JP2005314720A - Vacuum treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate waiting time for vacuum treatment and shorten tact time. <P>SOLUTION: A vacuum treatment apparatus 10 comprises a load chamber 11, a vacuum preheating chamber 12, a treatment chamber 13 and an unload chamber 14. In the vacuum preheating chamber 12, vacuum treatment is carried out on a substrate W for a longer period of time than that in a treatment chamber 13. The load chamber 11 has a switchable structure between an atmosphere release state and a vacuum closed state, and carries the substrate W out to the vacuum preheating chamber 12. The unload chamber 14 has also a switchable structure between an atmosphere release state and a vacuum closed state, and carries a treated substrate W in from the treatment chamber 13. The vacuum preheating chamber 12 has a capability of simultaneously treating more pieces of substrates W than the treatment chamber 13 has. The vacuum preheating chamber 12 has a carrier device 15 provided therein which further has changeable transportation lines L1 and L2 for transporting the substrate W from the treatment chamber 13 to the unload chamber 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a vacuum processing apparatus that performs thin film formation, etching, heat treatment, and the like in a vacuum atmosphere.

  In a case where a plurality of different vacuum processes are sequentially performed with one apparatus, a vacuum preheating chamber is provided as a device for transferring an object to be processed from a processing chamber to the next processing chamber in a vacuum. There is known a load lock type vacuum apparatus provided with a plurality of substrate transfer means. This apparatus is configured to transfer another preheated substrate from the vacuum preheating chamber to the processing chamber using the substrate transfer means while continuing to preheat the substrate in the vacuum preheating chamber (for example, Patent Document 1).

JP 2001-239144 A (2nd page, FIG. 2)

  In the load lock type vacuum apparatus of Patent Document 1, when the processed substrate is taken out into the atmosphere, the inside of the vacuum preheating chamber must be once leaked to the atmospheric pressure. During this operation, there is a problem that vacuum preheating cannot be performed and a processing time gap occurs.

(1) In the vacuum processing apparatus according to the first aspect, a long-time processing chamber for performing vacuum processing with a long processing time, a short-time processing chamber for performing vacuum processing with a short processing time, and an object to be processed before processing are first vacuumed. The load chamber that can be switched between open to the atmosphere and vacuum sealed, which is carried out to the processing chamber where processing is performed, and the open to air and vacuum sealed, where the processed object is finally transported from the processing chamber where vacuum processing is performed. The long-time processing chamber is configured to simultaneously process a larger number of objects to be processed simultaneously in the short-time processing chamber. In the long-time processing chamber of this vacuum processing apparatus, the workpiece is transferred from the loading chamber or the processing chamber that performs vacuum processing immediately before to the unloading chamber or the processing chamber that performs vacuum processing immediately after passing through the long-time processing chamber. It is preferable to provide a transport means having two or more switchable transport paths.
(2) The vacuum processing apparatus according to claim 3 is the vacuum processing apparatus according to claim 1 or 2, wherein the first processing chamber is a long-time processing chamber and the last processing chamber is a short time. It may be a processing chamber. According to a fourth aspect of the present invention, in the vacuum processing apparatus of the first or second aspect, the first processing chamber is a short-time processing chamber, and the last processing chamber is a long-time processing. It may be a room.
(3) The vacuum processing apparatus according to claim 5 is the vacuum processing apparatus according to claim 1 or 2, wherein a plurality of long-time processing chambers are provided, and the first processing chamber for vacuum processing is the first long-time processing chamber. In addition, the processing chamber that performs vacuum processing last may be the second long-time processing chamber. A vacuum processing apparatus according to a sixth aspect is the vacuum processing apparatus according to the first or second aspect, wherein a plurality of short-time processing chambers are provided, and the processing chamber that performs vacuum processing first is the first short-time processing chamber. The processing chamber in which the vacuum processing is finally performed may be the second short-time processing chamber.

(4) A vacuum processing apparatus according to a seventh aspect includes a long-time processing chamber for performing vacuum processing with a long processing time, a short-time processing chamber for performing vacuum processing with a short processing time adjacent to the long-time processing chamber, and a pre-processing A delivery chamber that can be switched between open to the atmosphere and vacuum-sealed, which carries out the long-time vacuum treatment and the short-time vacuum treatment through the long-time treatment chamber. The long-time processing chamber is configured to simultaneously process a larger number than the number of objects to be processed simultaneously by the short-time processing chamber. In the long-time processing chamber of this vacuum processing apparatus, the first transfer path for transferring the processing object from the delivery chamber to the short-time processing chamber via the long-time processing chamber and the processing object are stored in the short-time processing chamber. It is preferable to provide a transfer means having a second transfer path for transferring to the delivery chamber via the processing chamber for a long time.
(5) A vacuum processing apparatus according to a ninth aspect includes a long-time processing chamber for performing vacuum processing with a long processing time, a short-time processing chamber for performing vacuum processing with a short processing time adjacent to the long-time processing chamber, and a pre-processing A delivery chamber that can be switched between open-to-air and vacuum-sealed, which carries out the short-time vacuum processing and the long-time vacuum processing through the short-time processing chamber. The long-time processing chamber is configured to simultaneously process a larger number than the number of objects to be processed simultaneously by the short-time processing chamber. In the long-time processing chamber of the vacuum processing apparatus, there is provided a transfer means having a first transfer path for carrying an object to be processed from the short-time processing chamber and a second transfer path for transferring the workpiece to the short-time processing chamber. It is preferable to provide it.

  The vacuum processing apparatus of the present invention is provided with a chamber that can be switched between open to the atmosphere and vacuum-sealed, and the number of treatments in the long-time treatment chamber is larger than the number of treatments in the short-time treatment chamber, thereby eliminating the waiting time for the treatment. The tact time of the entire process can be shortened.

Hereinafter, a vacuum processing apparatus according to an embodiment of the present invention will be described with reference to FIGS.
<First Embodiment>
FIG. 1 is an overall configuration diagram schematically showing a configuration of a vacuum processing apparatus according to a first embodiment of the present invention. The vacuum processing apparatus 10 includes a load chamber 11, a vacuum preheating chamber 12, a processing chamber 13, an unload chamber 14, and a transfer device 15. The load chamber 11 and the unload chamber 14 are configured to be switchable between open air and vacuum sealing. The vacuum preheating chamber 12 and the processing chamber 13 are always kept in vacuum while the vacuum processing apparatus 10 is in operation. The load chamber 11 is connected to the exhaust system 11a and the leak system 11b, and the unload chamber 14 is connected to the exhaust system 14a and the leak system 14b. The vacuum preheating chamber 12 and the processing chamber 13 are connected to exhaust systems 12a and 13a, respectively. The external station 30 is configured as a separate body from the vacuum processing apparatus 10 and is a casing for storing the substrate W before processing and supplying it to the vacuum processing apparatus 10, and the inside is always at atmospheric pressure. .

  The load chamber 11 is provided with a gate G 1 facing the external station 30 side, and a gate G 2 is provided at the boundary between the load chamber 11 and the vacuum preheating chamber 12. A gate G3 is provided at the boundary between the vacuum preheating chamber 12 and the processing chamber 13, and a gate G4 is provided at the boundary between the processing chamber 13 and the unload chamber 14. The unload chamber 14 is provided with a gate G5. The gates G <b> 1 to G <b> 5 each seal the chamber when the substrate W is processed, and open the chamber when the substrate W is loaded and unloaded. The substrate W is an object to be processed that is heated in the vacuum preheating chamber 12 and subjected to predetermined processing, for example, film formation, etching, and sputtering, in the processing chamber 13.

  A conveying device 15 is provided in the vacuum preheating chamber 12. The transfer device 15 has two lines of transfer lines for carrying the substrate W from the load chamber 11 and carrying the substrate W out to the processing chamber 13 when the preheating is completed. Switching between the two transport lines L1 and L2 is performed by moving the substrate W in the vertical direction (y direction) in the figure by a lift mechanism (not shown). That is, the transport device 15 is configured to be able to switch between a solid line display position (referred to as a lower position) and a two-dot chain line display position (referred to as an upper position) in the drawing. A heater 16 for preheating the substrate W is disposed in each of the two transport lines L1 and L2.

  FIG. 2 is a perspective view schematically showing the transfer device 15 of the vacuum processing apparatus according to the present embodiment. The transport device 15 includes a heater 16, carry-in / out ports 17 a and 17 b, transport members 18 a and 18 b, and a lift mechanism 19. The carry-in / out ports 17a and 17b are openings through which the substrate W passes. The conveying members 18a and 18b are a plurality of rotating members that place the substrate W during preheating and rotate around the axis when carrying in and out to transfer the substrate W along the conveying lines L1 and L2. The inside of the conveying device 15 has a two-stage structure, and one set of the carry-in / out port 17a and the carrying member 18a constitutes the carry line L1, and one set of the carry-in / out port 17b and the carry member 18b constitutes the carry line L2. The conveyance lines L1 and L2 are independent conveyance lines. In FIG. 2, only one heater 16 is shown, but as shown in FIG. 1, the heaters 16 are arranged on the transfer lines L <b> 1 and L <b> 2 so as to be independently controllable one by one.

  The transport device 15 has a lift mechanism 19, and the lift mechanism 19 includes a moving shaft 19 a and a fixed shaft 19 b, and the upper surface of the moving shaft 19 a is fixed to the bottom surface of the upper portion of the transport device 15. By a power mechanism (not shown), the moving shaft 19a moves in the y direction with respect to the fixed shaft 19b and moves up and down the upper portion of the conveying device 15. The vacuum processing apparatus 10 is also provided with a loading apparatus for loading the substrate W from the external station 30 to the load chamber 11 and a unloading apparatus for unloading the substrate W from the unload chamber 14 to the outside of the apparatus. Omitted.

  Hereinafter, the transfer operation of the substrate W will be described with reference to FIG. FIG. 3 is a timing chart of substrate conveyance using the vacuum processing apparatus 10, and (a) to (d) represent the internal state of the apparatus when a predetermined time has elapsed. In addition, in order to avoid becoming complicated, the code | symbol of a component is attached | subjected only to Fig.3 (a).

  In the present embodiment, it is assumed that the preheating time in the vacuum preheating chamber 12 is longer than the processing time in the processing chamber 13. That is, the vacuum preheating chamber 12 corresponds to a long-time processing chamber, and the processing chamber 13 corresponds to a short-time processing chamber. Now, based on the processing time (cycle time) T of the processing chamber 13, the preheating time of the vacuum preheating chamber 12 is 2 × T. Arrows x1 to x5 indicate operations of passing the substrate W through the gates G1 to G5, respectively. In operation x1, after the pressure of the load chamber 11 is adjusted to atmospheric pressure, the gate G1 is opened to load the substrate W, the gate G1 is closed, and the load chamber 11 is evacuated. Similarly, in the operation x5, after the pressure of the unload chamber 14 is adjusted to the atmospheric pressure, the gate G5 is opened to unload the substrate W, the gate G5 is closed, and the unload chamber 14 is evacuated. In operations x2, x3, and x4, the chambers are under substantially the same vacuum pressure, and the gates are opened and closed without adjusting the pressure. The substrates W are numbered as W1, W2, W3... In the order of processing.

  FIG. 3A shows a state of the vacuum processing apparatus 10 when the first substrate W1 is transferred from the vacuum preheating chamber 12 to the processing chamber 13 by the operation x3, and this is an initial state t = 0. . At this time, the transport device 15 is in the lower position, and the processing time T has elapsed for the substrate W2 in the lower stage of the transport device 15. The substrate W3 is transferred to the upper stage of the transport device 15 by the operation x2. The substrate W4 is carried into the load chamber 11 by the operation x1. When the substrate W is carried in, the load chamber 11 is opened to the atmosphere and evacuated after the loading.

  FIG. 3B shows the state of the vacuum processing apparatus 10 when one cycle has elapsed and t = T. At this time, the substrate W1 is transferred to the unload chamber 14 by the operation x4. The substrate W2 which has been transferred to the upper position and has been processed for the cycle time 2 × T is transferred to the processing chamber 13 by the operation x3. For the substrate W3, the processing time T has passed in the upper stage of the transfer device 15. The substrate W4 is transferred to the lower stage of the transport device 15 by the operation x2. The substrate W5 is carried into the load chamber 11 by the operation x1.

  FIG. 3C shows the state of the vacuum processing apparatus 10 when one cycle has elapsed and t = 2T. At this time, the substrate W1 is carried out of the apparatus by the operation x5. The substrate W2 is transferred to the unload chamber 14 by the operation x4. The substrate W3 which has been transferred to the lower position and has been processed for the cycle time 2 × T is transferred to the processing chamber 13 by the operation x3. For the substrate W4, the processing time T has passed in the lower stage of the transfer device 15. The substrate W5 is transferred to the upper stage of the transfer device 15 by the operation x2. The substrate W6 is carried into the load chamber 11 by the operation x1.

  FIG. 3D shows the state of the vacuum processing apparatus 10 when one cycle has elapsed and t = 3T. At this time, the substrate W2 is carried out of the apparatus by the operation x5. The substrate W3 is transferred to the unload chamber 14 by the operation x4. The substrate W4 that has been transferred to the upper position and has been processed for the cycle time 2 × T is transferred to the processing chamber 13 by the operation x3. For the substrate W5, the processing time T has passed in the upper stage of the transfer device 15. The substrate W6 is transferred to the lower stage of the transport device 15 by the operation x2. The substrate W7 is carried into the load chamber 11 by the operation x1.

  Hereinafter, a plurality of substrates W can be processed continuously by repeating the above steps. As shown in the timing chart of FIG. 3, the substrate W is always present in the load chamber 11, the vacuum preheating chamber 12, the processing chamber 13, the unload chamber 14, and the transfer device 15, and no idle time is generated. . Accordingly, the tact time can be shortened when a plurality of types of vacuum processing are performed by a single vacuum processing apparatus.

  In the present embodiment, in the vacuum processing apparatus 10 having a four-chamber configuration including the load chamber 11, the vacuum preheating chamber 12, the processing chamber 13, and the unload chamber 14, a long time treatment (preheating) is performed first, and a short time later. Although the apparatus configuration is such that the processing is performed, the present invention can also be applied to a vacuum processing apparatus in which the preheating time is shorter than the processing time in the processing chamber 13, that is, the processing is performed first for a short time. In this case, a transfer device 15 having a two-stage transfer line may be provided in the processing chamber 13 that performs long-time processing. Furthermore, the present invention can also be applied to a vacuum processing apparatus in which a processing chamber that performs another long-time processing and / or a processing chamber that performs another short-time processing is connected between the vacuum preheating chamber 12 and the processing chamber 13. .

  As a modification of the present embodiment, a vacuum processing apparatus in which the first processing chamber is a long-time processing chamber and the last processing chamber is another long-time processing chamber, The present invention can also be applied to a vacuum processing apparatus in which a processing chamber for performing processing is a short-time processing chamber and a processing chamber for performing vacuum processing is another short-time processing chamber. Even in the case of the above-described modification, a transfer device 15 having a two-stage transfer line may be provided in a processing chamber that performs long-time processing. Further, in the case of a vacuum processing apparatus in which the first processing chamber is a long-time processing chamber and the last processing chamber is another long-time processing chamber, the space between these two long-time processing chambers. Of course, a short-time processing chamber is connected, but a third long-time processing chamber can also be provided. Further, in the case of a vacuum processing apparatus in which the first processing chamber is a short-time processing chamber and the last processing chamber is another short-time processing chamber, the space between these two short-time processing chambers. In addition, it is natural that a long-time processing chamber is connected, but a third short-time processing chamber can also be provided.

<Second Embodiment>
FIG. 4 is an overall configuration diagram schematically showing the configuration of the vacuum processing apparatus according to the second embodiment of the present invention. The vacuum processing apparatus 20 includes a load / unload chamber 21, a vacuum preheating chamber 22, a processing chamber 23, and a transfer device 15. The load / unload chamber 21 is configured to be switchable between atmospheric release and vacuum sealing. The vacuum preheating chamber 22 and the processing chamber 23 are always kept in vacuum while the vacuum processing apparatus 20 is in operation. The load / unload chamber 21 is connected to an exhaust system 21a and a leak system 21b. The vacuum preheating chamber 22 and the processing chamber 23 are connected to exhaust systems 22a and 23a, respectively. The external station 40 is configured as a separate body from the vacuum processing apparatus 20 and is a housing for storing and supplying the substrate W before processing to the vacuum processing apparatus 20 and collecting the processed substrate W. The interior is always at atmospheric pressure.

  The load / unload chamber 21 is provided with a gate G 6 facing the external station 40, and a gate G 7 is provided at the boundary between the load / unload chamber 21 and the vacuum preheating chamber 22. A gate G8 is provided at the boundary between 22 and the processing chamber 23. Each of the gates G6 to G8 seals the chamber when the substrate W is processed, and opens the chamber when the substrate W is loaded and unloaded.

  In the vacuum preheating chamber 22, a transfer device 25 similar to the transfer device 15 of the first embodiment is provided. The configuration of the transport device 25 is the same as that of the transport device 15, but the transport direction by the transport line is different. The transfer device 25 loads the substrate W from the load / unload chamber 21, and when the preheating is completed, the transfer device 25 transfers the substrate W that has been processed from the process chamber 23 and the transfer line L <b> 3 for unloading the substrate W to the process chamber 23. A conveyance line L4 for carrying in and carrying out to the load / unload chamber 21 is provided. Description of the structure of the transport device 25 is omitted. In addition, the load / unload chamber 21 has two stages, that is, an upper stage 21A dedicated to carry-out and 21B dedicated to carry-in in accordance with the transfer lines L3 and L4. The same applies to the external station 40.

  FIG. 5 is a timing chart of substrate conveyance using the vacuum processing apparatus 20 according to the second embodiment, and (a) to (d) show the internal state of the apparatus when time elapses. Also in the present embodiment, as in the first embodiment, the vacuum preheating chamber 22 corresponds to a long-time processing chamber, the processing chamber 23 corresponds to a short-time chamber, and the processing time of the processing chamber 23 (Cycle time) Based on T, the preheating time of the vacuum preheating chamber 22 is 2 × T. Arrows x6 to x8 indicate the operation of passing the substrate W through the gates G6 to G8, arrow x9 indicates the operation of sequentially passing the substrate W through the gates G8 and G7, and arrow x10 indicates the operation of passing the substrate W through the gate G6. The operation to pass is shown. Operations x7 and x8 are operations by the transport line L3, and operations x9 are operations by the transport line L4. In operation x6, after the pressure of the load / unload chamber 21 is adjusted to atmospheric pressure, the gate G6 is opened to load the substrate W, the gate G6 is closed, and the load / unload chamber 21 is evacuated. Similarly, in the operation x10, after the pressure of the load / unload chamber 21 is adjusted to atmospheric pressure, the gate G6 is opened, the substrate W is unloaded, the gate G6 is closed, and the load / unload chamber 21 is evacuated. In operations x7, x8, and x9, the chambers are under substantially the same vacuum pressure, and the gates are opened and closed without adjusting the pressure.

  FIG. 5A shows the state of the vacuum processing apparatus 20 when the first substrate W1 is transferred from the vacuum preheating chamber 22 to the processing chamber 23 by operation x8, and this is the initial state t = 0. . At this time, the transfer device 25 is in the lower position, and the substrate W2 has a processing time T in the lower stage of the transfer device 25. The substrate W3 is transferred to the upper stage of the transfer device 25 by operation x7. The substrate W4 is carried into the upper stage 21A of the load / unload chamber 21 by the operation x6.

  FIG. 5B shows the state of the vacuum processing apparatus 20 when one cycle has elapsed and t = T. First, the transfer device 25 is moved to the upper position, and the substrate W1 is transferred from the processing chamber 23 to the lower stage 21B of the load / unload chamber 21 through the vacuum preheating chamber 22 by operation x9. The substrate W2 that has been processed at the cycle time 2 × T is transferred to the processing chamber 23 by the operation x8. For the substrate W3, the processing time T has passed in the upper stage of the transfer device 25. The substrate W4 is transferred to the lower stage of the transport device 25 by the operation x7.

  FIG. 5C shows the state of the vacuum processing apparatus 20 when one cycle has elapsed and t = 2T. Before t = 2T, the load / unload chamber 21 is opened to the atmosphere, and the substrate W1 is carried out to the external station 40 by operation x10, and the substrate W5 is loaded / unload chamber 21 by operation x6. The evacuation is completed. The substrate W2 is transferred from the processing chamber 23 to the lower stage 21B of the load / unload chamber 21 through the vacuum preheating chamber 22 by the operation x9. Subsequently, the transfer device 25 is moved to the lower position, and the substrate W3 that has been processed for the cycle time 2 × T is transferred to the processing chamber 23 by the operation x8. For the substrate W4, the processing time T has passed in the lower stage of the transfer device 25. The substrate W5 is transferred to the upper stage of the transfer device 25 by operation x7.

  FIG. 5D shows the state of the vacuum processing apparatus 20 when one cycle has elapsed and t = 3T. Before t = 3T, the load / unload chamber 21 is opened to the atmosphere, and the substrate W2 is carried out to the external station 40 by the operation x10, and the substrate W6 is loaded by the operation x6. The evacuation is completed. The transport device 25 is moved to the upper position, and the substrate W3 is transferred from the processing chamber 23 to the lower stage 21B of the load / unload chamber 21 through the vacuum preheating chamber 22 by the operation x9. Subsequently, the substrate W4 that has been processed for the cycle time 2 × T is transferred to the processing chamber 23 by the operation x8. For the substrate W5, the processing time T has elapsed in the upper stage of the transfer device 25. The substrate W6 is transferred to the lower stage of the transport device 25 by operation x7.

  Hereinafter, a plurality of substrates W can be processed continuously by repeating the above steps. As shown in the timing chart of FIG. 5, the substrate W is always present in the vacuum preheating chamber 22, the processing chamber 23, and the transfer device 25, and no free time is generated. The load / unload chamber 21 releases the atmosphere and evacuates once in each cycle time for loading and unloading the substrate W. This operation is performed during the processing of the substrate W. It does not occur at all. Accordingly, the tact time can be shortened when a plurality of types of vacuum processing are performed by a single vacuum processing apparatus.

  Since the vacuum processing apparatus 20 of the present embodiment has a three-chamber configuration including a load / unload chamber 21, a vacuum preheating chamber 22, and a processing chamber 23, the four-chamber vacuum processing apparatus 10 of the first embodiment. Compared to, it can achieve downsizing while having the same processing capability.

  Although the vacuum processing apparatus 20 of this Embodiment was an apparatus structure which performs a long time process (preliminary heating) previously and performs a short time process later, reverse the order and perform a short time process first, The present invention can also be applied to long-time processing later. That is, the vacuum preheating chamber 22 and the processing chamber 23 of the present embodiment are exchanged, and the load / unload chamber 21, the processing chamber 23, and the vacuum preheating chamber 22 are arranged in this order. In the case of this modification, since preheating cannot be performed after the processing, vacuum preheating is performed in the processing chamber 23, and the same processing as that in the processing chamber 23 is performed in the vacuum preheating chamber 22. In this case as well, a transfer device 25 having a two-stage transfer line may be provided in a chamber for long-time processing. Further, in the present embodiment and the above-described modification, a vacuum that connects a processing chamber that performs another long-time processing and / or a processing chamber that performs another short-time processing between the short-time processing chamber and the long-time processing chamber. The present invention can also be applied to a processing apparatus.

  The present invention is not limited to the embodiments described above as long as the characteristics are not impaired. For example, in the above embodiment, when the cycle time for short-time processing is T, the cycle time for long-time processing is 2 × T, and the number of transfer lines of the transfer devices 15 and 25 is two. If the cycle time for long-time processing is 3 × T, the number of transfer lines can be increased to three according to the cycle time. Further, the arrangement of the conveying lines is not limited to the upper and lower two stages, but may be two rows in the horizontal direction.

1 is an overall configuration diagram schematically showing a configuration of a vacuum processing apparatus according to a first embodiment of the present invention. It is a perspective view which shows typically the conveying apparatus of the vacuum processing apparatus which concerns on embodiment of this invention. It is a timing chart of substrate conveyance using the vacuum processing apparatus concerning a 1st embodiment of the present invention. It is a whole block diagram which shows typically the structure of the vacuum processing apparatus which concerns on the 2nd Embodiment of this invention. It is a timing chart of substrate conveyance using the vacuum processing apparatus concerning a 2nd embodiment of the present invention.

Explanation of symbols

10, 20: Vacuum processing apparatus 11: Load chamber 12, 22: Vacuum preheating chamber 13, 23: Processing chamber 14: Unload chamber 15, 25: Transfer device G1 to G8: Gate W, W1 to W8: Substrate Processed material)

Claims (10)

A long-time processing chamber for long-time vacuum processing,
A short-time processing chamber for vacuum processing with a short processing time;
A load chamber capable of switching between open-to-air and vacuum-sealed, which unloads the object to be processed to a processing chamber where vacuum processing is first performed;
An unloading chamber capable of switching between opening to the atmosphere and vacuum sealing, carrying in the processing object after processing from the processing chamber for performing vacuum processing at the end,
The vacuum processing apparatus, wherein the long-time processing chamber is configured to simultaneously process a larger number than the number of the objects to be processed that are simultaneously processed in the short-time processing chamber. The vacuum processing apparatus according to claim 1,
In the long-time processing chamber, the object to be processed is transferred from the loading chamber or a processing chamber that performs vacuum processing immediately before to the unloading chamber or a processing chamber that performs vacuum processing immediately after passing through the long-time processing chamber. A vacuum processing apparatus characterized in that a transport means having two or more switchable transport paths is provided. The vacuum processing apparatus according to claim 1 or 2,
The processing chamber that performs vacuum processing first is the long-time processing chamber,
The vacuum processing apparatus is characterized in that the processing chamber for performing vacuum processing at the end is the short-time processing chamber. The vacuum processing apparatus according to claim 1 or 2,
The processing chamber that performs the vacuum processing first is the short-time processing chamber,
The vacuum processing apparatus is characterized in that the processing chamber for performing vacuum processing last is the long-time processing chamber. The vacuum processing apparatus according to claim 1 or 2,
A plurality of the long-time processing chambers are provided,
The first processing chamber that performs vacuum processing is a first long-time processing chamber,
The vacuum processing apparatus is characterized in that the last processing chamber for vacuum processing is a second long-time processing chamber. The vacuum processing apparatus according to claim 1 or 2,
A plurality of the short-time processing chambers;
The first processing chamber that performs vacuum processing is a first short-time processing chamber,
The vacuum processing apparatus is characterized in that the processing chamber for performing vacuum processing last is a second short-time processing chamber. A long-time processing chamber for long-time vacuum processing,
A short-time processing chamber adjacent to the long-time processing chamber and performing vacuum processing with a short processing time;
Unloading the processing object before processing to the long-time processing chamber and switching the open-air and vacuum-sealing for transferring the processing object after the long-time vacuum processing and the short-time vacuum processing through the long-time processing chamber With a possible delivery room,
The vacuum processing apparatus, wherein the long-time processing chamber is configured to simultaneously process a larger number than the number of objects to be processed that are simultaneously processed by the short-time processing chamber. The vacuum processing apparatus according to claim 7,
In the long-time processing chamber, a first transfer path for transferring the object to be processed from the delivery chamber to the short-time processing chamber via the long-time processing chamber, and the object to be processed in the short-time processing chamber. A vacuum processing apparatus, comprising a transfer means having a second transfer path for transferring from a processing chamber to the delivery chamber via the long-time processing chamber. A long-time processing chamber for long-time vacuum processing,
A short-time processing chamber adjacent to the long-time processing chamber and performing vacuum processing with a short processing time;
Unloading the processing object before processing to the short-time processing chamber, switching the opening to the atmosphere and vacuum-sealing for transporting the processing object after the short-time vacuum processing and long-time vacuum processing through the short-time processing chamber With a possible delivery room,
The vacuum processing apparatus, wherein the long-time processing chamber is configured to simultaneously process a larger number than the number of objects to be processed that are simultaneously processed by the short-time processing chamber. The vacuum processing apparatus according to claim 9, wherein
In the long-time processing chamber, there is provided a transfer means having a first transfer path for carrying the object to be processed from the short-time processing chamber and a second transfer path for transferring to the short-time processing chamber. The vacuum processing apparatus characterized by the above-mentioned.

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