JP2005314669A5 - - Google Patents

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Publication number
JP2005314669A5
JP2005314669A5 JP2005088334A JP2005088334A JP2005314669A5 JP 2005314669 A5 JP2005314669 A5 JP 2005314669A5 JP 2005088334 A JP2005088334 A JP 2005088334A JP 2005088334 A JP2005088334 A JP 2005088334A JP 2005314669 A5 JP2005314669 A5 JP 2005314669A5
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JP
Japan
Prior art keywords
film
thermal expansion
expansion coefficient
stretch ratio
ppm
Prior art date
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Withdrawn
Application number
JP2005088334A
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Japanese (ja)
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JP2005314669A (en
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Publication date
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Priority to JP2005088334A priority Critical patent/JP2005314669A/en
Priority claimed from JP2005088334A external-priority patent/JP2005314669A/en
Publication of JP2005314669A publication Critical patent/JP2005314669A/en
Publication of JP2005314669A5 publication Critical patent/JP2005314669A5/ja
Withdrawn legal-status Critical Current

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Description

上記支持体から剥離されたゲルフィルムは、通常回転ロールにより走行速度を規制しながら走行方向に延伸される。機械搬送方向への延伸倍率(MDX)は、140℃以下の温度で1.01〜1.9倍、好ましくは1.05〜1.6倍、さらに好ましくは1.05〜1.4倍で実施される。搬送方向に延伸されたゲルフィルムは、テンター装置に導入され、テンタークリップに幅方向両端部を把持されて、テンタークリップと共に走行しながら、幅方法へ延伸される。この時フィルムの機械搬送方向(MD)の延伸倍率に比べ幅方向(TD)の延伸倍率を高く設定すること、具体的には幅方向の延伸倍率を機械搬送方向の延伸倍率の1.1〜1.5倍に設定することによってフィルムTDに配向勝ったフィルムすなわちフィルムMDには金属に近似した熱膨張係数を保持しつつ、フィルムTDの熱膨張係数を低く抑えたフィルムを得ることができる。これら範囲内にて両者の延伸倍率の調整を行い、フィルムのTDの熱膨張係数α TD が3〜10ppm/℃、フィルムのMDの熱膨張係数α MD が10〜20ppm/℃の範囲にするのが好ましく、α TD が3〜7ppm/℃、α MD が14〜18ppm/℃の範囲がより好ましい。 The gel film peeled off from the support is usually stretched in the running direction while regulating the running speed with a rotating roll. The draw ratio (MDX) in the machine conveying direction is 1.01 to 1.9 times, preferably 1.05 to 1.6 times, more preferably 1.05 to 1.4 times at a temperature of 140 ° C. or less. To be implemented. The gel film stretched in the transport direction is introduced into a tenter device, and both ends in the width direction are gripped by the tenter clip and stretched in the width method while running with the tenter clip. At this time, the stretch ratio in the width direction (TD) is set higher than the stretch ratio in the machine transport direction (MD) of the film, specifically, the stretch ratio in the width direction is 1.1 to 1.1 of the stretch ratio in the machine transport direction. By setting the film to 1.5 times, it is possible to obtain a film in which the thermal expansion coefficient of the film TD is kept low while maintaining the thermal expansion coefficient close to that of the metal in the film MD that is well aligned with the film TD. To adjust the draw ratio of the two in within these ranges, the thermal expansion coefficient alpha TD in the TD of the film is 3~10ppm / ℃, the thermal expansion coefficient alpha MD in the MD of the film to within the range of 10 to 20 ppm / ° C. The α TD is preferably 3 to 7 ppm / ° C., and the α MD is more preferably 14 to 18 ppm / ° C.

JP2005088334A 2004-03-30 2005-03-25 Polyimide film and copper-clad laminate using the same as substrate Withdrawn JP2005314669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005088334A JP2005314669A (en) 2004-03-30 2005-03-25 Polyimide film and copper-clad laminate using the same as substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004097907 2004-03-30
JP2005088334A JP2005314669A (en) 2004-03-30 2005-03-25 Polyimide film and copper-clad laminate using the same as substrate

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2010180128A Division JP4777471B2 (en) 2004-03-30 2010-08-11 Polyimide film and copper-clad laminate based on the same
JP2012194817A Division JP2013014776A (en) 2004-03-30 2012-09-05 Polyimide film, and copper-clad laminate using the same as substrate material

Publications (2)

Publication Number Publication Date
JP2005314669A JP2005314669A (en) 2005-11-10
JP2005314669A5 true JP2005314669A5 (en) 2007-09-20

Family

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Family Applications (1)

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JP2005088334A Withdrawn JP2005314669A (en) 2004-03-30 2005-03-25 Polyimide film and copper-clad laminate using the same as substrate

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JP (1) JP2005314669A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4777471B2 (en) 2004-03-30 2011-09-21 東レ・デュポン株式会社 Polyimide film and copper-clad laminate based on the same
JP2008106140A (en) * 2006-10-25 2008-05-08 Du Pont Toray Co Ltd Polyimide film and method for producing the same
JP2008106138A (en) * 2006-10-25 2008-05-08 Du Pont Toray Co Ltd Polyimide film and method for producing the same
JP2008106139A (en) * 2006-10-25 2008-05-08 Du Pont Toray Co Ltd Polyimide film and method for producing the same
JP5126734B2 (en) * 2006-12-11 2013-01-23 東レ・デュポン株式会社 Copper plate
JP2008201940A (en) * 2007-02-21 2008-09-04 Du Pont Toray Co Ltd Low thermally shrinkable polyimide film and method for producing the same
JP2008211045A (en) * 2007-02-27 2008-09-11 Du Pont Toray Co Ltd Chip-on film
JP4947297B2 (en) * 2007-05-23 2012-06-06 東レ・デュポン株式会社 Copper plate
JP4888719B2 (en) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 Copper plate
JP5256681B2 (en) * 2007-10-05 2013-08-07 住友ベークライト株式会社 Semiconductor device, printed wiring board for semiconductor device, and copper-clad laminate
WO2009142248A1 (en) * 2008-05-20 2009-11-26 宇部興産株式会社 Aromatic polyimide film, laminate and solar cell
CN102112293B (en) * 2008-06-02 2014-12-03 宇部兴产株式会社 Method for producing aromatic polyimide film wherein linear expansion coefficient in transverse direction is lower than linear expansion coefficient in machine direction
JP2010125795A (en) * 2008-11-28 2010-06-10 Ube Ind Ltd Polyimide film, and polyimide laminate
JP5621768B2 (en) 2009-04-14 2014-11-12 宇部興産株式会社 Polyimide films for metallizing, production methods thereof, and metal laminated polyimide films
TWI628068B (en) * 2009-08-21 2018-07-01 東麗 杜邦股份有限公司 Polyimide film
JP5285557B2 (en) * 2009-09-18 2013-09-11 東レ・デュポン株式会社 Aromatic polyimide film and method for producing the same
JP5347980B2 (en) * 2010-01-14 2013-11-20 住友金属鉱山株式会社 Metallized polyimide film and flexible wiring board using the same
JP2011167906A (en) * 2010-02-18 2011-09-01 Du Pont-Toray Co Ltd Polyimide sheet
JP6121168B2 (en) * 2013-01-16 2017-04-26 東レ・デュポン株式会社 Polyimide film and method for producing the same
JP6361550B2 (en) * 2015-03-30 2018-07-25 住友金属鉱山株式会社 Method for judging quality of polyimide film, and method for producing copper-clad laminate and flexible wiring board using the polyimide film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127523A (en) * 1983-12-14 1985-07-08 Toray Ind Inc Base film for magnetic recording medium in high density
JP2615542B2 (en) * 1985-04-23 1997-05-28 東レ株式会社 Base film for high density recording media
JP3001061B2 (en) * 1990-04-20 2000-01-17 住友ベークライト株式会社 Heat-resistant film with low linear expansion coefficient and method for producing the same
JP3567624B2 (en) * 1995-07-05 2004-09-22 東レ株式会社 Aromatic polyamide film or aromatic polyimide film
JPH10176071A (en) * 1996-10-18 1998-06-30 Toray Ind Inc Aromatic polyamide film or aromatic polyimide film
JP2001072781A (en) * 1998-11-05 2001-03-21 Kanegafuchi Chem Ind Co Ltd Polyimide film and substrate for electric and electronic apparatus using same
JP4665373B2 (en) * 2002-05-17 2011-04-06 東レ・デュポン株式会社 Polyimide film

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