JP2005332933A - Manufacturing apparatus and method of fixing thereof - Google Patents

Manufacturing apparatus and method of fixing thereof Download PDF

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Publication number
JP2005332933A
JP2005332933A JP2004149173A JP2004149173A JP2005332933A JP 2005332933 A JP2005332933 A JP 2005332933A JP 2004149173 A JP2004149173 A JP 2004149173A JP 2004149173 A JP2004149173 A JP 2004149173A JP 2005332933 A JP2005332933 A JP 2005332933A
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Prior art keywords
floor
manufacturing apparatus
manufacturing
suction
foot
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Keisuke Hiraide
桂介 平出
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To easily fix manufacturing apparatuses to a floor and to easily remove them from the floor. <P>SOLUTION: The manufacturing apparatus 10 are provided with: the main bodies of the manufacturing apparatuses 10; legs 20 supporting the main bodies of the manufacturing apparatuses 10 onto the floor; and sticking rings which are provided on the bottom surfaces of the legs 20 and can be stuck to the floor 1a. The manufacturing apparatuses 10 constitute the manufacturing line of a semiconductor device e.g. Operation members 50a and 50b for sticking the sticking rings to the floor 1a by depressing the sticking rings to the floor 1a can be provided in addition. The bottom surfaces of the legs 20 are expanded more than the upper parts 22 of the leg 20, and can be recessed except for peripheries. The sticking ring can be provided so as to cover the recesses of the bottom surfaces of the legs 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、製造装置及びその固定方法に関する。特に本発明は、床への固定及び床からの取り外しを簡単に行うことができる製造装置及びその固定方法に関する。   The present invention relates to a manufacturing apparatus and a fixing method thereof. In particular, the present invention relates to a manufacturing apparatus that can be easily fixed to a floor and removed from the floor, and a fixing method thereof.

半導体装置を製造する製造ラインは、複数の製造装置により構成されている。これらの製造装置は、地震への対策として工場の床に固定される必要がある。   A manufacturing line for manufacturing a semiconductor device includes a plurality of manufacturing apparatuses. These manufacturing devices need to be fixed on the factory floor as a countermeasure against earthquakes.

図４（Ａ）は、製造装置を床に固定する従来の方法を示す側面概略図であり、図４（Ｂ）は図４（Ａ）のＢ−Ｂ断面図である。図４（Ａ）に示すように製造装置１００は足部１０３にアジャスタボルト１０３ａを有している。アジャスタボルト１０３ａは足部１０３の底部材１０３ｂ上に立設しており、上部が製造装置１００の本体の底フレーム１０２に設けられたネジ孔にねじ込まれている。   FIG. 4A is a schematic side view illustrating a conventional method for fixing a manufacturing apparatus to a floor, and FIG. 4B is a cross-sectional view taken along line BB in FIG. As shown in FIG. 4A, the manufacturing apparatus 100 has an adjuster bolt 103a on the foot 103. The adjuster bolt 103 a is erected on the bottom member 103 b of the foot 103, and the upper part is screwed into a screw hole provided in the bottom frame 102 of the main body of the manufacturing apparatus 100.

図４（Ｂ）に示すように製造装置１００は、以下のようにして固定金具１１４を用いて床に固定されている。 固定金具１１４は一端に切欠１１４ａが設けられており、この切欠１１４ａにアジャスタボルト１０３ａが差し込まれることにより固定金具１１４はアジャスタボルト１０３ａに組みつけられている。
また図４（Ａ）に示すように固定金具１１４の他端は鉄板からなる床１０１に固定されている。詳細には、固定金具１１４の他端には孔１１４ｂが設けられており、この孔１１４ｂにボルト１１０が挿入されている。ボルト１１０は孔１１４ｂを挿通した後、さらに床１０１に設けられた孔を挿通している。そしてボルト１１０の開放端側にはナット１１２が床１０１の裏面からねじ込まれている。このようにして固定金具１１４の他端は床１０１に固定されている。 As shown in FIG. 4 (B), the manufacturing apparatus 100 is fixed to the floor using the fixing bracket 114 as follows. The fixing bracket 114 is provided with a notch 114a at one end, and the fixing bracket 114 is assembled to the adjuster bolt 103a by inserting the adjuster bolt 103a into the notch 114a.
As shown in FIG. 4A, the other end of the fixture 114 is fixed to a floor 101 made of an iron plate. Specifically, a hole 114b is provided at the other end of the fixing bracket 114, and the bolt 110 is inserted into the hole 114b. The bolt 110 passes through a hole provided in the floor 101 after passing through the hole 114b. A nut 112 is screwed into the open end side of the bolt 110 from the back surface of the floor 101. In this way, the other end of the fixture 114 is fixed to the floor 101.

上記した方法で製造装置を床に固定するためには、固定金具を製造装置の足部のアジャスタボルトに組み付けると共に、床に孔を開け、この孔及び固定金具にボルトを差込み、さらに床の裏面側からボルトにナットをねじ込む必要があった。従って製造装置の固定に時間及びコストがかかっていた。
また製造工程を変更したり製造装置を入れ替えたりする場合などには、製造ラインを構成する製造装置を移動させる必要がある。上記した方法により製造装置を床に固定した場合、製造装置を床から取り外すためには、ボルト、固定金具、及び床の裏面にあるナットを取り外す必要があった。このため製造装置の移動には時間及びコストがかかっていた。 In order to fix the manufacturing apparatus to the floor by the above method, the fixing bracket is assembled to the adjuster bolt of the foot of the manufacturing apparatus, a hole is made in the floor, the bolt is inserted into the hole and the fixing bracket, and the back surface of the floor It was necessary to screw the nut into the bolt from the side. Therefore, it takes time and cost to fix the manufacturing apparatus.
Moreover, when changing a manufacturing process or replacing a manufacturing apparatus, it is necessary to move the manufacturing apparatus which comprises a manufacturing line. When the manufacturing apparatus is fixed to the floor by the above-described method, in order to remove the manufacturing apparatus from the floor, it is necessary to remove the bolt, the fixing bracket, and the nut on the back surface of the floor. Therefore, it takes time and cost to move the manufacturing apparatus.

本発明は上記のような事情を考慮してなされたものであり、その目的は、床への固定及び床からの取り外しを容易に行える製造装置及びその固定方法を提供することにある。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a manufacturing apparatus that can be easily fixed to the floor and removed from the floor, and a fixing method thereof.

上記課題を解決するため、本発明にかかる製造装置は、
製造装置本体と、
前記製造装置本体を床上に支持する足部と、
前記足部の底面に設けられ、床に吸着可能な吸着盤と
を具備する。 In order to solve the above problems, a manufacturing apparatus according to the present invention includes:
A manufacturing apparatus body;
Feet for supporting the manufacturing apparatus body on the floor;
And a suction disc provided on the bottom surface of the foot portion and capable of being adsorbed to the floor.

この製造装置は、足部の底面に設けられた吸着盤が床に吸着することにより、床に固定される。従って床に孔をあけることなく、且つボルト及びナットを用いることなく、製造装置を床に固定することができる。
この製造装置は、例えば半導体装置の製造ラインを構成する装置である。 This manufacturing apparatus is fixed to the floor by adsorbing the suction disk provided on the bottom of the foot to the floor. Therefore, the manufacturing apparatus can be fixed to the floor without making holes in the floor and without using bolts and nuts.
This manufacturing apparatus is, for example, an apparatus constituting a manufacturing line for semiconductor devices.

外部から力を加えられて動くことにより、吸着盤を床に向けて押下して該床に吸着させる操作部材を更に具備してもよい。この場合簡単に製造装置を床に固定させることができる。なお、操作部材を吸着盤を吸着させる場合とは反対側に動かすと、吸着盤が床から離れるようにするのが好ましい。   An operation member may be further provided that moves by applying force from the outside to press the suction board toward the floor and suck the floor to the floor. In this case, the production apparatus can be easily fixed to the floor. In addition, it is preferable to move the suction member away from the floor when the operation member is moved to the opposite side to the case of sucking the suction plate.

足部の底面は、足部の上部より広がっており、且つ周縁部を除いて窪んでおり、吸着盤は、底面の窪みを塞ぐように設けられていてもよい。このようにすると吸着盤の面積を大きくすることができるため、製造装置を強固に床に固定することができる。   The bottom surface of the foot portion extends from the upper portion of the foot portion and is recessed except for the peripheral edge portion, and the suction disk may be provided so as to close the recess of the bottom surface. If it does in this way, since the area of a suction disk can be enlarged, a manufacturing apparatus can be firmly fixed to a floor.

本発明に係る製造装置の固定方法は、製造装置の足部の底面に吸着盤を設け、該吸着盤を床に吸着させることにより前記製造装置を前記床に固定するものである。   The manufacturing apparatus fixing method according to the present invention is to fix the manufacturing apparatus to the floor by providing a suction disk on the bottom of the foot of the manufacturing apparatus and adsorbing the suction disk to the floor.

発明を実施するための形態BEST MODE FOR CARRYING OUT THE INVENTION

以下、図面を参照して本発明の実施形態について説明する。図１は第１の実施形態に係る製造装置を用いた工場を側面から見た概略図である。この工場は半導体装置を製造する工場であり、クリーンルーム１が設けられている。クリーンルーム１の中には製造ラインを構成する複数の製造装置１０が設置されている。製造装置１０は例えばシリコン基板の表面を酸化する熱酸化装置、半導体基板上にポリシリコンや酸化シリコンなどを成膜するＣＶＤ装置、配線となる金属膜を成膜するスパッタリング装置等であり、クリーンルーム１の床１ａに固定されている。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a factory using the manufacturing apparatus according to the first embodiment as viewed from the side. This factory is a factory for manufacturing semiconductor devices, and a clean room 1 is provided. In the clean room 1, a plurality of manufacturing apparatuses 10 constituting a manufacturing line are installed. The manufacturing apparatus 10 is, for example, a thermal oxidation apparatus that oxidizes the surface of a silicon substrate, a CVD apparatus that forms polysilicon, silicon oxide, or the like on a semiconductor substrate, a sputtering apparatus that forms a metal film to be a wiring, and the like. It is fixed to the floor 1a.

図２は床１ａに固定された製造装置１０の構成を示す一部破断の側面概略図であり、図３は図２のＡ−Ａ断面図である。これらの図に示すように、製造装置１０は複数の足部２０それぞれに柱状のアジャスタボルト２２を有している。アジャスタボルト２２それぞれは足部２０の底部材２４上に立設しており、上部が製造装置１０の本体の底フレーム３０に設けられたネジ孔３０ａにねじ込まれている。底部材２４は略円柱形状であり、その底面積はアジャスタボルト２２の断面積より広くなっている。
また底フレーム３０には複数の車輪４０が設けられているが、製造装置１０が固定されている状態すなわち足部２０が製造装置１０を支持している状態では、すべての車輪４０は床１ａから浮いている。 2 is a partially broken side schematic view showing the configuration of the manufacturing apparatus 10 fixed to the floor 1a, and FIG. 3 is a cross-sectional view taken along the line AA of FIG. As shown in these drawings, the manufacturing apparatus 10 has a columnar adjuster bolt 22 in each of a plurality of legs 20. Each adjuster bolt 22 is erected on the bottom member 24 of the foot 20, and the upper part is screwed into a screw hole 30 a provided in the bottom frame 30 of the main body of the manufacturing apparatus 10. The bottom member 24 has a substantially cylindrical shape, and its bottom area is wider than the cross-sectional area of the adjuster bolt 22.
The bottom frame 30 is provided with a plurality of wheels 40. When the manufacturing apparatus 10 is fixed, that is, when the foot 20 supports the manufacturing apparatus 10, all the wheels 40 are connected to the floor 1a. Floating.

図３に詳細を示すように底部材２４の底面は縁を除いて窪んでおり、この窪み２４ａを塞ぐように吸着盤２５が貼り付けられている。吸着盤２５はエラストマなど弾性を有する材料から形成されているため、中央部が上に引き上げられることにより床１ａとの間に低圧の気密部２５ａを形成することができる。   As shown in detail in FIG. 3, the bottom surface of the bottom member 24 is recessed except for the edge, and a suction disk 25 is attached so as to close the recess 24 a. Since the suction disk 25 is made of an elastic material such as an elastomer, a low-pressure airtight part 25a can be formed between the suction part 25 and the floor 1a by pulling the center part upward.

吸着盤２５の略中央部には、棒状の連結部材５２の一端部５２ａが取り付けられている。連結部材５２の他端部５２ｂは、底部材２４の上面２４ｃに設けられた孔２４ｂを貫いて上面２４ｃの上に露出している。そして他端部５２ｂは、上面２４ｃ上に設けられたカム５０ｂにピン５１を用いて回転可能に組み付けられている。カム５０ｂにはレバー５０ａがついており、このレバー５０ａを回転させるとカム５０ｂは底部材２４の上面２４ｃに接しながら回転する。そしてカム５０ｂの回転運動は連結部材５２の上下運動に変換され、この上下運動により吸着盤２５が引き上げられ、また吸着盤２５が押し下げられる。このようにレバー５０ａ、カム５０ｂ、ピン５１及び連結部材５２は、本発明に係る操作部材の一例として機能する。
なお底部材２４の上面には図示しないストッパーが設けられており、このストッパーによりレバー５０ａ又はカム５０ｂを、吸着盤２５を引き上げた状態で固定することができるようになっている。 One end 52 a of a rod-shaped connecting member 52 is attached to the substantially central portion of the suction disk 25. The other end 52b of the connecting member 52 is exposed on the upper surface 24c through a hole 24b provided in the upper surface 24c of the bottom member 24. The other end 52b is rotatably mounted using a pin 51 to a cam 50b provided on the upper surface 24c. The cam 50b has a lever 50a. When the lever 50a is rotated, the cam 50b rotates while contacting the upper surface 24c of the bottom member 24. The rotational movement of the cam 50b is converted into the vertical movement of the connecting member 52, and the suction disk 25 is pulled up and the suction disk 25 is pushed down by this vertical movement. Thus, the lever 50a, the cam 50b, the pin 51, and the connecting member 52 function as an example of the operation member according to the present invention.
A stopper (not shown) is provided on the upper surface of the bottom member 24 so that the lever 50a or the cam 50b can be fixed with the suction plate 25 pulled up.

次に製造装置１０の設置方法について説明する。製造装置１０を固定する前は、アジャスタボルト２２はネジ孔３０ａに十分にねじ込まれているため、足部２０の底部材２４は床１ａから浮いており、代わりに車輪４０が床１ａに接地して製造装置１０を支持している。また吸着盤２５は押し下げられて平板状（図３の点線で示した状態）になっている。
この状態で、まず製造装置１０を設置したい場所に移動させる。 Next, a method for installing the manufacturing apparatus 10 will be described. Before the manufacturing apparatus 10 is fixed, the adjuster bolt 22 is sufficiently screwed into the screw hole 30a. Therefore, the bottom member 24 of the foot 20 is lifted from the floor 1a, and instead the wheel 40 is grounded to the floor 1a. The manufacturing apparatus 10 is supported. Further, the suction plate 25 is pushed down to have a flat plate shape (a state indicated by a dotted line in FIG. 3).
In this state, the manufacturing apparatus 10 is first moved to a place where it is desired to be installed.

次いで複数のアジャスタボルト２２それぞれをネジ孔３０ａから出ていく方向に回し、足部２０の底部材２４を床１ａに接地させると共に車輪４０を床１ａから浮かせる。このとき吸着盤２５の周縁部には製造装置１０の重さが加わる。
そしてレバー５０ａを図３のＡ方向に回すことにより、カム５０ｂを回転させる。このとき吸着盤２５の周縁部には製造装置１０の重さが加わっているため、床１ａと吸着盤２５の間には気密部２５ａが形成される。そしてストッパーを用いてレバー５０ａ及びカム５０ｂをこの状態で固定する。これにより底部材２４は床１ａに吸着し、製造装置１０が床１ａに固定される。 Next, each of the plurality of adjuster bolts 22 is rotated in the direction of exiting from the screw hole 30a, and the bottom member 24 of the foot 20 is grounded to the floor 1a and the wheel 40 is floated from the floor 1a. At this time, the weight of the manufacturing apparatus 10 is added to the peripheral portion of the suction plate 25.
Then, the cam 50b is rotated by turning the lever 50a in the direction A in FIG. At this time, since the weight of the manufacturing apparatus 10 is added to the peripheral portion of the suction plate 25, an airtight portion 25 a is formed between the floor 1 a and the suction plate 25. Then, the lever 50a and the cam 50b are fixed in this state using a stopper. Thereby, the bottom member 24 is adsorbed to the floor 1a, and the manufacturing apparatus 10 is fixed to the floor 1a.

なお製造装置１０を移動させるときは、ストッパーを外してレバー５０ａ及びカム５０ｂを元に戻して気密部２５ａをなくせばよい。そしてアジャスタボルト２２を底フレーム３０のネジ孔３０ａにねじ込むことにより、底部材２４を床１ａから浮かせると同時に車輪４０を床１ａに接地させる。このようにすると製造装置１０を容易に移動させることができるようになる。   When the manufacturing apparatus 10 is moved, the stopper 50 is removed, the lever 50a and the cam 50b are returned to the original position, and the airtight portion 25a is eliminated. Then, by screwing the adjuster bolt 22 into the screw hole 30a of the bottom frame 30, the bottom member 24 is floated from the floor 1a, and at the same time, the wheel 40 is grounded to the floor 1a. In this way, the manufacturing apparatus 10 can be easily moved.

以上のように本実施形態によれば、足部２０の底部材２４の底面に窪み２４ａ及び窪み２４ａを塞ぐ吸着盤２５を設け、吸着盤２５により底部材２４を床１ａに吸着させるようにしたため、固定金具を用いることなく、且つ床１ａに孔をあけてこの孔にボルトを通して床１ａの裏面からナットをねじ込むことなく、製造装置１０を床１ａに固定することができる。従って従来と比べて製造装置１０を短時間で床１ａに固定し、また床１ａから取り外すことができる。
また底部材２４はアジャスタボルト２２よりも広がっているため、吸着盤２５の面積を広くすることができる。従って吸着盤２５の床１ａに対する吸着力を上げ、製造装置１０を強固に床に固定することができる。 As described above, according to the present embodiment, the depression 24a and the suction board 25 that closes the depression 24a are provided on the bottom surface of the bottom member 24 of the foot portion 20, and the bottom member 24 is adsorbed to the floor 1a by the adsorption board 25. The manufacturing apparatus 10 can be fixed to the floor 1a without using a fixing metal fitting and without making a hole in the floor 1a and screwing a nut into the hole from the back surface of the floor 1a. Therefore, the manufacturing apparatus 10 can be fixed to the floor 1a and removed from the floor 1a in a shorter time than in the past.
Further, since the bottom member 24 is wider than the adjuster bolt 22, the area of the suction plate 25 can be increased. Accordingly, the suction force of the suction board 25 to the floor 1a can be increased, and the manufacturing apparatus 10 can be firmly fixed to the floor.

尚、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲内で種々変更して実施することが可能である。例えば上記した各実施形態において、製造装置は半導体装置を製造する装置であったが他の物を製造する装置であってもよい。また操作部材の構成は上記した実施例に限られず、例えば吸着盤の略中央部を上に引き上げたり押し下げたりすることができれば、どのような構成であってもよい。   Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in each of the above-described embodiments, the manufacturing apparatus is an apparatus for manufacturing a semiconductor device, but may be an apparatus for manufacturing another object. Further, the configuration of the operation member is not limited to the above-described embodiment, and any configuration may be used as long as, for example, the substantially central portion of the suction disk can be pulled up or pushed down.

本発明の実施形態に係る製造装置を用いた工場を側面から見た概略図。Schematic which looked at the factory using the manufacturing apparatus which concerns on embodiment of this invention from the side. 床１ａに固定された製造装置１０の構成を示す一部破断の側面概略図。FIG. 3 is a partially cutaway side view schematically showing the configuration of the manufacturing apparatus 10 fixed to the floor 1a. 図２のＡ−Ａ断面図。AA sectional drawing of FIG. （Ａ）は、製造装置を床に固定する従来の方法を示す側面概略図、（Ｂ）は（Ａ）のＡ−Ａ断面図。(A) is the side surface schematic diagram which shows the conventional method of fixing a manufacturing apparatus to a floor, (B) is AA sectional drawing of (A).

符号の説明Explanation of symbols

１…クリーンルーム、１ａ,１０１…床、１０…製造装置、２０,１０３…足部、２２,１０３ａ…アジャスタボルト、２４,１０３ｂ…底部材、２４ａ…窪み、２４ｂ…孔、２４ｃ…上面、２５…吸着盤、２５ａ…気密部、３０,１０２…底フレーム、３０ａ…ネジ孔、４０…車輪、５０ａ…レバー、５０ｂ…カム、５１…ピン、５２…連結部材、５２ａ…一端部、５２ｂ…他端部、１００…製造装置、１０１ａ,１１４ｂ…孔、１１０…ボルト、１１２…ナット、１１４…固定金具、１１４ａ…切欠 DESCRIPTION OF SYMBOLS 1 ... Clean room, 1a, 101 ... Floor, 10 ... Manufacturing apparatus, 20, 103 ... Leg part, 22, 103a ... Adjuster bolt, 24, 103b ... Bottom member, 24a ... Recess, 24b ... Hole, 24c ... Top surface, 25 ... Adsorption plate, 25a ... Airtight part, 30, 102 ... Bottom frame, 30a ... Screw hole, 40 ... Wheel, 50a ... Lever, 50b ... Cam, 51 ... Pin, 52 ... Connecting member, 52a ... One end, 52b ... Other end Part, 100 ... manufacturing apparatus, 101a, 114b ... hole, 110 ... bolt, 112 ... nut, 114 ... fixing bracket, 114a ... notch

Claims (6)

製造装置本体と、
前記製造装置本体を床上に支持する足部と、
前記足部の底面に設けられ、床に吸着可能な吸着盤と
を具備する製造装置。 A manufacturing apparatus body;
Feet for supporting the manufacturing apparatus body on the floor;
A manufacturing apparatus comprising: a suction disk provided on a bottom surface of the foot part and capable of being sucked to the floor. 前記製造装置は半導体装置の製造ラインを構成する装置である請求項１に記載の製造装置。   The manufacturing apparatus according to claim 1, wherein the manufacturing apparatus is an apparatus constituting a semiconductor device manufacturing line. 前記吸着盤の周縁部が前記床に押し付けられた状態で、外部から力を加えられて動くことにより、該吸着盤の略中央部を上に引き上げて前記床に吸着させる操作部材を更に具備する請求項１又は２に記載の製造装置。   An operation member is further provided that pulls up the substantially central portion of the suction disk upward and attracts it to the floor by moving by applying force from the outside in a state where the peripheral edge of the suction disk is pressed against the floor. The manufacturing apparatus according to claim 1 or 2. 前記操作部材は、前記吸着盤を吸着させる場合とは反対側に動くことにより、前記吸着盤を前記床から開放する請求項３に記載の製造装置。   The manufacturing apparatus according to claim 3, wherein the operation member moves to a side opposite to a case where the suction plate is sucked to open the suction plate from the floor. 前記足部の前記底面は、前記足部の上部より広がっており、且つ周縁部を除いて窪んでおり、
前記吸着盤は、前記底面の窪みを塞ぐように設けられている請求項１〜４のいずれか一項に記載の製造装置。 The bottom surface of the foot part extends from the upper part of the foot part and is recessed except for the peripheral edge part,
The said adsorption | suction board is a manufacturing apparatus as described in any one of Claims 1-4 provided so that the hollow of the said bottom face may be plugged up. 製造装置の足部の底面に吸着盤を設け、該吸着盤を床に吸着させることにより前記製造装置を前記床に固定する製造装置の固定方法。   A method of fixing a manufacturing apparatus, wherein an adsorption board is provided on a bottom surface of a foot portion of the manufacturing apparatus, and the manufacturing apparatus is fixed to the floor by adsorbing the adsorption board to the floor.
JP2004149173A 2004-05-19 2004-05-19 Manufacturing apparatus and method of fixing thereof Withdrawn JP2005332933A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058266A1 (en) 2005-11-17 2007-05-24 Matsushita Electric Industrial Co., Ltd. Portable wireless communication terminal abd emergency broadcast receiving system
US20130231076A1 (en) * 2008-08-11 2013-09-05 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058266A1 (en) 2005-11-17 2007-05-24 Matsushita Electric Industrial Co., Ltd. Portable wireless communication terminal abd emergency broadcast receiving system
US20130231076A1 (en) * 2008-08-11 2013-09-05 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device
US20130231074A1 (en) * 2008-08-11 2013-09-05 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device
US20130237177A1 (en) * 2008-08-11 2013-09-12 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device
US9131362B2 (en) * 2008-08-11 2015-09-08 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device
US9179281B2 (en) * 2008-08-11 2015-11-03 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device
US9307382B2 (en) * 2008-08-11 2016-04-05 Htc Corporation Method of managing reception of natural disaster warning notification messages for a wireless communication system and related communication device

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