1377402 九、發明說明： 【發明所屬之技術領域】 % 本發明係關於一種背光模組及其組裝方法，特別是一種簡化組裝並提 v 昇發光效率的背光模组及其組裝方法。1377402 IX. Description of the invention: [Technical field to which the invention pertains] % The present invention relates to a backlight module and an assembly method thereof, and more particularly to a backlight module that simplifies assembly and improves luminous efficiency and an assembly method thereof.
V 【先前技術】 習知背光模组如一種邊光(Edge light)式背光模組，是利用位在該背光模 組側邊的發光元件如燈管或發光二極體(LED)等產生可見光源，並藉由一包 • 覆該發光元件的燈罩(Lamp holder)内表面(該燈罩可具反射功能)將該光源 、 反射導入一導光板中，該光源在該導光板内會以全反射臨界角進行連續的 反射傳遞，亦會受位在導光板下表面之反射片反射，使光源射出導光板上 ' 表面。 • 如第1圖所示，為習知背光模組10之發光二極體(LED)之組裝方式， 其中需利用一雙面膠14將一承載發光二極體12的電路基板13直接貼附於 一燈罩15内表面，但因為只能手動安裝，其組裝極不容易；此外，受到電 鲁 路基板13上用於焊固發光二極體12之焊墊(pad)距離該電路基板13邊緣至 少要維持一定的製作公差(如〇_25 mm)的限制，使該發光二極體12側表面 無法與電路基板丨3邊緣對齊，該發光二極體12與導光板1之間形成一間 隙17，故使該導光板u不能緊靠該發光二極體12 ’光源易從間隙中散出， 進而使發光效率降低。 為改善前述絚裝將電路基板直接貼附於燈罩所造成的不方便，另有一 習知背光模組20，如第2圖所示’其係利用一背膠24將該導光板21、電 路基板23和燈罩25三者固定在一起；惟，此種固定方式不僅無法改善組 5 1377402 裝不易的問題且會進-步導致導触果變差。 【發明内容】 ’ 本發@之纟要目的在提供—背光模組及其組裝方法，其利用在燈罩 、Λ形成一開孔’將至少一發光二極體經該開孔直接置入該燈罩内，且承載 該至少-發光二極體的電路基板可_定至腿罩外表面上，使得光源組 裝更為容易及簡化。 本發明之-人要目的在提供—背光模組及其組裝方法，其個在燈罩 鲁 上形成開孔’以方便將至少一發光二極體經該開孔置入該燈罩内，且使 、 —置人該燈罩_導光板可以緊靠該至少-發光二極體，以提昇該模組之 發光效率。 為達上述目的，本發明提供一種背光模組，其包括：至少一發光二極 體、-導絲、-承載該至少—發光二極體的電路基板，以及—罩體部。 該罩體部具#-上蓋、-下蓋及-側邊以在該罩體勒部形成-收容 空間，其中該導光板設置於該罩體部之部份内表面上…開孔係貫穿該罩 # 體部之上蓋、下蓋及側邊三者其中之一的内外表面，使該發光二極體可以 經由關孔置人該罩體部的收容㈣中，融緊_導光板以完整地導引 光源。在錄光二嫌置人之后，該承紐光二鋪的t路基減以螺絲 或黏朦固定於該罩體部之上蓋、下蓋及侧邊三者其中任一的外表面上。盆 中該電路基板可為一具可撓性之軟板材質。 此外，本發明亦提供一種背光模組之組裝方法，包括： 提供-具有-收容空間之罩體部’該罩體部係具有—開孔貫穿該罩體 6 1377402 部之内外表面； 提供-電路基板’該電路基板上承餘少—料二極體； t 職至少一發光二極體經由該開孔置入該罩體部的收容空間中； 將該電路基板固定於該罩體部的外表面上；以及 將-導光板設置於該罩體部之部份内表面，並鄰接該至少—發光二極 體，藉此大幅簡化該背光模組之組裝。 【實施方式】 • 首先如第3圖所示，為依據本發明之第-實施例的-種背光模組30之 V 側向^面圖主要包括·導光板3卜光源元件32、電路基板33、固持元件 34及罩體部35 » 該光源兀件32可為一發光二極體(LED)或是其他燈具，其具有焊塾 •焊固於該電路基板33上電性連接該電路基板33以進行發光。為簡化說明 起見’第3圖所不僅以—個光社件32為代表之示意圖，實際運用時，該 背光組裝職3G師係可⑽置多鑛述光駄件％。 籲 $體部35主要為一上蓋35卜一下蓋352及-使上下蓋相互連接的側 邊353所組成’形成如同一”匸，，字型的斷面，並使該罩體部％内部形成一 收容空間356 ;罩體邹35另包括一開孔36貫穿該罩體部35之下蓋352内 外表面’該下蓋352可延伸至該導光板31 T方，而導光板31 -側末端緊 鄰該開孔30邊緣’亦即導光板係設置於部份下蓋352之内表面上，但 並未遮住開孔36。藉此，當該連接電路基板33上的光源元件32經由該開 孔36置入該罩體部35的收容空間356中時，可使該光源元件32在該罩體 7 1377402 部35中的位置恰能緊鄰該導光板31之側末端，以完整地導引光源方向， 避免散光《此時，位於該開孔36之外的電路基板33亦能藉由該固持元件 ^ 34 (如黏膠或螺絲)固定於該罩體部35之下蓋352的外表面上。需注意的 、，， 疋’在其他實施方式上，該罩體部35本身可為一燈罩(LampHolder)或者是 一内表面塗覆或放置反射料質的反射罩，亦可設計成與一反射板一體製成。 另見第4圖所示，為依據本發明之第二實施例的一種背光模组4〇之側 向°】面圖，主要包括·導光板41、光源元件42、電路基板43 '固持元件 _ 44、罩體部45及背板49。與前述第-實施例不同之處在於，該罩體部45 係與背板49 一體成形，藉此無需分成兩個組件來製作，因而可降低製作成 另見第5圖所示，為依據本發明之第三實施例的—種背光模组5〇之側 向抽圖，主要包括：導光板5卜光源元件52、電路基板53、固持元件 54及罩體部55。與前述第一實施例不同之處在於，—開孔％係貫穿該罩 體部55之上蓋551的内外表面，該上蓋551可延伸至該導光板5ι上方， _而導光板51 -侧末端緊鄰該開孔56邊緣，亦即導光板51係設置於部份上 蓋551之内表面上，但並未遮住開孔56。當該連接電路_53的光源元件 52經由該開孔56置入該罩體部％的收容空間说中時，該光源元件邮 該罩體部55中的位置可以緊鄰該導光板51之側末端。此時，位於該開孔 %之外的電路基板53亦能藉由該固持元件54 (如黏穆或螺絲)固定於該罩 體部55之上蓋551的外表面上。同時，由於電路基板y係位於罩體部％ 之上蓋551的外表面上，因此該電路基板53之部份厚度可以為位於該罩體 8 邛55上方的膠框(未繪示)所包含容納，相對可以讓整體模組的厚度減少。 在其他實财U，料_55本衫為—燈犯㈣腿ef)或者是一内 表面塗覆或放置反射料質的反射罩。 另見第6圖所示，為依據本發明之第四實施例的一種背光模組6〇之側 向。J面圖’主要包括.導歧61、光源元件&、電路基板&、固持元件 64及罩體部65。與前述第三實施例不同之處在於，一開孔％储向貫穿 該罩體部65之-崎M3之⑽表面。#該連接基板63上的光源元 件62經由該開孔66置入該罩體部65的收容空間娜中時，該光源元件纪 頂端可以緊靠該導光板61之—側末端。因為電路基板63是-具可撓性之 軟板材質，因此可藉由該固持元件64 (如黏勝或螺絲)固定於該罩體部65之 上蓋651、下蓋652及側邊653三處或任何一處的外表面。利用將光源元件 62設置於罩體部65之側邊653時，於未減小整體背光模組之大小之情況 下，相對的，該導光板62.¾:計的長度可以增長；或者，於使用相同長度之 導光板62之情況下，整體背光模組之大小則可以變小。 於本發明中，發光二極體之數目可以為一個或是複數個。於具有複數 個發光二極體之情況下，其相對應之罩體部之開孔數目可以是一對一的開 孔數目’也就是說，罩體部之開孔係為各自獨立的，且開孔之數目是與發 光二極體之數目相同。當然’發光二極體之數目與相對應之罩體部之開孔 數目亦可以是以例如二對一之情形設計，也就是說，罩體部之開孔係為各 自獨立的’每二個發光二極體為一組，設置於一開孔内，此時，開孔之數 目則是為發光二極體之數目之一半。於實際運用時，可以依實際需求而加 1377402 以變化，並不以上述為限。 此外，如第7圖所示為一種背光模組之組裝方法，包括下列步肆： 步帮S70 ’提供-草體部，該罩體部具有一上蓋、一下蓋及一側邊以形 -收谷空間，且該罩體部具有一開孔貫穿該罩體部之上蓋、下蓋或側邊 二者任何一處之内外表面上。 中 步帮S72，提供-電路基板，該電路基板上承載至少一發光二極體。 步锦S74,將該至少一發光二極體經由該開孔置入該罩體部的收容空間 步驟S76，在該發光二嫌置人該输卩之后，即侧则絲或黏膠 將該電路基板ϋ錄關孔外找雜敎—核面上。如絲電路基板 為本身為-可撓性之軟減質，射固定於該罩體部之上蓋、下蓋及側邊 三者中任一處上。 ^驟S78 ’將-導光板&置於該罩體部之部份内表面上，並鄰接該至少 一發光二_ ’藉此大幅簡化歸絲組之組裝。需注意的是，前述罩體 部本身可為-辟(Lamp Hddei·)或者是-内表面塗覆姐置反射料質的反 射罩，亦可設計成與一反射板一體製成或與背板一體成形。 基此，本發明提供的一種背光模組及其組裝方法，是利用燈罩上開設 一開孔，可以方便地將發光二極體經該開孔直接置入該燈罩中藉以緊靠導 光板，以提昇該模組之發光效率；在發光二極體置入之后，即可迅速地將 承載發光二極體的電路基板貼固至該燈罩外表面上之工作，因而能提昇組 裝效率。 1377402 綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟以上 所述者僅為本發明之較佳實施例，舉凡熟悉此項技藝之人士，在援依本發 明精神架構下所做之等效修飾或變化，皆應包含於以下之申請專利範圍内。V [Prior Art] A conventional backlight module, such as an edge light type backlight module, generates visible light by using a light-emitting element such as a lamp tube or a light-emitting diode (LED) located on the side of the backlight module. a source, and the light source and the reflection are introduced into a light guide plate by a cover covering an inner surface of the light holder (the light cover can have a reflection function), and the light source is totally reflected in the light guide plate The critical angle is continuously reflected and transmitted, and is also reflected by the reflection sheet located on the lower surface of the light guide plate, so that the light source is emitted from the surface of the light guide plate. As shown in FIG. 1 , the LED module of the conventional backlight module 10 is assembled, and a circuit board 13 carrying the LED 12 is directly attached by a double-sided tape 14 . On the inner surface of a lampshade 15, but because it can only be manually installed, its assembly is extremely difficult; in addition, the pad on the electric circuit board 13 for soldering the light-emitting diode 12 is spaced from the edge of the circuit substrate 13. At least a certain manufacturing tolerance (such as 〇25 mm) is required to ensure that the side surface of the light-emitting diode 12 cannot be aligned with the edge of the circuit board 丨3, and a gap is formed between the light-emitting diode 12 and the light guide plate 1. 17, so that the light guide plate u can not be close to the light-emitting diode 12' light source is easily discharged from the gap, thereby reducing the luminous efficiency. In order to improve the inconvenience caused by attaching the circuit board directly to the lamp cover, the conventional backlight module 20, as shown in FIG. 2, uses a backing glue 24 to guide the light guide plate 21 and the circuit substrate. 23 and the lampshade 25 are fixed together; however, this fixing method can not only improve the problem that the group 5 1377402 is not easy to install, and the step-by-step causes the guide fruit to deteriorate. SUMMARY OF THE INVENTION [The present invention is intended to provide a backlight module and an assembly method thereof, which utilizes an opening in the lampshade and the crucible to directly insert at least one light-emitting diode into the lampshade through the opening. The circuit substrate carrying the at least-light-emitting diode can be fixed to the outer surface of the leg cover, so that the light source assembly is easier and simplified. The object of the present invention is to provide a backlight module and an assembly method thereof, wherein an opening is formed in the lampshade to facilitate placing the at least one light-emitting diode into the lampshade through the opening, and - placing the lampshade - the light guide plate can abut the at least - light emitting diode to enhance the luminous efficiency of the module. To achieve the above object, the present invention provides a backlight module including: at least one light emitting diode, a guide wire, a circuit substrate carrying the at least light emitting diode, and a cover portion. The cover portion has a #-upper cover, a lower cover and a side to form a receiving space in the cover portion, wherein the light guide plate is disposed on a part of the inner surface of the cover portion;罩# The inner and outer surfaces of one of the upper cover, the lower cover and the side of the body, such that the light-emitting diode can be placed in the housing (4) of the cover body via the closing hole, and the light guide plate is completely integrated Guide the light source. After the recording of the second light, the t-base of the New Zealand Light II shop is fixed by screws or adhesives on the outer surface of any of the upper cover, the lower cover and the side of the cover. The circuit board in the basin can be made of a flexible flexible board material. In addition, the present invention also provides a method for assembling a backlight module, comprising: providing a cover portion having a accommodating space, wherein the cover portion has an opening and an inner and outer surface extending through the cover portion of the cover member 6 1377402; a substrate on the circuit substrate with a small amount of material diodes; at least one light emitting diode is placed in the receiving space of the cover portion through the opening; the circuit substrate is fixed outside the cover portion And arranging the light guide plate on a part of the inner surface of the cover portion and adjoining the at least one light emitting diode, thereby greatly simplifying assembly of the backlight module. [Embodiment] First, as shown in FIG. 3, the V side view of the backlight module 30 according to the first embodiment of the present invention mainly includes a light guide plate 3, a light source element 32, and a circuit board 33. The holding element 34 and the cover portion 35 » The light source element 32 can be a light emitting diode (LED) or other lamp having a soldering wire and soldered to the circuit substrate 33 to electrically connect the circuit substrate 33 To illuminate. In order to simplify the explanation, the 3rd figure is not only a schematic diagram represented by a photo-member 32. In actual use, the backlight assembly unit 3G division can (10) set up more minerals. The body portion 35 is mainly composed of an upper cover 35 and a cover 352 and a side 353 which connects the upper and lower covers to each other to form a cross section of the same shape, and the inner portion of the cover portion is formed. a receiving space 356; the cover body 35 further includes an opening 36 extending through the inner surface of the lower cover 352 of the cover portion 35. The lower cover 352 can extend to the light guide plate 31 T, and the side end of the light guide plate 31 is adjacent to the side The edge of the opening 30, that is, the light guide plate is disposed on the inner surface of the partial lower cover 352, but does not cover the opening 36. Thereby, when the light source element 32 on the connection circuit substrate 33 passes through the opening When the 36 is placed in the receiving space 356 of the cover portion 35, the position of the light source member 32 in the portion of the cover 7 1377402 can be just adjacent to the side end of the light guide plate 31 to completely guide the direction of the light source. Avoiding astigmatism "At this time, the circuit substrate 33 located outside the opening 36 can also be fixed to the outer surface of the lower cover 352 of the cover portion 35 by the holding member 34 (such as adhesive or screw). It should be noted that, in other embodiments, the cover portion 35 itself may be a lamp cover (LampHolder) or The reflector is coated on the inner surface or placed on the reflective material, and can also be designed to be integrally formed with a reflector. See also FIG. 4, which is a backlight module 4 according to the second embodiment of the present invention. The side surface of the crucible includes a light guide plate 41, a light source element 42, a circuit board 43' holding member 44, a cover portion 45, and a back plate 49. The difference from the foregoing embodiment is that The cover portion 45 is integrally formed with the back plate 49, thereby eliminating the need to be divided into two components, thereby reducing the fabrication of the backlight module according to the third embodiment of the present invention. 5侧 lateral drawing, mainly includes: light guide plate 5 light source element 52, circuit substrate 53, holding element 54 and cover portion 55. The difference from the first embodiment is that - the opening % is through The inner and outer surfaces of the cover 551 of the cover portion 55, the upper cover 551 can extend above the light guide plate 5, and the side end of the light guide plate 51 is adjacent to the edge of the opening 56, that is, the light guide plate 51 is disposed on the partial cover 551. On the inner surface, but does not cover the opening 56. When the light source of the connecting circuit _53 When the element 52 is inserted into the receiving space of the cover portion % via the opening 56, the position of the light source element in the cover portion 55 may be adjacent to the side end of the light guide plate 51. At this time, the opening is located. The circuit substrate 53 other than % can also be fixed to the outer surface of the upper cover 551 of the cover portion 55 by the holding member 54 (such as a glue or a screw). Meanwhile, since the circuit substrate y is located at the cover portion On the outer surface of the upper cover 551, a part of the thickness of the circuit board 53 can be accommodated by a plastic frame (not shown) located above the cover 8 邛 55, which can reduce the thickness of the overall module. In other real money, the material is _55, the shirt is a light (4) leg ef) or a reflective cover is coated or placed on the inner surface. See also Fig. 6, which is a side view of a backlight module 6A according to a fourth embodiment of the present invention. The J-side view mainly includes a guide 61, a light source element & a circuit board & a holding member 64, and a cover portion 65. The difference from the foregoing third embodiment is that an opening % is stored toward the (10) surface of the - M3 through the cover portion 65. When the light source element 62 on the connection substrate 63 is placed in the housing space of the cover portion 65 via the opening 66, the light source element top end can abut the side end of the light guide plate 61. Because the circuit board 63 is made of a flexible flexible board material, it can be fixed to the cover portion 65, the lower cover 652 and the side 653 by the holding member 64 (such as a sticker or a screw). Or the outer surface of any place. When the light source element 62 is disposed on the side edge 653 of the cover portion 65, the length of the light guide plate 62.3⁄4: can be increased without reducing the size of the overall backlight module; or In the case where the light guide plate 62 of the same length is used, the size of the entire backlight module can be made small. In the present invention, the number of the light emitting diodes may be one or plural. In the case of having a plurality of light-emitting diodes, the number of openings of the corresponding cover portion may be a one-to-one number of openings. That is, the openings of the cover portion are independent, and The number of openings is the same as the number of light-emitting diodes. Of course, the number of the light-emitting diodes and the number of openings of the corresponding cover portion can also be designed, for example, in a two-to-one manner, that is, the openings of the cover portion are independent of each of the two The light-emitting diodes are a group and are disposed in an opening. At this time, the number of the openings is one-half of the number of the light-emitting diodes. In actual use, it can be changed according to actual needs by 1377402, not limited to the above. In addition, as shown in FIG. 7 , a method for assembling a backlight module includes the following steps: Step S70 'provides a grass body portion, the cover body portion has an upper cover, a lower cover and a side edge to shape-receive a valley space, and the cover portion has an opening extending through the inner and outer surfaces of any of the upper cover, the lower cover or the side of the cover portion. The middle step S72 provides a circuit substrate on which at least one light emitting diode is carried. Step S74, the at least one light-emitting diode is placed into the accommodating space of the cover portion through the opening step S76, after the light-emitting diode is placed, the side wire or the glue is used for the circuit The substrate is recorded outside the hole to find the chowder-nuclear surface. The silk circuit board is softly degraded by itself, and is fixed to any of the upper cover, the lower cover and the side of the cover. The step S78' places the light guide plate & on a portion of the inner surface of the cover portion and abuts the at least one light-emitting portion to greatly simplify the assembly of the wire group. It should be noted that the cover portion itself may be a Lamp Hddei or a reflective cover on which the inner surface is coated with a reflective material, or may be designed to be integrally formed with a reflector or with a back plate. One piece is formed. Therefore, the backlight module provided by the present invention and the assembling method thereof are characterized in that an opening is formed in the lamp cover, and the light-emitting diode can be conveniently placed directly into the lamp cover through the opening to abut the light guide plate, thereby The luminous efficiency of the module is improved; after the light-emitting diode is placed, the circuit substrate carrying the light-emitting diode can be quickly attached to the outer surface of the lamp cover, thereby improving assembly efficiency. 1377402 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention are included in the following claims. .
11 1377402 【圖式簡單說明】 第1圖為習知背光模組之一剖面視圖。 - 第2圖為另一習知背光模組之一剖面視圖。 丨 第3圖為依據本發明之第—實施例之背光模組的-剖面視圖。 第4圖為依據本發a月之第二實施例之背光模組的一剖面視圖。 第5圖為依據本發明之第三實施例之背光模組的—剖面視圖。 第6圖為依據本發明之第四實施例之背光模組的一剖面視圖。 • 帛7圖顯示依據本發明之背光模組之組裝方法的流程圖。 【主要元件符號說明】 10, 20 習知背光模組 H，21 導光板 12, 22 發光二極體 13, 23 電路基板 14,24 雙面膠 15, 25， 燈罩 17 間隙 49 背板 30, 40, 50, 60 背光模組 31,41,51,61 導光板 32,42,52, 62 發光二極體 33, 43, 53, 63電路基板 34,44, 54, 64 雙面膠 35, 45, 55, 65 罩體部 36, 46, 56, 66 開孔 351，551，651 上蓋 352, 652 下蓋 353,653 側邊 356, 556, 656 收容空間 S70, S72, S74, S76及S78皆為方法步驟 1211 1377402 [Simple description of the drawing] Figure 1 is a cross-sectional view of a conventional backlight module. - Figure 2 is a cross-sectional view of another conventional backlight module. Figure 3 is a cross-sectional view of a backlight module in accordance with a first embodiment of the present invention. Figure 4 is a cross-sectional view of a backlight module in accordance with a second embodiment of the present invention. Fig. 5 is a cross-sectional view showing a backlight module in accordance with a third embodiment of the present invention. Figure 6 is a cross-sectional view showing a backlight module in accordance with a fourth embodiment of the present invention. • Figure 7 shows a flow chart of the assembly method of the backlight module according to the present invention. [Main component symbol description] 10, 20 Conventional backlight module H, 21 Light guide plate 12, 22 Light-emitting diode 13, 23 Circuit board 14, 24 Double-sided tape 15, 25, Lamp cover 17 Clearance 49 Back plate 30, 40 , 50, 60 backlight module 31, 41, 51, 61 light guide plate 32, 42, 52, 62 light-emitting diode 33, 43, 53, 63 circuit board 34, 44, 54, 64 double-sided tape 35, 45, 55, 65 hood 36, 46, 56, 66 opening 351, 551, 651 upper cover 352, 652 lower cover 353, 653 side 356, 556, 656 accommodating spaces S70, S72, S74, S76 and S78 are all method step 12