JP2005335143A - Method for manufacturing architectural board - Google Patents
Method for manufacturing architectural board Download PDFInfo
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- JP2005335143A JP2005335143A JP2004155425A JP2004155425A JP2005335143A JP 2005335143 A JP2005335143 A JP 2005335143A JP 2004155425 A JP2004155425 A JP 2004155425A JP 2004155425 A JP2004155425 A JP 2004155425A JP 2005335143 A JP2005335143 A JP 2005335143A
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- fiber board
- surface layer
- ground
- board
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Abstract
Description
本発明は建築用板の製造方法に関する。 The present invention relates to a method for manufacturing a building board.
従来、この種の製造方法として以下の如きものは知られている。
木質系素材からなる基板の上面に、上下の両表層部が研削加工されて表層部の内側の硬質層を露出させた木質繊維板を張り付ける工程を有するものは知られている。
上下の表層部を研削加工していない、乾式法によって成形が完了した木質繊維板[中質繊維板(MDF)、ハードファイバーボード等]は、周知のごとく、上下の表層部の内側に、他の部分に比較して比重の高い硬質層を有している。前記硬質層は、一対の加圧プレートによって加熱・圧縮する際において、加圧プレートに当接する部分(表層部)の水分蒸発や結合剤の硬化が瞬間に行われるが、表層部の内側部(硬質層となる部分)は表層部より遅れて水分蒸発や結合剤の硬化が行われるため等の理由により、発生すると考えられている。前記したごとく、従来の製造にあっては、上下の両表層部が研削加工されて表層部の内側の硬質層を露出させた木質繊維板を使用するというものである。なお、この明細書において、木質系素材には、むくの木材、合板等が含まれる。
It is known to have a step of attaching a wood fiber board in which both upper and lower surface layer portions are ground to expose a hard layer inside the surface layer portion on the upper surface of a substrate made of a wood material.
As is well known, wood fiberboards [Middle fiberboard (MDF), hard fiberboard, etc.] that have been molded by the dry method, in which the upper and lower surface layers are not ground, are placed inside the upper and lower surface layers. It has a hard layer with a high specific gravity compared to the part. When the hard layer is heated / compressed by a pair of pressure plates, moisture evaporation of the portion contacting the pressure plate (surface layer portion) and curing of the binder are performed instantaneously, but the inner portion of the surface layer portion ( The portion that becomes the hard layer) is considered to occur due to reasons such as water evaporation and binder curing being performed behind the surface layer portion. As described above, in the conventional manufacturing, the wood fiber board in which the upper and lower surface layer portions are ground and the hard layer inside the surface layer portion is exposed is used. In this specification, the wood-based material includes peeled wood, plywood and the like.
前記従来の製造方法には以下の如き欠点があった。
木質系素材からなる基板の上面に、節や年輪を形成する粗密部等による凹凸(以下、上面凹凸という。)がある場合、基板の上面に木質繊維板を加圧しつつ貼り付けると、上面凹凸に沿って木質繊維板の下面(貼着面)が変形し、その変形に伴って木質繊維板の上面も変形して凹凸となり、見栄えが悪くなるという欠点があった。
The conventional manufacturing method has the following drawbacks.
If there is unevenness (hereinafter referred to as “upper surface unevenness”) on the upper surface of the substrate made of a wood-based material due to a dense portion or the like that forms nodes and annual rings, the upper surface unevenness will be The lower surface (sticking surface) of the wood fiber board is deformed along with the deformation, and the upper surface of the wood fiber board is also deformed and becomes uneven with the deformation, and the appearance is poor.
本発明は前記欠点を解消するために以下の如き手段を採用した。
(1)請求項1の発明は、木質系素材からなる基板の上面に、少なくとも上の表層部が研削加工されていない木質繊維板を貼り付ける工程と、木質繊維板の上の表層部を研削加工して、表層部の内側の、他の部分に比較して比重の高い硬質層を上面に露出させる工程とを有するものである。
(2)請求項2の発明は、前記基板が少なくとも3枚の針葉樹単板からなる合板である請求項1記載のものである。
The present invention employs the following means in order to eliminate the above disadvantages.
(1) The invention of claim 1 includes a step of attaching a wooden fiberboard whose upper surface layer portion is not ground to the upper surface of a substrate made of a wood-based material, and grinding the surface layer portion on the wooden fiberboard. And a step of exposing a hard layer having a higher specific gravity than the other part inside the surface layer part to the upper surface.
(2) The invention according to
本発明は前記した如き構成によって以下の如き効果を奏する。
(1)請求項1の発明によれば、基板に木質繊維板を貼り付けた後に、即ち、木質繊維板の上面に凹凸が現れた後に、木質繊維板の上面を研削加工するものであるから、木質繊維板の上面の凹凸を削って、木質繊維板の上面を平らとすることが出来、その結果、見栄えがよい建築用板を得ること出来る。また、硬質層が上面に表われるので、建築用板の上面の硬度を高くすることが出来る。
(2)請求項2の発明によれば、基板が安価な針葉樹単板からなる合板であるので、安価な建築用板を得ることが出来る。
The present invention has the following effects by the configuration as described above.
(1) According to the first aspect of the present invention, the upper surface of the wood fiber board is ground after the wood fiber board is attached to the substrate, that is, after irregularities appear on the upper surface of the wood fiber board. It is possible to flatten the upper surface of the wood fiber board by shaving the unevenness of the upper surface of the wood fiber board, and as a result, it is possible to obtain a building board having a good appearance. Moreover, since the hard layer appears on the upper surface, the hardness of the upper surface of the building board can be increased.
(2) According to invention of
以下に本発明の実施の形態を説明する。 Embodiments of the present invention will be described below.
[第1工程]
木質系素材からなる基板2を準備する。前記基板2は、少なくとも3枚、本実施の形態では5枚の針葉樹単板からなる合板である。基板2の厚さは9mm前後で、平面形状は製品に応じた形状となされる。
また、下の表層部を研削し、他方、上の表層部を研削加工していない木質繊維板3を準備する。即ち、木質繊維板3は、下の硬質層が露出し、上の表層部及びその内側の硬質層を有しているものである。木質繊維板3の厚さは3mm前後で、平面形状は基板2と同一となされる。
[First step]
A
Moreover, the lower surface layer part is ground, On the other hand, the
[第2工程]
その後、基板2の上面に、木質繊維板3を、上の表層部を上に向けて公知の接着剤を介して加圧しつつ貼り付ける。
[Second step]
Then, the
[第3工程]
その後、木質繊維板3の上面の表層部を、例えば0.25mm程度研削加工して、木質繊維板3の内側の硬質層を上面(表面)に露出させる。
[Third step]
Thereafter, the surface layer portion on the upper surface of the
以下に変形例等について説明を加える。
(1)第3工程の後、木質繊維板3の上面に突板等の化粧シートを貼り付けるようにしてもよい。
(2)第2工程において、上下の両表層部を研削加工していない木質繊維板を、基板の上面に加圧しつつ貼り付けるようにしてもよい。
A description will be given below of modifications and the like.
(1) After the third step, a decorative sheet such as a veneer may be attached to the upper surface of the
(2) In the second step, a wood fiber board whose upper and lower surface layers are not ground may be applied to the upper surface of the substrate while being pressed.
2 基板
3 木質繊維板
2
Claims (2)
The method for manufacturing a building board according to claim 1, wherein the substrate is a plywood made of at least three softwood veneers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004155425A JP2005335143A (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing architectural board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004155425A JP2005335143A (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing architectural board |
Publications (1)
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JP2005335143A true JP2005335143A (en) | 2005-12-08 |
Family
ID=35489226
Family Applications (1)
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JP2004155425A Pending JP2005335143A (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing architectural board |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106836622A (en) * | 2017-01-03 | 2017-06-13 | 深圳大学 | A kind of multi-functional non-dismantling formwork of fibrous composite and preparation method thereof |
-
2004
- 2004-05-26 JP JP2004155425A patent/JP2005335143A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106836622A (en) * | 2017-01-03 | 2017-06-13 | 深圳大学 | A kind of multi-functional non-dismantling formwork of fibrous composite and preparation method thereof |
CN106836622B (en) * | 2017-01-03 | 2020-01-21 | 深圳大学 | Multifunctional disassembly-free template made of fiber composite material and preparation method of multifunctional disassembly-free template |
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