JP2005328696A - Method for machining terminal of electric wire and method for manufacturing electric wire product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for machining a terminal of an electric wire for easily performing the terminal machining of a plurality of extra fine coaxial cables, and to provide a method for manufacturing a electric wire product. <P>SOLUTION: After outer coatings of ends of coaxial cables arranged in parallel are removed to expose an outer conductor, the exposed outer conductor is removed to expose an insulative substance. All of a plurality of the outer conductors arranged in parallel are coated with a solder layer as a whole, and the solder layer and the outer conductors are cut at a given position of the solder layer 4. The outer conductors on further tip side of the cutting position and the solder layer tip side from the cutting position are removed as a whole to expose the insulative substance. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for processing an end of an electric wire and a method for manufacturing an electric wire processed product, in particular, a liquid crystal display of a personal computer and an end of a micro coaxial cable used as a wiring material around a display of an ultrasonic diagnostic apparatus requiring high resolution. The present invention relates to a processing method and a manufacturing method of the processed product.

  Conventionally, an FPC (flexible printed circuit board) has been mainly used as a wiring material of an LCD (liquid crystal display) used for a notebook personal computer or the like. On the other hand, in recent years, high-speed image signals have been required to improve the image quality of LCDs, and in order to cope with this, a micro coaxial cable is applied to the wiring material around the display instead of FPC. It became so.

  In recent years, with the growing demand for notebook computers and portable computers, personal computers have been increasingly required to be smaller, thinner and lighter. Are beginning to be used.

  However, when connecting an ultra-fine coaxial cable to an FPC, PCB (printed circuit board) circuit, or connector terminal, a process is required to reliably drop all the outer conductors of the multi-core ultra-fine coaxial cable to ground. It was necessary to keep the center conductor at a predetermined pitch, and it was very time-consuming to carry out these operations.

  Accordingly, an object of the present invention is to provide an electric wire terminal processing method and an electric wire processed product manufacturing method capable of solving the above-described problems and easily performing the terminal processing of a plurality of ultrafine coaxial cables. .

  In order to achieve the above object, the method for processing an end of an electric wire according to the present invention removes the outer sheath on the end side of a plurality of coaxial cables arranged in parallel to expose the outer conductor, and then exposes the exposed outer conductor. In the terminal processing method of the electric wire to be removed, after covering the entire exposed outer conductor with a solder layer, the solder layer and the outer conductor are cut at a predetermined position of the solder layer, and the outer conductor on the tip side from the cutting position Are collectively removed.

  In addition, the method of manufacturing an electric wire processed product according to the present invention includes a step of removing the outer cover on the end side of a plurality of coaxial cables arranged in parallel to expose the outer conductor, and the exposed outer conductor as a whole with a solder layer. A step of covering, a step of cutting the solder layer and the outer conductor at a predetermined position of the solder layer, removing the outer conductor on the distal end side from the cutting position to expose the insulator, and the exposed insulator And a step of exposing the center conductor by shifting in a direction to peel off the insulator on the end portion side from a predetermined position after fixing at a predetermined pitch.

  In the above-described method for processing an end of an electric wire and a method for manufacturing an electric wire product according to the present invention, the cable is bent up and down at a predetermined position of the solder layer to cut the solder layer and the external conductor. Alternatively, a step of forming a processing groove in a direction orthogonal to the length direction of the cable is provided at a predetermined position of the solder layer, and the solder layer and the external portion are pulled or bent from the processing groove as a starting point. The conductor may be cut. In view of the good shape of the cut surface, it is preferable to cut by providing a processed groove.

  The processed groove may be formed by cutting the surface of the solder layer with a mechanical blade, or may be formed by melting and removing the solder in a portion irradiated with laser light by laser processing. In the case of laser processing, the solder between each line is removed together with the processing groove, and a slit (through hole) is formed in a perforation, so that it is easy to cut at the processing groove position by pulling or bending.

  Further, although the pitch of the insulating core is maintained by the solder layer remaining after the outer conductor is removed, it is preferable to fix the conductive plate on the solder layer by soldering or the like. As a result, even when the cut surfaces of the outer conductor and the solder layer are uneven, the conductive plate maintains the straightness of the end surface of the outer conductor processed portion, and positioning when mounting to the connector is facilitated.

  According to the present invention, it is possible to provide an ultrafine coaxial cable processed product as an internal wiring material that can cope with high image quality of an LCD.

  In addition, since the outer conductor can be removed at once by putting a processing groove in a predetermined position of the solder layer formed by soldering the outer conductor and then mechanically cutting the outer conductor at the processing groove and pulling it out, The processing of conductors is very simple and the productivity of processed products is excellent.

  In addition, since the ground bar is soldered after the external conductors are removed all at once, the straightness of the end face of the processed part is maintained, and when connecting to the connector, positioning is easy, so the connection workability is very good ing.

  In order to carry out the present invention easily and efficiently, the present inventors have made various studies, and as a result, have found that the efficiency of the terminal processing work for a plurality of coaxial cables can be improved by the following procedure. It was.

  That is, the method for processing the end of the electric wire and the method for manufacturing the processed electric wire according to the present invention are as follows.

  (1) Arrange a plurality of coaxial cables at a predetermined pitch, and fix the cable ends with adhesive tape or the like.

  (2) Cut the cable to a predetermined length.

  (3) Irradiate a laser beam to the portion fixed with the adhesive tape to make a slit, pull the outer jacket (jacket) to peel it off, and expose the outer conductor (horizontal winding shield wire).

  (4) The outer conductor is immersed in a solder bath and soldered together, and the entire conductor portion is covered with a solder layer and fixed.

  (5) A processed groove having a perforated slit is formed in the solder layer by laser light.

  (6) The external conductor is cut by bending the cable up and down using the processing groove as a fulcrum.

  (7) Mechanically pulling the batch soldering portion of the outer conductor on the end side to remove the outer conductor together with the solder layer to expose the insulator.

  (8) Solder-plated metal conductive plate is soldered on the remaining solder layer.

  (9) A plastic tape is stuck on the exposed insulator, and each insulating core is fixed at an equal pitch.

  (10) A slit is formed by irradiating a laser beam at an intermediate position between the conductive plate and the plastic tape.

  (11) The insulator on the end side is peeled off and shifted to expose the inner conductor.

  (12) Cut off the insulator on the end side from the plastic tape to obtain a wire processed product.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

First, 11 micro coaxial cables 10 are arranged in parallel at a pitch of 0.5 mm, and the adhesive tape 1 is attached from above and below to fix the micro coaxial cable 10. The obtained tape-like cable is cut into a length of 150 mm. Next, a slit is formed by irradiating the CO ₂ laser beam at a position 15 mm from both ends, and the adhesive tape 1 and the outer cover (jacket) 2 are shifted 20 mm in a direction in which they are peeled together to expose the external conductor 3 (see FIG. 1).

  The micro coaxial cable 10 to be used has a cross section as shown in FIG. 10, and an inner conductor 9 formed by twisting seven tin-plated copper alloy wires having a diameter of 0.03 mm is made of 0.08 mm thick fluorine. An outer conductor (horizontal winding shield) 3 covered with a tin-plated annealed copper wire having a diameter of 0.032 mm is provided on the insulating layer 6 made of a base resin (PFA), and polyester as an outer jacket (jacket) 2 The outer diameter is 0.34 mm by overlappingly winding the tape.

  Next, the entire exposed outer conductor (20 mm) is immersed in a solder bath, and the outer conductor 3 is soldered together to form the solder layer 4 (FIG. 2).

  Next, a processing groove 5 is formed by irradiating the central portion of the solder layer 4 completely covering the outer conductor 3 with laser light (FIG. 3). At this time, a YAG laser was used for processing. The laser processing conditions were as follows: the scan speed was 5 to 50 mm / s, the Q switch frequency was 1 to 20 kHz, and the lamp current value was 5 to 15 A. In the processed groove 5, the outer conductor 3 is exposed where the outer conductor 3 exists, and slits (through holes) are formed in portions between the wire cores where the outer conductor 3 does not exist.

  Next, the cable is bent in the vertical direction with the processed groove 5 as a fulcrum, and the outer conductor 3 is cut. Thereafter, the soldered outer conductor 3 is pulled and removed in a lump to expose the insulating layer 6 (FIG. 4).

  The cut surfaces of the outer conductor 3 and the solder layer 4 are cut by bending, so that irregularities (burrs) are generated, but the outer conductor 3 is placed on the solder layer 4 so that the irregularities are not visible. Are sandwiched between two conductive plates 7 made of solder-plated rectangular copper plates having a width of 1.5 mm and a thickness of 0.15 mm, and are fixed by soldering (FIG. 5). Thereby, the linearity of the end surface of the outer conductor processed portion is maintained, and positioning when mounting to the connector is facilitated.

  Next, the insulating film 8 is affixed on the insulator 6 with the pitch of each insulating core maintained, and the insulating core is fixed (FIG. 6).

Next, a slit is formed in the insulator 6 between the insulating film 8 and the conductive plate 7 by laser light (CO ₂ laser), and then the insulating film 8 is pulled to shift the insulator 6 toward the end side so that the inside is cut. The conductor 9 is exposed (FIG. 7).

  Finally, the tip portion of the insulating film 8 with the fixed pitch of the insulator 6 was cut to complete a wire processed product (FIG. 8).

  FIG. 9 is a cross-sectional view taken along the line AA in FIG. 8. Since the outer conductor 3 is soldered together with the solder layer 4, the pitch of the inner conductor 9 is maintained accurately without being disturbed during the manufacturing process. Yes.

In each of the laser processing steps in the above-described embodiment, it has been confirmed that the internal conductor 9 and the insulator 6 that is the covering material thereof are not affected by heat from the laser beam. Further, the laser to be used is not limited to the embodiment, and various lasers such as a YAG laser, a CO ₂ laser, and an excimer laser can be used. Also, regarding the processing conditions, various commercially available lasers have different specifications, setting parameters for processing, and the like, and are not limited to the processing condition ranges described in the embodiments of the present invention.

  The formation of the processing groove on the solder layer 4 is not limited to laser processing, and a mechanical blade sandwiched from above and below may be pressed against the solder layer 4 to form.

  Further, the number of the conductive plates 7 may be one, or may be omitted when the linearity of the end face of the outer conductor processed portion is not particularly required.

It is explanatory drawing which shows the process of exposing an external conductor in the Example of this invention. It is explanatory drawing which shows the process of lump soldering the exposed external conductor in the Example of this invention. It is explanatory drawing which shows the process of forming a process groove | channel in the external conductor soldered collectively in the Example of this invention. It is explanatory drawing which shows the process of exposing an insulating layer in the Example of this invention. It is explanatory drawing which shows the process of soldering a conductive plate in the Example of this invention. It is explanatory drawing which shows the process of fixing the insulation core by heat-seal | fusing the plastic tape in the Example of this invention. It is explanatory drawing which shows the process of exposing a center conductor in the Example of this invention. It is explanatory drawing which shows the completed electric wire processed goods in the Example of this invention. It is AA sectional drawing of FIG. It is sectional drawing of a microfine coaxial cable.

Explanation of symbols

1 Adhesive tape 2 Outer skin (jacket)
3 Outer conductor (horizontal winding shield layer)
4 Solder Layer 5 Processed Groove 6 Insulating Layer 7 Conductive Plate 8 Insulating Film 9 Inner Conductor 10 Micro Coaxial Cable

Claims (14)

In the method of processing an end of an electric wire in which the outer conductor is exposed by removing the outer sheath on the end side of a plurality of coaxial cables arranged in parallel, and then the exposed outer conductor is removed to expose the insulator. After covering the whole of the plurality of arranged outer conductors collectively with a solder layer, the solder layer and the outer conductor are cut at a predetermined position of the solder layer, and the outer conductor and the cutting end on the tip side from the cutting position are cut. A method of processing an end of an electric wire, wherein the insulator is exposed by removing the solder layer on the tip side from the position in a lump. A processed groove is formed on the upper surface of the solder layer in a direction orthogonal to the length direction of the cable, and the processed groove is a perforated slit having a portion where an external conductor is exposed and a through hole. The method for processing an end of an electric wire according to claim 1. 3. The method of processing an end of an electric wire according to claim 2, wherein the cable is bent up and down with the processing groove as a starting point to cut the solder layer and the outer conductor. 4. The method of processing an end of an electric wire according to claim 2, wherein the solder layer and the outer conductor are cut by pulling or bending starting from the processed groove. 5. 5. The method of processing an end of an electric wire according to claim 2, wherein the processing groove is formed by melting and removing the solder in a portion irradiated with laser light by laser processing. 6. The method for processing an end of an electric wire according to claim 5, wherein the laser processing is performed within a condition range of a scan speed of 5 to 50 mm / s, a Q switch frequency of 1 to 20 kHz, and a lamp current value of 5 to 15A. The method for processing an end of an electric wire according to any one of claims 1 to 6, wherein a conductive plate is fixed on the solder layer remaining without being removed. Removing the outer sheath of the end portions of the plurality of coaxial cables arranged in parallel to expose the outer conductor, covering the whole of the plurality of outer conductors arranged in parallel with a solder layer, and the solder Cutting the solder layer and the outer conductor at a predetermined position of the layer, and removing the outer conductor on the tip side from the cutting position and the solder layer on the tip side from the cutting position to expose the insulator; and And a step of exposing the central conductor by fixing the exposed insulator at a predetermined pitch and then shifting the insulator on the end side from the predetermined position in a peeling direction. A processed groove is formed on the upper surface of the solder layer in a direction orthogonal to the length direction of the cable, and the processed groove is a perforated slit having a portion where an external conductor is exposed and a through hole. The manufacturing method of the electric wire processed product of Claim 8 characterized by the above-mentioned. The method of manufacturing an electric wire processed product according to claim 9, wherein the cable is bent up and down with the processed groove as a starting point to cut the solder layer and the outer conductor. The method for manufacturing a processed wire product according to claim 9 or 10, wherein the solder layer and the outer conductor are cut by pulling or bending starting from the processed groove. 12. The electric wire according to claim 9, wherein in the step of forming the processed groove, the processed groove is formed by melting and removing the solder in a portion irradiated with laser light by laser processing. Manufacturing method of processed products. The method of manufacturing a wire processed product according to claim 12, wherein the laser processing is performed within a condition range of a scan speed of 5 to 50 mm / s, a Q switch frequency of 1 to 20 kHz, and a lamp current value of 5 to 15A. The electric wire according to any one of claims 8 to 13, further comprising a step of fixing a conductive plate on the solder layer remaining without being removed after the step of exposing the insulator. Manufacturing method of processed products.

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