JP3933782B2 - Wooden substrate - Google Patents

Wooden substrate Download PDF

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Publication number
JP3933782B2
JP3933782B2 JP04900198A JP4900198A JP3933782B2 JP 3933782 B2 JP3933782 B2 JP 3933782B2 JP 04900198 A JP04900198 A JP 04900198A JP 4900198 A JP4900198 A JP 4900198A JP 3933782 B2 JP3933782 B2 JP 3933782B2
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JP
Japan
Prior art keywords
plywood
thickness
board
wood
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP04900198A
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Japanese (ja)
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JPH11229596A (en
Inventor
耕一 喜多
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東建リーバ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP04900198A priority Critical patent/JP3933782B2/en
Publication of JPH11229596A publication Critical patent/JPH11229596A/en
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Description

【0001】
【発明の属する技術分野】
本発明は木質系床材などの基板として好ましく用いられる木質系基板の構成に関する。
【0002】
【従来の技術】
従来、合板を基板とし、その表面にツキ板や化粧紙などの化粧シートを貼着し、基板の四周辺に接合用の実加工を施した床板が最も一般的であった。
【0003】
ところが、近年、合板用木材の質が低下しているのに床材の見掛や表面性能、強度などはより高度な性能が要求され、合板を基板としその表単板に直接ツキ板や化粧紙を貼着しても要求性能を満たす事が艱難な状況が発生している。特に、ツキ板の干割れ現象を防止したりやキャスターにも傷付きにくい表面性能を得るには、基板を変更するかツキ板に特殊な処理を施す事が必要となっている。
【0004】
そこで、合板に比べて表面が平滑で高度の高いパーティクルボードやMDFを基板とする床材も検討されたが、水分変化による収縮が合板よりも約2〜3倍近くおおきく、また中心部の強度が合板よりも低いので実加工ができないなど、床材の基板としては問題の多いものであった。
【0005】
【発明が解決しようとする課題】
本発明の目的は、合板と木質繊維板を複合する事により、表面性能に優れ、曲げ破壊強度が大きく、撓みや反りの少ない、有用な木質系基板を提供する事にある。
【0006】
【課題を解決するための手段】
本発明の請求項1記載の木質系基板は、合板の表面単板をサンダー等により研削して厚み規制し、その上面に接着剤を介して木質繊維板が貼着された事を特徴とする。
【0007】
本発明の請求項2記載の木質系基板は、請求項1 記載の木質系基板において、合板の裏単板の厚さが1.2mm以上で、木質繊維板が厚さ1.5mm以下である事を特徴とする。
【0008】
【発明の実施の形態】
図面を参照しながら本発明を詳述すると、合板1は表単板2と裏単板3の厚さが1.2mm以上の5 プライ構成で、総厚みとしては10.5mm〜11.5mmの範囲にある合板1が使用できる。そして、合板1はその表に貼着される木質繊維板4の厚さに対応し、複合した総厚さが12mmに仕上がる様に合板1の表単板2を厚み規制サンダー等により研削する。
【0009】
例えば、合板1の厚さが11.0mmで木質繊維板4の厚さが1.5mmの場合は、合板1の表単板2を0.5mmだけ研削して10.5mmに仕上げた後、常用の木材用接着剤を塗布し、木質繊維板4を重ねて接着する事で、厚さ12mmの複合基板を作成する。
【0010】
上記の発明に用いる木質繊維板4は、硬質繊維板、比重が0.35〜0.8にある中密度繊維板(MDF)、パーティクルボードなどで、厚さは1.5mm以下の薄いものを用いる。木質繊維板4は1.5mmの厚さに製造された物であっても良いし、3.0mm程度の厚みに製造された物を2層に剥裂して用いる事も出来る。
【0011】
合板1と木質繊維板4を接着する方法としては、尿素樹脂、フェノール樹脂、エポキシ樹脂、アクリル樹脂、ウレタン樹脂、変性酢酸ビニル樹脂、水性ビニルウレタン樹脂などからなる合成樹脂接着剤を合板表面または木質繊維板の裏面に塗布し、熱圧又は冷圧締して接着する。熱圧締条件としては、温度90〜110℃、圧力3〜10kg/cm2 を時間1〜5分。冷圧条件は、圧力5〜10kg/cm2 を時間20〜180分の範囲で行う事が出来る。
【0012】
【作用】
この発明において、複合基板の厚み規制を合板1の表単板2部分で行うのは、裏単板3を出来るだけ薄くしない様にして、日本農林規格(JAS)の複合フローリング規格に合格させるためで有り、特に曲げ試験による撓み量を適合基準内に確保する事にある。
【0013】
日本農林規格に基づく複合フローリングの曲げ試験とは、試験フローリングの表面を上面としてスパン700mmに支え、スパンの中央に直交して置いた荷重棒の上に試験フローリングの幅100mm当り3kgとして計算した荷重を加えた時及び幅100mm当り7kgとして計算した荷重を加えた時の撓みの差を求め、その差が3.5mm以下であれば基準に適合する。
【0014】
なお、合板1の表単板2面に貼着する木質繊維板4の厚さを1.5mm以上にすると、厚さ12mm程度の複合基板を構成する場合、表側の層が厚くなりすぎて基板に反りが生じ易くなる。また、合板1の裏単板3の厚さが1.2mm以下になると、複合フローリングの曲げ試験による撓み量がJASの適合基準以下の値になり易い為である。
【0015】
以下、実施例により本発明を説明する。
【0016】
【実施例1】
合板1は南洋材から製造した単板を用い、表単板2と裏単板3の厚さが1.2mmの5 プライ構成で94.5cm×184cmの、総厚みは11.5mmの合板1とした。一方、その合板1の表単板2面に貼着されるMDF4は厚さが1.2mmの物を用意した。そして、合板1の表単板2を厚み規制サンダーにより0.7mm研削して、合板1の厚さを10.8mmとした。ついで、合板1の表単板2表面にウレタン樹脂系接着剤を80g/m2 塗布し、その上に用意したMDF4を重ねた。5kg/m2 の圧力で1 時間冷圧締し、求める厚さが12mmの木質系基板を得た。そして、そのMDF4表面に厚さ0.25mmのツキ板を尿素酢酸ビニル樹脂接着剤を介して熱圧接着した後、30.3cm×181.8cmに切断し、4周辺に接合用の実加工を施した。最後に、そのツキ板表面に合成樹脂塗料により塗膜を形成し、化粧床板を得た(図示せず)。その化粧床板をJAS規格に基づく複合フローリングの曲げ試験に供したところ、撓み量は2.9mmであり、適合基準に合格する値であった。
【0017】
【実施例2】
合板1は針葉樹から製造した単板を用い、表単板2と裏単板3の厚さが1.3mmの5 プライ構成で94.5cm×184cmの、総厚みは11.0mmの合板1とした。一方、その合板1の表単板2面に貼着される薄物パーティクルボード4は厚さが1.8mmの物を用意した。そして、合板1の表単板2を厚み規制サンダーにより0.8mm研削して、合板1の厚さを10.2mmとした。ついで、合板1の表単板2表面に水性ビニルウレタン樹脂系接着剤を90g/m2 塗布し、その上に用意した薄物パーティクルボード4を重ねた。6kg/m2 の圧力で1 時間冷圧締し、求める厚さが12mmの木質系基板を得た。そして、その薄物パーティクルボード4表面に厚さ0.25mmのツキ板を尿素酢酸ビニル樹脂接着剤を介して熱圧接着した後、30.3cm×181.8cmに切断し、4周辺に接合用の実加工を施した。最後に、そのツキ板表面に合成樹脂塗料により塗膜を形成し、化粧床板を得た(図示せず)。その化粧床板をJAS規格に基づく複合フローリングの曲げ試験に供したところ、撓み量は2.7mmであり、適合基準に合格する値であった。
【0018】
【発明の効果】
本発明によれば、表面が平滑で硬度が高く、曲げ強度にも優れ、反りの無い木質系床材の基板がえられる為、基板の表面に従来通り厚さの薄いツキ板などの化粧シートを貼着しても、見掛けと表面性能及び強度に優れた床板を提供する事が出来る。
【図面の簡単な説明】
【図1】本発明による木質系基板の構成図。
【符号の説明】
1 合板
2 表単板
3 裏単板
4 木質繊維板
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a wooden substrate that is preferably used as a substrate for a wooden flooring or the like.
[0002]
[Prior art]
Conventionally, a floor board in which a plywood is used as a substrate, a decorative sheet such as a stick board or decorative paper is pasted on the surface, and actual processing for bonding is performed on the four periphery of the substrate has been most common.
[0003]
However, in recent years, although the quality of plywood has deteriorated, the appearance, surface performance, and strength of flooring are required to be higher. Even when paper is stuck, it is difficult to meet the required performance. In particular, it is necessary to change the substrate or to perform a special treatment on the board to prevent the cracking phenomenon of the board and to obtain a surface performance that hardly damages the casters.
[0004]
Therefore, particle boards that have a smoother surface than that of plywood, and flooring that uses MDF as a base material have been studied. However, shrinkage due to moisture change is about 2 to 3 times that of plywood, and the strength of the center part is also high. However, since it is lower than the plywood, it cannot be actually processed.
[0005]
[Problems to be solved by the invention]
An object of the present invention is to provide a useful wood-based substrate which is excellent in surface performance, has a high bending fracture strength, and has little bending and warping by combining a plywood and a wood fiberboard.
[0006]
[Means for Solving the Problems]
The woody substrate according to claim 1 of the present invention is characterized in that the surface single plate of the plywood is ground by a sander or the like to regulate the thickness, and the wood fiberboard is attached to the upper surface via an adhesive. .
[0007]
The wood substrate according to claim 2 of the present invention is the wood substrate according to claim 1, wherein the thickness of the back veneer of the plywood is 1.2 mm or more and the wood fiber board is 1.5 mm or less. It is characterized by things.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described in detail with reference to the drawings. The plywood 1 has a 5-ply configuration in which the thickness of the front veneer 2 and the back veneer 3 is 1.2 mm or more, and the total thickness is 10.5 mm to 11.5 mm. Plywood 1 in range can be used. The plywood 1 corresponds to the thickness of the wood fiber board 4 adhered to the front surface, and the front single plate 2 of the plywood 1 is ground by a thickness regulating sander or the like so that the combined total thickness is finished to 12 mm.
[0009]
For example, when the thickness of the plywood 1 is 11.0 mm and the thickness of the wood fiber board 4 is 1.5 mm, the front single plate 2 of the plywood 1 is ground by 0.5 mm and finished to 10.5 mm. A common wood adhesive is applied, and the wood fiber board 4 is stacked and bonded to form a composite substrate having a thickness of 12 mm.
[0010]
The wood fiber board 4 used in the above invention is a hard fiber board, a medium density fiber board (MDF) having a specific gravity of 0.35 to 0.8, a particle board, etc., having a thickness of 1.5 mm or less. Use. The wood fiber board 4 may be a product manufactured to a thickness of 1.5 mm, or a product manufactured to a thickness of about 3.0 mm may be split into two layers and used.
[0011]
As a method for adhering the plywood 1 and the wood fiber board 4, a synthetic resin adhesive made of urea resin, phenol resin, epoxy resin, acrylic resin, urethane resin, modified vinyl acetate resin, aqueous vinyl urethane resin, or the like is used. Apply to the back of the fiberboard and bond with hot or cold pressing. As the hot pressing conditions, a temperature of 90 to 110 ° C. and a pressure of 3 to 10 kg / cm 2 are used for 1 to 5 minutes. As the cold pressure condition, a pressure of 5 to 10 kg / cm 2 can be performed in a time range of 20 to 180 minutes.
[0012]
[Action]
In this invention, the thickness regulation of the composite substrate is performed on the front veneer 2 portion of the plywood 1 in order to pass the composite flooring standard of the Japanese Agricultural Standard (JAS) by making the back veneer 3 as thin as possible. In particular, the amount of bending by the bending test is to be ensured within the conformity standard.
[0013]
The bending test of the composite flooring based on the Japanese Agricultural Standards is the load calculated as 3kg per 100mm width of the test flooring on the load rod which is supported on the span 700mm with the surface of the test flooring as the upper surface and placed perpendicular to the center of the span When the load is calculated and the load calculated as 7 kg per 100 mm width is applied, the difference in deflection is obtained. If the difference is 3.5 mm or less, the standard is met.
[0014]
In addition, when the thickness of the wood fiber board 4 adhered to the front single plate 2 surface of the plywood 1 is 1.5 mm or more, when forming a composite substrate having a thickness of about 12 mm, the front side layer becomes too thick. Warpage easily occurs. In addition, when the thickness of the back veneer 3 of the plywood 1 is 1.2 mm or less, the amount of bending by the bending test of the composite flooring tends to be a value less than the JAS conformity standard.
[0015]
Hereinafter, the present invention will be described by way of examples.
[0016]
[Example 1]
The plywood 1 is a single plate manufactured from South Sea wood. The plywood 1 is 94.5 cm × 184 cm in a 5-ply configuration in which the thickness of the front single plate 2 and the back single plate 3 is 1.2 mm, and the total thickness is 11.5 mm. It was. On the other hand, MDF4 stuck to the surface veneer 2 surface of the plywood 1 prepared the thing with thickness 1.2mm. And the front single board 2 of the plywood 1 was ground 0.7 mm with the thickness control sander, and the thickness of the plywood 1 was 10.8 mm. Next, 80 g / m 2 of urethane resin adhesive was applied to the surface of the front veneer 2 of the plywood 1, and the prepared MDF 4 was stacked thereon. Cold pressing was performed at a pressure of 5 kg / m 2 for 1 hour to obtain a wooden substrate having a desired thickness of 12 mm. Then, a 0.25 mm thick board is bonded to the surface of the MDF 4 by hot-pressure bonding using a urea vinyl acetate resin adhesive, and then cut into 30.3 cm × 181.8 cm, and actual processing for bonding is performed around the 4 periphery. gave. Finally, a coating film was formed on the surface of the board with a synthetic resin paint to obtain a decorative floor board (not shown). When the decorative floor board was subjected to a bending test of a composite flooring based on the JAS standard, the amount of deflection was 2.9 mm, which was a value that passed the conformance standard.
[0017]
[Example 2]
The plywood 1 is a single board manufactured from conifers. The plywood 1 and the back veneer 3 have a 5-ply configuration with a thickness of 1.3 mm. The plywood 1 has a total thickness of 11.0 mm and is 94.5 cm × 184 cm. did. On the other hand, the thin particle board 4 adhered to the surface 2 of the front veneer 1 of the plywood 1 was prepared with a thickness of 1.8 mm. And the front single board 2 of the plywood 1 was ground 0.8 mm with the thickness control sander, and the thickness of the plywood 1 was 10.2 mm. Next, 90 g / m 2 of an aqueous vinyl urethane resin adhesive was applied to the surface of the front veneer 2 of the plywood 1, and the prepared thin particle board 4 was stacked thereon. Cold pressing was performed at a pressure of 6 kg / m 2 for 1 hour to obtain a wooden substrate having a desired thickness of 12 mm. Then, a 0.25 mm thick board is bonded to the surface of the thin particle board 4 through a urea vinyl acetate resin adhesive, and then cut into 30.3 cm × 181.8 cm. Actual processing was performed. Finally, a coating film was formed on the surface of the board with a synthetic resin paint to obtain a decorative floor board (not shown). When the decorative floor board was subjected to a bending test of a composite flooring based on the JAS standard, the amount of deflection was 2.7 mm, which was a value that passed the conformance standard.
[0018]
【The invention's effect】
According to the present invention, a wooden flooring substrate having a smooth surface, high hardness, excellent bending strength, and no warpage can be obtained. Therefore, a decorative sheet such as a thin board as usual on the surface of the substrate. Even if affixed, a floor board excellent in appearance, surface performance and strength can be provided.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a wood substrate according to the present invention.
[Explanation of symbols]
1 Plywood 2 Front veneer 3 Back veneer 4 Wood fiberboard

Claims (2)

合板(1 )の表面単板(2)がサンダー等により研削して厚み規制され、その上面に接着剤を介して木質繊維板(4)が貼着された事を特徴とする木質系基板。A wood-based substrate characterized in that a surface single plate (2) of a plywood (1) is ground and regulated by a sander or the like, and a wood fiber board (4) is adhered to the upper surface of the plywood (1) via an adhesive. 合板(1)の裏単板(3)の厚さが1.2mm以上で、木質繊維板(4)が厚さ1.5mm以下である事を特徴とする請求項1 記載の木質系基板。2. The wood substrate according to claim 1, wherein the thickness of the back veneer (3) of the plywood (1) is 1.2 mm or more and the wood fiber board (4) is 1.5 mm or less.
JP04900198A 1998-02-13 1998-02-13 Wooden substrate Expired - Lifetime JP3933782B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04900198A JP3933782B2 (en) 1998-02-13 1998-02-13 Wooden substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04900198A JP3933782B2 (en) 1998-02-13 1998-02-13 Wooden substrate

Publications (2)

Publication Number Publication Date
JPH11229596A JPH11229596A (en) 1999-08-24
JP3933782B2 true JP3933782B2 (en) 2007-06-20

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JP04900198A Expired - Lifetime JP3933782B2 (en) 1998-02-13 1998-02-13 Wooden substrate

Country Status (1)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5879836B2 (en) * 2011-09-07 2016-03-08 大日本印刷株式会社 Method for producing flooring decorative material
JP5828139B2 (en) * 2011-09-26 2015-12-02 パナソニックIpマネジメント株式会社 Manufacturing method of base material for wooden flooring

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JPH11229596A (en) 1999-08-24

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