 side and the outer peripheral surface of the connection plug 9, respectively. When the plug 9 is connected, by engaging the positioning protrusion 33 and the receiving groove 34, the rotational positions of both can be accurately matched.

  The electrical wiring for the LED illumination unit 14 of the endoscope apparatus is as shown in FIG. That is, in the lens adapter 2 described above, two sets of LED wirings 35a and 35b are provided corresponding to the two types of LED bare chips 19a and 19b having different sizes, and each of these LED wirings 35a and 35b has an individual current. The power supply circuit 37 is connected via control circuits 36a and 36b (for example, a constant current circuit).

  In the endoscope apparatus according to this embodiment, as described above, a plurality of LEDs of the LED illumination unit 14 are arranged on the mounting base 16 with the LED bare chips 19a and 19b remaining, and the front surfaces thereof are a common phosphor. 21. In addition, since the LED bare chips 19a and 19b are arranged on the mounting base 16 by combining different sizes of the LED bare chips 19a and 19b at this time, a large number of LED bare chips 19a and 19b are arranged in a limited space on the front surface of the mounting base 16. LEDs can be densely packed. For this reason, if the installation space on the attachment base 16 is the same, more LEDs can be mounted in a dense state, and if the same number of LEDs are mounted, the LED installation space can be reduced. Therefore, in this endoscope apparatus, a sufficient amount of light can be secured without increasing the outer shape of the lens adapter 2.

  In particular, in the case of this embodiment, the LED bare chips 19a... 19b... Having different sizes are arranged on the front surface of the circular mounting base 16 in a ring shape and offset from each other in the circumferential direction. The substantially square LED bare chips that are difficult to be densely arranged can be efficiently concentrated on the front surface of the mounting base 16.

  In addition, since the endoscope apparatus of this embodiment is configured to individually connect the current control circuits 36a and 36b to the LED wirings 35a and 35b corresponding to the two types of LED bare chips 19a and 19b having different sizes, respectively. An optimum current can be constantly supplied to the LED bare chips 19a and 19b having different sizes. When the current control circuits 36a and 36b are individually connected to the LED wirings 35a and 35b as in this embodiment, for example, the replacement is made with the replacement adapter 2A shown in FIG. 5 having only one kind of LED bare chip 19b. However, there is no problem that the current flowing through the LED bare chip 19b and the voltage that acts are changed.

  In the first embodiment shown in FIGS. 1 to 5, two types of LED bare chips 19 a and 19 b having different sizes are arranged in a ring shape on the front surface of the disk-shaped mounting base 16, but the second embodiment shown in FIG. You may make it use combining LED bare chip | tip 119a, 119b from which a shape differs like embodiment. In this second embodiment, a substantially square LED bare chip 119a and a triangular LED bare chip 119b are used, and a pair of two triangular LED bare chips 119b and 119b that are adjacent to each other is adjacent to a substantially square LED. Arranged between the bare chips 119a and 119a. The pair of triangular LED bare chips 119b and 119b are arranged so that the apex angle of the triangle formed by the pair faces radially inward. In FIG. 6, 38a is an electrode for the substantially rectangular LED bare chip 119a, and 38b is an electrode for the triangular LED bare chip 119b.

  The endoscope apparatus according to this embodiment can basically obtain the same functions and effects as those of the first embodiment, but the LED bare chips 119a and 119b having different shapes are appropriately combined on the mounting base 16. The LED bare chips 119a, 119b,... Are more densely arranged on the front surface of the mounting base 16. That is, as shown in FIG. 6, when the substantially square LED bare chips 119a... Are arranged in a ring shape, a substantially fan-shaped gap is formed between the adjacent LED bare chips 119a and 119a. If the triangular LED bare chip 119b is arranged between the LED bare chips 119a and 119a to be used, the useless gap between the LED bare chips 119a and 119b can be further reduced.

  In the embodiment shown in FIGS. 1 to 5, the front surface of the mounting base 16 on which the plurality of types of LED bare chips 19 a and 19 b are arranged is covered with the common phosphor 21, but an LED bare chip that emits white light is used. Or when irradiating the light of LED other than white as it is, the cover lens 40 is arrange | positioned in front of multiple types of LED bare chip 19a, 19b like 3rd Embodiment shown in FIG. 7, and it permeate | transmits it. A good sealing member may be used.

  Further, when the front surfaces of the plurality of types of LED bare chips 19a and 19b are covered with the cover lens 40 as described above, according to the type of the LED bare chips 19a and 19b covering the front surfaces as in the fourth embodiment shown in FIG. The optical characteristics of the cover lens may be partially changed. In the embodiment shown in FIG. 8, the curvature of the lens and the like are changed between the radially inner region 40a of the cover lens 40 positioned in front of the LED bare chip 19a and the radially outer region 40b positioned in front of the LED bare chip 19b. I have to. In this case, appropriate light distribution characteristics according to the size and shape of the LED bare chips 19a and 19b can be obtained.

  FIG. 9 shows a fifth embodiment of the present invention. The basic configuration of the endoscope apparatus of this embodiment is substantially the same as that of the first embodiment, but the wiring for the LED illumination unit 14 is different from that of the first embodiment. That is, in this endoscope apparatus, the LED wiring 35a connecting the large LED bare chips 19a and the LED wiring 35b connecting the small LED bare chips 19b are connected in parallel to the common current control circuit 36. Current correction resistors 41a and 41b are interposed in the LED wirings 35a and 35b of the apparatus main body 5, respectively.

  In this embodiment, the current control circuit 36 can be made one by interposing the appropriate current correction resistors 41a and 41b in the LED wirings 35a and 35b. Therefore, the circuit configuration of the apparatus is simplified and manufactured. Cost can be reduced. The current correction resistors 41a and 41b are not necessarily provided in all the LED wirings 35a and 35b, and may be provided only in any necessary LED wiring.

  In the fifth embodiment shown in FIG. 9, the current correction resistors 41a and 41b are interposed in the LED wirings 35a and 35b in the apparatus main body 5. However, the sixth embodiment shown in FIG. As described above, the current correction resistors 41a and 41b may be interposed in the LED wirings 35a and 35b in the lens adapter 2, respectively. In this case, the LED wirings 35a and 35b of the LED bare chips 19a and 19b and the current correction resistors 41a and 41b are assembled and incorporated into the lens adapter 2, so that the circuit on the insertion portion or the device main body side is adjusted. Therefore, the lens adapter can be easily replaced with another lens adapter having different specifications.

  11 and 12 show a seventh embodiment of the present invention. The basic configuration of the endoscope apparatus of this embodiment is substantially the same as that of the first embodiment, but the configuration of the mounting base 216 is greatly different from that of the first embodiment.

  That is, as shown in FIG. 12, the mounting base 216 of this embodiment is formed by superposing a perforated disc-shaped first base plate 216a and a second base plate 216b, and each base plate 216a, 216b is superposed. LED bare chips 19a and 19b of different types such as size and shape are attached. Specifically, the first base plate 216a is formed slightly smaller than the second base plate 216b, and a pair of electrode sheets 218a, 218a and a plurality of LED bare chips 19a. ing. Similarly, the second base plate 216b has a pair of electrode sheets 218b, 218b and a plurality of LED bare chips 19b arranged in a ring shape in the outer region of the region where the first base plate 216a is superposed. . The LED bare chips 19a,..., 19b... On the respective base plates 216a, 216b are connected to the respective electrodes 17A, 17B on the electrode sheets 218a, 218b by wire wirings 20 as in the other embodiments described above. Further, the first base plate 216a and the second base plate 216b are fixed to each other by bonding or the like after finishing the wire wiring 20 of the LED bare chips 19a.

  The mounting base 216 formed in this manner has a structure in which the first base plate 216a protrudes in the shape of a step at the center of the front surface of the second base plate 216b, and the LED bare chips 19a. The upper LED bare chips 19b... As shown in FIG. 11, phosphors 221a and 221b are filled and applied on the front surface of the mounting base 216 assembled as described above, and all the LED bare chips 19a... 19b. The front of is covered. Specifically, one phosphor 221a is applied only to the front surface of the LED bare chip 19b ... on the second base plate 216b, and the other phosphor 221b is the LED bare chip 19a on the first base plate 216a. ... And the front surface of the phosphor 221a. Therefore, the phosphors 221a and 221b are arranged in two layers on the front side of the LED bare chips 19b ... radially outside the mounting base 216, and the other phosphor is placed on the front side of the radially inside LED bare chips 19a ... 221a is arranged in a single layer.

  In the endoscope apparatus of this embodiment, LED bare chips 19a... 19b... Having different sizes and shapes are arranged in combination on the front surface of the mounting base 216, and the front surfaces thereof are phosphors 221a which are transmissive sealing members. Since it is covered with 221b, the basic effect that a sufficient amount of light can be secured without causing an increase in size (increase in diameter) of the lens adapter 2 can be obtained as in the first embodiment. Further, in the case of this embodiment, a single-layer phosphor 221a is disposed on the front surface of one LED bare chip 19a, and phosphors 221a and 221b are disposed in two layers on the front surface of the other LED bare chip 19b. Therefore, the wavelength of the light irradiated forward can be changed according to the type of the LED bare chips 19a, 19b. For example, while the white light is irradiated through the single layer phosphor 221a in front of the LED bare chips 19a ... It is also possible to irradiate yellowish light through the two layers of phosphors 221a and 221b in front of the LED bare chips 19b.

  Further, in the apparatus of this embodiment, since the mounting base 216 has a structure in which two base plates 216a and 216b having different outer diameters are superposed, the LED bare chips 119a and 119b and electrode sheets are formed on the base plates 216a and 216b. After attaching 18, both base plates 216 a and 216 b can be superposed and fixed to each other. For this reason, the assembly | attachment workability | operativity of components improves.

  In the seventh embodiment, the characteristics of the phosphors arranged on the front surfaces of the different types of LED bare chips 119a and 119b are made different (the single body of the phosphor 221a is arranged on the front surface of the LED bare chip 19a, and the LED bare chip 19b is arranged). The phosphors 221b and 221a are arranged in a layer on the front surface of the LED.) However, the single phosphor 221 is used as in the eighth embodiment shown in FIG. 13, and the front surfaces of the LED bare chips 19a and 19b are arranged. Only the thickness of the phosphor 221 to be covered may be partially varied. In the case of the embodiment shown in FIG. 13, the output of the LED bare chip 19b on the outer peripheral side is larger than the output of the LED bare chip 19a on the inner peripheral side, and the phosphor 221 is thick on the front surface of the LED bare chip 19b on the outer peripheral side. It is thin on the front surface of the inner side LED bare chip 19a. For this reason, the light emitted from the LED illumination unit 14 becomes white light that is substantially uniform over the entire front surface.

  FIG. 14 shows a ninth embodiment of the present invention. In this embodiment, the configuration of the mounting base 316 is slightly different from those of the seventh and eighth embodiments. That is, the mounting base 316 of this embodiment is formed by superimposing and fixing two base plates 316a and 316b in the same manner, but the two base plates 316a and 316b are formed to have substantially the same outer diameter. A plurality of windows 50 are arranged in a substantially annular shape on the first base plate 316a arranged on the front side, and the radial direction between the adjacent windows 50, 50 on the front surface of the first base plate 316a. A substantially rectangular LED bare chip 319a... Is attached to the inner position and the outer position, respectively. On the other hand, a plurality of substantially rectangular LED bare chips 319b are attached to the front surface of the second base plate 316b disposed on the rear side so as to correspond to the position of the window 50 of the first base plate 316a. A pair of electrode sheets 18 and 18 having two electrodes 17A and 17B are attached. In this embodiment, the LED bare chip 319a on the first base plate 316a is formed to be smaller than the LED bare chip 319b on the second base plate 316b.

  The electrode 17B on one side on the electrode sheet 18 is connected to the LED bare chip 319b on the front surface of the second base plate 316b by wire bonding (wire wiring is not shown), and the electrode 17A on the other side of the electrode sheet 18 is connected. Are connected to the LED bare chip 319a through the notch groove 51 of the first base plate 316a in a state where both the base plates 316a and 316b are superposed and fixed. In this embodiment as well, although not shown, a transparent sealing member such as a phosphor covering the front of all the LED bare chips 319a and 319b is disposed on the front surface of the first base plate 316a.

  In the case of this embodiment, the LED bare chips 319a and 319b having different sizes are separately attached to the first base plate 316a and the second base plate 316b, respectively, so that the attachment work of the LED bare chips 319a and 319b is facilitated. There is an advantage that further dense arrangement of the LED bare chips 319a and 319b is facilitated.

  FIG. 15 shows a tenth embodiment of the present invention. In this embodiment, as in the seventh embodiment, the mounting base 416 is configured by superposing and fixing the first base plate 416a having a small outer diameter on the front surface of the second base plate 416b. The base plates 416a and 416b are greatly different in that they are formed of an insulating soft plate member. Specifically, the second base plate 416b formed by the soft plate member is formed by extending a pair of strips 54 and 54 on the outer edge of the disc-shaped main body 53, and each of the strips. An input electrode 55 is provided at the tip of 54, and wirings 56, 57 connected to the input electrodes 55 are embedded from the main body 53 to the strips 54, 54. One wiring 56 of the second base plate 416 b is connected to the LED bare chip 19 b... Bonded and fixed to the front surface of the main body 53, and the other wiring 57 is a relay electrode 58 provided on the front side of the main body 53. It is connected to the.

  On the other hand, the first base plate 416a similarly formed of a soft plate-like member has an electrode 59 that is electrically connected to the relay electrode 58 when the base plate 416a is superposed on the second base plate 416b. Is provided. This electrode 59 is connected to the LED bare chips 19a... Fixed to the front surface of the first base plate 416a.

  The endoscope apparatus of this embodiment can basically obtain the same effects as those of the seventh embodiment shown in FIGS. 11 and 12, but the base plates 416a and 416b are connected to the wirings 56 and 57 and Since it is formed by the soft plate-like member in which the electrodes 55 and 58 are embedded, there is an additional advantage that the assembling of the base plates 416a and 416b to a narrow portion is facilitated and the wiring work is facilitated.

  16 and 17 show an eleventh embodiment of the present invention. The mounting base 516 of this embodiment is formed of an insulating soft plate-like member as in the above-described tenth embodiment, but the soft plate-like member is formed in a band shape, This is largely different in that the soft plate-like member is bonded and fixed to the step-shaped mounting base support surface 60.

  The mounting base 516 is made of a continuous band-shaped soft plate-like member. As shown in FIG. 17, the mounting base 516 is swirled in the center direction in a natural state, and has a substantially disk shape as a whole in plan view. More specifically, the spiral radial outer region 516a of the mounting base 516 is formed with a wide band width, the inner region 516b is formed with a narrow width, and the wide outer region 516a has a large size. A substantially rectangular LED bare chip 19a is attached along the spiral direction, and a small-sized substantially rectangular LED bare chip 19b is similarly attached along the spiral direction in the narrow inner region 516b. The large LED bare chip 19a and the small LED bare chip 19b are connected to the electrodes 17A and 17B provided at the ends of the band on the outer side in the radial direction of the mounting base 516 by the wire wiring 20 or the like, respectively.

  The mounting base support surface 60 is formed by a pair of metal disk members 61 and 62 as shown in FIG. 16A, and is inserted in a state where the disk members 61 and 62 are superposed and fixed to each other. It is designed to be fixed to the part. One disk member 61 is formed with a small diameter with respect to the other disk member 62, and in a state where both the disk members 61, 62 are overlapped, a step-like mounting base support surface 60 on the front side, that is, The first support surface 61a of one disk member 61 and the second support surface 62a of the other disk member 62 are formed.

  The band-shaped mounting base 516 made of a soft plate member is fixed to the mounting base support surface 60 of the disk members 61 and 62 as shown in FIG. 16B. At this time, the mounting base 516 has a wide width. The radially outer region 516a is bonded to the second support surface 62a of the large-diameter disk member 62, and the narrow radially inner region 516b is bonded to the first support surface 61a of the small-diameter disk member 61, A connecting portion with the radially outer region 516a is inclined gently and obliquely and is stretched over the second support surface 62a. In addition, a phosphor or a cover lens (not shown) is provided on the front surface of the mounting base 516 attached to the disk members 61 and 62 in this manner so as to cover the front surfaces of the LED bare chips 19a and 19b as in the other embodiments described above. .) Is arranged.

  Therefore, in the case of this embodiment, the LEDs can be efficiently densely arranged on the mounting base 516 by combining LED bare chips 19a and 19b having different sizes as in the other embodiments described above. Since it is formed from a continuous strip-shaped soft plate-like member, there is an advantage that it is possible to improve manufacturing efficiency and ease of assembly. Further, in this embodiment, the radial inner region 516b of the mounting base 516 is gently inclined with respect to the step portion of the mounting base support surface 60, so that the LED bare chip 19b is mounted on the inclined portion. If it arrange | positions, there also exists an advantage that the light distribution of LED can be changed gently.

  Subsequently, a twelfth embodiment shown in FIGS. 18 and 19 will be described. In the endoscope apparatus of this embodiment, a truncated cone-shaped attachment base support surface 660 is provided at the front end of the lens holder 612 of the insertion portion, and the attachment base made of a soft plate member is provided on the attachment base support surface 660. 616 is attached. As shown in FIG. 19 (A), the mounting base 616 has a perforated disc-like soft plate-like member partly cut out in a fan shape, and the cut-out base is shown in FIG. 19 (B). It is bonded to the mounting base support surface 660 in the shape of a head cone. A plurality of large LED bare chips 19a and small LED bare chips 19b each having a substantially rectangular shape are attached to the front surface of the attachment base 616. As shown in FIG. 19A, the large LED bare chip 19a is annularly arranged, and the small LED bare chip 19b is similarly annularly arranged so as to be offset from the LED bare chip 19a in the circumferential direction. ing. In addition, although illustration is abbreviate | omitted, each LED bare chip 19a ..., 19b ... is connected to the electrode by the wire wiring etc. As shown in FIG.

  Further, a phosphor 21 that is a transparent sealing member is attached to the tapered outer peripheral surface of the attachment base 616 attached to the lens holder 612 so as to cover the front surfaces of all the LED bare chips 19a. . In this embodiment, a wide-angle lens is used as the objective lens 611a at the front end, and the front and surroundings of the insertion portion can be observed over a wide range through the wide-angle lens.

  In this embodiment, the same basic effects as those of the other embodiments described above can be obtained, and a mounting base 616 made of a soft plate member is attached to the mounting base support surface 660 having a truncated cone shape. Therefore, the light emitted from the LED bare chips 19a... 19b.

  20 to 22 show a thirteenth embodiment of the present invention. In the endoscope apparatus of this embodiment, the outer surface of the cylindrical portion at the front end of the lens holder 12 is an attachment base support surface 760, and the attachment base 716 made of a soft plate member is attached to the attachment base support surface 760.

  The mounting base 716 is formed of a strip-shaped soft plate member as shown in FIG. 21, and LED bare chips 19a... 19b... Having different sizes are attached along the longitudinal direction of the member. As shown in FIG. 22, the mounting base 716 is rolled into a cylindrical shape and mounted on the mounting base support surface 760. At this time, the LED bare chips 19a and 19b having different sizes are offset from each other in the circumferential direction. ing. Although not shown in the case of this embodiment, each LED bare chip is connected to the electrode by wire wiring or the like.

  In addition, a reflection wall 70 whose front inner surface is a reflection surface a is extended at the rear end of the lens holder 612 located behind the mounting base support surface 760. The reflection surface 70a reflects the component of the light emitted from the LED bare chips 19a, 19b,... Toward the rear side to the front side as indicated by the arrow in FIG. Moreover, the fluorescent substance 21 which is a transparent sealing member is arrange | positioned so that the front surface of all the LED bare chips 19a ..., 19b ... may be covered on the outer peripheral side of the attachment base 716.

  Also in this embodiment, the basic effect that the LEDs can be densely arranged on the mounting base 716 can be obtained, and an advantage that a sufficient amount of light can be emitted toward the outer periphery, particularly the front outer periphery side. There is.

  In addition, when the mounting base 716 of this embodiment is formed by a soft plate member having a constant width, a long soft plate member provided with repeated wiring patterns is continuously formed in advance. The individual mounting bases 716 may be separated from the soft plate member. When the mounting base 716 is formed in this way. Production efficiency increases, and product costs can be reduced.

The perspective view of the principal part which shows 1st Embodiment of this invention. The figure which combined the perspective view (A) which shows the state which decomposed | disassembled the endoscope apparatus of the embodiment, and the perspective view (B) which shows the state which assembled and accommodated the endoscope apparatus. The longitudinal cross-sectional view of the principal part which shows the same embodiment. The front view of the principal part which shows the same embodiment. The schematic wiring diagram of LED which shows the same embodiment. The front view of the principal part which shows 2nd Embodiment of this invention. Longitudinal cross-sectional view of the main part showing the third embodiment of the present invention The longitudinal cross-sectional view of the principal part which shows 4th Embodiment of this invention. The schematic wiring diagram of LED which shows the 5th Embodiment of this invention. The schematic wiring diagram of LED which shows the 6th Embodiment of this invention. The longitudinal cross-sectional view of the principal part which shows 7th Embodiment of this invention. The figure which described combining the exploded perspective view (A) of the principal part which shows the same embodiment, and the perspective view (B) after an assembly | attachment. Sectional drawing of the principal part which shows 8th Embodiment of this invention. The disassembled perspective view which shows the 9th Embodiment of this invention. The disassembled perspective view which shows the 10th Embodiment of this invention. The figure which combined and described the perspective view (A) which shows the 11th Embodiment of this invention, and the perspective view (B) of a completed part. The front view of the principal part which shows the same embodiment. The longitudinal section of the important section showing the 12th embodiment of this invention. The figure which combined and described the top view (A) of the expansion | deployment state before the assembly | attachment of the soft plate-shaped member which shows the same embodiment, and the perspective view (B) at the time of an assembly | attachment. Sectional drawing of the principal part which shows 13th Embodiment of this invention. The top view of the expansion | deployment state of the soft plate-shaped member which shows the same embodiment. The disassembled perspective view which shows the same embodiment.

Explanation of symbols

16, 216, 316, 416, 516, 616, 716 Mounting base 216a, 216b, 316a, 316b, 416a, 416b Base plate 19a, 19b, 119a, 119b, 319a, 319b LED bare chip 21, 221, 221a, 221b Phosphor (Transparent sealing member)
35a, 35b LED wiring 36a, 36b Current control circuit 40 Cover lens (transparent sealing member)
41a, 41b Current correction resistor 60, 660, 760 Mounting base support surface 70a Reflective surface

Claims (16)

In an endoscope apparatus in which an LED for illumination is provided in an insertion portion that is inserted into a lumen of an endoscopic target,
A plurality of types of LED bare chips having different shapes or sizes are attached to a mounting base provided integrally with the insertion portion, and the front surfaces of the plurality of LED bare chips are covered with a common transparent sealing member. Endoscopic device.   The endoscope apparatus according to claim 1, wherein different types of LED bare chips are arranged between adjacent LED bare chips of the same type.   2. A plurality of LED bare chips of the same type are arranged in a ring on a circular mounting base, and a plurality of different types of LED bare chips are arranged in a ring by being offset in the circumferential direction from the LED bare chips of the same type. The endoscope apparatus according to 2.   The endoscope apparatus according to claim 1, wherein the transparent sealing member is a phosphor.   The endoscope apparatus according to claim 4, wherein the thickness of the phosphor is partially changed according to the type of the LED bare chip covering the front surface.   The endoscope apparatus according to claim 4, wherein the phosphor is partially changed in material characteristics according to a type of an LED bare chip covering a front surface.   The endoscope apparatus according to claim 1, wherein the permeable sealing member is a cover lens.   The endoscope apparatus according to claim 7, wherein the cover lens partially changes optical characteristics according to a type of an LED bare chip that covers a front surface.   The endoscope apparatus according to any one of claims 1 to 8, wherein the mounting base is configured by superposing a plurality of base plates, and different types of LED bare chips are mounted on the base plates. .   The endoscope apparatus according to claim 1, wherein the mounting base is formed of an insulating soft plate member.   The endoscope apparatus according to claim 10, wherein a mounting base support surface of the insertion portion is formed in a truncated cone shape, and a mounting base made of a soft plate member is attached to the mounting base support surface.   The endoscope apparatus according to claim 10, wherein an attachment base support surface of the insertion portion is formed in a columnar shape, and an attachment base made of a soft plate member is attached to the attachment base support surface.   The endoscope apparatus according to claim 12, wherein a reflecting surface is provided on a rear side of the soft plate member.   The LED wiring which connected the LED bare chip of the same kind was provided with two or more sets according to the kind of LED bare chip, and each LED wiring was each connected to the separate electric current control circuit, The any one of Claims 1-13 characterized by the above-mentioned. The endoscope apparatus described.   A plurality of LED wirings connecting the same type of LED bare chips are provided according to the type of LED bare chip, and these LED wirings are connected in parallel to a common current control circuit, and a current correction resistor is connected to any LED wiring. The endoscope apparatus according to claim 1, wherein the endoscope apparatus is provided. An adapter having a mounting base to which the LED bare chip is attached and a transparent sealing member covering the front surface thereof is detachably provided at the distal end of the insertion portion body, and the plurality of sets of LED wiring and current correction are provided on the adapter. The endoscope apparatus according to claim 15, wherein a resistor is provided.

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