JP2005321846A - Design data examination method for printed wiring board and examination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely examine compliance to complicated restrictions or specifications in a manufacturing process with high reliability on a conductor pattern based on design data for manufacturing a printed wiring board. <P>SOLUTION: By applying a set of circles, which use a specification value of a maximum conductor diameter shown by a UL specification item as a diameter and are arranged at a fine pitch, to the conductor pattern information created by processing the design data for the printed wiring board, presence/absence of an overlapping part or a contact part between the outer circumference of the circle and the conductor pattern is examined. If it is determined that there is no overlapping part or contact part as the examination result, the conductor pattern fails examination by this examination method. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inspection method and an inspection apparatus for inspecting whether designed design data for manufacturing a printed wiring board conforms to a predetermined design rule or manufacturing restrictions.

Recently, printed wiring boards on which electronic devices and the like are mounted are increasingly required to have higher density and higher reliability, and the design rules and manufacturing restrictions have become more complex. There is a need for an inspection apparatus for design data that can provide highly accurate results.
The UL (Underwriters Laboratories Inc.) standard is known as an important safety standard as a manufacturing constraint for printed wiring boards, and the manufacturer of the printed wiring board has obtained the certification according to that standard and respects that standard. Manufacturing in a safe manner is widely performed because it provides convenience in product transactions. (See Non-Patent Document 1 for UL standards)
Regarding the dimensional standard of the conductor pattern of the printed wiring board based on this standard, a typical standard item (requirement) relates to the maximum conductor diameter. The maximum conductor diameter (Maximum unpierced conductor area) is generally determined by the following non-patent literature: “The maximum conductor area without any holes in the printed wiring board is determined by the largest circle that can be inscribed in the pattern. It must not exceed the circle of the diameter that is specified. "
An apparatus and method for inspecting the above-mentioned standard items using CAD design data has been proposed. (For example, see Patent Document 1). In this example, the pattern layout data of the circuit pattern on the printed wiring board is first compared with the design rule check value, and if it does not conform to it, it is further judged whether it can actually be manufactured by comparing with the manufacturing process rule check data. Yes.

  Alternatively, in order to inspect whether or not the design value of the printed wiring board manufacturing conductor pattern is compatible with the standard value, conventionally, after the printed wiring board manufacturing process design is determined, the CAM (Computer Aided Manufacturing) The person in charge of the editing machine inspected each standard item according to the instruction of the manufacturing process design document.

UL796 8th edition "printed wiring board" (translation) Safety Issues Study Group 2003 JP 07-319933 A

  However, according to the demand for high-density wiring of the printed wiring board, restrictions on the manufacturing process are complicated regarding the conductor pattern based on the design data for manufacturing the printed wiring board. For example, with respect to constraints such as pattern size and area dimensions, a conventional inspection method that checks the pattern data of a printed wiring board using a standard value as it is as a determination criterion cannot perform an accurate and reliable inspection. There is a point.

  In particular, the standard value for the conductor pattern required by the safety standard for printed wiring boards (hereinafter referred to as the UL standard) for the manufacturing process is as described above. The standard for the maximum conductor diameter is the concept of an inscribed circle. It is a limitation, and the method of determining and determining one-dimensionally measured values by sensitively estimating the existence area of nonconformity does not result in an accurate inspection. Therefore, in the actual procedure, the inspection is performed by a method of extracting a conductor pattern that seems to be incompatible with the manufacturing constraints while visually checking the conductor pattern displayed on the display device. In such a sensitive method, there is a possibility that an inspection failure or a measurement error may occur, and the reliability may be lowered and the work time may be enormous.

The present invention has been made in view of the above viewpoint, and an inspection method for quickly and reliably inspecting conformity to restrictions on manufacturing processes complicated with respect to design data of printed wiring boards. The purpose is to provide an inspection device.
The design data inspection method according to the present invention is a design data inspection method for inspecting a standard value related to a conductor pattern of a printed wiring board, based on the designed design data for printed wiring board manufacture.
A design information storage step of reading, processing and storing the design data;
A display process for displaying inspection results,
A standard input process for inputting standard items and standard values, creating and storing a standard table,
A standard value selection step of selecting a standard value for each predetermined standard item from the standard table;
Using the design data, an inspection data creation step for generating inspection data,
Using the standard value selected in the standard value selection step, an inspection data creation step for generating inspection data,
The method includes a standard determination step of comparing the inspection data with the inspection data to determine suitability of the design data with respect to the standard value.
Further, at least one of the standard items is an item of a maximum conductor diameter relating to a printed wiring board, and when the standard item to be inspected is a maximum conductor diameter, the data to be inspected is stored in the design information storing step. Data generated by performing a negation operation on the conductor pattern information synthesized from the generated data,
The inspection data is a set of circles having the maximum conductor diameter, and is data generated by arranging them at a predetermined pitch in the X direction and the Y direction.
The standard determination step is a determination step related to a standard value of the maximum conductor diameter, and when the inspection data is compared with the inspection data, data that does not overlap the inspection data is inspection result data. It is characterized by comprising the process of displaying as

Furthermore, the design data inspection apparatus according to the present invention is a design data inspection apparatus for inspecting a standard value related to a conductor pattern of a printed wiring board, based on the designed design data for manufacturing the printed wiring board.
Design information storage means for reading, processing and storing the design data;
Display means for displaying inspection results, etc .;
Standard input means for inputting standard items and standard values, creating and storing standard tables,
A standard value selecting means for selecting a standard value for each predetermined standard item from the standard table;
Inspected data creating means for generating data for inspection using the design data;
Using the standard value selected in the standard value selection step, inspection data creating means for generating inspection data,
Standard determination means for comparing the inspection data and the inspection data to determine suitability of the design data with respect to the standard value is provided.
Further, at least one of the standard items is an item of a maximum conductor diameter related to the printed wiring board, and when the standard item to be inspected is a maximum conductor diameter, the data to be inspected is stored in the design information storage unit. Data generated by performing a negation operation on the conductor pattern information synthesized from the generated data,
The inspection data is a set of circles having the maximum conductor diameter, and is data generated by arranging them at a predetermined pitch in the X direction and the Y direction.
The standard determination means is a determination means related to a standard value of the maximum conductor diameter, and when the inspection data is compared with the inspection data, data that does not overlap the inspection data is inspection result data. It is characterized by comprising means for displaying as.

According to the design data inspection method and inspection apparatus according to the present invention having the above-described configuration, the conductor pattern related to the design data for manufacturing a printed wiring board designed by CAD conforms to a complicated constraint value in the manufacturing process. Judgment of sex becomes easy. In addition, the inspection data generated based on the design data for printed wiring board manufacturing is compared with the inspection data generated based on the constraint values in the manufacturing process and judged, so accurate and reliable inspection Can do.
In particular, the inspection of the maximum conductor diameter, which is a restriction item of the UL standard for the conductor pattern, enables an inspection faithful to the definition of the restriction. Further, if there is a non-conformity as a result of the inspection, the non-conforming position information is output based on the design data, which makes it easy to provide information to the designer and make it easy to understand.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The design data inspection apparatus according to the present invention has been shown to be implemented by a computer apparatus independent of the printed wiring board design apparatus using CAD, but may be an apparatus integrated with CAD.

[Design data inspection equipment]
The present invention inspects whether the data of a conductor pattern designed for the production of a printed wiring board conforms to a standard value relating to the dimensions of a conductor pattern certified for each production process. If there is, the design data inspection apparatus 1 detects the conductor pattern.

FIG. 1 shows a system configuration block diagram of a design data inspection apparatus 1 according to the present invention.
In the design data inspection apparatus 1, the design information storage means 2 is means for reading design data for manufacturing a printed wiring board designed by a CAD system and storing it as inspection information after performing predetermined processing described later. .
The display means 8 is a means for causing the display 10 or the printer 11 to display inspection information, a standard table used in the standard input means 3 and standard value selection means 4 described later, and inspection result data in a standard determination means 7 described later. . The standard input means 3 is a means for creating a standard table from the manufacturing process name input using the display means 8 and the standard values of standard items related to the conductor pattern.

Further, the standard value selection means 4 displays the standard table by the display means 8, and specifies the standard value for each standard item to be inspected by the operator selecting the manufacturing process name in the standard table in an interactive format. Means. The inspected data creation means 5 is means for generating predetermined inspected data for each standard item to be inspected using the information for inspection.
The inspection data creation means 6 is means for generating predetermined inspection data based on the standard value selected by the standard value selection means 4. Further, the standard judging means 7 judges the conformity with respect to the standard value of the design data for manufacturing the printed wiring board by comparing the inspected data and the inspecting data, and inspects if there is a nonconformity. It is a means for displaying and storing the result data using the display means 8.

The design data inspection apparatus 1 of the present invention further includes a keyboard and a pointing device input device that are commonly used in the design information storage means 2 and the standard input means 3. In addition to the processed design data, the created standard table, the selected standard value, the generated data for inspection, the inspection data and the inspection result data, etc., the storage device 9 is connected. A program for executing the flowchart is stored.
The display means 8 is connected to a display 10 and a printer 11 for displaying image information or numerical information. In addition, an interface (not shown) for reading design data of a printed wiring board designed by another CAD design apparatus is provided. The design data inspection apparatus 1 of this embodiment is connected to the printed wiring board CAD apparatus via a LAN, but the design data may be read via a storage medium.

[Flow chart of design data inspection method]
FIG. 2 is a flowchart showing a design data inspection method for manufacturing a printed wiring board according to the present invention. In the design data inspection method of the present embodiment, first, design data for manufacturing a printed wiring board is processed into information for inspection. On the other hand, maximum conductor diameter information as a UL standard value for each manufacturing process is created as a standard table, and a standard value for a predetermined manufacturing process is selected.

  Next, conductor pattern negative operation graphic data is generated as inspection data from the inspection information, and standard circle graphic data is generated from the standard value. Thereafter, both graphic data are compared, and a standard circle having an overlapping portion or a contact point with the conductor pattern negative calculation graphic data is deleted from the standard circular graphic data to generate inspection result data. This test result data is used to determine the suitability of the design data with respect to the standard value of the maximum conductor diameter.

The embodiment will be described below with reference to FIG. 2 and the related drawings.
In FIG. 2, processing (excluding activation and termination of the apparatus) involved by the operator for selection / determination is represented by a parallelogram frame. Other than that, it shows that the inspection apparatus of the present invention is an automatic process.
In this embodiment, design data for manufacturing a printed wiring board having six layers will be described. The design data for manufacturing a printed wiring board is generally composed of a plurality of virtual layer information in a CAD apparatus, and the outline is information as shown on the left side of FIG. In order to inspect the conductor pattern of each layer according to this embodiment, the layer No. 3 circular hole information, layer no. Layer No. 30 as board outline information and conductor pattern information of each layer. 5-7 upper surface pattern information, layer No. 8-10 bottom surface pattern information and No. 69 to 82 inner layer layer information is used.

  In step S200 of FIG. 2, the design data inspection apparatus of the present invention is started up. In step S202, design data for manufacturing a printed wiring board is read using the design information storage means 2. First, an information storage holder (see the right side of FIG. 3) is prepared in the storage device 9 of the inspection apparatus. Thereafter, a layer necessary for this inspection is extracted from design data for manufacturing a printed wiring board, processed and stored in the storage holder. The processing at this time does not change, add, or delete the dimensions and layout position information held in the design data, but synthesizes multiple layer information or sets the information attributes such as positive information and negative information. Information is reversed.

FIG. 4 shows an example of layer information. FIG. 4 is a visual illustration for easy understanding of the relationship between information positive / negative information, and the information is shown in black. For example, the design data of the first layer (upper surface) of this embodiment will be described in detail. The solid pattern information for obtaining the shielding effect is the layer number. 6 is stored as negative information of “upper surface negative” (see (a) of FIG. 4), and information for extracting conductors in a specific area in the solid pattern is layer No. 7 is stored as negative information (see FIG. 4B).
In addition, the information on the layer number is used to place the conductor pattern of the wiring in this “upper surface negative” area. 5 is stored in the “upper surface positive pattern” as positive information (see FIG. 4C). Therefore, the conductor pattern information on the upper surface of the first layer needs to be stored in the storage holder after combining the three layer information into one information.

  The method is the negative information layer No. 6 Information on “Top Negative” and layer no. 7 After combining the information of “upper surface negative”, this information is negated to generate new positive information. In addition to this, the layer number of the positive information. 5 is added and synthesized (FIG. 4D), and the layer number of the storage holder is used as the information for the positive information inspection of the first layer. 101. The design data of the second to sixth layers below are processed by combining layer information or adjusting information attributes according to the structure and attributes of the information. 102-105 and layer no. 111 respectively.

  Next, the layer No. 3 circular hole information and layer No. The information on the 30 board outlines is stored in each storage holder layer number. 3 and layer no. 30. Thus, step S202 is completed.

  In the process of step S202 in this embodiment, the operator confirms the configuration information and design specifications of the design data, including whether the information of each layer is negative information or positive information, or whether the information of a plurality of layers should be combined. The information is extracted and processed and stored in the storage holder. However, if the layer structure and attributes of the design data are uniformly arranged, it may be automatically programmed.

  In the standard input process of step S204, the operator performs a process of inputting or changing the standard value of the standard item that the UL standard has certified to the manufacturer for each manufacturing process in the standard table. That is, the standard table shown in FIG. 5 is displayed on the display 10 by the display means 8, and the operator inputs the standard value certified by the UL standard into the column designated by the manufacturing process name and the standard item using the keyboard. The addition of new manufacturing processes and changes in standard values can be edited in the same way. The same applies to the addition of standard items. Thereafter, the created standard table is stored in the storage device 9. This standard input process is a process that can pass to the next step S206 if a standard table has already been created.

  In the standard value selection process in step S206, the standard table is displayed on the display 10 from the storage device 9 by the standard value selection means, and the operator designates the manufacturing process name determined in the manufacturing design of the printed wiring board by the pointing device or the like. In this case, the standard value used for the inspection for each standard item in the manufacturing process can be selected. In this embodiment, the manufacturing process name T-2 is selected as shown in FIG. 5, and the standard value of the maximum conductor diameter is 40.0 mm.

(Measurement of maximum conductor diameter)
Hereinafter, the inspection of the maximum conductor diameter for the design data will be described in detail. Steps S208 to S218 in FIG. 2 are processes for generating inspection data, steps S220 to S222 are processes for generating inspection data, and steps S224 to S226 are processes for determining conformity with standards.

  First, in step S208, the first layer to be inspected is designated as the first layer, and in the next step S210, the layer number of the storage holder is stored from the storage device 9 as information for inspecting the first layer. 101, “top surface positive pattern” information is read.

  In step S212, the read layer No. 101. It is determined whether the information of “upper surface positive pattern” is negative information or positive information. In the case of positive information, the process proceeds to step S214. In the case of negative information, the process proceeds to step S213, and after being reversed to positive information, the process proceeds to step S214. The first layer of this embodiment is positive information, and the process proceeds to step S214 as it is. This information is the same information that has been stored by processing the design data in step S202, and is displayed as shown in FIG. In FIG. 6 (a), the conductor pattern portion is visually displayed in a state where it is not painted in order to facilitate the following description.

In manufacturing a printed wiring board, the information shown in FIG. 6C is generated from the information shown in FIG. 6A by the CAM device, and this information is drawn on the photosensitive film to create a photomask. Next, the photomask image is transferred to the photoresist coated on the copper surface of the copper-clad laminate, which is the material of the printed wiring board, and the design data is etched by etching the copper using the photoresist image as a mask. A copper pattern is formed by accurately transferring the conductor pattern at.
The conductor pattern painted black in FIG. 6C is formed as a copper pattern on the printed wiring board. The present invention has a practical purpose to inspect the conformity with respect to the restriction (standard) value of the dimension of the copper pattern to be manufactured with the design data for manufacturing the printed wiring board described above.

  In FIG. 6A, the conductor pattern 4 of the wiring is designed with components that start from the land element 41 and continue from the line segment element 42 to the line segment element 43, and have the pad element 44 as an end point. . In FIG. 6, the border line of each pattern component is drawn. The solid conductor pattern 5 is a conductor pattern composed of the surface elements 51 to 54 and the land elements 55 attached to the positions of the circular holes, and is drawn with border lines of the respective components. The center of the land element 55 is where a circular hole is processed in the manufacturing process.

  Next, in the process of synthesizing the circular hole information in step S214, the layer number is stored from the saved file in the storage device 9. The circular hole information of No. 3 is read out, and this circular hole portion is inverted into negative information with no information, and is combined with the processing information up to step S214. The circular hole information of the present embodiment is one place of the circular hole to be processed at the center of the land element 55 and three places at the center of the land of the conductor patterns 4 and 6 of the wiring, and each circular hole 56 has a circle border line. This is shown in FIG. 6 (b).

  Thereafter, in step S216, the information shown in FIG. 6B is contoured to obtain the information shown in FIG. 6C. That is, by the contouring process, the wiring pattern 4 replaces the set of information from the land element 41 to the pad element 44 with the pattern information of one wiring. Similarly, the solid pattern 5 has the surface elements 51 to 54 and the land elements. The information set of the element 55 is replaced with information of one continuous solid pattern. As a result, information of each conductor pattern bordered by the outline is obtained. FIG. 6D shows a visual display of the conductor pattern of the information after the contouring process painted black.

  Next, in the negative operation graphic process of step S218, a negative operation process is performed on the information of FIG. 6D that has been processed up to step S216 to generate conductor pattern negative operation graphic data (see FIG. 6E). . The first layer data to be inspected relating to the maximum conductor diameter is generated by the processing from step S208 to step S218. That is, in FIG. 6E, the conductor pattern is inverted and displayed in white without information, and the area other than the conductor pattern is generated as black with information.

(Judgment method)
The process of generating inspection data relating to the standard item of the maximum conductor diameter will be described using steps S220 to S222. This is shown in FIG. First, in the process of step S220, the layer number is changed from the storage holder of the storage device 9. The board outline information stored in 30 is read out and framed. In the generation process of the standard circle graphic data in step S222, the center coordinates of the standard circle whose diameter is the standard value of the maximum conductor diameter are set at a predetermined pitch in the X direction and the Y direction so as to fall within the region of the outline. Generate a set of standard circles. (See FIG. 7 (a)).

  In this embodiment, standard circle graphic data in which 40.0 mm diameter circles selected in the standard value selection process (step S206) are arranged at a pitch of 0.2 mm in the X and Y directions is created as inspection data. FIG. 7A schematically shows the process of step S222 represented by the circumference of the standard circle information.

Next, the standard determination process will be described with reference to steps S224 to S226. First, in step S224, the conductor pattern negative operation graphic data that is the data to be inspected and the standard circle graphic data that is the verification data are overlaid and compared. (Refer FIG.7 (b)).
Next, the standard circle having the overlapping part or the contact part with the information (black pattern in FIG. 6 (e)) in the conductor pattern negation graphic data is deleted from the inspection data and displayed schematically. Generate inspection result data. (See FIG. 7 (c)). As shown in FIG. 7C, the processing result up to step S224 is the remaining standard circle 71, and the conductor pattern 72 inscribed in the standard circle is wider than the diameter of the circle certified by the UL standard. It has an area and is found to be incompatible with the maximum conductor diameter standard. If the standard circle information does not remain in the inspection result data in the processing so far, the design data is compatible, and if the standard circle information remains, the design data is incompatible with the maximum conductor diameter. Further, the center coordinates of the remaining circle are stored as position information indicating the position of nonconformity.

Next, in step S228, the name of the inspected layer is displayed, and if there is no remaining circle information, it is displayed as conforming. If there is any remaining standard circle information, the inspection result data is displayed on the display 10 by the display means 8. At the same time, the inspection result data is stored in the storage device 9.
Thus, the inspection of the first layer is completed, and thereafter, until the completion of the inspection of the sixth layer of the lowermost layer, the steps S210 to S229 are repeated to inspect the design data for manufacturing the printed wiring board regarding the standard value of the maximum conductor diameter. finish.

  In the above embodiment, in generating the standard circle graphic data, the standard circle graphic data generated by arranging the standard circles at the same pitch with a predetermined area larger than the substrate outline without using the information of the board outline is created and inspected. It is also preferable to use the data.

Further, the pitch for arranging the standard circles is not limited to 0.2 mm, and it is preferable to set a pitch that is practically acceptable in consideration of the detection level in the determination described later. In order to increase the detection level in determination, it is preferable to make the pitch smaller. In addition, it is preferable to create inspection data using a circle slightly smaller than the standard circle of the maximum conductor diameter instead of the standard circle in order to improve the detection level and speed up the inspection.

  The verification result data can be provided as electronic information to the designer of the printed wiring board, and the design data is corrected or edited based on the result. According to the embodiment of the present invention, as shown in FIG. 7C, the inspection result data is obtained based on the design data, which is very easy to understand for the designer.

  Information of verification result data generated by the present invention can be provided to the designer in any information form such as electromagnetic medium, information transmission or hard copy, and a simple verification result with high reliability and accuracy can be designed. Information can be provided to the person. In this embodiment, the inspection of the design data for manufacturing the 6-layer printed wiring board has been described. However, the present invention does not depend on the number of layers and can cope with all the design data for manufacturing the printed wiring board. .

The present invention is useful for quickly determining pass / fail at the design stage with respect to the standard value of the conductor width of a printed wiring board. It is also useful to design this function while inspecting it by incorporating this function into the CAD apparatus as one inspection function.
The present invention can also be used for inspection of design data with respect to design rules. Furthermore, it can also be developed into design data of semiconductor circuit patterns.

It is a block diagram illustrating the basic composition of the inspection device by the present invention. It is a flowchart figure which illustrates the embodiment of the inspection method by this invention. It is a figure which illustrates the relationship between the information structure of the design data in the embodiment of this invention, and the information structure of the information for test | inspection. It is a figure which illustrates visually the structure of the design data of the 1st layer (upper surface) in the embodiment of the present invention. It is a figure which shows the example of the specification table in the aspect of this invention, and shows the largest conductor diameter corresponding to a manufacturing process name. It is a figure which illustrates visually the production | generation process of the to-be-inspected data in the embodiment of this invention. It is a figure which shows visually the test result data obtained by comparing the test data generation process, test data, and data to be tested in the embodiment of the present invention.

Explanation of symbols

4 Wiring conductor pattern 5 Solid conductor pattern 56 Circular hole

Claims (8)

In the design data inspection method for inspecting the standard value for the conductive pattern of the printed wiring board based on the design data for manufacturing the printed wiring board,
A design information storage step of reading, processing and storing the design data;
A display process for displaying inspection results,
A standard input process for inputting standard items and standard values, creating and storing a standard table,
A standard value selection step of selecting a standard value for each predetermined standard item from the standard table;
Using the design data, an inspection data creation step for generating inspection data,
Using the standard value selected in the standard value selection step, an inspection data creation step for generating inspection data,
A design data inspection method comprising: a standard determination step of comparing the inspection data and the inspection data to determine suitability of the design data with respect to the standard value.   The design data inspection method according to claim 1, wherein at least one of the standard items is an item of a maximum conductor diameter relating to a printed wiring board. The standard item to be inspected is the maximum conductor diameter,
The data to be inspected is data generated by performing a negative operation of the conductor pattern information synthesized from the design data,
The inspection data is a collection of circles having the maximum conductor diameter, and is inspection data generated by arranging them at a predetermined pitch in the X direction and the Y direction. Design data inspection method.   The standard determination step is a determination step relating to a standard value of the maximum conductor diameter, and when the inspection data is compared with the inspection data, data that does not overlap the inspection data is displayed as inspection result data. 4. The design data inspection method according to claim 1, further comprising the step of: Based on design data for printed wiring board manufacture, in a design data inspection apparatus that performs inspection of standard values for conductor patterns of printed wiring boards,
Design information storage means for reading, processing and storing the design data;
Display means for displaying inspection results, etc .;
Standard input means for inputting standard items and standard values, creating and storing standard tables,
A standard value selecting means for selecting a standard value for each predetermined standard item from the standard table;
Inspected data creating means for generating data for inspection using the design data;
Using the standard value selected in the standard value selection step, inspection data creating means for generating inspection data,
A design data inspection apparatus comprising: a standard determination unit that compares the data to be inspected with the data for inspection to determine the suitability of the design data with respect to the standard value.   The design data inspection apparatus according to claim 5, wherein at least one of the standard items is an item of a maximum conductor diameter relating to a printed wiring board. The standard item to be inspected is the maximum conductor diameter,
The data to be inspected is data generated by performing a negative operation of the conductor pattern information synthesized from the design data,
7. The design according to claim 5, wherein the inspection data is a set of circles having the maximum conductor diameter, and is generated by arranging the circles at a predetermined pitch in the X direction and the Y direction. Data inspection device. The standard determination means is a determination means related to a standard value of the maximum conductor diameter, and when the inspection data is compared with the inspection data, data that does not overlap the inspection data is displayed as inspection result data. The design data inspection apparatus according to claim 5, wherein the design data inspection apparatus comprises:

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