JPS63165091A - Continuous machining method and device for hole - Google Patents

Abstract

PURPOSE:To continuously bore many holes at a high speed without the mechanical contact machining by providing a laser oscillator to oscillate pulsatively consisting of a rotating polygon mirror, a ftheta lens and other optical elements and using the scanning of laser light oscillated pulsatively and the relative movement of a sheet to be machined. CONSTITUTION:When the sheet 1 to be machined is reeled off and attains the hole machining position 4 by feed rolls 3 which are driven to rotate by an intermittent driving device to repeat rotation-stoppage at a high speed, the laser light 16 having the peak power such as the pulse oscillation, etc., is projected on the sheet 1 to be machined at the hole machining position 4 from a continuous machining device 10. The continuous machining device 10 is constituted of the laser oscillator 11, a collimator 12, a prism 13, the rotating polygon mirror 14 and the ftheta lens 15 and the laser light 16 repeats to scan one direction from an optional edge of the sheet 1 to be machined to a different edge and one hole per pulse is machined smoothly by adjusting the scanning speed of the laser light 16 and pulse intervals of the laser light 16.

Description

[Detailed Description of the Invention] Industrial Application Field: The present invention relates to a means for performing hole drilling (local area removal) at high speed and continuously using repetitive peak power such as laser pulse oscillation. 0 Background of the Invention/Prior Art: For example, in daily life goods, office supplies, etc., continuous holes are pre-drilled for the convenience of dividing the goods into appropriate lengths or sizes. Drilling processes such as loose perforations are widely used regardless of the field of the product.

Conventionally, such continuous hole machining has been performed by a mechanical method using a blade.

Problems to be Solved by the Invention: In this contact machining using a cutter, the portion where the hole has been melted is discharged as scrap, which requires separate θ treatment. Furthermore, depending on the material of the sheet to be drilled or the hole to be processed, the management of the cutter can be complicated, such as the adaptability of the cutter and the sheet, or when changing the size of the hole or expanding or contracting the gap between the holes. The most difficult thing to do was to respond immediately to requests from time to time.

On the other hand, various methods have been proposed for removing sheets by irradiating them with laser light. Hole processing, cutting processing,
Partial removal of a metal layer of a laminate film is a well-known example of processing. However, these laser beam processing methods, regardless of whether pulse oscillation or continuous oscillation is used, continuously irradiate the workpiece for a limited irradiation time and scan the workpiece to drill, cut, or melt the deposited metal film. It was designed to be an effective means for extending the area beyond a certain extent or expanding the surface area.

Means/effect for solving the problems: The present invention aims to solve all of the above problems by performing continuous machining of small holes without mechanical contact machining, and by advantageously using laser light. There is. That is, the peak power of the laser pulse oscillation 1i or Qx switch oscillation repeatedly appears (hereinafter referred to as pulsed oscillation).

), and propose a method and apparatus 1 for continuously drilling a large number of holes at high speed.

The continuous hole machining means using pulsed laser oscillation in the present invention performs a long cutting at one location at the peak of the laser power, that is, for each repeated pulse of the peak power, and simultaneously scans the laser beam or the workpiece. This is a method of machining a large number of holes continuously at high speed by using both passes or relative movement of both. The present invention forms perforations, fine filters, or pinholes by locally removing the object to be processed using the peak power of the laser beam. It is possible to take advantage of advantages such as easy control of the repetition time of occurrence←disappearance. In the present invention, one (long) hole can be formed with one pulse, so by shortening the interval between pulses, it is possible to connect them into a slit shape, and it is also possible to form a gap.

Example: Hereinafter, one example of the present invention will be described. The laser used is a carbon dioxide gas, YAG, excimer, or other laser that can produce pulsed oscillation with a large peak power. The reason why pulse oscillation was adopted is that, as shown in Figure 2, in pulse oscillation or Q-switch oscillation, which has a sharp peak, the peak power 0 is large, so it is not possible to process one location with one pulse. This is because it is possible. Drilling one hole with one pulse is an effective means for machining a large number of consecutive holes at high speed.

Furthermore, each of the lasers mentioned above has its own characteristics, but
Among them, the excavation wavelength may be unique to each laser, so a laser corresponding to the absorption wavelength of the broken Loe sheets may be used.

Next, a specific example suitable for implementing the present invention will be explained based on the drawings.

The sheet to be processed (1) placed in a winding manner is fed by the feed roll (3) and taken to the hole drilling position e (4) '
pass through. The feed roll (3) rotates at foot speed, for example, is continuously rotated by a motor, or can be rotated and stopped by an intermittent drive device disclosed in Japanese Patent No. 60-172911. Intermittent rotation that repeats at high speed! I
Two times after being rotated, the sheet to be processed (1) reaches the hole drilling position (4) continuously or intermittently. (2) must be applied in order to properly perform laser beam irradiation and scanning.
This is a measuring roll when controlling the speed in step 1).

In this way, the egg is broken at the hole drilling position (4).
(1) is irradiated from V-the-light αQ continuous processing device 4 having a peak power such as pulse oscillation. As shown in FIG. 1, the continuous processing means 4 includes a laser oscillator (6) selected from carbon dioxide gas, YAG, and excimer and emitting pulsed oscillation;
It consists of an optical system consisting of a collimator (6), a prism (1), a rotating polygon mirror H, and an fθ lens (1). fθshi/zu (to) is hole machining i fi! It has the function of making the focal point of the irradiated laser beam U uniformly on the scanning plane over the entire width of the sheet to be processed (1) in (4) 2. The rotating polygon 1Au4 is such that the laser beam qQ is always d
The LJJ Loe sheet (1) is rotated by a multi-faceted 4-rotation motor 0 so as to repeat scanning in one direction from any edge to the other edge, and at the same time the laser beam (10 scans) is applied to the wave force Loe sheet (1). It eliminates the advance of the workpiece sheet (l) from any edge to the other four sides,
1t 7fi+ is generated by the scanning angle motor (to). Adjustment of the hole processing position (4) back and forth can be performed using the scanning position adjustment unit u1 attached to the rotary polygon kJIAt143.

In addition, the feed roll (3) is driven intermittently, and while the broken eggs (1) is stopped at the hole machining position (4), the pulsed laser beam Qte is scanned, and the workpiece sheet (1) is If the laser beam (lIQ) is blocked during forward movement, there is no need to use the scanning angle motor.

In any of the embodiments, by matching the traveling speed of the V-za beam μe and the pulse interval of the laser beam α, one hole per hole can be machined smoothly, and the length and size of the hole can be increased. ) and the hole spacing as desired. Another advantage of the present invention is that it is possible to change the hole diameter by controlling the distance between the optical system and the workpiece sheet.

Furthermore, for the fθ lens (to), reflective coating of the prism μs, etc., materials are selected according to the wavelength specific to each type of laser light, and their intensities are set according to the commonly used peak power.

Effects of the Invention: In the continuous high-speed/JO machining of holes according to the present invention, only the repeating part of the high output part of the peak power that is applied to the pulsed oscillation laser is used. Since one hole is machined per repeated pulse, high-speed machining is possible.

Therefore, when using a thermal laser with a long wavelength such as carbon dioxide or YAG, perforation can be performed very easily and efficiently. Perforations, etc., which are used to cut printer paper, which are handled in large quantities, can be made with holes without generating any dust. Also, like the perforations that are used to cut adhesive tape or the perforations that are used to cut laminate films, they have an adhesive or sticky layer, so it is impossible to do it with conventional blades and it is difficult to create multiple layers. Batch hole machining can also be performed at high speed.

Furthermore, when a short wavelength laser such as a solid state or excimer laser is used, it is highly effective in removing local areas of deposited gold JIA films formed on synthetic resin or glass by vapor deposition or the like. When used for electromagnetic wave shielding members, light-shielding visible films, electronic components, etc., it is superior to conventional etching methods in that it enables detailed processing without damaging the base material.

In addition, when using all lasers in the means of the present invention,
It is possible to drill micro holes in ultra-thin materials. In the case of a thin metal film, a masking metal can be formed, and it can also be used in the production of shadow masks, etc., where ionized liquid comes out through fine holes to cause an electrochemical reaction in alkaline storage batteries.

In the case of a 4m fat film, a masking film can be formed, and an electronic circuit can be used to selectively connect the chair to the holes, or a filtration membrane can be used to allow air to pass through but not bacteria. It is also easy to process to maintain performance. In the case of ultra-thin material, it can be used to create ventilation holes in leather, especially synthetic leather, and to create fabric for W1a masks.

As described above, the present invention has a wide range of applications in various fields, and has great industrial applicability.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing one embodiment A (if:) of the present invention, and Fig. 2 is an explanatory diagram of the utilization range of peak power of pulsed excavation. (1) ... Sheet to be processed (2) ... Measuring roll (3) ... Feed roll (4) ... Hole processing position αO ... Continuous processing device (B) ... Laser oscillator @ ... Collimator (To) ... Prism (141...Rotating multifaceted (to)...f
θ lens αQ...Laser light (b)...
Polygon mirror rotation motor (to)...Scanning angle motor (to)...Scanning position adjustment section 0...Peak power

Claims (1)

[Claims] 1. Laser light of pulsed oscillation with repeated peak power,
A feature is that the laser beam is irradiated onto the sheets to be processed and one hole is machined with each pulse, and a large number of holes are processed at high speed by scanning the laser beam and moving relative to the sheets to be processed. Continuous hole machining method. 2. A pulsed oscillation laser oscillator with an optical system consisting of a rotating polygon mirror, an fθ lens, and other optical elements is provided, and the sheets to be processed are placed on a line scanned by the focal point of the laser beam emitted from this laser oscillator. A continuous hole machining device characterized by a configuration that includes a feeding section for passing.