JP2005333504A - Method and apparatus for acquiring image data - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image data acquisition method and its apparatus capable of correctly complementing image data formed of defective pixels even if the defective pixels exist. <P>SOLUTION: By photographing a component 12 changing pixel positions, two images 55, 56 are acquired. Data on images A3, B3 corresponding to images A1, B1 of defective pixels acquired when the first image 55 is obtained, are found from the second image 56, and image data of the defective pixels in the first image are replaced with image data found from the second image to perform complement. Since the image data are complemented by replacing the data with real image data instead of data interpolation in a constitution like this, correct image data can be obtained and defective data can be corrected by those data, even if images change much or have pixel defects near their edges. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an image data acquisition method and apparatus, and more particularly, in an electronic component mounting apparatus that automatically mounts an electronic component on a printed circuit board, a liquid crystal display panel, a display panel substrate, or the like. The present invention relates to a method and apparatus for acquisition.

  Conventionally, in an electronic component mounting apparatus, the picked-up electronic component is picked up by an image pickup device having a solid-state image pickup device such as a CCD or CMOS, and the picking posture of the component is recognized by processing the image data, and the correction is made. And parts are mounted. Since the imaging device is manufactured using a large number of elements, defective elements (pixels) due to the manufacturing technology are generated. If there is a defective pixel in the image pickup device, the component recognition becomes inaccurate, and various methods have been considered to correct this. For example, in Patent Document 1, the detection circuit extracts pixel data of a total of 5 pixels before and after the pixel of interest, and further before and after that, and calculates an amount of protrusion for these pixel data using an adder and a comparison circuit. Judgment is made. In this method, the threshold control circuit controls the threshold for determining the protrusion amount according to the luminance level of the surrounding pixels, the detection circuit determines a pixel defect, outputs a detection signal, and outputs a correction signal to the correction circuit. The image data by the defective pixel is output and corrected.

  Further, from Patent Document 2, after interpolating white defective pixels and black defective pixels from surrounding pixels, rewriting the interpolation data in the first memory, and repeating this replacement for the number of white defective pixels and black defective pixels, It is known to correct image data of defective pixels by converting the signal into a predetermined signal by a signal processing means.

Furthermore, it is known from Patent Document 3 to determine whether a target pixel is a defective pixel by comparing an average value of pixel data around the target pixel with pixel data of the target pixel.
Japanese Patent Laid-Open No. 7-7675 JP 2001-16504 A JP 2002-84464 A

  Conventionally, when there is a defective pixel, interpolation is performed based on surrounding pixels. If it is attempted to correct this by calculation as in the conventional case, the pixel may have the same grayscale data as the surroundings, but the pixel defect is different from the surroundings, and only the defective pixel part is darker than the actual one. There is a problem that the brightness state of the defective pixel cannot be obtained accurately when the case is bright or bright. In addition, when an image of a part or the like is taken, there is a problem in that correction near the edge is inaccurate because the difference in shading is large and the area changes rapidly for each pixel.

  When a defective pixel is interpolated by calculation as in the prior art, an edge is obtained by performing image processing by binarization or the like. For example, as shown in FIG. 12A, when there is a defective pixel 91 at the edge portion of the component 90, when the grayscale data of the pixel is viewed on the ZZ cross section of FIG. ) And (C), the edge is obtained by binarizing with the threshold value TH. As shown in FIG. 12B, when there is no defective pixel, an edge is obtained at the boundary between the pixel 104 and the pixel 105, but as shown in FIG. 12C, the pixel is defective and the defective pixel is dark. In this case, the edge moves to the boundary between the pixel 105 and the pixel 106, and a shift D for one pixel occurs. As a result, the edge position is shifted by one pixel, and there is a problem that measurement data becomes inaccurate.

  Conventionally, when a defective pixel is found, it is found by comparing with the surrounding pixels. In this case, in the case of a defective pixel that always has darker data than the actual pixel in a dark image portion, the defective pixel and the surrounding pixel are detected. There was a problem that it was not possible to find it. Further, in the case of obtaining a always bright image, there is also a problem that when a defective pixel that is brighter than the actual one is found, there is no difference from the surrounding area and detection is impossible.

  The present invention solves such problems, and provides an image data acquisition method and apparatus that can accurately complement image data of defective pixels even when there are defective pixels.

The present invention
A method of capturing an image of a subject with an imaging device including a solid-state imaging device and acquiring image data,
Identify the position of the defective pixel in the solid-state image sensor,
The subject is imaged to obtain a first image, the pixel position is changed and the same subject is imaged to obtain a second image,
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. It is characterized by replacing with and complementing.

The present invention also provides:
An apparatus that captures an image of a subject with an imaging device including a solid-state imaging device and acquires image data,
A storage device for storing a position of a defective pixel of the solid-state imaging device;
An imaging device that captures a subject to obtain a first image, moves the subject by a predetermined amount, and obtains a second image;
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. It is characterized by replacing with and complementing.

The present invention also provides:
An apparatus that captures an image of a subject with an imaging device including a solid-state imaging device and acquires image data,
A first imaging device for capturing a subject and acquiring a first image;
A storage device for storing a position of a defective pixel of the solid-state imaging device of the first imaging device;
A second imaging device that is arranged at a different position from the first imaging device and that captures the same subject and obtains a second image;
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. It is characterized by replacing with and complementing.

  In the present invention, two images are acquired by changing the pixel position and the subject is imaged, and image data corresponding to the image of the defective pixel when the first image is acquired is obtained from the second image. Image data of defective pixels in one image is replaced with image data obtained from the second image. Therefore, in the present invention, since the image data is complemented by replacing actual image data instead of data interpolation, accurate image data is obtained even if there is a pixel defect near a sharply changing image or edge. The defect data can be corrected with the data. Also, even when there are a plurality of defective pixels, different from those obtained by calculation using surrounding pixels, accurate correction can be performed as in the case of one pixel defect.

  The present invention is particularly applied to an electronic component mounting apparatus that automatically mounts an electronic component on a printed circuit board, a liquid crystal display panel, a display panel substrate, or the like when acquiring image data of the component in order to recognize the electronic component. In the following, the present invention will be described in detail based on examples.

  FIG. 1 shows the configuration of an electronic component mounting apparatus showing an embodiment of the present invention. Reference numeral 1 denotes a mounting head, which includes a plurality of suction nozzles for sucking and holding electronic components (hereinafter abbreviated as components) as will be described later. The mounting head 1 is attached to the X-axis gantry 2 so as to be movable in the X-axis direction, and the X-axis gantry 2 is attached to the Y-axis gantry 3 so as to be movable in the Y-axis direction. An electronic component supply device 4 that supplies components to be mounted on the circuit board 5 is disposed on the front surface of the electronic component mounting device. Further, in order to detect a component suction position shift (position shift between the center position of the suction nozzle and the center position of the suctioned component) and a suction angle shift (tilt), a CCD camera equipped with a lens 6 for imaging the component, An imaging device 7 such as a CMOS camera is disposed between the electronic component supply device 4 and the substrate 5.

  FIG. 2 shows the structure of the mounting head 1 in detail. The mounting head 1 has a substrate 1a attached to the X-axis gantry 2 of FIG. 1 and is movable in the X-axis direction. The mounting head 1 includes a plurality of suction nozzles 8 for vacuum-sucking components, and the suction nozzles are arranged on the nozzle shaft (suction). A θ-axis motor 9 that rotates about an axis) and a Z-axis motor 10 that drives the suction nozzle in the vertical direction are attached to the substrate 1a.

  FIG. 3 shows the configuration of the control system of the electronic component mounting apparatus. Reference numeral 20 denotes a microcomputer (CPU) that controls the entire apparatus, and a controller (control means) that includes a RAM, a ROM, and the like, and controls apparatuses and devices connected thereto. The mounting head 1 is moved in the X axis direction along the X axis gantry 2 by the X axis motor 21, and the X axis gantry 2 is driven in the Y axis direction along the Y axis gantry 3 by the Y axis motor 22. Thereby, the mounting head 1 can move in the X-axis direction and the Y-axis direction. The Z-axis motor 10 moves the suction nozzle 8 up and down in the Z-axis direction (height direction), and the θ-axis motor 9 rotates the suction nozzle 8 around the nozzle axis. The illumination control circuit 23 controls the lighting of the light source of the illumination device 40 that illuminates the component 12 and the amount of light.

  The recognition device (image processing device) 27 performs image recognition of the component 12 sucked by the suction nozzle 8 and includes an A / D converter 27a, a memory 27b, and a CPU 27c. The analog image signal output from the digital signal is converted into a digital signal by the A / D converter 27a and stored in the memory 27b. The CPU 27c performs the suction position shift amount and the suction angle shift of the component 12 sucked based on the image data. Calculate the amount.

  The keyboard 28 and mouse 29 are used for inputting data such as component data, and the storage device 30 is composed of a flash memory or the like, and is input from the component data input by the keyboard 28 and mouse 29 or from a host computer (not shown). Used to store supplied component data. The monitor (display device) 31 displays component data, calculation data, an image of the component 12 captured by the imaging device 7, and the like.

  FIG. 4 shows a state where the component 12 sucked by the suction nozzle 8 is imaged by the imaging device 7. A plurality of light sources 41 such as light-emitting diodes are attached around the inside of the illumination device 40. At the time of component recognition, the light source 11 is turned on by the illumination control circuit 23, and the component 12 illuminated thereby is imaged by the imaging device 7. Then, this image is taken into the recognition device 27 and component recognition such as component center and component inclination is performed.

  With such a configuration, if there is a defective pixel in the CCD or CMOS that constitutes the imaging device 7, the image data of that portion is not correct and accurate component recognition is not guaranteed. Therefore, the present invention will be described below. In such a way, the image data by the defective pixel is corrected. In the following, an example in which the imaging device is configured by a CMOS camera will be described. However, the imaging device can also be applied to an imaging device that images components using other photoelectric elements such as other CCD cameras as pixels.

  First, know what image size is per pixel. For this purpose, the imaging device 7 images a jig 45 having two circle marks 45a and 45b as shown in FIG. 5 to obtain the number of pixels between the two circle marks. The actual distance X between the two marks measured in (1) is divided to obtain the image size per pixel. In the case of the present embodiment, the size of the image per pixel of the imaging device 7 by the lens 6 is set to 0.1 [mm / pixel]. As another method for obtaining the image size per pixel, the nozzle tip of the suction nozzle 8 is imaged at the normal position, and then the nozzle tip position is moved by a predetermined distance (for example, 2 mm), and the nozzle tip is imaged. Thus, there is a method for obtaining the number of pixels corresponding to the movement distance.

  Next, a pixel defect of the imaging device is detected. As shown in FIG. 6, in the image 50 captured by the imaging device 7, when a partial image 51 is cut out and enlarged, a plurality of defective pixels 51a and 51b exist at random positions in the CMOS. The partial image is a defect image. The position and number of defective pixels are different for each CMOS, and a defective image deteriorates component recognition. Therefore, in the present invention, the position of the defective pixel is obtained as follows.

  Two types of jigs were prepared: a white jig 60 made of a uniform white acrylic plate and a black jig 61 made of a uniform matte black acrylic plate. First, the white jig 60 is shown in FIG. As described above, the illumination device 40 is inserted at a position shifted from the focal position of the imaging device 7, the light source 41 is turned on, and the white jig 60 is illuminated to acquire an image. In FIG. 7, the black jig 61 is also inserted, but this black jig is removed when photographing the white jig.

  An image 52 captured through the white jig 60 is shown in FIG. 8A. This image is processed by the recognition device 27 to detect a position where the brightness of the image is equal to or less than a predetermined value. Then, defective pixels 52a, 52b, and 52c whose luminance becomes dark are detected. In this manner, dark defective pixels that are darker than other pixels can be found by processing the image captured by the white jig 60. In this case, the defective pixels 52d, 52e, and 52f that are brighter than the other pixels cannot be distinguished from the background and cannot be detected.

  Next, the black jig 61 is inserted at a position where the disturbance just above the lens 6 does not enter. At this time, the white jig 60 may remain inserted. When the image is acquired by turning on the light source, an image 53 as shown in FIG. 8B is obtained. By performing image processing in the same manner, a position where the brightness is larger than a predetermined value is detected, and other pixels are obtained. It is possible to find defective pixels 53a, 53b, and 53c that are brighter. In this case, the defective pixels 53d, 53e, and 53f that are darker than the other pixels cannot be distinguished from the background and cannot be detected.

  The coordinate positions of the defective pixels 52a, 52b, 52c, 53a, 53b, and 53c detected in this way are stored in the ROM of the controller 20 or the storage device 30. The operation of finding the defective pixel may be performed once after the image pickup apparatus is assembled, and is usually detected at the time of factory shipment and the information is stored.

  Next, the component 12 is adsorbed and imaged by the imaging device. The image is shown in FIG. 9A with reference numeral 55, and the image of the component 12 exists at the center. The white portion is the edge portion, the black portion is the body portion, and the center of gravity of the component 12 is O (X3, Y3). In that case, there are images A1 and B1 based on defective pixels indicated by black four corners that are darker than the surrounding pixels around the component 12, and the coordinate positions thereof are stored by the above-described method. A1 (X1, Y1) and B1 (X2, Y2) are obtained.

  Subsequently, FIG. 9B shows an image 56 obtained by moving the mounting head 1 by 1 mm for 10 pixels in the X-axis direction and capturing the image again. The image of the component 12 exists at a position shifted from the center of the image, and the coordinates of the center of gravity are O (X3 + 1, Y3). “X3 + 1” is the amount of movement of the X coordinate position corresponding to the amount of movement of 1 mm. The following notation is the same. Similarly, the image 56 includes images A2 and B2 based on defective pixels, and the coordinate positions thereof are the same as those of the images A1 and B1, and are A2 (X1, Y1) and B2 (X2, Y2).

  Thus, the image by the defective pixel can be compensated from both images taken by shifting by a predetermined amount. That is, as shown in FIG. 10, images A1 and B1 that are defective due to defective pixels in image 55 become images A3 and B3 in image 56, and their coordinate positions A3 (X1 + 1, Y1), B3 (X2 + 1, Y2). ) Is not a defective pixel, the images A3 and B3 corresponding to the images A1 and B1 are correct image data. Therefore, by replacing the image data of A1 (X1, Y1) and B1 (X2, Y2) with the image data of A3 (X1 + 1, Y1) and B3 (X2 + 1, Y2), the data of the images A1 and B1 by the defective pixels Can be complemented with correct image data.

  Based on the above, the actual component mounting operation is performed as follows.

  The mounting head 1 is moved above the electronic component supply device 4 by operating the X-axis gantry 2 and the Y-axis gantry 3, the component 12 is sucked by the suction nozzle 8, and the mounting head 1 is moved above the imaging device 7. Let it pass without stopping. When the component 12 comes to the center of the imaging device 7, the light source 41 of the illumination device 40 is turned on, the shutter of the imaging device 7 is turned off, and an image 55 as shown in FIG. The data is stored in the memory 27b of the recognition device 27.

  Subsequently, when the mounting head 1 is moved, the light source is turned on again when the position is moved by 1 mm, which is 10 pixels, and the shutter of the imaging device 7 is turned off again, as shown in FIG. 9B. The image 56 is acquired and stored in the memory 27b. Now, the solid-state imaging device (CMOS, CCD) of the imaging device 40 has a defect in a pixel having the coordinates of (X1, Y1) and (X2, Y2) by the method described with reference to FIG. Assume that pixel positions are stored. Since the data of the images A1 and B1 having the coordinates of (X1, Y1) and (X2, Y2) are images of defective pixels, if component recognition is performed using data including the image data, accurate component recognition may not be possible. There is sex. Therefore, the data of the images A3 and B3 corresponding to the images A1 and B1 are obtained from the image 56, and the data of the images A1 and B1 are replaced with the data of the images A3 and B3 and complemented. That is, the image data at the coordinate positions of A3 (X1 + 1, Y1) and B3 (X2 + 1, Y2) is acquired from the image 56, and this data is obtained as A1 (X1, Y1) and B1 (X2, Y2) of the image 55. Let it be image data. Since the image data of A3 (X1 + 1, Y1) and B3 (X2 + 1, Y2) is image data that would be obtained when the pixels of the images A1 and B1 are not defective, the data of the complemented image 55 is The image data including the data of the component 12 is reliable image data.

  Since the image data with reliability of the component 12 is obtained by the above-described complementation, the image data is image-processed by the recognition device 27 to calculate the component center and the component inclination. The X-axis motor 21, the Y-axis motor 22, and the θ-axis motor 9 are driven so that the shift amount and the suction angle shift amount are corrected, and the component 12 is mounted on the circuit board 5.

  As described above, the present invention does not perform correction by calculation using peripheral data of defective pixels as in the prior art, but processes a rapidly changing image or an image near an edge because of a complementing method for replacing actual data. Can be corrected accurately. In addition, even when a plurality of defective pixels are present, different from those obtained by calculation using surrounding pixels, correction can be performed exactly as in the case of one pixel defect.

  In addition, when imaging a jig for detecting defective pixels, the jig is arranged at a position where the focal position of the optical system of the imaging device is shifted, and imaging is performed, so that unevenness of the jig or fine attached to the jig is detected. Therefore, it is possible to image uniform grayscale data without imaging uneven dust and illumination unevenness, and accurately detect defective pixels. In that case, it is possible to find both a defective pixel that becomes brighter and a defective pixel that becomes darker by using white and black jigs in the process of obtaining the coordinates of the defective pixel.

  In the above-described embodiment, an image is captured twice, and correction is performed using two images. However, three or more images may be used. Further, the image is taken while moving the mounting head 1 on the imaging device 7 at the time of recognition. However, even if the mounting head 1 is temporarily stopped on the imaging device 7, moved again and stopped again, an image is acquired. good.

  In the above-described embodiment, when imaging is performed by shifting the first image and the second image, the shift is about 10 pixels, but other pixel numbers may be used. However, it is a premise that the object (parts) to be imaged is shown in the shifted image. Further, the shift amount is set to a movement distance such that the positions of pixel defects do not overlap in the images before and after the shift.

  Moreover, when obtaining the defective pixel, the white jig plate 60 is used. However, a self-lighting colored light emitting plate using EL or LED may be used. Further, the jig plate is arranged in close proximity to the lens 6 of the imaging device 7 so as to be able to advance and retreat, and is configured so that light from the outside does not enter when it is positioned in the lens portion, and detects defective pixels that become bright when turned off. A single jig plate may be used by detecting defective pixels that become dark when lit. Furthermore, it is good also as position data of a defective pixel using the data of the defective pixel position by the manufacture inspection in the manufacturer of an imaging device previously.

  In the above-described embodiments, the imaging optical system for recognizing a component has been described. However, the same effect can be obtained by applying the same to an optical system for detecting a position reference mark on a circuit board.

  Further, in the above-described embodiment, the process for obtaining the defective pixel is performed only once at the time of assembly. However, when the solid-state image sensor of the imaging apparatus is deteriorated by using it for a long time, the density data is obtained. In order not to be recorded accurately and recorded as a value darker than the actual brightness and to be in the same state as the defective pixel, the defective pixel is generated every certain production time such as every 10,000 hours. The operator may be prompted to perform the inspection, and the inspection may be executed. When a defective pixel is inspected every certain period of production time, a jig for obtaining a defective pixel is built in the imaging device so that the device automatically determines the inspection time and the device automatically starts the inspection. It may be. In this case, the production time is set to a fixed time when the defective pixel is inspected every fixed time. However, the inspection timing may be determined by counting the number of parts mounted or the number of times the imaging apparatus is used. In addition, when the number of defective pixels in one imaging device is more than a certain value by inspection of defective pixels at regular time intervals, for example, when the number of defective pixels is 256 or less due to the specifications of the imaging camera, 516 or more that is twice that number. In such a case, the operator may be prompted to replace the imaging camera, and the operator performs maintenance for replacing the imaging camera based on a message prompting replacement.

[Other embodiments]
In the embodiment described above, the movement amount of the pixel positions of the two images 55 and 56 is obtained based on the movement amount of the mounting head 1, but the mounting head 1 is moved to a position that is moved by 1 mm, which is 10 pixels. When moving and acquiring an image, the amount of movement may not be accurate due to the accuracy of the axis. In this case, when the images are replaced, pattern matching is performed on the image of the component 12 of the image 55 and the image 56 with reference to the image of the component 12 that is the imaging target component, and the amount of movement between the images 55 and 56 is calculated. May be calculated, and the amount of movement may be obtained to determine the position of the pixel to be replaced, and the replacement may be performed. As shown in FIG. 9A, the center position of the part 12 of the image 55 acquired first is O (X3, Y3), and then the image 56 shown in FIG. 9B taken for correction. Since the position of the part 12 is O (X3 + 1, Y3), it can be seen from the difference between the two positions that the amount of movement is (1, 0). 1 mm in the X direction is 0.1 mm / pixel, which means that 10 pixels have moved. The parts in the two images have only a parallel movement and no rotational movement. Since matching is performed on the same part, the correlation can be obtained with a very high probability, and the movement amount can be calculated. In this embodiment, pattern matching is used, but there is no problem if the position can be calculated by other recognition methods. When the movement amount is obtained by this pattern matching, even if an error occurs in the movement axis of the mounting head 1, it can be corrected accurately.

  Also, when calculating the amount of movement by this pattern matching, the positions of the parts of the two images were calculated, but a mark was placed in the vicinity of the part on the mounting head and imaged at the same time as each part. Marks may be pattern matched. In addition, a mark is placed near the imaging device, and when the component is imaged by the imaging device, the positional relationship is such that the mark can be captured by the circuit board recognition camera provided on the mounting head, and the component is imaged by the imaging device. At the same time, the mark may be picked up by the board recognition camera, and the movement amount may be calculated from two images of the mark recognized by the board recognition camera.

  In the above-described embodiment, the calculation is performed by correlating the images in order to obtain the amount of movement when the image is taken twice. However, the encoder signal of the XY axis gantry is recorded at the same timing as when the shutter is released. In addition, the movement amount may be obtained from the position difference at that time.

  Moreover, you may make it obtain by imaging two images with a different imaging device. This method will be described below.

  As shown in FIG. 11, an imaging device 73 including a lens 72 and an imaging device 83 including a lens 82 are provided. The imaging device 73 is disposed directly below the illumination device 40 and is a half mirror inclined at 45 degrees. A part image passing through 71 is captured. On the other hand, the imaging device 83 captures an image obtained by reflecting the component image reflected by the half mirror 71 by the total reflection mirror 81 tilted by 45 degrees. With such a configuration, it is possible to capture an image with the same field of view with the two imaging devices 72 and 73.

  With such a configuration, the jig 45 in which the distance between the two circular marks 45a and 45b shown in FIG. 5 is measured in advance by the measuring device is imaged, and the number of pixels of the two marks on the jig and the measuring device in advance are measured. The distance divided by the number of pixels is calculated from the distance measured in step 1, and the size of the image per pixel is obtained. In the case of the present embodiment, the size of the image per pixel of each imaging element of the imaging devices 73 and 83 by the lenses 72 and 82 is set to 0.1 [mm / pixel].

  Based on the image of the jig 45 thus obtained, the position of the reference circle mark is calculated by calculating the position from the origin on the element. If this calculation is obtained by the imaging devices 73 and 83, respectively, and the coordinates of the mark obtained from the imaging device 73 are (10, 10) and the coordinates of the mark on the imaging device 83 are (11, 10), Since the position is shifted by (1, 0), the positional shift of the optical axes of the imaging devices 73 and 83 can be obtained. This deviation amount is stored in a memory.

  At the time of actual component recognition, the mounting head 1 is moved to the image pickup device 73, the illumination light source 41 is turned on when the component 12 comes directly above the image pickup device 73, and the shutters of both the image pickup devices 73 and 83 are simultaneously turned off. Imaging is performed with two imaging devices. By such a method, images similar to those shown in FIGS. 9A and 9B can be simultaneously obtained, stored in the memory 27b, and image data complementation with defective pixels is performed by the method described above.

  In this case, the defect position of the pixel of the imaging device 73 is stored in the storage device 30, and the image by the defective pixel is corrected from the image captured by the imaging device 83. Alternatively, the defect position of the pixel of the imaging device 83 may be stored in the storage device 30 and the image of the defective pixel may be corrected from the image captured by the imaging device 73.

  In this way, if the configuration is such that one field of view is captured by two imaging devices, it is not necessary to shift the position and image twice, so that recognition can be performed at a higher speed. Since the relationship is fixed, there is no need to calculate the amount of movement of the two images for each imaging, and the positions of the two imaging devices are acquired at the time of installation, and the first is based on the positions of the respective imaging devices. It is only necessary to complement the second image with the second image, and accurate component image data can be acquired with a simple configuration.

It is the perspective view which showed schematic structure of the component mounting apparatus used for this invention. It is the perspective view which showed the detailed structure of the mounting head. It is the block diagram which showed the structure of the control system of a component mounting apparatus. It is explanatory drawing which showed the state which images a component with an imaging device. It is a top view of the jig | tool for calculating | requiring the image size per pixel. It is explanatory drawing which showed that there exists a pixel defect in an image. It is explanatory drawing which showed the state which inserts a jig | tool in order to detect a defective pixel, and images a component. (A) is an image figure which shows the defective pixel detected at the time of a white jig | tool, (B) is an image figure which shows the defective pixel detected at the time of a black jig | tool. (A) is an image figure which shows the image which imaged components, (B) is an image figure which shows the image obtained when the same component is imaged by changing a pixel position. It is explanatory drawing which showed the method of complementing the image data by a defective pixel. It is the block diagram which showed the arrangement configuration of the imaging device in the case of acquiring an image using two imaging devices. (A) is an image of the image of the component, (B) is an explanatory diagram showing the brightness level of the pixel when there is no defective pixel, and (C) is the brightness level of the pixel when there is a defective pixel. It is explanatory drawing which showed.

Explanation of symbols

7 Imaging device 8 Suction nozzle 12 Electronic component 40 Illumination device 45 Jig 73, 83 Imaging device

Claims (7)

A method of capturing an image of a subject with an imaging device including a solid-state imaging device and acquiring image data,
Identify the position of the defective pixel in the solid-state image sensor,
The subject is imaged to obtain a first image, the pixel position is changed and the same subject is imaged to obtain a second image,
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. The image data acquisition method characterized by replacing with and complementing.   The image data acquisition method according to claim 1, wherein imaging with changing pixel positions is performed by moving a subject.   The image data acquisition method according to claim 1, wherein a position movement amount when the pixel position is changed is obtained based on the first and second images.   The image data acquisition method according to claim 1, wherein the first image is acquired by one imaging device, and the second image is acquired by another imaging device arranged at a position different from the imaging device.   2. The electronic component mounted on a circuit board by a component mounting apparatus, wherein the electronic component is recognized after the complementation, and the electronic component is mounted based on the recognition result. 5. The image data acquisition method according to any one of items 1 to 4. An apparatus that captures an image of a subject with an imaging device including a solid-state imaging device and acquires image data,
A storage device for storing a position of a defective pixel of the solid-state imaging device;
An imaging device that captures a subject to obtain a first image, moves the subject by a predetermined amount, and obtains a second image;
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. An image data acquisition apparatus characterized by being replaced by and complementing. An apparatus that captures an image of a subject with an imaging device including a solid-state imaging device and acquires image data,
A first imaging device for capturing a subject and acquiring a first image;
A storage device for storing a position of a defective pixel of the solid-state imaging device of the first imaging device;
A second imaging device that is arranged at a different position from the first imaging device and that captures the same subject and obtains a second image;
Image data corresponding to the image of the defective pixel when the first image is obtained is obtained from the second image, and image data of the defective pixel in the first image is obtained from the second image. An image data acquisition apparatus characterized by being replaced by and complementing.

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