JP2005322757A - Cooling device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To constitute a large-sized heat sink by suppressing deformation of fins. <P>SOLUTION: A cooling device 1 is constituted of a heat sink 2 which arranges side by side a first heat sink 2a and a second heatsink 2b laminating two or more sheets of fins 6 with spacing. Heat pipes 4a-4c are connected to the first heat sink 2a, and a heat pipes 5a-5c are connected to the second heat sink 2b. Each heat pipes 4a-4c and 5a-5c are connected to a heat receiving material 3. The heat transmitted to the heat-receiving material 3 is transmitted to the first heat sink 2a and the second heat sink 2b, respectively. Further, the cooling device has a framework 7 supported by the heat pipes 4a-4c and 5a-5c. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat sink in which a plurality of fins are stacked, a cooling device in which a heat receiving portion attached to a heat-generating component is connected by a heat pipe, and an electronic apparatus including the cooling device. Specifically, a plurality of heat sinks are arranged, heat pipes are connected to each heat sink to form a heat sink part, and a frame body that supports each heat pipe is provided to suppress fin deformation and enlarge the heat sink part. It is something that can be done.

  In an electronic apparatus such as a personal computer, for example, a cooling device in which a heat sink formed with rib-like fins is directly attached to a heat generating component such as a CPU (central processing unit) is used to cool various components.

  In recent years, with the increasing trend of power consumption of heat-generating components, the amount of heat generation has increased, and a larger heat sink has been demanded.

  For this reason, a cooling device has been proposed in which a heat receiving member attached to a heat generating component and a heat sink are separated and the heat receiving member and the heat sink are connected by a heat pipe. Furthermore, a cooling device has been proposed in which a heat sink has a structure in which fins of thin plate materials are stacked at a narrow pitch to increase the heat radiation area (see, for example, Patent Document 1).

  In a cooling device including a heat sink having a configuration in which a plurality of fins are stacked, one end side of the heat pipe is extended along the stacking direction of the fins, and the heat pipe is inserted into a hole formed in each fin and fixed. Thus, each fin and the heat pipe are connected. The other end of the heat pipe is connected to the heat receiving member.

Japanese Patent Laid-Open No. 10-107192

  In a cooling device including a heat sink having a configuration in which a plurality of fins are stacked, when the heat sink is enlarged, the fin itself is enlarged. However, since the fin is made of a thin plate material, there is a problem that distortion or the like is easily generated when the fin is enlarged, and is easily deformed when vibration is applied during transportation or the like.

  When the fins constituting the heat sink are deformed and the stacked fins come into contact with each other, the heat dissipation efficiency is deteriorated and the cooling capacity is lowered. In addition, the possibility of being a defective product increases, and the yield decreases.

  Further, when the heat sink is enlarged, the number of fins to be stacked is increased, and the length of the heat pipe is increased. When the length of the heat pipe is increased, there is a problem that the heat pipe vibrates and the fins are deformed when vibration is applied during transportation or the like.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a cooling device capable of suppressing the deformation of the fin and increasing the size of the heat sink, and an electronic apparatus including the cooling device. To do.

  In order to solve the above-described problems, a cooling device according to the present invention includes a heat sink in which a plurality of fins made of a thin plate material are stacked at intervals, a heat receiving portion attached to a heat-generating component, and a stack of fins on one end side. In a cooling device including a heat pipe extending along a direction and connected to each fin and having the other end connected to the heat receiving portion, a plurality of heat sinks are arranged side by side, and each heat sink has a plurality of heat pipes. A heat sink that is connected, a heat pipe that protrudes from the fin located at one end of the stacked fins, a frame that supports each heat pipe that protrudes from the fin located at the other end, and a frame that is attached to the frame Provided with a leg portion having elasticity.

  In the cooling device according to the present invention, the heat generated by the heat generating component is absorbed by the heat receiving portion and transmitted to the heat sink portion by the heat pipe.

  The heat sink part is composed of a plurality of heat sinks, and the heat receiving part and each heat sink are respectively connected by a plurality of heat pipes. Each heat sink is formed by laminating a plurality of fins, and each fin and the heat pipe are connected.

  Thereby, the heat transmitted from the heat receiving portion to the heat pipe is transmitted to the fins of the heat sinks and radiated.

  In this way, by configuring the heat sink part from a plurality of heat sinks, a large heat sink part with an increased heat dissipation area is formed without increasing the size of the fins. Since the fin is made of a thin plate material, deformation such as distortion is likely to occur when the fin is enlarged, but deformation of the fin is suppressed by increasing the size of the heat sink without increasing the size of the fin.

  Furthermore, when vibration caused by transportation is added by supporting each heat pipe protruding from the fin located on one end side and each heat pipe protruding from the fin located on the other end side in the laminated fin by the frame body Vibration of individual heat pipes such as is suppressed.

  Each heat sink has a plurality of heat pipes connected to each fin. By suppressing vibration of each heat pipe, deformation of the fins is suppressed.

  Moreover, although fins adjoin by arrange | positioning a heat sink side by side, the deformation | transformation by the contact of adjacent fins is suppressed by suppressing the vibration of each heat pipe.

  In addition, since the frame body is a leg portion having elasticity and is fixed to the housing of the electronic device, for example, vibration during transportation is absorbed by the leg portion, and transmission of vibration to the heat sink portion is suppressed.

  In this way, by suppressing the deformation of the fins, the ratio that is judged as a defective product is reduced, and the yield is improved.

  An electronic apparatus according to the present invention includes the above-described cooling device, and in the electronic device in which the heat generating component and the cooling device for cooling the heat generating component are attached to the inside of the housing, the cooling device is made of a thin plate material. A heat sink portion in which heat sinks in which a plurality of configured fins are stacked at intervals are arranged side by side, a heat receiving portion attached to a heat-generating component, and one end side extends along the fin stacking direction. A plurality of heat pipes connected to each fin and connected to the heat receiving portion at the other end, each heat pipe protruding from the fin located on one end side among the stacked fins, and protruding from a fin located on the other end side An attachment means comprising: a frame body that supports each heat pipe; and a leg portion that is attached to the frame body and has elasticity, and the leg portion of the cooling device is attached to the inside of the housing , Those having a fixing means for fixing by contacting the heat receiving portion to the heat-generating component, and blowing means for blowing air to the heat sink unit.

  In the electronic device according to the present invention, the heat generated by the heat generating component is absorbed by the heat receiving portion of the cooling device and transmitted to the heat sink portion by the heat pipe.

  The heat sink part of the cooling device is composed of a plurality of heat sinks, and the heat receiving part and each heat sink are connected by a plurality of heat pipes. Each heat sink is formed by laminating a plurality of fins, and each fin and the heat pipe are connected.

  Thereby, the heat transmitted from the heat receiving portion to the heat pipe is transmitted to the fins of the heat sinks and radiated. Then, by blowing air to the heat sink by the air blowing means, the heat transmitted from the heat receiving portion to the heat pipe is radiated by the fins while forcibly cooling the fins.

  In the cooling device, by configuring the heat sink part from a plurality of heat sinks, a large heat sink part with an increased heat dissipation area is formed without increasing the size of the fins. Since the fin is made of a thin plate material, deformation such as distortion is likely to occur when the fin is enlarged, but deformation of the fin is suppressed by increasing the size of the heat sink without increasing the size of the fin.

  Furthermore, by supporting each heat pipe projecting from the fin located on one end side among the laminated fins and each heat pipe projecting from the fin located on the other end side with a frame, vibration due to transportation is applied to the cooling device. Suppresses vibration of individual heat pipes when added, etc., and suppresses deformation of fins.

  In addition, since the frame body is fixed to the casing by elastic leg portions, vibrations during transportation and the like are absorbed by the leg portions, and transmission of vibrations to the heat sink portion is suppressed.

  Here, the connection position of the heat pipe in each fin of the cooling device is a position closer to the front with respect to the air flow along the surface of the fin, and at least one of the plurality of heat pipes is the other By disposing the position rearward along the air flow direction with respect to the heat pipe, heat is transmitted to the entire surface of the fin, and heat is efficiently dissipated.

  According to the cooling device of the present invention, by configuring the heat sink portion from a plurality of heat sinks, it is possible to configure a large heat sink portion with an increased heat dissipation area without increasing the size of the fins. Therefore, the deformation of the fin can be suppressed and the cooling capacity can be improved.

  In addition, since a plurality of heat pipes are supported by the frame body, vibrations of individual heat pipes can be suppressed and deformation of the fins can be suppressed when vibration is applied during transportation or the like.

  Further, since the frame body is an elastic leg portion and is fixed to the housing of the electronic device, for example, vibrations such as transportation can be absorbed by the leg portion, and transmission of vibration to the heat sink portion can be suppressed. Accordingly, deformation of the fins can be suppressed.

  From the above, in the cooling device of the present invention, it is possible to improve the cooling capacity by suppressing the deformation of the fins accompanying the enlargement of the heat sink portion.

  According to the electronic device according to the present invention, by configuring the heat sink portion from a plurality of heat sinks in the cooling device, it is possible to configure a large heat sink portion with an increased heat dissipation area without increasing the size of the fins. Therefore, the deformation of the fin can be suppressed and the cooling capacity can be improved.

  Moreover, even if the capacity | capacitance of a ventilation means falls because the cooling capacity in a heat sink part improves, a cooling capacity can be maintained. Therefore, when the air blowing means is a fan, the number of rotations can be reduced to reduce noise.

  In addition, since a plurality of heat pipes are supported by the frame body, vibrations of individual heat pipes can be suppressed and deformation of the fins can be suppressed when vibration is applied during transportation or the like.

  Further, since the frame body is fixed to the housing with elastic leg portions, vibration transmitted to the housing during transportation or the like can be absorbed by the leg portions and transmission of vibration to the heat sink portion can be suppressed. Therefore, it is possible to suppress the deformation of the fins, the transmission of vibrations to the heat generating component side through the heat receiving part connected by the heat sink part and the heat pipe, and the like.

  As described above, in the electronic device of the present invention, the heat generating component can be efficiently cooled by mounting a cooling device that suppresses the deformation of the fins accompanying the increase in size of the heat sink portion and improves the cooling capacity. Therefore, it is possible to suppress the deterioration of the capability of the heat generating component and to extend the life.

  Hereinafter, embodiments of a cooling device and an electronic apparatus according to the present invention will be described with reference to the drawings. 1 to 3 show a configuration example of the cooling device of the present embodiment, FIG. 1 is a perspective view, FIG. 2A is a top view, FIG. 2B is a front view, and FIG. 3A is a side view, and FIG. 3B is a cross-sectional view taken along line AA in FIG. 2B.

<Overall configuration of cooling device>
The cooling device 1 of the present embodiment has a configuration in which a heat sink portion 2 and a heat receiving member 3 are connected by a plurality of heat pipes 4a to 4c and 5a to 5c. The heat sink part 2 includes a first heat sink 2a in which a plurality of fins 6 are stacked at intervals, and a second heat sink 2b in which a plurality of fins 6 are similarly stacked at intervals.

  The first heat sink 2a and the second heat sink 2b are arranged side by side, and one end side of the heat pipes 4a to 4c is connected to each fin 6 constituting the first heat sink 2a.

  Further, one end side of the heat pipes 5a to 5c is connected to each fin 6 constituting the second heat sink 2b. Further, the other end side of the heat pipes 4 a to 4 c and the other end side of the heat pipes 5 a to 5 c are connected to one heat receiving member 3.

  Thereby, in the heat pipes 4a to 4c, the side connected to the first heat sink 2a is the heat radiating side, and the side connected to the heat receiving member 3 is the heat absorbing side. Similarly, in the heat pipes 5a to 5c, the side connected to the second heat sink 2b is a heat radiating side, and the side connected to the heat receiving member 3 is a heat absorbing side.

  The heat sink part 2 includes a frame body 7 surrounding the first heat sink 2a and the second heat sink 2b. The frame body 7 is supported by the heat pipes 4a to 4c and the heat pipes 5a to 5c, and both directions along the surface of the fin 6 are open. As will be described later, the heat sink unit 2 is forcibly cooled by receiving air blown by a fan. For this reason, as shown in FIG.3 (b), the one surface which the frame 7 is opening becomes the ventilation | gas_flowing inflow part 7a, and the other surface becomes the ventilation | gas_flowing discharge part 7b.

  The frame body 7 includes a first leg portion 8a and a second leg portion 8b. The first leg portion 8a and the second leg portion 8b are plate springs made of a plate-like spring material such as stainless steel, and one end thereof is fixed to the discharge portion 7b side of the frame body 7 and the other. A mounting hole 8c through which a screw passes is formed at the end of the.

  As shown in FIGS. 2 and 3, the first leg portion 8 a and the second leg portion 8 b are arranged such that the other end portion is behind the discharge portion 7 b with respect to one end portion attached to the frame body 7. It is configured to be bent into a predetermined shape so as to be positioned and elastically deformable.

<Configuration of heat sink part>
Next, the detail of the structure of the fin 6 and the frame 7 which comprise the heat sink part 2 is demonstrated.

  FIG. 4 is a perspective view showing a configuration example of the fin 6. The fin 6 having the same structure is used for the first heat sink 2a and the second heat sink 2b. The fin 6 is made of, for example, an aluminum thin plate material and includes holes 9a to 9c.

  If the hole 9a is the fin 6 constituting the first heat sink 2a, the heat pipe 4a shown in FIG. 2 or the like is inserted, and if it is the second heat sink 2b, the heat pipe 5a is inserted. The hole 9b is inserted with the heat pipe 4b or the heat pipe 5b, and the hole 9c is inserted with the heat pipe 4c or the heat pipe 5c.

  The fin 6 is rectangular, and the holes 9 a to 9 c are arranged side by side along the longitudinal direction of the fin 6. Here, the holes 9a to 9c are arranged closer to the inflow portion 7a shown in FIG. Further, for example, the hole 9b is arranged so as to be displaced by a predetermined amount L closer to the discharge part 7b with respect to the holes 9a and 9c.

  Each of the holes 9a to 9c includes an annular protrusion 10a that protrudes in one direction by so-called burring formation processing. Moreover, the bending piece part 10b formed by bend | folding the both ends of the longitudinal direction of the fin 6 in the same direction as the protrusion direction of the cyclic | annular protrusion 10a is provided. Here, the protruding amount of the annular protrusion 10a with respect to the surface of the fin 6 and the height of the bent piece 10b are the same.

  In the fin 6 having the above-described configuration, the hole 9a is inserted into the heat pipe 4a, the hole 9b is inserted into the heat pipe 4b, the hole 9c is inserted into the heat pipe 4c, and each hole and the heat pipe are press-contacted. Or it is fixed by welding or the like. Thereby, the fin 6 is attached to the heat pipes 4a to 4c.

  Then, as shown in FIG. 2 and the like, the heat pipes 4a to 4c are attached in a form in which a plurality of fins 6 are laminated. Similarly, the plurality of fins 6 are attached to the heat pipes 5a to 5c in a stacked form. Here, the laminated fins 6 are held at predetermined intervals by the annular protrusions 10a of the holes 9a to 9c and the bent piece 10b.

  FIG. 5 is an exploded perspective view showing a configuration example of the frame body 7. The frame body 7 is made of, for example, an aluminum thin plate, and includes an upper plate 11, a first lower plate 12 a, a second lower plate 12 b, and a connecting plate 13.

  The upper plate 11 includes an upper side portion 11a and side portions 11b formed by bending both ends in the longitudinal direction of the upper side portion 11a. The upper side portion 11a includes holes 14a to 14c into which the heat pipes 4a to 4c are inserted and holes 15a to 15c into which the heat pipes 5a to 5c are inserted. The hole portions 14a to 14c and the hole portions 15a to 15c are formed with annular projections (not shown) by burring so that the heat pipe can be fixed by, for example, pressure contact.

  Furthermore, the upper side part 11a is provided with one rib 16, for example. The rib 16 is formed by denting a part of the upper side portion 11a, and extends along the longitudinal direction of the upper side portion 11a.

  One side part 11b is formed between the first lower plate 12a and an annular protrusion on one of them by burring, a through hole is formed on the other, and the annular protrusion is inserted into the through hole. By crimping, a hole 17a for attaching the first lower plate 12a and a bent piece 18a in which the hole 17a is formed are provided. Similarly, the other side portion 11b includes a hole portion 17b to which the second lower plate 12b is attached and a bent piece 18b.

  In addition, the side portions 11b include, for example, two ribs 16 extending along the longitudinal direction. Furthermore, the upper plate 11 includes a folded portion 19 that is folded back by folding both edges of the upper side portion 11a and both side portions 11b in the lateral direction.

  The first lower plate 12a includes holes 20a to 20c into which the heat pipes 4a to 4c are inserted. Similarly, the second lower plate 12b includes holes 21a to 21c into which the heat pipes 5a to 5c are inserted. The hole portions 20a to 20c and the hole portions 21a to 21c are formed with annular projections (not shown) by burring so that the heat pipe can be fixed by pressure contact, for example.

  Further, as described above, the first lower plate 12a includes a bent piece 22a and a hole 23a to which one side 11b of the upper plate 11 is attached by caulking. Furthermore, a hole 24a to which the connecting plate 13 is attached is provided.

  Similarly, the second lower plate 12b includes a bent piece 22b and a hole 23b to which the other side portion 11b of the upper plate 11 is attached. Moreover, the hole part 24b to which the connection plate 13 is attached is provided.

  Furthermore, the first lower plate 12a and the second lower plate 12b include, for example, one rib 16 along the longitudinal direction. Further, the first lower plate 12a and the second lower plate 12b include a folded portion 25 that is folded by double-folding one edge portion in the short direction.

  The connecting plate 13 includes a hole 26a to which the first lower plate 12a is attached and a hole 26b to which the second lower plate 12b is attached.

  In the frame 7 having the above-described configuration, the first lower plate 12a has the hole 20a inserted in the heat pipe 4a, the hole 20b inserted in the heat pipe 4b, and the hole 20c inserted in the heat pipe 4c. Each hole and the heat pipe are fixed by pressure welding or welding.

  The second lower plate 12b has holes 21a inserted into the heat pipe 5a, holes 21b inserted into the heat pipe 5b, holes 21c inserted into the heat pipe 5c, and each hole and heat pipe. Is fixed by pressure welding or welding.

  On the upper side of the first lower plate 12a, a plurality of fins 6 are attached to the heat pipes 4a to 4c as described above, and the first heat sink 2a in which the plurality of fins 6 are stacked is configured. Further, on the upper side of the second lower plate 12b, a plurality of fins 6 are attached to the heat pipes 5a to 5c to constitute a second heat sink 2b in which the plurality of fins 6 are laminated.

  In the upper plate 11, the hole 14a is inserted at the tip of the heat pipe 4a, the hole 14b is inserted at the tip of the heat pipe 4b, and the hole 14c is inserted at the tip of the heat pipe 4c.

  Further, the hole 15a is inserted into the tip of the heat pipe 5a, the hole 15b is inserted into the tip of the heat pipe 5b, and the hole 15c is inserted into the tip of the heat pipe 5c. And each hole and a heat pipe are fixed by pressure welding or welding.

  For example, the upper plate 11 and the first lower plate 12a may be configured such that one of the holes to be fastened is configured as an annular protrusion and the other hole is configured as a through hole, and the annular protrusion is fitted into the through hole. It is fixed by a fastening method of fixing by fastening.

  The upper plate 11 and the second lower plate 12b, the first lower plate 12a and the connecting plate 13, and the second connecting plate 12b and the connecting plate 13 are also fixed by the same fastening method.

  That is, the upper plate 11 and the first lower plate 12a are fixed by caulking the hole portion 17a of the bent piece 18a of one side portion 11b and the hole portion 23a of the first lower plate 12a. The hole portion 17a of 11b and the hole portion 23a of the bent piece 22a of the first lower plate 12a are integrally formed by caulking and fixing.

  Similarly, the upper plate 11 and the second lower plate 12b are fixed by caulking the hole 17b of the bent piece 18b of the other side 11b and the hole 23b of the second lower plate 12b. The hole portion 17b of the portion 11b and the hole portion 23b of the bent piece 22b of the second lower plate 12b are integrally formed by caulking and fixing.

  Further, the first lower plate 12a and the second lower plate 12b are fixed by caulking the hole portion 24a of the first lower plate 12a and the hole portion 26a of the connecting plate 13, and the hole portion of the second lower plate 12b. By caulking and fixing the holes 26b of the connecting plate 13 and 24b, the lower side portion 27 of the frame body 7 is formed integrally with the connecting plate 13.

  Accordingly, as shown in FIGS. 1 to 3, the upper side 11a and the lower side 27 support the heat pipes 4a to 4c and the heat pipes 5a to 5c, and surround the first heat sink 2a and the second heat sink 2b. The enclosing frame 7 is configured, and the first heat sink 2a and the second heat sink 2b are arranged in parallel, and the heat sink portion 2 in which the inflow portion 7a and the discharge portion 7b are formed is configured.

  Here, since the frame body 7 is made of a thin plate material for weight reduction, the frame body 7 is provided with reinforcing means by the ribs 16 and the folded portions 19 and 25 to deform the side portions in the longitudinal direction. suppress.

  Here, as will be described later, for example, the first leg portion 8a and the second leg portion 8b that support the frame body 7, the first leg portion 8a is fixed to the other side portion 11b, and the second leg portion 8b, for example. The part 8 b is fixed to the first lower plate 12 a that constitutes the lower side part 27. In FIG. 5, the second leg 8b is not shown because it is disposed on the back side of the first lower plate 12a.

<Configuration of heat pipe and heat receiving member>
Returning to FIGS. 1 to 3, the configuration of the heat pipes 4 a to 4 c, 5 a to 5 c and the heat receiving member 3 will be described.

  The heat pipes 4a to 4c and the heat pipes 5a to 5c are made of, for example, copper material having good thermal conductivity, one end and the other end are sealed, and a working fluid is sealed in an internal cavity. Usually, the cavity is evacuated.

  In this example, six heat pipes 4a to 4c and 5a to 5c are arranged side by side. The width of the heat sink portion 2 along the direction in which the heat pipes 4 a to 4 c and 5 a to 5 c are arranged is wider than the width of the heat receiving member 3. Since the heat pipes 4a to 4c and 5a to 5c are attached to the heat sink part 2 at one end on the heat dissipation side and attached to the heat receiving member 3 at the other end to the heat absorption side, the heat pipes 4a to 4c , 5 a to 5 c include a curved portion 29.

  Here, the curvature in the curved portion 29 of the heat pipes 4a and 5a arranged on the outside is configured to be larger than the curvature in the curved portion 29 of the heat pipes 4c and 5c arranged on the inside, and each of the heat pipes 4a to 4c and 5a. ˜5c has a form in which the other end side gathers on the heat receiving member 3.

  The heat receiving member 3 is a block made of, for example, a copper material having good thermal conductivity, and includes six grooves not shown. The other end portions of the heat pipes 4a to 4c and 5a to 5c are respectively inserted into the groove portions and fixed by pressure welding or the like.

  The heat receiving member 3 includes a plate 30. The plate 30 is made of, for example, a stainless steel plate, and is attached to the front surface of the heat receiving member 3 with screws or the like, and functions as a spacer and a receiving portion that receives a pressing force when attached to a heat-generating component as will be described later.

<Assembly procedure of cooling device>
The outline of the assembling procedure of the cooling device 1 having the above-described configuration will be described with reference to FIGS. The first lower plate 12a and the plurality of fins 6 are sequentially fitted and fixed by pressure welding or welding as described above.

  Similarly, the heat pipes 5a to 5c, which are bent into a predetermined shape and formed with a curved portion 29, are held by a jig (not shown), and the second lower plate 12b and the plurality of fins 6 are sequentially fitted and pressed or welded. Fix with etc.

  Next, the upper plate 11 is fitted into the heat pipes 4a to 4c and the heat pipes 5a to 5c and fixed by pressure welding or welding. Further, one side 11b of the upper plate 11 and the first lower plate 12a are fixed by caulking or the like, and the other side 11b and the second lower plate 12b are fixed by caulking or the like.

  Then, the connecting plate 13 is fixed to the first lower plate 12a and the second lower plate 12b by caulking or the like.

  Next, by inserting the other end on the heat absorption side of the heat pipes 4a to 4c and 5a to 5c into a groove portion (not shown) of the heat receiving member 3 and fixing it by pressure contact or the like, and attaching the plate 30 to the heat receiving member 3, A cooling device 1 is configured.

  In the cooling device 1, a first heat sink portion 2 a in which a plurality of fins 6 are attached and stacked on the heat pipes 4 a to 4 c and a second heat sink portion 2 a in which the plurality of fins 6 are attached to the heat pipes 5 a to 5 c and stacked. A heat sink portion 2b is provided.

  The heat transmitted to the heat receiving member 3 is transmitted to the first heat sink 2a through the heat pipes 4a to 4c and radiated, and is also transmitted to the second heat sink 2b through the heat pipes 5a to 5c and radiated. Is done.

  Further, by providing the frame body 7 supported by the heat pipes 4a to 4c and 5a to 5c and surrounding the first heat sink 2a and the second heat sink 2b, the strength of the heat sink portion 2 can be improved and the fins 6 can be deformed. It has a structure to prevent.

  In the cooling device 1 of this example, the heat sink portion 2 has a configuration in which the fins 6 are divided into two. If the fins are configured as a single sheet without a split structure, the fins are enlarged. Since the fin is made of a thin plate material, it easily deforms when the fin is enlarged. When the fins are deformed, the fins to be stacked come into contact with each other, and the heat dissipation efficiency decreases.

  In addition, the cooling device 1 of this example includes six heat pipes. However, if the fin is composed of one piece, an assembly process for supporting the six heat pipes at a time and attaching the fins is required.

  On the other hand, by making the fin 6 into a divided structure as in this example, the large heat sink portion 2 can be configured while the fin itself is small. Thereby, a deformation | transformation of the fin 6 can be suppressed.

  Further, in this example, for example, an assembly process for supporting the three heat pipes and attaching the fins 6 can be performed, so that the operation becomes easier as compared with the assembly process for attaching the fins to the six heat pipes at a time.

  If the size of the heat sink part 2 is increased, the number of heat pipes that conduct heat from the heat receiving member 3 to the heat sink part 2 may be increased. The number of heat pipes handled at one time can be reduced in the assembly process of attaching to the pipe.

<Configuration of electronic equipment>
The cooling device 1 having the above-described configuration is mounted on an electronic device such as a personal computer in order to cool heat-generating components such as a CPU (central processing unit). Next, the electronic device of this embodiment will be described.

  6 to 10 show examples of the configuration of the electronic device according to the present embodiment, FIG. 6 is a cutaway perspective view, FIG. 7 is a front view, FIG. 8 is a cross-sectional side view of the main part, and FIG. FIG. 10 is an exploded perspective view.

  The electronic device 31 includes a substrate 33 inside a housing 32. The substrate 33 is referred to as a mother board, and is fixed to the back plate 32a of the housing 32 with a screw 35 or the like via a post 34, for example.

  A CPU 36 is mounted on the substrate 33 as a heat generating component to be cooled by the cooling device 1. The CPU 36 is mounted on the substrate 33 via the socket 37. The substrate 33 is also provided with a socket for mounting a substrate such as a memory.

  In addition, the substrate 33 includes an attachment member 38 to which the cooling device 1 is attached. The attachment member 38 is an example of a fixing means, includes an attachment grip 39 and an attachment fitting 40, and is attached to the substrate 33 via the mount portion 41.

  The attachment grip 39 is an M-shaped leaf spring material and is attached to one mount portion 41 so as to be freely rotatable. The mounting bracket 40 is rotatably attached to the other mount portion 41, and includes a locking portion (not shown) that is detachably locked by a mounting / dismounting bracket 39a provided on the mounting grip 39.

  In the cooling device 1, the heat receiving member 3 is pressed against the CPU 36 by the attachment clip 39 and fixed. That is, the mounting grip 39 presses the heat receiving member 3 against the CPU 36 by bringing the back surface of the heat receiving member 3 and the surface of the CPU 36 into contact with each other and engaging the detachable bracket 39 a of the mounting grip 39 with the mounting bracket 40. In addition, you may interpose grease etc. with high heat conductivity between the heat receiving member 3 and CPU36.

  Here, the pressing force of the heat receiving member 3 by the mounting grip 39 varies depending on the thickness of the heat receiving member 3. Therefore, as shown in FIG. 1 and the like, by attaching the plate 30 to the heat receiving member 3, it is possible to adjust the thickness of the heat receiving member 3 so as to obtain an appropriate pressing force with which the heat receiving member 3 is in close contact with the CPU 36. Become.

  The cooling device 1 is attached to the housing 32 by the first leg portion 8a and the second leg portion 8b. For this reason, as shown in FIG. 10, the first mounting portion 42a is provided at a predetermined position of the back plate 32a of the housing 32 corresponding to the first leg portion 8a, and corresponds to the second leg portion 8b. The second mounting portion 42b is provided. The first attachment portion 42a and the second attachment portion 42b are an example of attachment means, and are constituted by, for example, screw holes. Moreover, although not shown in figure, you may provide the hole part, convex part, etc. which position a leg part.

  Further, the housing 32 is provided with a vent hole 43 at a portion facing the discharge portion 7 b of the heat sink portion 2 of the cooling device 1. The ventilation hole 43 is formed in the back plate 32a of the housing 32, and for example, slit-shaped openings are arranged side by side.

  The electronic device 31 includes a fan 44 that forcibly cools the heat sink portion 2 of the cooling device 1. The fan 44 is an example of a blowing unit, and is attached to a portion of the heat sink portion 2 that faces the inflow portion 7a. The fan 44 is fixed to the housing 32 via a bracket 45, for example.

  FIG. 11 is a perspective view illustrating a configuration example of the bracket 45. The bracket 45 includes a frame 46 to which the fan 44 is attached, and a first leg 47 and a second leg 48 that support the frame 46 with respect to the housing 32.

  The frame 46 includes an opening 46a through which the fan 44 blows air and a screw hole 46b for attaching the fan 44 shown in FIG. The first leg 47 is provided with a mounting hole 47a, and the second leg 48 is provided with a mounting hole 48a.

  Here, as shown in FIG. 6 and the like, one fan 44 is attached to each of the first heat sink 2a and the second heat sink 2b. In this example, two fans 44 are attached to the bracket 45. Fixed side by side.

  Returning to FIG. 10, the housing 32 includes an attachment portion 49 on the side plate 32 b in order to attach the bracket 45. The attachment portion 49 is constituted by a screw hole. Moreover, although not shown in figure, you may provide the hole part, convex part, etc. which position a leg part. The second leg portion 48 of the bracket 45 is attached to the attachment portion 49.

  The first leg portion 47 of the bracket 45 shares the first attachment portion 42a to which the first leg portion 8a of the cooling device 1 is attached.

  In the electronic device 31 described above, the cooling device 1 is fixed by the heat receiving member 3 being pressed against the CPU 36 by the mounting clip 39. In the heat sink portion 2 of the cooling device 1, the second leg portion 8 b is fixed to the second mounting portion 42 b of the back plate 32 a with the screw 50.

  The first leg portion 8 a of the heat sink portion 2 is sandwiched between the first leg portion 47 of the bracket 45 and the back plate 32 a and is fixed to the first attachment portion 42 a by the screw 50. Thereby, each one leg part of the cooling device 1 and the bracket 45 is fixed with one screw.

  In addition, the 1st leg part 8a of the cooling device 1 is the shape which can be elastically deformed so that the heat sink part 2 can mainly move to the left-right direction and the front-back direction, and the 2nd leg part 8b is mainly left-right direction. The shape is elastically deformable so that the heat sink portion 2 can move in the front-rear direction.

  The second leg portion 48 of the bracket 45 is fixed to the attachment portion 49 of the side plate 32b with a screw 50. Thereby, the bracket 45 is attached to the housing 32 so as to cover the inflow portion 7a side of the heat sink portion 2. Then, the two fans 44 are fixed to the bracket 45 with screws.

<Operation of electronic equipment>
Next, the operation of the electronic device 31 will be described. First, when the electronic device 31 operates, the fan 44 rotates. Note that the rotation speed of the fan 44 may be variable according to, for example, the operating rate of the CPU 36. For example, the control is performed such that the rotation speed of the fan 44 is increased when the operation rate of the CPU 36 is high, and the rotation speed of the fan 44 is decreased when the operation rate of the CPU 36 is low.

  The air generated by rotating the fan 44 passes between the fins 6 from the inflow portion 7a of the heat sink portion 2 and flows to the discharge portion 7b, and is discharged from the vent hole 43 to the outside of the housing 32. The flow of air by the fan 44 is indicated by arrows in FIGS.

  When the electronic device 31 operates, heat is generated in the CPU 36. Since the heat receiving member 3 of the cooling device 1 is in contact with the surface of the CPU 36 as shown in FIG. 8, the heat generated in the CPU 36 is conducted from the portion in contact with the CPU 36 to the heat receiving member 3. Absorbs the generated heat.

  The heat conducted from the CPU 36 to the heat receiving member 3 is conducted to the first heat sink 2a by the heat pipes 4a to 4c, and conducted to the second heat sink 2b by the heat pipes 5a to 5c.

  Briefly describing the function of the heat pipe, the heat conducted to the heat receiving member 3 evaporates the working fluid on the heat absorption side of the heat pipes 4a to 4c and 5a to 5c, and the steam of the working fluid becomes the heat pipes 4a to 4c, It is transmitted to the heat radiation side of 5a-5c.

  Since the heat radiation sides of the heat pipes 4a to 4c and 5a to 5c are connected to the plurality of fins 6, the fins 6 are cooled by blowing air from the fan 44, so that the heat pipes 4a to 4c and 5a to 5c The heat dissipation side is also cooled.

  Thereby, the vapor | steam of the hydraulic fluid in heat pipe 4a-4c, 5a-5c is cooled, and it returns to a liquid phase state again. And the hydraulic fluid which returned to the liquid phase state recirculate | refluxs to the heat absorption side of heat pipe 4a-4c, 5a-5c again. Due to the phase change and movement of the hydraulic fluid, heat is transferred from the heat receiving member 3 to the heat sink portion 2.

  Since the cooling device 1 of this example has a configuration in which the heat receiving member 3 and the heat sink portion 2 are connected by a heat pipe, the heat sink portion 2 can be increased in size as compared with a configuration in which the heat sink is directly attached to a heat generating component such as the CPU 36. It is.

  That is, in an electronic device such as a personal computer, an improvement in cooling capacity is required with an increase in power consumption of a CPU or the like. For this reason, in order to increase the heat radiation area, an increase in the size of the heat sink is required. Further, in the configuration in which the heat sink is forcibly cooled by the fan, an increase in the size of the heat sink is required in order to reduce the noise by reducing the rotation of the fan.

  However, in the configuration in which the heat sink is directly attached to the heat generating component, even if the heat sink is enlarged, heat cannot be efficiently conducted to the entire heat sink. On the other hand, in the configuration in which the heat receiving member and the heat sink are separated and connected by a heat pipe, heat can be efficiently conducted to the entire heat sink by the arrangement of the heat pipe.

  Furthermore, in addition to increasing the size of the heat sink, the heat sink has a structure in which thin plate fins are stacked at a narrow pitch to further increase the heat radiation area.

  Here, when the size of the fin is increased in accordance with the increase in the size of the heat sink, the fin is formed of a thin plate material, and thus is easily deformed.

  On the other hand, in this example, the heat sink part 2 is composed of a first heat sink 2a in which a plurality of fins 6 are stacked and a second heat sink 2b in which a plurality of fins 6 are stacked. The large-sized heat sink part 2 is comprised, without becoming. Thereby, a deformation | transformation of the fin 6 can be suppressed, ensuring a thermal radiation area.

  Further, the first heat sink 2a and the second heat sink 2b are arranged by adjoining the end portions in the longitudinal direction of the fin 6 so that the heat sink portion 2 is compared with the case where the fin is constituted by one plate material. The size will not be larger than necessary.

  In this example, in the first heat sink 2 a, the heat pipes 4 a to 4 c are arranged on both end sides and near the center in the longitudinal direction of the fin 6. Similarly, in the second heat sink 2b, the heat pipes 5a to 5c are arranged on both ends and near the center in the longitudinal direction of the fin 6.

  Thereby, the heat transmitted from the CPU 36 to the heat receiving member 3 is efficiently transmitted through the heat pipes 4a to 4c over the entire surface in the longitudinal direction of the fins 6 constituting the first heat sink 2a.

  Further, the heat transmitted from the CPU 36 to the heat receiving member 3 is efficiently transmitted through the heat pipes 5a to 5c over the entire surface in the longitudinal direction of the fins 6 constituting the second heat sink 2b.

  Further, the inflow portion 7 a in the heat sink portion 2 receives the air blown by the fan 44 from the direction intersecting the longitudinal direction of the fin 6. A large number of fins 6 are arranged at a narrow pitch, so that the air blown by the fan 44 is received over a wide area.

  Therefore, the heat conducted to the first heat sink 2 a by the heat pipes 4 a to 4 c and the heat conducted to the second heat sink 2 b by the heat pipes 5 a to 5 c are efficiently cooled by the fan 44.

  Here, each fin 6 has a temperature distribution in which the temperature on the inflow portion 7a side in contact with the heat pipes 4a to 4c or the heat pipes 5a to 5c is high and the temperature on the discharge portion 7b side is low. For this reason, in order to make the entire temperature of the fins 6 uniform and increase the fin efficiency, in this example, one of the heat pipes is arranged with a slight shift toward the discharge portion 7b in each heat sink. Thus, heat can be transmitted to the discharge part 7b side of the fin 6 as well. Thereby, heat dissipation efficiency can be improved more.

  Now, when the fins 6 are arranged adjacent to each other by the first heat sink 2a and the second heat sink 2b, when vibration is applied during transportation or the like, there is a possibility that the heat pipe is deformed by vibration and adjacent fins come into contact with each other. is there.

  Since the fin 6 is a thin plate material, it is easily deformed by contact. For this reason, in the heat pipes 4a to 4c and the heat pipes 5a to 5c, vibrations and the like are obtained by supporting the portions protruding from the upper and lower ends of the fins 6 to be stacked by the upper side portion 11a and the lower side portion 27 of the frame body 7. The heat pipes 4a to 4c and 5a to 5c are prevented from being deformed and the fins 6 are protected.

  In a personal computer, the user may open the housing 32 and add components. For this reason, by covering the periphery of the fin 6 with the frame body 7, it is difficult to directly touch the fin 6 during work, and deformation of the fin 6 can be prevented.

  Further, the frame body 7 is supported by the housing 32 by the first leg portion 8a and the second leg portion 8b. Since the first leg portion 8a and the second leg portion 8b are made of spring material and have elasticity, when vibration is applied to the housing 32 during transportation of the electronic device 31, vibration is directly transmitted from the housing 32 to the heat sink. It is prevented from being transmitted to part 2.

  That is, in a configuration in which the heat sink is directly attached to the casing without using elastic legs, vibration applied to the casing during transportation or the like is directly transmitted to the heat sink. As a result, the heat sink vibrates and the fins are deformed.

  On the other hand, by attaching the heat sink part 2 to the housing 32 via the first leg part 8a and the second leg part 8b having elasticity, vibration of the heat sink part 2 is suppressed and deformation of the fin 6 is prevented. be able to.

  As described above, in the cooling device 1 of the present embodiment, the heat sink portion 2 can be increased in size while suppressing the deformation of the fins 6 to improve the cooling capacity. In the electronic device 31 provided with such a cooling device 1, heat-generating components such as the CPU 36 can be efficiently cooled to suppress a decrease in capacity and to extend the life. Furthermore, since the cooling capacity can be maintained even if the rotational speed of the fan 44 is decreased, the rotational speed of the fan 44 can be decreased to reduce noise.

  In addition, by suppressing the vibration of the heat sink portion 2, it is possible to suppress the vibration from being transmitted to the substrate 33 via the heat receiving member 3. Further, since the heat receiving member 3 itself is pressed against the CPU 36 by the mounting clip 39 having elasticity, vibrations and the like can be absorbed. Thereby, generation | occurrence | production of the stress in the board | substrate 33 can be prevented.

  Further, when the heat receiving member 3 is attached to the CPU 36, the position of the attachment hole 8 c of the first leg portion 8 a or the second leg portion 8 b and the housing 32 side are determined depending on the accuracy of components constituting the cooling device 1. There is a possibility that the position of the mounting portion is slightly shifted. Also in this case, since the first leg portion 8a and the second leg portion 8b have elasticity, misalignment can be absorbed by slightly deforming the first leg portion 8a or the second leg portion 8b. .

  Here, in the electronic device 31, the discharge portion 7 b side of the heat sink portion 2 of the cooling device 1 is configured to be visible from the outside through the vent hole 43 of the housing 32. As described above, in the cooling device 1 of the present example, the lower side portion 27 of the frame body 7 includes the first lower plate 12a and the second lower plate 12b.

  There may be a step between the first lower plate 12a and the second lower plate 12b, but the first lower plate 12a and the second lower plate can be obtained by connecting the discharge portion 7b side with the connecting plate 13. The level difference of the plate 12b cannot be seen from the outside, and the commercial value can be improved.

  In the electronic device 31 including the cooling device 1 and the cooling device 1 according to the embodiment described above, the heat sink unit 2 is configured by two heat sinks, but may be configured by two or more heat sinks. .

  Also, the number of heat pipes may be increased or decreased according to the size of the fins and the number of heat sinks.

  Furthermore, the heat pipe connected to the heat sink part and the heat pipe connected to the heat receiving member may be divided, and the heat pipes may be connected by a member having airtightness and flexibility. That is, since the width of the heat sink along the direction in which the heat pipes are arranged is wider than the width of the heat receiving member, each heat pipe has a curved portion. However, when the heat sink is enlarged, it becomes difficult to form the heat pipe. . Therefore, by dividing the heat pipe and connecting it with a member having flexibility, it becomes easy to form the heat pipe, and an improvement in yield can be expected.

  The present invention is applicable as a cooling device for an electronic device installed in a moving body such as a vehicle.

It is a perspective view which shows the structural example of the cooling device of this Embodiment. FIG. 2A shows a top view, FIG. 2B shows a front view, and FIG. 2C shows a bottom view. The structural example of the cooling device of this Embodiment is shown, Fig.3 (a) is a side view, FIG.3 (b) is AA sectional drawing of FIG.2 (b). It is a perspective view which shows the structural example of a fin. It is a disassembled perspective view which shows the structural example of a frame. It is a fractured perspective view which shows the structural example of the electronic device of this Embodiment. It is a front view which shows the structural example of the electronic device of this Embodiment. It is principal part sectional drawing which shows the structural example of the electronic device of this Embodiment. It is principal part plane sectional drawing which shows the structural example of the electronic device of this Embodiment. It is a perspective view of the state which decomposed | disassembled which shows the structural example of the electronic device of this Embodiment. It is a perspective view which shows the structural example of a bracket.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Cooling device, 2 ... Heat sink part, 2a ... 1st heat sink, 2b ... 2nd heat sink, 3 ... Heat receiving member, 4a-4c ... Heat pipe, 5a- 5c ... Heat pipe, 6 ... Fin, 7 ... Frame, 7a ... Inflow part, 7b ... Discharge part, 8a ... First leg, 8b ... Second 8c ... mounting holes, 9a-9c ... holes, 10a ... annular projections, 10b ... bent piece, 11 ... upper plate, 11a ... upper side, 11b ... Side side part, 12a ... 1st lower plate, 12b ... 2nd lower plate, 13 ... Connection plate, 14a-14c ... Hole part, 15a-15c ... Hole Part, 16 ... rib, 17a, 17b ... hole, 18a, 18b ... bent piece, 19 ... folded 20a-20c ... hole, 21a-21c ... hole, 22a, 22b ... bent piece, 23a, 23b ... hole, 24a, 24b ... hole, 25 ..Folded part, 26a, 26b ... hole, 27 ... lower side part, 29 ... curved part, 30 ... plate, 31 ... electronic device, 32 ... housing, 32a ..Back plate, 32b ... Side plate, 33 ... Substrate, 34 ... Post, 35 ... Screw, 36 ... CPU, 37 ... Socket, 38 ... Mounting member, 39 ... Attachment clip, 39a ... Removable bracket, 40 ... Attachment bracket, 41 ... Mount, 42a ... First attachment, 42b ... Second attachment, 43 ...・ Vent hole, 44 ... Fan, 45 ... Bracket, 46 ... Frame, 46a ... Open , First leg 47 ..., 47a ... mounting hole, 48 ... second leg, 48a ... mounting hole, 49 ... mounting portion 50 ... Screw

Claims (14)

A heat sink in which a plurality of fins made of a thin plate material are stacked at intervals, and
A heat receiving part attached to the heat generating component;
In a cooling device including a heat pipe having one end side extending along the lamination direction of the fins and connected to the fins, and the other end side connected to the heat receiving unit,
A plurality of the heat sinks are arranged side by side, and a heat sink portion in which a plurality of the heat pipes are connected to each heat sink,
Among the laminated fins, a frame that supports the heat pipes protruding from the fins located on one end side and the heat pipes protruding from the fins located on the other end side, and
A cooling device comprising: a leg portion attached to the frame and having elasticity. 2. The cooling device according to claim 1, wherein each of the heat sinks is arranged side by side in a direction along a surface of the fin and in a left-right direction with respect to an air flow along the surface of the fin. The cooling device according to claim 1, wherein the leg portion is formed by bending a plate-like spring member. The cooling device according to claim 1, wherein a connection position of the heat pipe in each fin is a position closer to the front of each fin with respect to an air flow along the surface of the fin. At least one of the plurality of heat pipes connected to each of the heat sinks is disposed with a position shifted rearward along the air flow direction with respect to the other heat pipes. Item 5. The cooling device according to Item 4. The cooling device according to claim 1, wherein the frame body includes a reinforcing means. The cooling device according to claim 6, wherein the reinforcing means is a rib formed by forming an uneven portion in a part of the frame. The cooling device according to claim 6, wherein the reinforcing means is configured by folding back an edge of the frame. In an electronic device in which a heat generating component and a cooling device for cooling the heat generating component are attached to the inside of the housing,
The cooling device is
A heat sink portion in which a plurality of fins composed of thin plate materials are arranged side by side with a plurality of fins disposed at intervals, and
A heat receiving portion attached to the heat generating component;
A plurality of heat pipes, one end side extending along the lamination direction of the fins, connected to the fins of the heat sinks, and the other end side connected to the heat receiving unit,
Among the laminated fins, a frame that supports each heat pipe protruding from the fin located on one end side and each heat pipe protruding from the fin located on the other end side, and
A leg portion attached to the frame body and having elasticity;
Inside the housing,
Attachment means to which the legs of the cooling device are attached;
Fixing means for fixing the heat receiving portion in contact with the heat generating component;
An electronic device comprising: a blowing unit that blows air to the heat sink part. The electronic device according to claim 9, wherein the leg portion is formed by bending a plate-like spring member. The air blowing means is at least one fan, and includes a bracket for supporting the fan, and the bracket has a leg portion fixed to the housing by the attachment means together with the leg portion of the cooling device. The electronic device according to claim 9. The electronic apparatus according to claim 9, wherein the heat sinks are arranged side by side in a direction along a surface of the fin and in a horizontal direction with respect to an air flow along the surface of the fin. The electronic apparatus according to claim 9, wherein a connection position of the heat pipe in each fin is a position closer to the front of each fin with respect to an air flow along the surface of the fin. At least one of the plurality of heat pipes connected to each of the heat sinks is disposed with a position shifted rearward along the air flow direction with respect to the other heat pipes. Item 14. An electronic device according to Item 13.

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