JP2005340510A - Method for manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board suitable for a mounted circuit device for easily forming a plated layer for enabling highly reliable bonding, and for executing fine wiring patterning. <P>SOLUTION: This method for manufacturing a wiring board comprises a process to carry out the pattern etching of the first face side conductive region of a conductive sheet 8, and to form a projecting conductive part including a plurality of independent wiring layers 9, 10, 11a and 11b of a wiring board on the second face side conductive region; a process to laminate the projecting conductive part of the conductive sheet oppositely to an insulating layer, and to embed and integrate the projecting conductive part in an insulating layer; a process to remove the second face side conductive layer by etching while a band-shaped plated electrode is made to remain for commonly connecting the independent wiring layers; a process to coat an insulating layer for plating so that the region to be plated can be exposed; a process to plate the region to be plated; and a process to remove the band-shaped plate electrode part, and to electrically separate the independent wiring layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a wiring board having a wiring pattern portion having a bonding pad, such as for a mounted circuit device or a package.

  As is well known, mounting circuit devices or packages in which electronic components such as IC elements and resistor elements are mounted on a wiring board are being put to practical use for the purpose of enhancing the functionality and miniaturization of various electronic devices. ing. In this type of mounting circuit device or package configuration, for example, a wiring board having a wiring pattern portion including a wire bonding pad, a solder bonding pad, etc., an island pad, etc. is used. In addition, the wiring board has a single-sided type or a double-sided type in which signal wiring patterns are built in an insulating layer in multiple layers, or a configuration in which a ground layer or a heat dissipation layer is installed on the back surface (other main surface). May be taken.

  FIG. 7 is an enlarged plan view of an example of a single-sided wiring board of this type, and includes a wire bonding pad 2a, a solder bonding pad 2b, etc. on one main surface of the insulator layer 1. A pattern portion 2 and further an island-shaped pad (electronic component mounting portion) 3 are provided. Here, the wire bonding pad 2a, the solder bonding pad 2b, and the island-like pad 3 are patterned simultaneously with the so-called wiring pattern 2c by selective etching of copper foil or the like, but it is easy to form a highly reliable connection. Thus, these surfaces are plated with gold or the like.

  That is, when the wiring pattern part 2 including the wire bonding pad 2a, the soldering pad 2b, and the island-like pad 3 are formed by selective etching in the manufacturing process of the wiring board, as shown in FIG. The power supply terminal portions 4a and 4b to which 2 is connected are patterned on the outer peripheral edge portion, and the outer shape processed portion 5 on the tip side of the power supply terminal portions 4a and 4b is used as a plating electrode. Then, a plating resist layer is coated on the entire surface except the surface of the wire bonding pad 2a, the surface of the solder bonding pad 2b, the surface of the island-shaped pad 3 and the surface of the power supply terminal portions 4a and 4b (regions partitioned by dotted lines). Then, after electroplating and selectively providing a required metal plating layer, for example, a gold plating layer, in a region along preset outline processing lines, for example, AA and BB lines The wiring board is manufactured by cutting and separating.

  In addition, in the manufacturing process of the wiring board, a part of the island-shaped pad 3 is electrically independent from the so-called wiring pattern 2, and as shown in FIG. The lead wire 6 is patterned and connected to the plating electrode 5, and after the completion of plating, the lead wire 6 is broken by drilling 7 processing or the like. Further, in this type of wiring board manufacturing means, the wiring board is generally designed to have multiple layouts in consideration of productivity and mass productivity. That is, a plurality of groups of unit wiring pattern portions 2 and power supply terminal portions 4a and 4b are patterned on one main surface of the insulator layer, and plating electrodes are made common in the outer shape processing portion 5 to perform selective plating processing collectively. After performing the above, a method of separating the unit wiring board also for external processing is adopted.

  Wiring boards for mounting circuit devices tend to require a configuration with island-like pads for expanding applications, improving functions, etc. On the other hand, not only the surface plating process is complicated, but also the wiring pattern There is a disadvantage that the design of 2c is restricted. That is, since the island-shaped pad 3 is not integrated with the so-called wiring pattern portion 2 like the wire bonding pad 2a or the like, it is necessary to separately form the power supply wiring pattern 6 in the electroplating process. However, the routing of the power supply wiring pattern 6 restricts the design of wiring miniaturization and high density wiring.

  Furthermore, if the power supply wiring pattern 6 is routed, there is a risk that the miniaturization of the wiring pattern 2c in the proximity region, the high density wiring, and the compactness of the wiring board may be impaired. Further, in order to increase the degree of freedom of the design, when the interlayer connection method is adopted, not only the routing wiring 6 is complicated, but also post-processing such as disconnection of the routing wiring 6 is required, so that the manufacturing process becomes complicated. This causes a decrease in productivity.

  In particular, an island-shaped pad 3 electrically connected by a conductor penetrating the insulator layer 1 is partially planar in FIG. 9A and partially cross-sectional in FIG. 9B. In the case of an interposer type of double-sided wiring board as shown in an enlarged manner, the arrangement of the lead wires 6 between the outer shape processed parts (plating electrodes) 5 connected to the island-like pads 3 is complicated, and the wiring pattern 2c has a high density. Is inhibited.

In any case, compared to the plated area of the wiring pattern portion 2, there is a concern that it is difficult to control the thickness of the electroplated layer formed due to the shape and thickness of the power supply wiring pattern 6.

  To deal with these problems, electroless plating may be applied instead of electroplating. However, there are problems such as ease of adverse effects due to plating temperature, difficulty in controlling the plating layer thickness, and cost. .

  The present invention has been made in response to the above-described circumstances, and is a wiring board suitable for a mounting circuit device that can easily form a plating layer that enables highly reliable bonding and can also form a finer wiring pattern. The purpose is to provide a manufacturing method.

In the first aspect of the present invention, the conductive region on the first surface side of the conductive sheet formed by the conductive region on the first surface side and the conductive region on the second surface side is subjected to pattern etching, and the second surface side Forming a convex conductive portion including a plurality of independent wiring layers to be a wiring circuit on the conductive region;
Laminating the convex conductive portion of the conductive sheet facing the insulator layer, and embedding and integrating the convex conductive portion into the insulator layer;
Removing the conductive region on the second surface side by etching, leaving a strip-shaped plating electrode portion so as to commonly connect the independent wiring layers; and
Coating the insulating layer for plating so that the region to be plated is exposed on the second surface side of the convex conductive portion exposed by the etching removal;
Plating the region to be plated through the strip-like plating electrode portion;
And a step of electrically separating the independent wiring layers from each other by removing the strip-like plated electrode portion.

  It is preferable that the connection between a part of the independent wiring layer and the strip-shaped plated electrode portion is made by an extension line of the convex conductive portion formed between the independent wiring layer and the strip-shaped plated electrode portion.

According to a second aspect of the present invention, there is provided an independently separated wiring pattern portion including a bonding pad on the first surface of the conductive sheet, a power supply terminal portion connected to each of the wiring patterns and extending toward the edge outer shape processing side, an island shape A contoured part that integrates the pad part and the power supply terminal part side is formed, and the wiring pattern part, the power supply terminal part, and the island-shaped pad part are formed on the convex conductive part by selective half-etching. Process,
The conductive sheet forming surface of the conductive sheet is laminated facing the insulator layer, and this laminate is pressed in the thickness direction so that the convex conductive part forming region of the conductive sheet is embedded in the insulator layer and integrated. Forming a conductive sheet-clad plate exposed on the second surface;
A conductive region covered with an etching resist layer for forming a strip-shaped plating electrode portion is formed between the wiring pattern portion and the power supply terminal portion of the conductive sheet-clad plate and adjacent to the island-shaped pad portion with an etching resist layer. A step of selectively etching and removing the flat second surface side of the sheet to separate the wiring pattern and the power supply terminal;
A plating resist layer is coated on the surface of the separated wiring pattern portion excluding the bonding pad, the power supply terminal portion, and the island-like pad portion, and selective plating is performed using the strip-like plating electrode portion as an electrode. Process,
A step of selectively removing the strip-shaped plated electrode portion to insulate and isolate each wiring pattern, the power supply terminal portion and the island-shaped pad;
The step of covering the wiring pattern other than the plated area of the wiring board obtained by insulating and isolating between each wiring pattern, the power supply terminal portion and the island-shaped pad, and
Cutting and separating the wiring board coated with the solder resist layer along an outline processing line;
It is in the manufacturing method of the wiring board characterized by comprising.

According to a third aspect of the present invention, there is provided an independently separated wiring pattern portion including a bonding pad on the first surface of the conductive sheet, a power supply terminal portion connected to each of the wiring patterns and extending toward the edge outer shape processing side, an island shape A contoured portion that integrates the pad portion and the power supply terminal portion side is formed, and the wiring pattern portion, the power supply terminal portion, and the island-shaped pad portion are selectively formed into a convex conductive portion by a half-etching process. Process,
The conductive sheet forming surface of the conductive sheet is laminated so as to face the insulator layer, and the laminate is pressed in the thickness direction so that the convex conductive portion of the conductive sheet is embedded in the insulator layer and integrated. A step of forming a conductive sheet-clad plate that is exposed;
Cover the strip-shaped plating electrode region with an etching resist layer to form a strip-shaped plating electrode that conducts to the contoured portion and island-shaped pad portion of the power supply terminal portion of the conductive sheet stretching plate and crosses the conductive sheet stretching plate, and is exposed A step of selectively etching the second surface side of the conductive sheet and separating the wiring pattern and the power supply terminal leaving the strip-shaped plating electrode;
Coating the plating resist layer on the surface of the separated wiring pattern portion excluding the bonding pad, the power supply terminal portion, and the island-shaped pad portion, and performing a selective plating process using the strip-shaped plating electrode as one electrode; ,
A step of selectively etching away the strip-shaped plating electrode after the electroplating process to insulate and isolate the island-shaped pad;
A step of coating the area other than the plated area of the wiring board obtained by insulating and isolating the island-shaped pads with a solder resist layer;
Cutting and separating the wiring board coated with the solder resist layer along the outer shape processing line;
It is in the manufacturing method of the wiring board characterized by comprising.

  According to one aspect of the present invention, the conductive sheet is, for example, a copper foil, an aluminum foil, a nickel foil, or the like having a thickness of about 12 to 35 μm, and a copper foil is desirable from the viewpoint of economy and workability. This selective half-etching (projection patterning on one side) of the conductive sheet includes, for example, subsequent etching processing, masking with an etching resist such as a dry film, processing with a corresponding etching solution, or flash etching. Done in the process.

  The insulator layer may be, for example, an epoxy resin, a phenol resin, a polyimide resin, a polyamideimide resin, a polyetherimide resin, a polyetheretherketone resin, a liquid crystal polymer, or a mixed system such as glass cloth, It is a sheet (film-like) combined with mats, fibers and the like. And the thickness of these insulator layers is about 10-1000 micrometers, Preferably it is about 50-200 micrometers, and it is good also as a structure which has a wiring pattern on both surfaces.

The insulator layer is preferably a multiaxially oriented thermoplastic liquid crystal polymer layer represented by, for example, xidar (trade name, manufactured by Dartco), Vectra (trade name, manufactured by Clanese), or the like. That is, this type of liquid crystal polymer has almost no hygroscopicity, has a dielectric constant of about 3.0 (1 MHz), and is stable in a wide frequency range.

  In the present invention, the plating resist that covers the areas to be plated prior to electroplating, that is, the bonding pads, the island-shaped pads, and the power supply terminals, is usually used in the manufacture of this type of wiring board. There is no particular limitation on the thickness and the like. For the bonding pads, the power supply terminal portions, and the island-shaped pads included in the wiring pattern portion, the conductor foil that forms the outer shape processed portion can also be used as a plating electrode.

  The band-shaped plated electrode portion is formed so as to cross the wiring pattern region from one side to the other side. The band shape is understood to have a broad meaning, and the ratio of the width to the length is 1 as long as the function is the same as well as 1 or more. The following are also included. In addition to the linear shape, it also includes a lattice shape, meandering, and other pattern arrangements.

  According to the present invention, not only thinning and miniaturization are possible with the formation of a wiring pattern or the like by so-called half-etching on one main surface, that is, the first surface side, but these wiring patterns and the like are also formed on the surface of the insulator layer. A configuration in which it is embedded and arranged is adopted. On the other hand, when forming the plating layer on the bonding pad surface and the island-shaped pad surface, the non-etching region is selectively left by crossing and conducting the wiring pattern group on the other main surface, that is, the second surface side. Make the layer function as a common strip-like plating electrode.

  In other words, a part of the conductive sheet used for wiring patterning is used for feeding power for electroplating not only to the bonding pads of the wiring pattern part but also to the island-shaped pads, and after the electroplating process, the means for separating conduction by half etching Is adopted. For this reason, it is possible to omit the formation of a power supply routing pattern for each island-shaped pad, and it is possible to reduce the size or increase the density of a highly accurate wiring pattern, thereby yielding a highly reliable wiring board for a mounted circuit device. Good and can be offered in mass production. Here, half-etching means that etching is performed up to the middle portion of the sheet without penetrating from one surface of the front and back surfaces of the conductive sheet, and this middle portion does not necessarily have to be at a half thickness position of the sheet.

  The conductive regions on the first surface side and the second surface side are regions having a thickness that is half-etched from one surface side. The remaining etched portion becomes the other conductive region.

  A description will be given below with reference to FIGS.

(Embodiment 1)
First, a conductive sheet having a thickness of 35 μm, for example, a copper foil is prepared as a conductive sheet, and an etching resist layer, for example, a photo-curable dry film is integrally disposed on at least one surface of the copper foil. The dry film is exposed and developed, and resist masking is performed according to the outer shape processing region and the wiring pattern. Thereafter, a half-etching process is performed to independently separate wiring pattern portions including bonding pads, power supply terminal portions that are connected to the respective wiring patterns and extend to the edge outer shape processing side, island-shaped pad portions, and the power supply terminal portions. A copper foil pattern having a contoured portion that integrates the sides and having the wiring pattern, bonding pad, island pad, and contoured region formed on a convex conductive portion having a height of about 18 μm is provided.

  FIG. 1 shows a half-etched surface 8 of a copper foil 8 after removing the etching resist layer, that is, a wiring pattern portion 9 composed of a wire bonding pad 9a, a solder bonding pad 9b and a wiring pattern 9c, and an island-shaped pad 10 The back surface of the main surface (first surface) 81 where the power supply terminal portions 11a and 11b and the contoured processed portion 12 are projected to form a convex conductive portion (9, 10, 11a, 11b, 12) is not etched. It is the see-through | perspective plan view seen from the other main surface (2nd surface) 82 side which is. 2 (a) and 2 (b) are enlarged views of a part of the half-etched copper foil 8, (a) is a plan view, and (b) is a CC line and DD in (a). It is sectional drawing along a line.

  Next, the conductive sheet 8 is laminated with the convex conductive portion facing the insulator layer 13, and the laminate is pressed in the thickness direction, and a part of FIG. Further, as shown in FIG. 3 (b), a partially enlarged perspective view of the convex conductive portion (half-etched pattern surface, first surface) 81 of the copper foil 8 is an insulator. It is embedded in the layer 13 and integrated into a single-sided copper foil-clad plate 14.

  Thereafter, as shown in a perspective view in FIG. 4, in order to form a belt-like plated electrode in the corresponding region between the wiring pattern portion 9 and the power supply terminal portion 11 a of the single-sided copper foil-clad plate 14 and adjacent to the island-like pad portion 10. Are coated with an etching resist layer (for example, dry film) 15a, 15b, 15c, and the exposed flat surface (second surface) 82 side of the copper foil 8 is selectively etched (for example, flash etching) to form a wiring pattern. 9c and the power supply terminals 11a and 11b are separated. That is, as shown in a partially enlarged perspective view in FIG. 5, the portions 15a, 15b, and 15c masked with the wiring pattern 9c are integrally formed by the strip-like plated electrode portion 8a (8b) that is the remaining copper foil. The region to be plated including the island-like pad 10 is processed so as to be conductively connected as a whole. The strip-shaped plated electrode portion includes a shape such as a line.

  Next, a plating resist layer (insulating layer for plating) 30 is coated on the surface of the separated wiring pattern portion 9 excluding the bonding pad 9a, the power supply terminal portions 11a and 11b, and the island-like pad portion 10, and is electrically connected with the counter electrode. A selective plating process is performed by applying a plating voltage between the strip-shaped plating electrode portions 8a and 8b by dipping in a plating solution. The voltage application at the time of electroplating may be applied to the outer shape processed portion 12 where the strip-shaped plated electrode portions 8a and 8b are connected.

  By the electroplating process, a plating layer (for example, a gold layer) is selectively formed on the exposed surfaces of the bonding pad 9a, the power supply terminal portions 11a and 11b, the island-shaped pad portion 10, and the like. After the electroplating process, the conductive foils 8a and 8b for the strip-like plating electrode are selectively removed by etching to insulate and isolate the wiring patterns 9c, the power supply terminal portions 11a and 11b, and the island-like pads 10. In this etching process, the exposed bonding pads 9a, the power supply terminal portions 11a and 11b, and the island-shaped pads 10 are not etched and maintain the required dimensional shape because the exposed surfaces are covered with the gold plating layer.

  Subsequently, the conductive patterns 8a and 8b for the strip-shaped plating electrodes are selectively etched away except for the surface of the wiring board where the wiring patterns 9c, the power supply terminal portions 11a and 11b, and the island-shaped pads 10 are insulated and isolated. The solder resist layer is coated on the surface (including the region surface). That is, the entire surface is covered with the solder resist layer except for the bonding pads 9a and 9b, the power supply terminal portions 11a and 11b, and the island-like pads 10. Thereafter, the wiring board coated with the solder resist layer is cut and separated along outline processing lines (AA lines and BB lines in FIGS. 1 and 4) to obtain a single-sided wiring board.

(Embodiment 2)
This embodiment is a method for manufacturing a so-called double-sided (interposer type) wiring board.

As in the case of Example 1, a conductive sheet, for example, a copper foil having a thickness of about 35 μm is prepared, and an etching resist layer, for example, a photocurable dry film is integrally disposed on at least one surface of the copper foil. The dry film on one main surface side is subjected to exposure and development processing, and resist masking is performed according to the outer shape processing region and floating island type bonding pads arranged in a grid pattern. Next, a half-etching process is performed so that the floating island type is enlarged as shown in a plan view in FIG. 6 (a), a cross-section in FIG. 6 (b), and a perspective view in FIG. 6 (c). The bonding pads 16a and 16b and the outer shape processing regions 17a and 17b are formed into copper foils 18a and 18b having a convex shape with a height of about 18 μm. Here, the floating island type bonding pads 16a and 16b and the outer shape processing areas 17a and 17b are respectively arranged correspondingly. Here, the floating island type bonding pad is an electrode pad in a region where it is difficult to draw a conductor to the edge of the substrate surrounded by other conductive regions.

  Thereafter, a conductive paste is printed on the top surface of one copper foil, for example, the protruding bonding pad 16a of the copper foil 18a, by a screen printing method to form a conical conductive bump 19. Here, the formation of the conductive bumps 19 is usually performed by repeating screen printing and drying processing. Next, an insulating layer, for example, a liquid crystal polymer film 20 having a thickness of about 50 μm and the other copper foil 18b are aligned and laminated on the surface where the conductive bump 19 is formed, and this laminated body is heated and pressurized. 6D, the double-sided copper foils 18a and 18b are electrically connected by the conductive bumps 19 through which the liquid crystal polymer film 20 is inserted, and the floating island type bonding pad 16a. , 16b and the like, and the double-sided copper foil-clad plate 21 in a state where the protrusions are embedded in the liquid crystal polymer film 20 is manufactured. Needless to say, through holes may be used instead of the conductive bumps.

  Next, as shown in a perspective view in FIG. 6 (e), a pair of floating island type bonding pads 16b is paired, and an etching resist (dry film) is formed on the exposed surface of the copper foil 18b so as to straddle the row of floating island type bonding pads 16b. ) 22 is pasted. The double-sided copper foils 18a and 18b of the double-sided copper foil-clad plate 21 to which the dry film 22 is bonded are subjected to, for example, flash etching treatment, and the surface of the liquid crystal polymer film 20 as shown in FIG. The floating island type bonding pads 16a and 16b are exposed in an island shape.

  With this flash etching process, the copper foil 18a of the double-sided copper foil-clad plate 21 is half-etched entirely in the floating island type bonding pad 16a region, and the floating island type bonding pad 16a is insulated from each other. On the other hand, in the copper foil 18b, since the etching of the masking 22 region is suppressed, the pair of floating island type bonding pads 16b is electrically connected to the outer shape processing portion 17b side by the strip-shaped electrode portion 22a remaining as a selective etching. The shape to take.

  In this state, when a plating voltage is applied by immersing it in the electroplating solution together with the counter electrode, the surfaces of the floating island type bonding pads 16a and 16b are plated by energization through the strip electrode portion 22a remaining in the connected masking 22. A metal layer is formed. After this electroplating process, the strip-shaped copper foil connected to the floating island type bonding pad 16b pair is selectively removed by etching, and if necessary, a solder resist layer is provided, which is shown in a plan view in FIG. Thus, a double-sided wiring board having floating island type bonding pads 16a and 16b which are electrically separated from each other and whose surfaces are covered with a gold plating layer or the like is obtained. Of course, so-called outer shape processing is finally performed.

  As can be seen from each of the above embodiments, a bonding pad, a power supply terminal portion, an island pad, etc. of the wiring pattern portion are temporarily formed by half etching treatment of the conductive sheet, while a part on the opposite surface side of the conductive sheet. Is temporarily used for power supply for electroplating and then removed and cut off by half etching. Accordingly, since it is possible to omit the formation of a power supply routing pattern for each island-shaped pad, it is easy to miniaturize and increase the density of the wiring pattern, and it is possible to obtain a highly reliable and compact wiring board. We were able to provide mass production well.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation can be taken in the range which does not deviate from the main point of invention. For example, the material of the insulator layer and the conductive sheet, or their thicknesses can be arbitrarily selected.

The top view which shows the surface which made the conductive sheet surface into the uneven | corrugated shape by half etching process in Embodiment 1. FIG. (A) is a plan view showing a part of the wiring patterning surface shown in FIG. Sectional drawing along a DD line. The part of the single-sided copper foil clad board which laminated | stacked and integrated the surface patterned into the uneven | corrugated shape in the insulator layer in Embodiment 1 is shown, (a) is sectional drawing, (b) is a perspective view. The perspective view which shows the aspect which selectively coat | covered the etching resist layer on the copper foil surface of the single-sided copper foil tension board in Embodiment 1. FIG. The perspective view which shows a part of state which selectively etched the copper foil of the single-sided copper foil-clad board from the surface side in Embodiment 1, and exposed the convex wiring pattern. The manufacturing embodiment of a double-sided floating island pad type wiring board in Embodiment 2 is shown schematically, (a) is a plan view showing a part of a copper foil surface patterned into a concavo-convex shape by a half-etching process, (b) ) Is a cross-sectional view, (c) is a perspective view, (d) is a cross-sectional view showing a part of a double-sided copper foil-clad plate in which a wiring pattern surface is laminated and integrated on both sides of an insulator layer, and (e) is one side. A perspective view showing a state in which a plating resist layer is selectively coated on the copper foil surface, (f) is a half-etching selectively from the surface side after the electroplating process to expose the wiring pattern of the convex conductive portion. The top view which shows a part of the state which removed the copper foil under an etching resist layer by the half-etching process again, and the top view which exposed the floating island pad surface each insulated. The top view which shows the example of a wiring pattern of the single-sided type | mold wiring board used in the conventional manufacturing method. The top view which expands and shows a part of FIG. In manufacture of the conventional double-sided floating island pad type | mold wiring board, (a) The top view which shows a part of example of the wiring for plating electric power feeding with respect to the floating island pad of the 1st surface side, (b) is sectional drawing which shows a double-sided copper passage structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 13,20 ... Insulator layer 9 ... Wiring pattern part 9a ... Wire bonding pad 9b ... Solder bonding pad 9c ... Wiring pattern 10, 16a, 16b ... Island-like pad 11a, 11b, 22 ... Feeding terminal part 12, 17a, 17b ... Processed part 6: Drawing line (pattern)
8, 18a, 18b ... conductive sheet (copper foil)
14 ... Single-sided copper foil-clad plate 15a, 15b, 20 ... Etching resist layer (dry film)
DESCRIPTION OF SYMBOLS 19 ... Conductive bump 21 ... Double-sided copper foil board 30 ... Plating resist layer (insulating layer for plating)
81 ... first surface 82 ... second surface

Claims (4)

A plurality of conductive regions on the first surface side of the conductive sheet formed by the conductive region on the first surface side and the conductive region on the second surface side are subjected to pattern etching to form a wiring circuit on the conductive region on the second surface side. Forming a convex conductive part including the independent wiring layer of
Laminating the convex conductive portion of the conductive sheet facing the insulator layer, and embedding and integrating the convex conductive portion into the insulator layer;
Removing the conductive region on the second surface side by etching, leaving a strip-shaped plating electrode portion so as to commonly connect the independent wiring layers; and
Coating the insulating layer for plating so that the region to be plated is exposed on the second surface side of the convex conductive portion exposed by the etching removal;
Plating the region to be plated through the strip-like plating electrode portion;
And a step of electrically separating the independent wiring layers from each other by removing the belt-like plated electrode portion. 2. The connection between the part of the independent wiring layer and the strip-shaped plated electrode portion is made by an extension line of the convex conductive portion formed between the independent wiring layer and the strip-shaped plated electrode portion. A method for manufacturing a wiring board. An independently separated wiring pattern portion including a bonding pad on the first surface of the conductive sheet, a power supply terminal portion connected to each of the wiring patterns and extending to the edge outer shape processing side, an island-shaped pad portion, and the power supply terminal portion side A step of forming a contoured portion to be integrated, and forming the wiring pattern portion, the power supply terminal portion, and the island-shaped pad portion into a convex conductive portion by selective half-etching;
The conductive sheet forming surface of the conductive sheet is laminated facing the insulator layer, and this laminate is pressed in the thickness direction so that the convex conductive part forming region of the conductive sheet is embedded in the insulator layer and integrated. Forming a conductive sheet-clad plate exposed on the second surface;
A conductive region covered with an etching resist layer for forming a strip-shaped plating electrode portion is formed between the wiring pattern portion and the power supply terminal portion of the conductive sheet-clad plate and adjacent to the island-shaped pad portion with an etching resist layer. A step of selectively etching and removing the flat second surface side of the sheet to separate the wiring pattern and the power supply terminal;
A plating resist layer is coated on the surface of the separated wiring pattern portion excluding the bonding pad, the power supply terminal portion, and the island-like pad portion, and selective plating is performed using the strip-like plating electrode portion as an electrode. Process,
A step of selectively removing the strip-shaped plated electrode portion to insulate and isolate each wiring pattern, the power supply terminal portion and the island-shaped pad;
The step of covering the wiring pattern other than the plated area of the wiring board obtained by insulating and isolating between each wiring pattern, the power supply terminal portion and the island-shaped pad, and
Cutting and separating the wiring board coated with the solder resist layer along an outline processing line;
A method for manufacturing a wiring board, comprising: An independently separated wiring pattern portion including a bonding pad on the first surface of the conductive sheet, a power supply terminal portion connected to each of the wiring patterns and extending to the edge outer shape processing side, an island-shaped pad portion, and the power supply terminal portion side A step of forming an outer shape processing portion to be integrated, and selectively forming the wiring pattern portion, the power supply terminal portion, and the island-shaped pad portion in a convex conductive portion by a half etching process;
The conductive sheet forming surface of the conductive sheet is laminated so as to face the insulator layer, and the laminate is pressed in the thickness direction so that the convex conductive portion of the conductive sheet is embedded in the insulator layer and integrated. A step of forming a conductive sheet-clad plate that is exposed;
Cover the strip-shaped plating electrode region with an etching resist layer to form a strip-shaped plating electrode that conducts to the contoured portion and island-shaped pad portion of the power supply terminal portion of the conductive sheet stretching plate and crosses the conductive sheet stretching plate, and is exposed A step of selectively etching the second surface side of the conductive sheet and separating the wiring pattern and the power supply terminal leaving the strip-shaped plating electrode;
Coating the plating resist layer on the surface of the separated wiring pattern portion excluding the bonding pad, the power supply terminal portion, and the island-shaped pad portion, and performing a selective plating process using the strip-shaped plating electrode as one electrode; ,
A step of selectively etching away the strip-shaped plating electrode after the electroplating process to insulate and isolate the island-shaped pad;
A step of coating the area other than the plated area of the wiring board obtained by insulating and isolating the island-shaped pads with a solder resist layer;
Cutting and separating the wiring board coated with the solder resist layer along the outer shape processing line;
A method for manufacturing a wiring board, comprising:

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