JP2005340669A5 - - Google Patents
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- Publication number
- JP2005340669A5 JP2005340669A5 JP2004160230A JP2004160230A JP2005340669A5 JP 2005340669 A5 JP2005340669 A5 JP 2005340669A5 JP 2004160230 A JP2004160230 A JP 2004160230A JP 2004160230 A JP2004160230 A JP 2004160230A JP 2005340669 A5 JP2005340669 A5 JP 2005340669A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004160230A JP4455166B2 (ja) | 2004-05-28 | 2004-05-28 | リードフレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004160230A JP4455166B2 (ja) | 2004-05-28 | 2004-05-28 | リードフレーム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005340669A JP2005340669A (ja) | 2005-12-08 |
JP2005340669A5 true JP2005340669A5 (nl) | 2007-06-14 |
JP4455166B2 JP4455166B2 (ja) | 2010-04-21 |
Family
ID=35493857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004160230A Expired - Fee Related JP4455166B2 (ja) | 2004-05-28 | 2004-05-28 | リードフレーム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4455166B2 (nl) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596796B (zh) | 2010-03-30 | 2017-08-21 | Dainippon Printing Co Ltd | Light-emitting diode lead frame or substrate, semiconductor device, and light-emitting diode lead frame or substrate manufacturing method |
US8933548B2 (en) | 2010-11-02 | 2015-01-13 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
CN107742472B (zh) * | 2017-09-25 | 2021-03-26 | 昆山国显光电有限公司 | 封装掩膜板、封装方法及显示面板 |
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2004
- 2004-05-28 JP JP2004160230A patent/JP4455166B2/ja not_active Expired - Fee Related