JP2005332830A - Method for manufacturing connecting unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting unit capable of improving both the electrical conductivity and the resilience of a contact contacting an external connection part such as, in particular, an IC, and to provide a method for manufacturing the same. <P>SOLUTION: For instance, the top face, the bottom face, and both side faces of a conductive member 40 are completely surrounded by an auxiliary resilient member 41 as shown in Fig. C. The conductive member 40 is composed of a material having specific resistance lower than that of the auxiliary resilient member 41. The auxiliary resilient member 41 is composed of a material having a yield point and an elastic modulus higher than those of the conductive member 40. Thereby, both the electrical conductivity and resilience of the spiral contact can be improved well. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connection device that is an IC socket to which, for example, an IC (integrated circuit) or the like is mounted, and in particular, to improve both conductivity and springiness of a contact that contacts an external connection portion such as an IC. The present invention relates to a method for manufacturing a possible connection device.

  The semiconductor inspection apparatus described in Patent Document 1 electrically temporarily connects a semiconductor to an external circuit board or the like. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor, and a large number of concave portions are provided on an insulating substrate opposite to the spherical contacts, and spiral contacts are provided in the concave portions. Opposed.

When the back side of the semiconductor is pressed toward the insulating substrate, the spiral contact contacts the outer surface of the spherical contact so that the spiral contact wraps spirally. The electrical connection between the two is ensured.
JP 2002-175859 A

  Conventionally, the spiral contact has been formed by pressing or the like. However, with the miniaturization of products, there is a limit in press working to ensure electrical connection in a fine range between semiconductor inspection equipment and semiconductors. Therefore, it was necessary to form by a new method that changed to press working.

  In addition to the promotion of such miniaturization, the spiral contactor is required to have good conductivity and springiness.

  Therefore, when Patent Document 1 is viewed from such a viewpoint, FIGS. 37 to 39 of Patent Document 1 disclose various methods for forming the spiral contact.

  However, in the manufacturing method of FIG. 37, for example, nickel is mainly plated as the main body of the spiral contact, and the fine contact using such a spiral contact has a too high conductor resistance, resulting in an inspection failure or inspection. It tends to be impossible.

  Further, in the manufacturing method of FIG. 38, the member constituting the spiral contactor includes the substrate 63 in addition to the copper foil 4 ′ and the like. In such a structure, the spring property of the spiral contactor is lowered, The spiral contact cannot be elastically deformed satisfactorily according to the shape of the semiconductor spherical contact, and contact failure is likely to occur.

  Further, Patent Document 1 makes no mention of appropriately improving both the electrical conductivity and the spring property of the spiral contactor.

  Accordingly, the present invention is for solving the above-described conventional problems, and in particular, a method for manufacturing a connection device capable of improving both the electrical conductivity and the spring property of a contact that contacts an external connection portion such as an IC. The purpose is to provide.

The present invention includes a base and a plurality of spiral contacts formed in a spiral on the base, and a plurality of external connection portions of an electronic component are in contact with the spiral contacts, respectively. In the manufacturing method,
The plurality of spiral contacts are plated by overlapping a conductive member and an auxiliary elastic member. At this time, the conductive member has a specific resistance lower than that of the auxiliary elastic member, and the auxiliary elastic member has the conductive material. A material having a higher yield point and higher elastic modulus than the elastic member is selected.

  By forming both the conductive member and the auxiliary elastic member by plating, the spiral contact can be reduced in size, and both the conductivity and the spring property of the spiral contact can be improved satisfactorily. It is.

  Moreover, in this invention, after forming either a conductive member or an auxiliary | assistant elastic member in spiral shape from metal foil, an auxiliary | assistant elastic member or an electroconductive member may be piled and formed on it.

  In the present invention, it is preferable that either the conductive member or the auxiliary elastic member is formed in a spiral shape, and then the periphery thereof is plated and covered with the auxiliary elastic member or the conductive member by an electroless plating method.

  In the present invention, the auxiliary elastic member is preferably formed of Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be).

In the present invention, when the auxiliary elastic member is formed using NiP, the composition is preferably Ni _100-x P _x (where x is at% and 10 ≦ x ≦ 30).

  By setting the phosphorus concentration in the NiP (nickel phosphorus) alloy used for the auxiliary elastic member to 10 at% or more, nickel crystal precipitation can be suppressed and spring physical properties (mechanical strength) can be improved. Moreover, it is possible to suppress the plating stress (particularly compressive stress) and suppress the occurrence of plating defects.

  Further, when the phosphorus concentration in the NiP (nickel phosphorus) alloy is higher than 30 at%, various intermetallic compounds of Ni and P are precipitated. Since these intermetallic compounds are very hard and brittle, the spring properties deteriorate.

When the phosphorus concentration in the NiP (nickel phosphorus) alloy is 10 at% or more and 30 at% or less, the desired spring physical properties can be obtained while maintaining ductility due to the presence of amorphous. As a specific example of the desired spring physical property, there is a standard of a tensile strength of 1000 MPa or more.
The thickness of the adhesion layer is preferably in the range of 0.01 μm to 0.1 μm.

  In the present invention, it is preferable that the conductive member is made of Cu, Au, Ag, Pd, or a Cu alloy.

  The Cu alloy forming the conductive member is preferably a Corson alloy having Cu, Si, and Ni.

  Moreover, in this invention, the auxiliary | assistant elasticity formed with the said electroconductive member formed with Cu alloy, and Ni or Ni-X (however, X is one or more types among P, W, Mn, Ti, and Be). It is preferable to form an adhesion layer made of a metal material selected from Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, or Pt between the layers.

  Directly plating Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be) directly on the surface of a conductive material made of a Cu alloy in which a plurality of elements are mixed, In particular, when electroless plating is performed, the film thickness of the auxiliary elastic member tends to be non-uniform.

When an adhesive layer made of a metal material selected from Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, or Pt is formed on the conductive member as in the present invention, Ni or It becomes easy to uniformly form the auxiliary elastic member made of Ni-X (where X is one or more of P, W, Mn, Ti, and Be).
The thickness of the adhesion layer is preferably formed in the range of 0.01 μm to 0.1 μm.

  As described above, according to the production method of the present invention, it is possible to produce a spiral contact that is fine and is excellent in conductivity and spring property by a simple method.

  1 is a perspective view showing an inspection apparatus used in a test for confirming the operation of an electronic component, and FIG. 2 is a sectional view taken along line 2-2 of FIG. is there.

  As shown in FIG. 1, the inspection apparatus 10 includes a base 11 and a lid 12 that is rotatably supported via a hinge 13 provided on one edge of the base 11. ing. The base 11 and the lid 12 are formed of an insulating resin material or the like, and a loading region (base) 11A that is concave in the Z2 direction is formed at the center of the base 11. An electronic component 1 such as a semiconductor can be mounted in the loading area 11A. A locked portion 14 is formed on the other edge of the base 11.

  As shown in FIG. 2, this inspection apparatus 10 is an inspection object in which a large number of spherical contacts (external connection parts) 1a are arranged in a matrix (lattice or grid) on the lower surface of the electronic component 1. It is what.

  As shown in FIG. 2, the loading area (base) 11A has a predetermined diameter, and a plurality of recesses (through holes) 11a penetrating from the front surface of the loading area 11A to the back surface of the base 11 are provided in the electronic area. It is provided corresponding to the spherical contact 1 a of the component 1.

  A plurality of spiral contacts 20 in which the contacts are formed in a spiral shape are provided on the upper surface of the recess 11a (the surface of the loading region 11A).

  FIG. 3 is a perspective view of the spiral contact 20. As shown in FIG. 3, a plurality of the spiral contacts 20 are formed on the base 11 with predetermined intervals in the X direction and the Y direction shown in the figure.

  Each spiral contact 20 has a base 21 fixed to the edge of the upper open end of the recess 11a like the spiral contact 20 shown in the upper left in FIG. A winding start end 22 is provided on the base 21 side. A winding end 23 extending spirally from the winding start end 22 is positioned at the center of the recess 11a.

  A conductive portion (not shown) is formed on the inner wall surface of the concave portion 11a, and the upper end of the conductive portion and the base portion 21 of the spiral contactor 20 are connected by a conductive adhesive or the like. The opening end below the recess 11a is closed by a connection terminal 18 connected to the conducting portion.

  As shown in FIG. 2, a printed board 30 having a plurality of wiring patterns and other circuit components is provided below the base 11, and the base 11 is fixed on the printed board 30. . The surface of the printed circuit board 30 is provided with a counter electrode 31 facing the connection terminal 18 provided on the bottom surface of the base 11, and the connection terminals 18 are in contact with the counter electrodes 31, respectively. The electronic component 1 and the printed circuit board 30 are electrically connected via the inspection apparatus 10.

  On the other hand, at the center position of the inner surface of the lid 12 of the inspection apparatus 10, a convex pressing portion 12a that presses the electronic component 1 downward in the figure is provided so as to face the loading area 11A. Further, a lock portion 15 is formed at a position on the opposite side to the hinge portion 13.

  Between the inner surface of the lid body 12 and the pressing portion 12a, a biasing member made of a coil spring or the like that biases the pressing portion 12a away from the inner surface of the lid body 12 is provided (not shown). . Accordingly, when the electronic component 1 is mounted in the recess 11a and the lid 12 is closed and locked, the electronic component 1 can be elastically pressed in the direction approaching the surface of the loading region 11A (Z2 direction). ing.

  The size of the loading area 11A of the base 11 is substantially the same as the outer shape of the electronic component 1, and when the electronic component 1 is mounted on the loading area 11A and the lid 12 is locked, the electronic component 1 side Each spherical contact 1a and each spiral contact 20 on the inspection apparatus 10 side can be positioned accurately in correspondence with each other.

  When the lock part 15 of the lid 12 is locked to the locked part 14 of the base 11, the electronic component 1 is pressed downward in the figure by the pressing part 12 a, so that each spherical contact 1 a becomes each spiral contact 20. Is pushed downward in the recess 11a (downward in the figure). At the same time, the outer shape of the spiral contact 20 is deformed so as to be expanded from the winding end 23 toward the winding start end 22 (outward from the center of the spiral), and is wound so as to embrace the outer surface of the spherical contact 1a. Each spherical contact 1a and each spiral contact 20 are connected.

  When the contact piece 20a for each turn constituting the spiral contactor 20 is cut in the film thickness direction from the line 4 which is a direction parallel to the width direction, and the cut surface is viewed from the arrow direction, the cut surface is It is as shown in FIG.

  In FIG. 4A, the auxiliary elastic member 41 is formed on the conductive member 40 in an overlapping manner. The conductive member 40 is made of a material having a specific resistance lower than that of the auxiliary elastic member 41, and the auxiliary elastic member 41 is made of a material having a yield point and an elastic coefficient higher than those of the conductive member 40.

  As shown in FIG. 4A, by forming the conductive member 40 and the auxiliary elastic member 41 so as to overlap each other, good conductivity of the spiral contactor 20 is secured by the conductive member 40, and the spiral contactor is good. The spring property is secured by the auxiliary elastic member 41.

  In FIG. 4A, the conductive member 40 may be formed on the auxiliary elastic member 41 in an overlapping manner.

  4A, both of the conductive member 40 and the auxiliary elastic member 41 may be formed by plating, or the conductive member 40 on the lower layer side (or if the lower layer side is the auxiliary elastic member 41). The auxiliary elastic member 41) is formed of metal foil, and the auxiliary elastic member 41 on the upper layer side (or the conductive member 40 if the upper layer side is the conductive member 40) is plated. There may be.

  In FIG. 4B, the conductive member 40, the auxiliary elastic member 41, and the coating member 42 are laminated in this order from the bottom. Here, the coating member 42 is provided to improve hardness and wear resistance. The coating member 42 is preferably formed of a material having a specific resistance lower than that of the elastic member 41 and has a function of reducing contact resistance with a contact of an electronic component.

  4C, the upper surface, the lower surface, and both side surfaces of the conductive member 40 are completely surrounded by the auxiliary elastic member 41. Thus, it is preferable that the conductive member 40 be completely surrounded by the auxiliary elastic member 41 because the spring property of the spiral contact 20 can be improved more appropriately.

  Alternatively, a structure in which the upper surface, the lower surface, and both side surfaces of the auxiliary elastic member 41 are completely surrounded by the conductive member 40 may be used. In such a case, particularly when used in a high frequency band, eddy current loss can be more effectively reduced, which is preferable. In this way, in order to completely cover the periphery of the metal member serving as the shaft, the conductive member 40 or the auxiliary elastic member 41 is formed by using, for example, an electroless plating method. What is necessary is just to form plating.

  4D is an application example of FIG. 4C. For example, the upper surface, the lower surface, and both side surfaces of the conductive member 40 are completely surrounded by the auxiliary elastic member 41, and the surface of the auxiliary elastic member 41 is covered with the coating member 42. It is the composition which covers.

  In FIG. 4E, an adhesion layer 70 is formed between the auxiliary elastic member 41 and the conductive member 40.

  In the contact piece shown in FIG. 4E, the conductive member 40 is made of Cu alloy, and the auxiliary elastic member 41 is made of Ni or Ni-X (where X is P, W, Mn, Ti, Any one or more of Be). The adhesion layer 70 is made of a metal material selected from Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, or Pt.

  Directly plating Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be) on the surface of a conductive material made of a Cu alloy in which a plurality of elements are mixed, especially When electroless plating is performed, the film thickness of the auxiliary elastic member 41 tends to be non-uniform.

  As shown in FIG. 4E, when the adhesion layer 70 exists between the conductive member 40 and the auxiliary elastic member 41, Ni or Ni-X (where X is P, W, Mn, It becomes easy to uniformly form the auxiliary elastic member 41 formed of Ti or Be). As a result, the spring physical property of each spiral contact can be stabilized. Also, the plating adhesion of the auxiliary elastic member 41 is improved. The auxiliary elastic member 41 has a film thickness of 0.5 μm to 10 μm.

The thickness of the adhesion layer 70 is preferably in the range of 0.01 μm to 0.1 μm.
The Cu alloy forming the conductive member 40 is preferably a Corson alloy having Cu, Si, and Ni.

  A Corson alloy containing Cu, Si, and Ni is a material that can achieve both high electrical conductivity and high strength, and is suitable as a material for spiral contacts.

  In this embodiment, a Corson alloy whose composition formula is represented by Cu—Ni—Si—Mg is used. The composition ratio is 96.2 mass% for Cu, 3.0 mass% for Ni, 0.65 mass% for Si, and 0.15 mass% for Mg.

A Corson alloy having this composition ratio has an electrical conductivity at 20 ° C. of 42 to 53% IACS, a tensile strength of 607 to 840 N / mm ² , a specific resistance at 20 ° C. of 38.3 nΩ · m, and a thermal conductivity of 180 W / mK. The thermal expansion coefficient is 17.6 × 10 ⁻⁶ / K (20 ° C. to 300 ° C.), the elastic coefficient is 131 kN / mm ² , and the density is 8.82 g / cm ³ .

  The auxiliary elastic member 41 may have a structure in which an upper surface, a lower surface, and both side surfaces of the auxiliary elastic member 41 are completely surrounded by the conductive member 40 with an adhesion layer 70 interposed therebetween.

  4F is an application example of FIG. 4E. For example, the auxiliary elastic member 41 completely surrounds the upper surface, the lower surface, and both side surfaces of the conductive member 40 with the adhesion layer 70 interposed therebetween. The surface is covered with the coating member 42. The film member has a film thickness in the range of 0.1 μm to 3 μm.

  In the present invention, the conductive member 40 is preferably selected from Cu, Au, Ag, Pd, or a Cu alloy.

The auxiliary elastic member 41 is preferably selected from Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be).
The coating member 42 is preferably selected from Au, Ag, Pd, and Sn.

In particular, when the auxiliary elastic member 41 is formed using NiP, the composition is preferably Ni _100-x P _x (where x is at% and 10 ≦ x ≦ 30).

  By setting the phosphorus concentration in the NiP (nickel phosphorus) alloy used for the auxiliary elastic member 41 to 10 at% or more, nickel crystal precipitation can be suppressed and the spring physical properties (mechanical strength) can be improved. Moreover, it is possible to suppress the plating stress (particularly compressive stress) and suppress the occurrence of plating defects.

  Further, when the phosphorus concentration in the NiP (nickel phosphorus) alloy is higher than 30 at%, various intermetallic compounds of Ni and P are precipitated. Since these intermetallic compounds are very hard and brittle, the spring properties deteriorate.

  When the phosphorus concentration in the NiP (nickel phosphorus) alloy is 10 at% or more and 30 at% or less, the desired spring physical properties can be obtained while maintaining ductility due to the presence of amorphous. As a specific example of the desired spring physical property, there is a standard of a tensile strength of 1000 MPa or more.

  FIG. 5 is a modification of the inspection apparatus 10 shown in FIG. 2, and is a partial cross-sectional view showing an enlarged part of the base 11 of the inspection apparatus 10. In FIG. 5, members denoted by the same reference numerals as in FIGS. 1 to 3 are the same members as in FIGS. 1 to 3.

  In FIG. 5, a plurality of spiral contacts 20 are provided above and below the base 11. As shown in FIG. 5, the base 11 is provided with a recess 11a at a position where the spiral contact 20 faces, and a conduction portion 17 is provided on the inner peripheral wall of the recess 11a. The conductive portion 17 is formed by plating with Cu or the like, for example.

  As shown in FIG. 5, the bases 11 are separated from each other in the vertical direction, and the bases 11 are bonded and fixed by an anisotropic conductive adhesive 19 applied to the opposing surfaces.

  As shown in FIG. 5, the base portions 21 of the spiral contacts 20 provided at predetermined intervals in the plane direction are connected to each other by a guide frame 45 formed of polyimide or the like, and the base portion 21 and the guide frame 45 are connected to the base plate. The base 11 is bonded and fixed by an anisotropic conductive adhesive 46 applied to the surface of the base 11.

  A method for manufacturing the spiral contact 20 according to the present invention will be mainly described with reference to FIGS.

  Reference numeral 50 shown in FIG. 6A is a substrate. The substrate 50 may be insulative, but it is preferable that the substrate 50 be conductive because a plating underlayer is not required in a later step. For example, the substrate 50 is made of Cu and has a thickness of 70 μm.

  In the step shown in FIG. 6B, a resist 51 is applied on the substrate 50, and further exposed and developed into the shape of the spiral contact 20, thereby forming a pattern 51 a of the spiral contact 20 on the resist 51. 6B shows a plan view of the pattern 51a of the spiral contact 20 formed on the resist 51 on the left side shown in FIG. 6B. In the left diagram of FIG. 6B, the hatched portion is the portion that remains as the resist 51 after exposure and development, and the white portion is the pattern 51a formed by removing the resist 51 by exposure and development. After the pattern 51a is formed on the resist 51 by exposure and development, the resist 51 is thermally cured by heat treatment.

  In FIG. 6C, the conductive member 40, the auxiliary elastic member 41, and the coating member 42 are plated in this order on the surface of the substrate 50 exposed in the pattern 51a. The plating method is a general electrolytic plating method. Thereby, the spiral contactor 20 having the cross-sectional shape shown in FIG. 4B is completed. Each time each member is formed by plating, the substrate is washed with water to remove stains on the plating surface, and then the process proceeds to the plating process for the next member.

  For example, in FIG. 6C, a two-layer structure of the conductive member 40 and the auxiliary elastic member 41 may be formed on the substrate 50 by plating. In this case, the spiral contact 20 having the cross-sectional shape shown in FIG. 4A is completed.

  6D, the resist 51 is removed. After removing the resist 51, a water washing process and a drying process are performed.

  Next, in the step of FIG. 6E, a guide frame 45 made of an insulating material such as polyimide, for example, has a hole 45a provided in the guide frame 45 just facing each spiral contact 20, and the hole 45a After positioning the peripheral edge portion 45 a 1 so as to overlap the base portion 21 of each spiral contact 20, the guide frame 45 is pasted on the base portion 21 and the substrate 50 between the base portions 21. The left figure of FIG. 6E is a planar shape of the guide frame 45.

  As shown in the left diagram of FIG. 6E, the shaded portion is a portion of the guide frame 45, and the guide frame 45 is provided with a hole 45 a at a position facing each spiral contact 20.

  For example, an epoxy-based thermosetting resin is applied to the lower surface of the guide frame 45, and after positioning and bonding the guide frame 45 as described above, a heat treatment is performed to thermoset the thermosetting resin, The guide frame 45 is bonded and fixed on the base 21 and the substrate 50 between the bases 21.

  Next, in the step of FIG. 6F, the substrate 50 is removed by using a method such as etching. Then, a water washing process and a drying process are performed.

  As shown in FIG. 6E, since the bases 21 of the adjacent spiral contacts 20 are connected by the guide frame 45, the spiral contacts 20 are separated even if the substrate 50 is removed in the step of FIG. 6F. There is nothing.

Next, the manufacturing method shown in FIG. 7 will be described below.
In FIG. 7A, the conductive member 40 according to the present invention formed of a metal foil is attached on a substrate 60 formed of an insulating resin such as polyimide. The metal foil may be the auxiliary elastic member 41 in the present invention. The substrate 60 may not be an insulating member, but if the substrate 60 formed of an insulating resin or the like is used, the substrate 60 can be used as the guide frame 45 described in the step of FIG. preferable.

  In the step of FIG. 7B, a resist 61 is applied on the conductive member 40, and the resist 61 is exposed and developed to leave a portion of the resist 61 that has the shape of the spiral contact 20, and the resist 61 in other portions. Remove. That is, the pattern 61a formed on the resist 61 is opposite to the resist 51 described in FIG. 6B, and the hatched portion in the left diagram of FIG. 6B is the portion of the pattern 61a formed on the resist 61. A portion is left as the resist 61.

  Next, when the conductive member 40a exposed in the pattern 61a is removed by, for example, etching, the conductive member 40 is left on the substrate 60 as the shape of the spiral contact 20.

  Next, in the step of FIG. 7C, the portion of the substrate 60a provided between the spiral contacts 20 that is exactly the base 21 is left, and the other portions of the substrate 60 are removed using, for example, a laser (indicated by arrows). Means a laser).

  As shown in FIG. 7D, since the bases 21 of the spiral contacts 20 are connected by the substrate 60a, the spiral contacts 20 are not separated, and the substrate 60a is connected to the guide frame 45 described in FIG. 6E. It has the same function.

  In the step of FIG. 7E, the auxiliary elastic member 41 is plated around the contact piece 20a and the base 21 for each turn of each spiral contact using an electroless plating method. The electroless plating method, also called chemical plating method, is a method in which the reducing substance of the plating solution reacts with metal ions, and only the chemical reaction is used to deposit and deposit a metal salt on the surface of the object to be plated. is there.

  If this method is used, the periphery of the conductive member 40 can be appropriately covered with the auxiliary elastic member 41. 7A, when the spiral contact 20 is formed using the metal foil of the auxiliary elastic member 41, the conductive member 40 is plated around the auxiliary elastic member 41 by electroless plating in FIG. 7E. To do.

Next, the manufacturing method shown in FIG. 8 will be described below.
In FIG. 8A, the conductive member 40 of the present invention formed of a metal foil is attached on a substrate 60 formed of an insulating resin such as polyimide.
The conductive member 40 is preferably a Corson alloy having Cu, Si, and Ni.

  A Corson alloy containing Cu, Si, and Ni is a material that can achieve both high electrical conductivity and high strength, and is suitable as a material for spiral contacts.

  In this embodiment, a Corson alloy whose composition formula is represented by Cu—Ni—Si—Mg is used. The composition ratio is 96.2 mass% for Cu, 3.0 mass% for Ni, 0.65 mass% for Si, and 0.15 mass% for Mg.

A Corson alloy having this composition ratio has an electrical conductivity at 20 ° C. of 42 to 53% IACS, a tensile strength of 607 to 840 N / mm ² , a specific resistance at 20 ° C. of 38.3 nΩ · m, and a thermal conductivity of 180 W / mK. The thermal expansion coefficient is 17.6 × 10 ⁻⁶ / K (20 ° C. to 300 ° C.), the elastic coefficient is 131 kN / mm ² , and the density is 8.82 g / cm ³ .

  The substrate 60 may not be an insulating member. However, if the substrate 60 formed of an insulating resin or the like is used, the substrate 60 can be used as the guide frame 45 described in the step of FIG. preferable.

  In the step of FIG. 8B, a resist 61 is applied on the conductive member 40, and the resist 61 is exposed and developed to leave a portion of the resist 61 that has the shape of the spiral contact 20 and the other portions of the resist 61. Remove. That is, the pattern 61a formed on the resist 61 is opposite to the resist 51 described in FIG. 6B, and the hatched portion in the left diagram of FIG. 6B is the portion of the pattern 61a formed on the resist 61. A portion is left as the resist 61.

  Next, when the conductive member 40a exposed in the pattern 61a is removed by, for example, etching, the conductive member 40 is left on the substrate 60 as the shape of the spiral contact 20.

  Next, in the step of FIG. 8C, the portion of the substrate 60a provided between the spiral contacts 20 that is exactly the base 21 is left, and the other portions of the substrate 60 are removed using, for example, a laser (indicated by arrows). Means a laser).

  As shown in FIG. 8D, since the bases 21 of the spiral contacts 20 are connected by the substrate 60a, the spiral contacts 20 are not separated, and the substrate 60a is connected to the guide frame 45 described in FIG. 6E. It has the same function.

  In the step of FIG. 8E, the adhesion layer 70 is formed around the contact piece 20a and the base portion 21 for each turn of each spiral contact. Since the plating base layer for the electrolytic plating method cannot be formed around the spiral contact 20, it is necessary to use the electroless plating method for forming the adhesion layer 70. The electroless plating method, also called chemical plating method, is a method in which the reducing substance of the plating solution reacts with metal ions, and only the chemical reaction is used to deposit and deposit a metal salt on the surface of the object to be plated. is there.

The plating solution composition for electroless plating is shown below.
NiSO ₄ · H ₂ 0 0.1 mol / l
NaH ₂ PO ₂ .6H ₂ O 0.2 mol / l
Citric acid 0.5 mol / l
(NH ₄ ) ₂ SO ₄ 0.5 mol / l

  Note that Pd that acts as a catalyst for the electroless plating reduction reaction is adhered to the periphery of the contact piece 20a and the base 21 before the adhesion layer 70 is formed by plating. The adhesion of Pd is performed by immersing the periphery of the contact piece 20a and the base 21 in an aqueous palladium chloride solution or an aqueous palladium sulfate solution to precipitate Pd. It is preferable to perform a pretreatment such as a degreasing treatment or a surface treatment by etching before the Pd deposition step.

  The adhesion layer 70 is formed of a metal material selected from Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, or Pt. The thickness of the adhesion layer 70 is preferably in the range of 0.01 μm to 0.1 μm.

  In the step of FIG. 8F, the auxiliary elastic member 41 is plated on the adhesion layer 70 using an electroless plating method. The auxiliary elastic member 41 has a film thickness of 0.5 μm to 10 μm.

  When a conductive member 40 is formed using a Cu alloy containing elements Si, Ni, etc. other than Cu, such as a Corson alloy, element Si, Ni, etc. appear on the surface of the conductive member 40, and the conductive member 40 The composition distribution on the surface becomes non-uniform. When the surface of the non-uniform conductive member 40 is directly plated with Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be), in particular, electroless plating, It becomes easy to form the film thickness of the auxiliary elastic member 41 non-uniformly.

  As shown in FIG. 8F, when the auxiliary elastic member 41 is plated on the adhesion layer 70, Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be). ), It is easy to form the auxiliary elastic member 41 with a uniform film thickness. As a result, the spring physical property of each spiral contact can be stabilized. Also, the plating adhesion of the auxiliary elastic member 41 is improved.

  If this method is used, the periphery of the conductive member 40 can be appropriately covered with the auxiliary elastic member 41. 8A, when the spiral contact 20 is formed using the metal foil of the auxiliary elastic member 41, the conductive member 40 is formed after the adhesion layer 70 is formed on the surface of the auxiliary elastic member 41 by the electroless plating method. Is plated on the adhesion layer 70 by an electroless plating method.

In particular, when the auxiliary elastic member 41 is formed using NiP, the composition is preferably Ni _100-x P _x (where x is at% and 10 ≦ x ≦ 30).

  By setting the phosphorus concentration in the NiP (nickel phosphorus) alloy used for the auxiliary elastic member 41 to 10 at% or more, nickel crystal precipitation can be suppressed and the spring physical properties (mechanical strength) can be improved. Moreover, it is possible to suppress the plating stress (particularly compressive stress) and suppress the occurrence of plating defects.

  Further, when the phosphorus concentration in the NiP (nickel phosphorus) alloy is higher than 30 at%, various intermetallic compounds of Ni and P are precipitated. Since these intermetallic compounds are very hard and brittle, the spring properties deteriorate.

  When the phosphorus concentration in the NiP (nickel phosphorus) alloy is 10 at% or more and 30 at% or less, the desired spring physical properties can be obtained while maintaining ductility due to the presence of amorphous. As a specific example of the desired spring physical property, there is a standard of tensile strength of 1000 MPa or more.

  9C is a process of FIG. 6C. For example, the conductive member 40 is formed by electrolytic plating, and after the processes of FIGS. 6D to 6F, the conductive member 40 is formed by using the above-described electroless plating. This is a case where the adhesion layer 70 and the auxiliary elastic member 41 are formed around the periphery by plating.

  Note that FIG. 10 is a process of FIG. 6C in which, for example, the conductive member 40 is formed by electrolytic plating, and after the processes of FIGS. 6D to 6F, the conductive member 40 is formed using the above-described electroless plating method. This is a case where the auxiliary elastic member 41 is plated around.

  In the present invention, the spiral contact 20 is formed using the manufacturing method as described above, and then the step of FIG. 11 is performed. The base 11 for joining the spiral contact 20 used in the step of FIG. 11 is the same as that described in FIG.

  In the step of FIG. 11A, the concave portion 11a is formed just at the position facing the spiral contact 20, and the inner wall surface 11a1 of the concave portion 11a is plated, for example, and the base 21 of the spiral contact 20 faces the concave portion. The base 11 on which the anisotropic conductive adhesive 46 is applied between the peripheral edge above 11 a and the adjacent peripheral edge is used, and the base 21 of the spiral contact 20 is connected to the anisotropic conductive material on the base 11. Adhesion is fixed through an adhesive 46.

  In the step of FIG. 11B, the protrusion adjusting member 70 is passed through the recess 11a from the bottom, and the contact piece 20a for each turn of each spiral contact 20 is protruded upward. At this time, the contact piece 20a on the inner side is adjusted so as to protrude above the contact piece 20a on the outer side (note that the dotted lines shown in FIG. 11B and FIG. Is lined up along the line).

  When two bases 11 that have been subjected to the process of FIG. 11B are made, and the bottom surfaces 11b of the bases 11 are bonded and fixed together using the anisotropic conductive adhesive 19 in the process of FIG. 11C, the structure shown in FIG. The connecting device is completed.

  If the manufacturing method of the spiral contactor 20 in the present invention is used, the spiral contactor 20 excellent in conductivity and spring property can be manufactured in a very simple method even when the connecting device is downsized.

The perspective view which shows the test | inspection apparatus used for the test for confirming operation | movement of an electronic component, 1 is a cross-sectional view taken along line 2-2 of FIG. An enlarged perspective view showing the shape of the spiral contact in the present invention, 4A, 4B, and 4C are cross-sectional views when the contact piece for each turn constituting the spiral contact in the present invention is cut in the film thickness direction from the direction parallel to the width direction, Partial sectional view showing a structure in which spiral contacts are provided on the upper and lower surfaces of the base, 6A to 6E are process diagrams for illustrating a first manufacturing method according to the present invention, 7A to 7E are process diagrams for showing a second manufacturing method according to the present invention, 8A to 8F are process diagrams for showing a third manufacturing method according to the present invention, FIG. 6F is a process diagram in the case where the adhesion layer and the auxiliary elastic member are plated by the electroless plating method after the process of FIG. 6F; FIG. 6F is a process diagram when the auxiliary elastic member is plated by an electroless plating method after the process of FIG. 6F; 11A to 11C are process diagrams performed after the processes shown in FIGS. 6 to 8;

Explanation of symbols

1 Electronic component 1a Spherical contact (external connection)
DESCRIPTION OF SYMBOLS 10 Connection apparatus 11 Base 19, 46 Anisotropic conductive adhesive 20 Spiral contact 20a Contact piece 21 Base 22 Winding end 23 Winding end 40 Conductive member 41 Auxiliary elastic member 42 Coating member 45 Guide frame 50, 60 Substrate 51 61 resist

Claims (9)

In a manufacturing method of a connection device having a base and a plurality of spiral contacts formed in a spiral shape on the base, and a plurality of external connection portions of an electronic component contacting each of the spiral contacts,
The plurality of spiral contacts are plated by overlapping a conductive member and an auxiliary elastic member. At this time, the conductive member has a specific resistance lower than that of the auxiliary elastic member, and the auxiliary elastic member has the conductive material. A method for manufacturing a connection device, wherein a material having a yield point and an elastic modulus higher than that of the elastic member is selected.   2. The method of manufacturing a connection device according to claim 1, wherein either one of the conductive member and the auxiliary elastic member is formed in a spiral shape from a metal foil, and then the auxiliary elastic member or the conductive member is formed by plating.   2. The method of manufacturing a connection device according to claim 1, wherein after either one of the conductive member and the auxiliary elastic member is formed in a spiral shape, the periphery thereof is covered with an auxiliary elastic member or a conductive member by electroless plating.   4. The connection device according to claim 1, wherein the auxiliary elastic member is formed of Ni or Ni—X (where X is one or more of P, W, Mn, Ti, and Be). Production method. The method for manufacturing a connection device according to claim 4, wherein the auxiliary elastic member is formed of Ni _100-x P _x .
However, x is at% and is 10 ≦ x ≦ 30.   6. The method of manufacturing a connection device according to claim 1, wherein the conductive member is formed of Cu, Au, Ag, Pd, or a Cu alloy.   The manufacturing method of the connection apparatus of Claim 6 using the Corson alloy which has Cu, Si, and Ni as Cu alloy.   Between the conductive member formed of a Cu alloy and an auxiliary elastic layer formed of Ni or Ni-X (where X is one or more of P, W, Mn, Ti, and Be), The method for manufacturing a connection device according to claim 1, wherein an adhesion layer made of a metal material selected from Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, or Pt is formed.   The method for manufacturing a connection device according to claim 8, wherein the thickness of the adhesion layer is in the range of 0.01 μm to 0.1 μm.

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